Chip structure, screen module and electronic equipment
By preparing conductive protrusions on the Bump surface and piercing into the metal layer of the screen body, the problems of high ACF material cost and complex adhesion process are solved, and the cost of screen manufacturing and the yield rate are reduced.
Patent Information
- Application Number
- CN202420390225.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-29
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-02-28
AI Technical Summary
In the prior art, ACF materials are costly and complex in attaching processes, resulting in loss of screen manufacturing yield.
Conductive protrusions are connected to Bump, conductive protrusions are prepared on the Bump surface by physical vapor deposition, and the tip is pierced into the metal layer of the screen body, so that the IC chip and the screen substrate are firmly connected and connected.
Without using ACF materials, the cost of screen manufacturing is reduced and the yield rate is improved.
Smart Images
Figure CN223079123U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor packaging technologies, and particularly to a chip structure, a screen module, and an electronic device. Background Art
[0002] In related technologies, when manufacturing a screen, an anisotropic conductive film (ACF) is required to connect an integrated circuit (IC) chip structure to the screen body. However, the material cost of the ACF is relatively high, and the required attaching process is relatively complex, resulting in a certain yield loss. Summary of the Invention
[0003] To overcome the problems existing in related technologies, the present disclosure provides a chip structure, a screen module, and an electronic device.
[0004] According to a first aspect of an embodiment of the present disclosure, a chip structure is provided. The chip structure has a conductive protrusion, and a first end surface of the conductive protrusion is connected to a surface of a bump in the chip structure.
[0005] In some embodiments of the present disclosure, the number of the conductive protrusions is at least one.
[0006] In some embodiments of the present disclosure, the sum of the areas of the first end surfaces of at least one of the conductive protrusions is less than or equal to the surface area of the bump.
[0007] In some embodiments of the present disclosure, a second end surface of the conductive protrusion opposite to the first end surface includes a pointed end portion.
[0008] In some embodiments of the present disclosure, the conductive protrusion is a cone, and the pointed end portion of the cone is opposite to the first end surface.
[0009] In some embodiments of the present disclosure, the material of the conductive protrusion is nickel.
[0010] In some embodiments of the present disclosure, the conductive protrusion is prepared on the surface of the bump by physical vapor deposition.
[0011] According to a second aspect of an embodiment of the present disclosure, a screen module is provided, including: an integrated circuit (IC) chip; wherein, the IC chip includes the chip structure as described in the first aspect; a screen body; wherein, a metal layer is provided at a position on the screen body in contact with the IC chip, and the pointed end portions of the conductive protrusions in the chip structure are inserted into the metal layer for conduction.
[0012] According to a third aspect of the embodiments of the present disclosure, an electronic device is provided. The electronic device includes an integrated circuit (IC) chip, and the IC chip has the chip structure as described in the first aspect.
[0013] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: Through the conductive protrusions connected to the Bump, the Bump is connected and conductively connected to other electronic components. When this solution is used in screen manufacturing, the IC chip can be connected and conductively connected to the screen substrate without using ACF materials, thereby reducing the manufacturing cost and improving the yield rate of screen manufacturing.
[0014] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present disclosure and, together with the specification, are used to explain the principles of the present disclosure.
[0016] Figure 1 It is a schematic structural diagram of a chip structure provided by an embodiment of the present disclosure.
[0017] Figure 2 It is a schematic structural diagram of another chip structure provided by an embodiment of the present disclosure.
[0018] Figure 3 It is a schematic structural diagram of yet another chip structure provided by an embodiment of the present disclosure.
[0019] Figure 4 It is a schematic structural diagram of yet another chip structure provided by an embodiment of the present disclosure.
[0020] Figure 5 It is a schematic diagram of a screen module provided by an embodiment of the present disclosure.
[0021] Reference numerals
[0022] 10. Conductive protrusion; 11. First end face; 12. Second end face; 13. Tip portion; 20. Bump. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] Here, the exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.
[0024] In this disclosure, unless otherwise clearly defined and limited, terms such as "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances.
[0025] Moreover, in the description of this disclosure, it should be understood that the orientation or positional relationship indicated by terms such as "opposite", "middle", "below", and "lower middle" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this disclosure and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this disclosure.
[0026] The chip structure and display module of the embodiments of this disclosure will be described below with reference to the drawings.
[0027] Figure 1 The structural schematic diagram of a chip structure provided for the embodiments of this disclosure is as Figure 1 shown. The chip structure has a conductive bump 10, and the first end face 11 of the conductive bump 10 is connected to the surface of the Bump 20 in the chip structure.
[0028] It should be noted that in the embodiments of this disclosure, the conductive bump 10 can be made of a metal material with good conductivity, and the shape of the conductive bump 10 can be any one of a sphere, an ellipsoid, a disc body, a rectangle, or a trapezoid, or other shapes. In practical applications, the conductive bump 10 is manufactured by equipment and may not be a standard sphere, ellipsoid, disc body, rectangle, or trapezoid, but it does not affect the specific achievable effect as long as the conductive bump 10 can normally connect and conduct the Bump 20 with other electronic components that need to be connected and conducted. For example, a groove corresponding to the conductive bump 10 can be preset at the connection of other electronic components that the Bump 20 needs to be connected and conducted, so that the conductive bump 10 can be placed in the groove to connect and conduct the Bump 20 with the electronic component.
[0029] In some embodiments of this disclosure, the number of the above-mentioned conductive bumps 10 is at least one.
[0030] It can be understood that according to the numerical relationship between the surface area of the Bump 20 and the area of the first end face 11 of a conductive bump 10, at least one conductive bump 10 can be provided on the surface of the Bump 20. As an example, please refer toFigure 2 , Figure 2 is a schematic structural diagram of another chip structure provided by an embodiment of the present disclosure. As Figure 2 shown, when the area of the surface of the Bump 20 in the chip structure is relatively large, the surface of the Bump 20 can be connected to two conductive protrusions 10. Thus, under the combined action of the two conductive protrusions 10, the Bump 20 is firmly connected and conducts electricity to the electronic component to be connected.
[0031] In some embodiments of the present disclosure, the sum of the areas of the first end faces 11 of at least one conductive protrusion 10 is less than or equal to the surface area of the Bump 20.
[0032] It should be noted that, in some embodiments of the present disclosure, if the surface of one Bump 20 is connected to multiple conductive protrusions 10, the shapes of different conductive protrusions 10 among the multiple conductive protrusions 10 may also be different. For example, if the surface of one Bump 20 is connected to two conductive protrusions 10, the shape of one conductive protrusion 10 may be ellipsoidal, and the other conductive protrusion 10 may be trapezoidal.
[0033] It should be noted that, in some embodiments of the present disclosure, if the surface of one Bump 20 is connected to multiple conductive protrusions 10, the areas of the first end faces 11 of different conductive protrusions 10 among the multiple conductive protrusions 10 may be different.
[0034] In some embodiments of the present disclosure, the second end face 21 of the conductive protrusion 10 opposite to the first end face 11 includes a pointed end portion 13.
[0035] As an example, please refer to Figure 3 , Figure 3 is a schematic structural diagram of yet another chip structure provided by an embodiment of the present disclosure. As Figure 3 shown, the second end face 21 of the conductive protrusion 10 in this chip structure opposite to the first end face 11 includes a pointed end portion 13. Thus, the pointed end portion 13 can pierce into the metal layer of the electronic component to which the Bump 20 needs to be connected, so that the Bump 20 is firmly connected and conducts electricity to the electronic component.
[0036] In some embodiments of the present disclosure, the conductive protrusion 10 is a cone, and the pointed end of the cone is opposite to the first end face 11.
[0037] As an example, please refer to Figure 4 , Figure 4 is a schematic structural diagram of yet another chip structure provided by an embodiment of the present disclosure. As Figure 4As shown, the outer shape of the conductive bump 10 included in the chip structure can be a cone. For example, a cone or a pyramid. Thus, the conductive bump 10 can penetrate into the metal layer of the electronic component that needs to be connected to the Bump 20, so that the Bump 20 and the electronic component are firmly connected and conduct electricity through the conductive bump 10.
[0038] In some embodiments of the present disclosure, the material of the above-mentioned conductive bump 10 is nickel.
[0039] In some embodiments of the present disclosure, the above-mentioned conductive bump 10 is prepared by physical vapor deposition on the surface of the Bump 20.
[0040] In practical applications, physical vapor deposition technology can be used to prepare a metal layer with a preset shape on the surface of the Bump 20 by using a stencil with a specific shape as the aforementioned conductive bump 10.
[0041] To implement the above embodiments, the present disclosure also provides a screen module, including: an IC (Integrated Circuit) chip, the IC chip includes the chip structure provided by any embodiment of the present disclosure; a screen body, a metal layer is provided at a position where the screen body contacts the IC chip, and the tip of the conductive bump in the chip structure is inserted into the metal layer. Conductive bump.
[0042] As an example, please refer to Figure 5 , Figure 5 is a schematic diagram of a screen module provided by an embodiment of the present disclosure. As Figure 5 shown, the screen module includes an IC chip and a screen body. After applying temperature and pressure to the conductive bump 10 through a hot press head, the conductive bump 10 can penetrate into the metal layer (for example, a Ti (titanium)-Al (aluminum)-Ti film) of the screen body, so that the Bump 20 of the IC chip and the screen body can be firmly connected and conduct electricity.
[0043] The present disclosure also provides an electronic device, the electronic device includes an IC chip, and the IC chip includes the chip structure provided by any embodiment of the present disclosure.
[0044] The Bump structure provided by the embodiments of the present disclosure enables the Bump to be connected and conduct electricity with other electronic components through the conductive bump connected to the Bump. When this solution is used in screen manufacturing, the IC chip and the screen substrate can be connected and conducted without using an ACF (Anisotropic Conductive Film) material, thereby reducing the manufacturing cost and improving the yield of screen manufacturing.
[0045] Other embodiments of the present disclosure will be readily apparent to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include known or customary technical means in the technical field not disclosed herein. The specification and examples are only to be considered as exemplary, and the true scope and spirit of the present disclosure are pointed out by the following claims.
[0046] It should be understood that the present disclosure is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.
Claims
1. A chip structure, characterized in that, The chip structure has conductive protrusions, and a first end face of the conductive protrusion is connected to the surface of a bump in the chip structure; Wherein, a second end face of the conductive protrusion opposite to the first end face includes a pointed end portion, and the pointed end portion is used for piercing into a metal layer of an electronic component.
2. The chip structure according to claim 1, characterized in that, The number of the conductive protrusions is at least one.
3. The chip structure according to claim 2, characterized in that, The sum of the areas of the first end faces of at least one of the conductive protrusions is less than or equal to the surface area of the bump.
4. The chip structure according to claim 1, characterized in that, The conductive protrusion is a cone, and the pointed end portion of the cone is opposite to the first end face.
5. The chip structure according to any one of claims 1 to 4, characterized in that, The material of the conductive protrusion is nickel.
6. The chip structure according to claim 1, wherein, The conductive protrusion is prepared on the surface of the bump by physical vapor deposition.
7. A screen module, characterized in that, Comprising: An integrated circuit (IC) chip; wherein, the IC chip has the chip structure as described in any one of claims 1 to 6; A screen body; wherein, a metal layer is provided at a position on the screen body that contacts the IC chip, and the conductive protrusions in the chip structure are inserted into the metal layer.
8. An electronic device, characterized in that, The electronic device includes an integrated circuit (IC) chip, and the IC chip has the chip structure as described in any one of claims 1 to 6.