Direct heat dissipation metal substrate structure

Abstract

The utility model relates to the technical field of metal substrates, in particular to a direct heat dissipation metal substrate structure which comprises a substrate body, a heat dissipation device is arranged on the lower surface of the substrate body, the heat dissipation device comprises a flow guide block, the flow guide block is fixedly connected with the lower surface of the substrate body, a flow guide hole is formed in the surface of the flow guide block, and the flow guide hole is communicated with the heat dissipation device. Fins are fixedly connected to the lower surface of the base plate body, a positioning device is arranged on the surface of the base plate body, the flow guide blocks and the fins are arranged in a staggered mode, first guide plates are fixedly connected to the lower surfaces of the flow guide blocks, and second guide plates are fixedly connected to the lower surfaces of the flow guide blocks. According to the utility model, as the flow guide block and the fins are arranged on the lower surface of the substrate body, the flow guide holes on the flow guide block can effectively guide air flow and accelerate heat dissipation, and the fins are arranged to increase the heat dissipation surface area and help to improve the heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of metal substrates, in particular to a metal substrate structure with direct heat dissipation. Background Art

[0002] A metal substrate is a material used in electronic devices, usually made of metals (such as aluminum, copper, etc.). As the basis of a circuit board, it is mainly used to provide good thermal conductivity and mechanical strength to support and protect electronic components. The advantage of a metal substrate lies in its excellent heat dissipation ability, which helps to reduce the heat generated by electronic components during operation, thereby improving the reliability and lifespan of the device. It is widely used in fields such as LED lighting, power modules, and automotive electronics.

[0003] Prior art such as the utility model with the publication number CN204859744U discloses a metal substrate structure with direct heat dissipation, which includes a metal substrate, a dielectric layer and a copper foil sequentially arranged on the metal substrate. The metal substrate is provided with raised blocks as heat dissipation areas, and the dielectric layer and the copper foil are hollowed out at positions corresponding to the raised blocks, so that the raised blocks are embedded into the hollowed-out parts of the dielectric layer and the copper foil and are flush with the copper foil. The metal-based printed circuit board of the utility model can realize directly soldering components on the metal base, and the components directly dissipate heat through the metal base. Because the thermal conductivity of the metal base itself is very high, the heat dissipation function of the metal-based printed circuit board can be greatly improved, thus meeting the heat dissipation requirements of high-power LED products.

[0004] Currently, most existing metal substrates are of an integrated design, which can only rely on air flow for heat dissipation. The contact area between the metal substrate and air is limited, making it difficult to transfer heat, easily causing the metal substrate to overheat and affecting the use of the metal substrate. Therefore, improvement operations are required. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the shortcomings in the prior art that most metal substrates are of an integrated design, which can only rely on air flow for heat dissipation, the contact area between the metal substrate and air is limited, making it difficult to transfer heat, easily causing the metal substrate to overheat and affecting the use of the metal substrate, and to propose a metal substrate structure with direct heat dissipation.

[0006] To achieve the above object, the utility model adopts the following technical solutions: A metal substrate structure with direct heat dissipation, including a substrate body, a heat dissipation device is provided on the lower surface of the substrate body, the heat dissipation device includes a diversion block, the diversion block is fixedly connected to the lower surface of the substrate body, diversion holes are provided on the surface of the diversion block, fins are fixedly connected to the lower surface of the substrate body, and a positioning device is provided on the surface of the substrate body. Since the diversion block and fins are provided on the lower surface of the substrate body, the diversion holes on the diversion block can effectively guide the air flow and accelerate the heat dissipation, and the setting of the fins increases the heat dissipation surface area, which helps to improve the heat dissipation efficiency.

[0007] Preferably, the diversion block and the fins are arranged alternately. The alternating arrangement of the diversion block and the fins can optimize the air flow path, reduce the resistance and eddy current of the air flow, and enable the air to flow through the heat dissipation device more evenly, further improving the heat dissipation effect.

[0008] Preferably, a first guiding plate is fixedly connected to the lower surface of the diversion block, and a second guiding plate is fixedly connected to the lower surface of the diversion block. The design of the heat dissipation device enables the heat to be quickly conducted from the substrate body to the diversion block and the fins, and the heat is dissipated into the air through natural convection or forced convection, thereby enhancing the stability and reliability of the heat dissipation.

[0009] Preferably, the number of both the first guiding plate and the second guiding plate is two, and the two first guiding plates and the second guiding plates are arranged in a mirror image.

[0010] Preferably, the first guiding plate and the second guiding plate have the same specifications, both the first guiding plate and the second guiding plate are inclined, and both ends of the first guiding plate and the second guiding plate are rounded.

[0011] Preferably, the positioning device includes mounting holes, the mounting holes are provided on the surface of the substrate body, a positioning cylinder is fixedly connected to the lower surface of the substrate body, the positioning cylinder is communicated with the mounting holes, a sliding sleeve is slidably connected to the inner wall of the positioning cylinder, and a washer is fixedly connected to the lower end of the sliding sleeve. The positioning device provided on the surface of the substrate body ensures the stable installation and accurate positioning of the heat dissipation device, avoids the loosening or displacement of the heat dissipation device during use, and helps to maintain the compactness and stability of the overall structure.

[0012] Preferably, a spring is fixedly connected to the upper surface of the sliding sleeve, the spring is located in the positioning cylinder, and the end of the spring away from the sliding sleeve is fixedly connected to the lower surface of the substrate body to ensure the normal use of the device.

[0013] Compared with the prior art, the advantages and positive effects of the utility model are as follows:

[0014] 1. In this utility model, due to the provision of flow guide blocks and fins on the lower surface of the substrate body, the flow guide holes on the flow guide blocks can effectively guide the air flow, accelerate the heat dissipation, and the fins increase the heat dissipation surface area, which helps to improve the heat dissipation efficiency. The staggered arrangement of the flow guide blocks and fins can optimize the air flow path, reduce the resistance and eddy current of the air flow, enable the air to flow more evenly through the heat dissipation device, and further enhance the heat dissipation effect. The design of the heat dissipation device enables the heat to be quickly conducted from the substrate body to the flow guide blocks and fins, and dissipates the heat into the air through natural convection or forced convection, thereby enhancing the stability and reliability of the heat dissipation. The positioning device provided on the surface of the substrate body ensures the stable installation and accurate positioning of the heat dissipation device, avoids the loosening or displacement of the heat dissipation device during use, and helps to maintain the compactness and stability of the overall structure. This design can not only be applied to various metal substrates that require heat dissipation, but also effectively dissipate heat under different environmental conditions, with strong adaptability and a wide range of applications. Description of the Drawings

[0015] Figure 1 is a three-dimensional structure schematic diagram of a metal substrate structure with direct heat dissipation proposed by this utility model;

[0016] Figure 2 is a bottom view structure schematic diagram of a metal substrate structure with direct heat dissipation proposed by this utility model;

[0017] Figure 3 is an exploded structure schematic diagram of a metal substrate structure with direct heat dissipation proposed by this utility model;

[0018] Figure 4 is in a metal substrate structure with direct heat dissipation proposed by this utility model Figure 3 Schematic diagram of the structure at location A;

[0019] Figure 5 is in a metal substrate structure with direct heat dissipation proposed by this utility model Figure 3 Schematic diagram of the structure at location B.

[0020] Legend Explanation:

[0021] 1. Substrate body; 2. Heat dissipation device; 21. Flow guide block; 22. Flow guide hole; 23. Fin; 24. First guide plate; 25. Second guide plate; 3. Positioning device; 31. Mounting hole; 32. Positioning cylinder; 33. Spring; 34. Sliding sleeve; 35. Washer. Detailed Implementation Manner

[0022] Please refer to Figures 1 - 5, the present utility model provides a technical solution: a metal substrate structure with direct heat dissipation, including a substrate body 1. A heat dissipation device 2 is provided on the lower surface of the substrate body 1. The heat dissipation device 2 includes a diversion block 21, and the diversion block 21 is fixedly connected to the lower surface of the substrate body 1. Diversion holes 22 are formed on the surface of the diversion block 21. Fins 23 are fixedly connected to the lower surface of the substrate body 1. A positioning device 3 is provided on the surface of the substrate body 1. Since the diversion block 21 and the fins 23 are provided on the lower surface of the substrate body 1, the diversion holes 22 on the diversion block 21 can effectively guide the air flow and accelerate the heat dissipation, and the setting of the fins 23 increases the heat dissipation surface area, which helps to improve the heat dissipation efficiency.

[0023] In this embodiment: the diversion block 21 and the fins 23 are arranged in an alternating manner. The alternating arrangement of the diversion block 21 and the fins 23 can optimize the air flow path, reduce the resistance and eddy current of the air flow, and enable the air to flow through the heat dissipation device 2 more evenly, further improving the heat dissipation effect.

[0024] Specifically, a first guiding plate 24 is fixedly connected to the lower surface of the diversion block 21, and a second guiding plate 25 is fixedly connected to the lower surface of the diversion block 21. The design of the heat dissipation device 2 enables the heat to be quickly conducted from the substrate body 1 to the diversion block 21 and the fins 23, and the heat is dissipated into the air through natural convection or forced convection, thereby enhancing the stability and reliability of the heat dissipation.

[0025] Specifically, the number of both the first guiding plate 24 and the second guiding plate 25 is two, and the two first guiding plates 24 and the second guiding plate 25 are arranged in a mirror image.

[0026] Specifically, the first guiding plate 24 and the second guiding plate 25 have the same specifications. The first guiding plate 24 and the second guiding plate 25 are both inclined, and both ends of the first guiding plate 24 and the second guiding plate 25 are rounded.

[0027] In this embodiment: the positioning device 3 includes a mounting hole 31, and the mounting hole 31 is formed on the surface of the substrate body 1. A positioning cylinder 32 is fixedly connected to the lower surface of the substrate body 1, and the positioning cylinder 32 communicates with the mounting hole 31. A sliding sleeve 34 is slidably connected to the inner wall of the positioning cylinder 32, and a washer 35 is fixedly connected to the lower end of the sliding sleeve 34. The positioning device 3 provided on the surface of the substrate body 1 ensures the stable installation and accurate positioning of the heat dissipation device 2, avoids loosening or displacement of the heat dissipation device 2 during use, and helps to maintain the compactness and stability of the overall structure.

[0028] Specifically, a spring 33 is fixedly connected to the upper surface of the sliding sleeve 34. The spring 33 is located in the positioning cylinder 32, and one end of the spring 33 away from the sliding sleeve 34 is fixedly connected to the lower surface of the substrate body 1 to ensure the normal use of the device.

[0029] Working principle: The working part of the substrate body 1 generates heat, and this heat is directly transferred to its lower surface through the substrate body 1. Since the substrate body 1 is made of metal material and has good thermal conductivity, it can effectively transfer the heat from the substrate body 1 to the heat dissipation device 2. The heat dissipation device 2 includes a flow guiding block 21 and fins 23. The flow guiding block 21 guides the air flow through the flow guiding holes 22 opened on its surface, enabling the air to better contact the surface of the heat dissipation device 2. The fins 23 are fixed on the lower surface of the substrate body 1, increasing the surface area of the heat dissipation device 2 and further expanding the heat distribution range through its high thermal conductivity. The design of the flow guiding block 21 enables the air flow to form a flow on the surface of the flow guiding block 21 through the flow guiding holes 22, thereby accelerating the removal of heat. When the air flows through the flow guiding holes 22 of the flow guiding block 21, it will carry away the heat on the heat dissipation device 2 and reduce the temperature of the heat dissipation device 2. The staggered arrangement design of the flow guiding block 21 and the fins 23 helps to optimize the air flow path, reduce the resistance and eddy current of the air flow, ensure that the air can flow evenly through the entire heat dissipation device 2, and enhance the heat dissipation effect.

Claims

1. A metal substrate structure with direct heat dissipation, comprising a substrate body (1), characterized in that: A heat dissipation device (2) is provided on the lower surface of the substrate body (1). The heat dissipation device (2) includes a diversion block (21) which is fixedly connected to the lower surface of the substrate body (1). Diversion holes (22) are formed on the surface of the diversion block (21). Fins (23) are fixedly connected to the lower surface of the substrate body (1). A positioning device (3) is provided on the surface of the substrate body (1).

2. The metal substrate structure with direct heat dissipation according to claim 1, wherein: The diversion block (21) and the fins (23) are arranged in an alternating manner.

3. The direct heat dissipation metal substrate structure according to claim 1, characterized in that: A first guiding plate (24) is fixedly connected to the lower surface of the diversion block (21), and a second guiding plate (25) is fixedly connected to the lower surface of the diversion block (21).

4. A metal substrate structure with direct heat dissipation according to claim 3, characterized in that: The number of both the first guiding plate (24) and the second guiding plate (25) is two, and the two first guiding plates (24) and the second guiding plates (25) are arranged in a mirror image.

5. The direct heat dissipation metal substrate structure according to claim 3, characterized in that: The first guiding plate (24) and the second guiding plate (25) have the same specifications. The first guiding plate (24) and the second guiding plate (25) are both inclined, and both ends of the first guiding plate (24) and the second guiding plate (25) are rounded.

6. The direct heat dissipation metal substrate structure according to claim 1, characterized in that: The positioning device (3) includes a mounting hole (31) formed on the surface of the substrate body (1). A positioning cylinder (32) is fixedly connected to the lower surface of the substrate body (1). The positioning cylinder (32) communicates with the mounting hole (31). A sliding sleeve (34) is slidably connected to the inner wall of the positioning cylinder (32). A washer (35) is fixedly connected to the lower end of the sliding sleeve (34).

7. A direct heat dissipation metal substrate structure according to claim 6, characterized in that: A spring (33) is fixedly connected to the upper surface of the sliding sleeve (34). The spring (33) is located in the positioning cylinder (32), and one end of the spring (33) away from the sliding sleeve (34) is fixedly connected to the lower surface of the substrate body (1).

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