Low-temperature sintered zirconia ceramic substrate

Abstract

The utility model relates to the technical field of ceramic substrates, in particular to a low-temperature sintered zirconia ceramic substrate. The low-temperature sintered zirconia ceramic substrate comprises a zirconia ceramic substrate body, a lower insulating layer fixedly connected to the lower end of the zirconia ceramic substrate body, and alignment holes distributed in the surface of the upper end of the zirconia ceramic substrate body at intervals; meanwhile, a Cu seed layer is formed on the surface of the upper end of the zirconia ceramic substrate body; forming a metal layer on the surface of the upper end of the Cu seed layer; the low-temperature sintered zirconia ceramic substrate is calibrated and aligned in advance, and then the circuit board is manufactured, so that the manufactured circuit board is high in precision; and high temperature is not needed in the manufacturing process, so that the energy consumption is relatively low.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic substrates, and specifically relates to a low-temperature sintered zirconia ceramic substrate. Background Technique

[0002] Ceramic substrates have excellent electrical insulation performance, high thermal conductivity, excellent solderability, and high adhesion strength, and can be etched into various patterns like PCB boards, with a large current-carrying capacity; therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology;

[0003] In the related art, a ceramic substrate is provided. This ceramic substrate is heated in oxygen-containing nitrogen at a high temperature of 1000 °C to firmly connect the copper foil and the ceramic substrate together by means of eutectic bonding;

[0004] Although this ceramic substrate has a firm connection between the copper foil and the ceramic substrate and excellent electrical conductivity, its disadvantages are also obvious. For example, since the alignment and calibration of the connection and fixing positions of the copper foil and the ceramic substrate cannot be carried out in advance, the circuit board accuracy at the connection position of the copper foil and the ceramic substrate of the produced ceramic substrate is poor; at the same time, since this ceramic substrate is produced at a high temperature of 1000 °C, it is necessary to heat to a relatively high temperature when processing the ceramic substrate, resulting in large energy consumption during the production of the ceramic substrate.

[0005] Aiming at the problems in the above background technique, the utility model aims to provide a low-temperature sintered zirconia ceramic substrate. Content of the Utility Model

[0006] The purpose of the utility model is to provide a low-temperature sintered zirconia ceramic substrate to solve the problems put forward in the above background technique.

[0007] To achieve the above purpose, the utility model provides the following technical solution:

[0008] A low-temperature sintered zirconia ceramic substrate, the low-temperature sintered zirconia ceramic substrate includes:

[0009] A substrate, wherein the substrate includes a zirconia ceramic substrate body, and a lower insulating layer is fixedly connected to the lower end of the zirconia ceramic substrate body;

[0010] Alignment holes are formed by laser drilling on the upper end surface of the zirconia ceramic substrate body and are arranged at intervals; at the same time, a Cu seed layer is deposited on the upper end surface of the zirconia ceramic substrate body through semiconductor technology; and the alignment holes are filled with holes to form a metal layer on the upper end surface of the Cu seed layer through electroplating technology.

[0011] As a further solution of the present utility model: a circuit chip is formed on the upper end surface of the substrate, and contact pieces are symmetrically distributed at one end of the upper end surface of the substrate, and the contact pieces are electrically connected to the circuit chip.

[0012] As a further solution of the present utility model: a resistor protection layer is fixedly connected to the upper end of the metal layer, and an upper insulating layer is fixedly connected to the upper end of the resistor protection layer.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] The low-temperature sintered zirconia ceramic substrate has the following advantages compared with the current ceramic substrate:

[0015] First, the low-temperature sintered zirconia ceramic substrate first forms alignment holes by laser drilling, then deposits a Cu seed layer on the upper end surface of the zirconia ceramic substrate body through a semiconductor process, and finally fills the alignment holes through an electroplating process to form a metal layer; making the circuit made of the entire low-temperature sintered zirconia ceramic substrate have high precision because of pre-calibrated alignment and then circuit board production; and no high temperature is required during the production process, so the energy consumption is also low.

[0016] Second, by respectively arranging an upper insulating layer and a lower insulating layer on the upper and lower ends of the zirconia ceramic substrate body, the functions of the upper insulating layer and the lower insulating layer are the same, both of which are to enable the low-temperature sintered zirconia ceramic substrate to be used in a strong acid and strong alkali environment and to achieve the effects of isolation, dust prevention and oxidation for the entire low-temperature sintered zirconia ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model.

[0018] Figure 1 It is a schematic structural diagram of a low-temperature sintered zirconia ceramic substrate according to an embodiment of the present utility model.

[0019] Figure 2 It is a side view of a low-temperature sintered zirconia ceramic substrate according to an embodiment of the present utility model.

[0020] In the figure: 1 - substrate, 2 - contact piece, 3 - circuit chip, 4 - upper insulating layer, 5 - resistor protection layer, 6 - metal layer, 7 - Cu seed layer, 8 - alignment hole, 9 - zirconia ceramic substrate body, 10 - lower insulating layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0022] Example

[0023] See also Figure 1 and Figure 2 The present invention provides a low-temperature sintered zirconia ceramic substrate in an embodiment, and the low-temperature sintered zirconia ceramic substrate comprises:

[0024] A substrate 1, wherein the substrate 1 comprises a zirconia ceramic substrate body 9, which is formed by low-temperature sintering of a zirconia ceramic raw material; a lower insulating layer 10 is fixedly connected to the lower end of the zirconia ceramic substrate body 9, and the lower insulating layer 10 is used to insulate and protect the lower end of the zirconia ceramic substrate body 9 of the entire low-temperature sintered zirconia ceramic substrate;

[0025] Alignment holes 8 arranged at intervals are formed on the upper surface of the zirconia ceramic substrate body 9 by laser drilling; a Cu seed layer 7 is deposited on the upper surface of the zirconia ceramic substrate body 9 by semiconductor process; the alignment holes 8 are filled by electroplating process on the upper surface of the Cu seed layer 7 to form a metal layer 6; a resistor protection layer 5 is fixedly connected to the upper end of the metal layer 6, and an upper insulating layer 4 is fixedly connected to the upper end of the resistor protection layer 5;

[0026] The low-temperature sintered zirconia ceramic substrate is firstly punched with a laser to form an alignment hole 8, and then a Cu seed layer 7 is deposited on the upper surface of the zirconia ceramic substrate body 9 by a semiconductor process, and finally the alignment hole 8 is filled with a metal layer 6 by an electroplating process; the circuit made of the entire low-temperature sintered zirconia ceramic substrate is pre-calibrated and then the circuit board is made, so the circuit board is high in precision; at the same time, compared with the related art, the copper foil and the ceramic substrate are firmly connected together by eutectic bonding by heating at a high temperature of 1000°C in oxygen-containing nitrogen, and the preparation temperature is relatively low, so the energy consumption is greatly reduced;

[0027] See also Figure 1 In one embodiment of the utility model, a circuit chip 3 is formed on the upper surface of the substrate 1, and the formed circuit chip 3 is made by laser engraving the metal layer 6 and the Cu seed layer 7 combined together; at the same time, a contact piece 2 is symmetrically distributed on one end of the upper surface of the substrate 1, and the contact piece 2 is electrically connected to the circuit chip 3; the contact piece 2 can be used to quickly align and stack multiple low-temperature sintered zirconia ceramic substrates, and can also provide power for the circuit chip 3 to operate when an external power supply is connected;

[0028] Please refer to Figure 2 In an embodiment of the present utility model, a resistor protection layer 5 is fixedly connected to the upper end of the metal layer 6, and an upper insulating layer 4 is fixedly connected to the upper end of the resistor protection layer 5. The provided resistor protection layer 5 is used to provide insulation protection during the energized operation of the entire low-temperature sintered zirconia ceramic substrate. The function of the provided upper insulating layer 4 is the same as that of the lower insulating layer 10, both of which are to enable the low-temperature sintered zirconia ceramic substrate to be used in a strong acid and strong base environment and to achieve the effects of isolating dust and oxidation for the entire low-temperature sintered zirconia ceramic substrate;

[0029] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0030] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A low-temperature sintered zirconia ceramic substrate, comprising: Substrate (1), said substrate (1) comprising a zirconia ceramic substrate body (9); characterized in that: A lower insulating layer (10) is fixedly connected to the lower end of the zirconia ceramic substrate body (9); alignment holes (8) arranged at intervals are formed on the upper end surface of the zirconia ceramic substrate body (9) by laser drilling; at the same time, a Cu seed layer (7) is deposited on the upper end surface of the zirconia ceramic substrate body (9) by semiconductor process; the alignment holes (8) are filled with a metal layer (6) on the upper end surface of the Cu seed layer (7) by electroplating process.

2. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: A circuit chip (3) is formed on the upper end surface of the substrate (1), and contact chips (2) are symmetrically distributed at one end of the upper end surface of the substrate (1), and the contact chips (2) are electrically connected to the circuit chip (3).

3. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: A resistance protection layer (5) is fixedly connected to the upper end of the metal layer (6), and an upper insulating layer (4) is fixedly connected to the upper end of the resistance protection layer (5).

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