Leveling structure for reducing welding deformation of printed circuit board (PCB) in furnace

Abstract

The utility model discloses a leveling structure for reducing welding deformation of a PCB in a furnace, the PCB comprises a PCB main body and a plurality of shielding covers, the surface of the PCB main body is provided with a plurality of pressing areas, each shielding cover is correspondingly arranged on the surface of each pressing area, and the leveling structure comprises a plurality of pressing parts, and a carrier, a pressing sheet and a pressing cover which are sequentially arranged according to the stacking direction; a mounting position is arranged on the surface of the carrier; according to the utility model, through the cooperation of the pressing sheets, the pressing covers and the pressing parts, the secondary pressing action on the PCB is realized, specifically, the pressing sheets are stacked on the carrier to apply pressure to the PCB main body, each shielding cover is exposed due to the existence of the cavity, and then the pressing covers are stacked on the pressing sheets, so that the pressing sheets can be pressed to the PCB main body. As each cavity can penetrate into one or more pressure applying parts, the surface of the shielding cover corresponding to each cavity can bear the pressure of one or more pressure applying parts, and the probability of poor missing solder caused by deformation of shielding cover type elements and deformation of a PCB (printed circuit board) is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board soldering, and particularly relates to a leveling structure for reducing the deformation of a PCB during furnace soldering. Background Art

[0002] In the production of modern electronic products, the furnace soldering of a PCB (printed circuit board) is one of the key steps. The use of a furnace fixture is to protect the surface-mounted components on the tin surface of the PCB from falling off (provided that the surface-mounted process on the tin surface is red glue).

[0003] In actual work, a PCB (printed circuit board) sometimes needs to be soldered with components such as a shielding cover. However, there are still some problems during soldering:

[0004] Specifically, due to the material characteristics and size differences of the PCB (printed circuit board), it is prone to thermal stress deformation during the high-temperature reflow soldering process. Especially for components such as shielding covers with a relatively high height or large mass, there is also a certain probability of deformation when they are exposed to high temperatures. At the same time, under the influence of the deformation of the PCB (printed circuit board) and the shielding cover components, the probability of open soldering increases significantly, thus seriously affecting the electrical performance and reliability of the product. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a leveling structure for reducing the deformation of a PCB during furnace soldering, aiming to solve the problem of open soldering caused by the deformation of the shielding cover components themselves and the PCB deformation as mentioned in the above background art.

[0006] To achieve the above purpose, the first aspect of the utility model provides a leveling structure for reducing the deformation of a PCB during furnace soldering. The PCB includes a PCB board main body and a plurality of shielding covers. The surface of the PCB board main body has a plurality of pressing areas, and each shielding cover is correspondingly arranged on the surface of each pressing area. The leveling structure includes a plurality of pressing parts, and a carrier, a pressing sheet, and a pressing cover arranged in sequence along the stacking direction;

[0007] The surface of the carrier has a mounting position for storing the PCB board main body;

[0008] The pressing sheet is pressed against the surface of the PCB board main body to pre-press the PCB board main body;

[0009] The surface of the pressing sheet has a plurality of cavities, and each cavity is correspondingly arranged with each shielding cover, so that at least part of the shielding cover on the surface of the PCB board main body is exposed;

[0010] The pressing cover is pressed against the surface of the pressing sheet and is detachably connected to the carrier;

[0011] The pressing part is arranged on the surface of the gland, and one or more of the pressing parts penetrate through the cavity of the pressing sheet and then press on the surface of the shielding cover at the corresponding position.

[0012] Furthermore, one or more pressing parts are also arranged along the edge of the pressing area on the surface of the gland to press on the edge area of the cavity on the surface of the pressing sheet.

[0013] Furthermore, the pressing part includes at least four elastic parts penetrating through the gland. The elastic parts have force - applying ends. When the pressing sheet and the gland are stacked, the elastic parts store energy and press on the surface of the shielding cover and / or the surface of the pressing sheet through the force - applying ends.

[0014] Furthermore, a first magnetic part is arranged on the surface of the carrier to be used for pulling the pressing sheet to be pressed against the surface of the main body of the PCB board.

[0015] Furthermore, two groups of positioning holes are provided on the surface of the main body of the PCB board. These two groups of positioning holes are symmetrically arranged with respect to the center line of the side on the length direction or width direction of the main body of the PCB board;

[0016] A flattening part matching with the positioning holes is arranged on the surface of the carrier to be used for flattening the main body of the PCB board.

[0017] Furthermore, the flattening part includes a fixing part and a stretching part. The fixing part and the stretching part are both arranged on the surface of the carrier and are respectively arranged corresponding to the two groups of positioning holes. When the main body of the PCB board is in the installation position, one group of positioning holes on the main body of the PCB board is embedded with the fixing part to maintain positioning, and the other group of positioning holes is embedded with the stretching part and is pulled by the stretching part to form a flattened state of the main body of the PCB board.

[0018] Furthermore, a magnetic part group is arranged on the surface of the carrier on the side opposite to the gland to be used for pulling the carrier and the gland to approach each other.

[0019] Furthermore, the magnetic part group includes a second magnetic part and a third magnetic part. The second magnetic part and the third magnetic part are respectively arranged on the surface of the carrier on the side opposite to the gland, and the magnetic poles on the opposite sides of the second magnetic part and the third magnetic part are opposite.

[0020] Due to the application of the above - mentioned scheme, the utility model has the following advantages and effects compared with the prior art:

[0021] The utility model can realize the secondary pressing action on the PCB through the cooperation of the pressing piece, the pressing cover and the pressing part. Specifically, first place the main body of the PCB board in the installation position, and then stack the pressing pieces on the carrier, so as to pre-press the main body of the PCB board through the pressing pieces. Due to the existence of the cavity, each shielding cover will be exposed. Then, stack the pressing covers on the pressing pieces. Since each cavity can penetrate one or more pressing parts, the surface of the shielding cover corresponding to each cavity will be subjected to the pressure of one or more pressing parts. That is, on the basis of the primary pressing of the pressing piece, the cooperation of the pressing part and the pressing cover completes the secondary pressing, reducing the probability of poor soldering caused by the deformation of the shielding cover components and the PCB deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG Figure 1 is a top view structural schematic diagram of the carrier provided by the embodiment of the utility model;

[0023] FIG Figure 2 is a top view structural schematic diagram of the main body of the PCB board provided by the embodiment of the utility model;

[0024] FIG Figure 3 is a top view structural schematic diagram of the pressing piece provided by the embodiment of the utility model;

[0025] FIG Figure 4 is a top view structural schematic diagram of the pressing cover provided by the embodiment of the utility model;

[0026] FIG Figure 5 is a top view structural schematic diagram when the main body of the PCB board and the carrier are installed in the embodiment of the utility model;

[0027] FIG Figure 6 is a top view structural schematic diagram when the pressing piece and the carrier are stacked in the embodiment of the utility model;

[0028] FIG Figure 7 is a top view structural schematic diagram when the carrier, the pressing piece and the pressing cover are stacked in sequence in the embodiment of the utility model;

[0029] FIG Figure 8 is a three-dimensional view when the carrier, the pressing piece and the pressing cover are stacked well in the embodiment of the utility model;

[0030] FIG Figure 9 is a main view longitudinal sectional structural schematic diagram when the elastic member is installed on the pressing cover in the embodiment of the utility model;

[0031] FIG Figure 10 is a main view longitudinal sectional structural schematic diagram when the carrier, the pressing piece and the pressing cover are stacked well in the embodiment of the utility model;

[0032] FIG Figure 11A perspective view of the pressing part provided by an embodiment of the present utility model installed on the pressing cover;

[0033] Appendix Figure 12 A perspective view of the pressing part provided by an embodiment of the present utility model pressing towards the pressing area;

[0034] Appendix Figure 13 A perspective view of the carrier provided by an embodiment of the present utility model.

[0035] In the above drawings: 1. PCB board main body; 2. shielding cover; 3. carrier; 4. pressing piece; 5. pressing cover; 6. pressing part; 7. installation position; 8. cavity; 9. elastic part; 10. positioning hole; 11. fixing part; 12. stretching part; 13. first magnetic part. Detailed implementation manners

[0036] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0037] The terms used herein are only for describing specific embodiments and are not intended to limit the present case. Singular forms such as "a", "this", "this", "the present", and "the" also include plural forms as used herein.

[0038] Regarding the use of "first", "second", etc. herein, it does not particularly refer to the meaning of order or sequence, nor is it used to limit the present case. It is only used to distinguish components or operations described with the same technical terms.

[0039] Regarding the use of "connection" or "positioning" herein, it can refer to two or more components or devices making direct physical contact with each other, or making indirect physical contact with each other. It can also refer to two or more components or devices operating or acting on each other.

[0040] Regarding the use of "include", "comprise", "have", etc. herein, they are all open-ended terms, that is, they mean including but not limited to.

[0041] Regarding the terms used herein, unless otherwise specified, they generally have the ordinary meanings of each term in this field, in the context of this case, and in the context of special content. Some terms used to describe the present case will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art regarding the description of the present case.

[0042] Such as Figures 1 - 13As shown in the figure, in the first embodiment of the present utility model, a leveling structure for reducing the deformation of a PCB during furnace soldering is proposed. The PCB includes a PCB board main body 1 and a plurality of shielding covers 2. The surface of the PCB board main body 1 has a plurality of pressing areas, and each shielding cover 2 is correspondingly arranged on the surface of each pressing area. The leveling structure includes a plurality of pressing parts 6, and a carrier 3, a pressing piece 4 and a pressing cover 5 are sequentially arranged in the stacking direction (generally, the stacking direction is to stack the carrier 3, the pressing piece 4 and the pressing cover 5 in sequence from bottom to top).

[0043] The surface of the carrier 3 has a mounting position 7 for storing the PCB board main body 1 (generally, the mounting position 7 can be set as a groove or a raised block matching the PCB board main body 1, and a groove is preferably selected here).

[0044] The pressing piece 4 is pressed against the surface of the PCB board main body 1 to pre-press the PCB board main body 1; the surface of the pressing piece 4 has a plurality of cavities 8, and each cavity 8 is correspondingly arranged with each shielding cover 2 so that at least part of the shielding cover 2 on the surface of the PCB board main body 1 is exposed; the pressing cover 5 is pressed against the surface of the pressing piece 4 and is detachably connected to the carrier 3 (for example, realized by means of pins, screws or adhesives, etc.); the pressing part 6 is arranged on the surface of the pressing cover 5, and one or more pressing parts 6 penetrate through the cavities 8 of the pressing piece 4 and then press against the surface of the corresponding shielding cover 2.

[0045] The present utility model can realize the secondary pressing action on the PCB through the cooperation of the pressing piece 4, the pressing cover 5 and the pressing part 6. Specifically, first place the PCB board main body 1 in the mounting position 7, and then stack the pressing piece 4 on the carrier 3, so as to press the PCB board main body 1 through the pressing piece 4. Due to the existence of the cavities 8, each shielding cover 2 will be exposed. Then, stack the pressing cover 5 on the pressing piece 4. Since one or more pressing parts 6 can penetrate into each cavity 8, the surface of the shielding cover 2 corresponding to each cavity 8 will be subjected to the pressure of one or more pressing parts 6, that is, on the basis of the first pressing of the pressing piece 4, the cooperation of the pressing part 6 and the pressing cover 5 completes the secondary pressing, reducing the probability of poor soldering due to the deformation of the shielding cover components and the deformation of the PCB.

[0046] Generally, the cavity can be selected as a long strip structure or a round hole structure. When it is set as a round hole structure, that is, a plurality of round holes corresponding to the pressing parts 6 are arranged on the cavity. However, this means that the shielding cover 2 is not completely exposed, but only the part corresponding to the pressing part 6 is exposed. And there is a risk that part of the surface of the shielding cover 2 is pressed by the pressing part 6 and part is pressed by the pressing piece 4, so the cavity 8 is selected to be in a long strip shape.

[0047] In some specific embodiments, in order to make the PCB board body 1 bear force evenly, one or more pressure parts 6 are also provided on the surface of the pressure cover 5 along the edge of the pressing area to apply pressure to the edge area of ​​the cavity 8 on the surface of the pressing sheet 4.

[0048] That is, when the shielding cover 2 is under pressure, in order to prevent the PCB body 1 from deforming at the edge of the cavity 8 on the surface of the pressing sheet 4, one or more pressure applying parts 6 apply pressure to the edge of the cavity 8 on the surface of the pressing sheet 4.

[0049] In some specific embodiments, the pressure-applying portion 6 includes at least four elastic members 9 (generally, preferably 4-6) that are inserted through the pressure cover 5. The elastic member 9 has a force-applying end. When the pressure sheet 4 and the pressure cover 5 are stacked, the elastic member 9 stores force and applies pressure to the surface of the shielding cover 2 and / or the surface of the pressure sheet 4 through the force-applying end (the structure of the elastic member 9 can be referred to Figure 9 , its lower end is the force-applying end, and a spring or other components may be arranged inside it. The spring may push the force-applying end to press on the surface of the shielding cover 2 or the pressing sheet 4. In actual operation, multiple elastic members 9 cooperate to apply pressure to the surface of the shielding cover 2 or the pressing sheet 4 or the surfaces of the shielding cover 2 and the pressing sheet 4).

[0050] Specifically, the process of applying pressure by the pressure applying unit 6 is as follows:

[0051] After the carrier 3 and the pressing sheet 4 are stacked, the pressing cover 5 needs to be stacked. When the pressing sheet 4 and the pressing cover 5 are stacked, the elastic member 9 will be compressed and contracted, thereby storing force and applying pressure to the surfaces of the shielding cover 2 and the pressing sheet 4 through the force-applying end.

[0052] In some specific embodiments, a magnetic member 13 is provided on the surface of the carrier 3 (the location of the magnetic member 13 is not fixed as long as the purpose of holding and pulling the pressing sheet 4 can be achieved) for pulling the pressing sheet 4 and pressing it against the surface of the PCB board body 1 .

[0053] When the pressing sheet 4 is pressed against the surface of the carrier 3 , the magnetic member 13 will pull the pressing sheet 4 to press against the surface of the PCB board body 1 , so that the PCB board body 1 will not move or deform.

[0054] Since the PCB body 1 is placed in the mounting position 7, although the pressing sheet 4 can maintain its flat state by pressing, there is still a risk of deformation of the PCB body 1 during welding. Therefore, in some specific embodiments, the surface of the PCB body 1 has two groups of positioning holes 10, and the two groups of positioning holes 10 are symmetrically arranged about the center line of the edge in the length direction or width direction of the PCB body 1;

[0055] The surface of the carrier 3 is provided with a flat piece that matches the positioning hole 10 to flatten the PCB board body 1 .

[0056] When the PCB board main body 1 is placed on the installation position 7, a flattening member cooperating with the positioning holes 10 can be used to flatten the PCB board main body 1, so that the flatness of the PCB board main body 1 is higher.

[0057] In some specific embodiments, the flattening member includes a fixing portion 11 and a stretching portion 12. Both the fixing portion 11 and the stretching portion 12 are arranged on the surface of the carrier 3 and are respectively arranged corresponding to two groups of positioning holes 10 (preferably in the state shown in Figure 1 and Figure 2 ). When the PCB board main body 1 is located at the installation position 7, a fixing portion 11 is embedded in a group of positioning holes 10 on the PCB board main body 1 to maintain positioning, and a stretching portion 12 is embedded in the other group of positioning holes 10 and is pulled by the stretching portion 12 to form a flattened state of the PCB board main body 1.

[0058] When the PCB board main body 1 is placed on the installation position 7, a fixing portion 11 is embedded in a group of positioning holes 10 on the PCB board main body 1 to fix one end of the PCB board main body 1, and a stretching portion 12 is embedded in the other group of positioning holes 10 and is pulled by the stretching portion 12 to form a flattened state of the PCB board main body 1.

[0059] In some specific embodiments, a magnetic member group is provided on the surface of the carrier 3 opposite to the pressing cover 5 for pulling the carrier 3 and the pressing cover 5 to approach each other.

[0060] In some specific embodiments, the magnetic member group includes a second magnetic member and a third magnetic member. The second magnetic member and the third magnetic member are respectively arranged on the surface of the carrier 3 opposite to the pressing cover 5, and the magnetic poles on the opposite sides of the second magnetic member and the third magnetic member are opposite.

[0061] The magnetic member group is arranged in this way to ensure that the PCB board main body 1 is completely attached to the carrier 3, that is, through the second magnetic member and the third magnetic member with opposite magnetic poles, the pressing cover 5 can be precisely attached to the carrier 3, indirectly making the PCB board main body 1 completely attached to the carrier 3.

[0062] It should be noted that in the drawings of the present utility model, Figure 2 A represented indicates the pressing area, Figure 10 C in represents the magnetic member group, Figure 4 B in represents the positions of a plurality of pressing portions 6 provided on the pressing cover 5 corresponding to the edge of the pressing area.

[0063] Working principle: (illustrated by an example)

[0064] First, load the PCB board main body 1 onto the installation position 7 on the carrier 3. When the PCB board main body 1 is placed on the installation position 7, a flattening member cooperating with the positioning holes 10 can be used to flatten the PCB board main body 1, that is, make the PCB board main body 1 as flat as possible by stretching, so that the flatness of the PCB board main body 1 is higher.

[0065] After the printing process is completed, a 0.6MM magnetic steel sheet (i.e., the pressing sheet 4) is attached to the surface of the PCB board main body 1. This magnetic steel sheet can be adsorbed by the magnetic part one 13 assembled on the carrier 3, so as to achieve the effect of covering and pressing the PCB board main body 1.

[0066] After the SMT soldering process is completed, the pressing cover 5 is placed on the carrier 3. When the pressing sheet 4 and the pressing cover 5 are stacked, the pressing part 6 will press on the surface of the shielding cover 2. That is, when the pressing sheet 4 and the pressing cover 5 are stacked, a plurality of elastic parts 9 arranged in the corresponding area of the cavity 8 will be simultaneously compressed and contracted, so as to store energy and press on the surface of the shielding cover 2 through the force application end. Each elastic part 9 can provide a pressure of 10~30gf, so as to ensure that the shielding cover components can maintain a high flatness state;

[0067] The pressing cover 5 will also press on the pressing sheet 4 at the same time. That is, 6~8 elastic parts 9 are designed at the edge of each pressing area for pressing. Each elastic part 9 provides a pressure of 10~50gf to ensure that the PCB board main body 1 is completely attached to the carrier 3. Finally, through the magnetic part two and the magnetic part three with opposite magnetic poles, the pressing cover 5 can be precisely attached to the carrier 3 together.

[0068] The above embodiments are only used to illustrate the technical concept and characteristics of the present invention. The purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A leveling structure for reducing the deformation of a PCB during furnace soldering. The PCB includes a PCB board body (1) and a plurality of shielding covers (2). The surface of the PCB board body (1) has a plurality of pressing areas, and each shielding cover (2) is correspondingly arranged on the surface of each of the pressing areas. It is characterized in that: The leveling structure includes a plurality of pressing parts (6), a carrier (3), a pressing sheet (4) and a pressing cover (5) which are sequentially arranged in the stacking direction; The surface of the carrier (3) has a mounting position (7) for storing the PCB board body (1); The pressing sheet (4) is pressed against the surface of the PCB board body (1) to pre-press the PCB board body (1); The surface of the pressing sheet (4) has a plurality of cavities (8), and each cavity (8) is correspondingly arranged with each shielding cover (2) so that at least a part of the shielding cover (2) on the surface of the PCB board body (1) is exposed; The pressing cover (5) is pressed against the surface of the pressing sheet (4) and is detachably connected to the carrier (3); The pressing part (6) is arranged on the surface of the pressing cover (5), and one or more pressing parts (6) penetrate through the cavity (8) of the pressing sheet (4) and then press the surface of the shielding cover (2) at the corresponding position; 2. The leveling structure for reducing the deformation of the PCB during furnace soldering according to claim 1, wherein: One or more pressing parts (6) are also arranged on the surface of the pressing cover (5) along the edge of the pressing area to press the edge area of the cavity (8) on the surface of the pressing sheet (4); 3. The leveling structure for reducing the deformation of the PCB during furnace soldering according to claim 2, wherein: The pressing part (6) includes at least four elastic members (9) arranged on the pressing cover (5), and the elastic members (9) have a force application end. When the pressing sheet (4) and the pressing cover (5) are stacked, the elastic members (9) store energy and press the surface of the shielding cover (2) and / or the surface of the pressing sheet (4) through the force application end; 4. The leveling structure for reducing the deformation of the PCB during furnace soldering according to claim 1, wherein: A first magnetic member (13) is arranged on the surface of the carrier (3) to be used for attracting the pressing sheet (4) to be pressed against the surface of the PCB board body (1); 5. The leveling structure for reducing the deformation of the PCB during furnace soldering according to claim 1, wherein: The surface of the PCB board body (1) has two groups of positioning holes (10), and the two groups of positioning holes (10) are symmetrically arranged about the center line of the side on the length direction or width direction of the PCB board body (1); A leveling member matched with the positioning holes (10) is arranged on the surface of the carrier (3) to be used for flattening the PCB board body (1); 6. The leveling structure for reducing the deformation of the PCB during furnace soldering according to claim 5, characterized in that: The leveling member includes a fixing part (11) and a stretching part (12). The fixing part (11) and the stretching part (12) are both arranged on the surface of the carrier (3) and are respectively correspondingly arranged with the two groups of positioning holes (10). When the PCB board body (1) is located at the mounting position (7), one group of positioning holes (10) on the PCB board body (1) is embedded with the fixing part (11) to maintain positioning, and the other group of positioning holes (10) is embedded with the stretching part (12) and is pulled by the stretching part (12) to form a flattened state of the PCB board body (1); 7. The leveling structure for reducing the deformation of the PCB during furnace soldering according to claim 1, wherein: A magnetic member group is arranged on the surface of the side of the carrier (3) opposite to the pressing cover (5) to be used for attracting the carrier (3) and the pressing cover (5) to approach each other; 8. The leveling structure for reducing the deformation of the PCB during furnace soldering according to claim 7, characterized in that: The magnetic member group includes a second magnetic member and a third magnetic member. The second magnetic member and the third magnetic member are respectively arranged on the surface of the side of the carrier (3) opposite to the pressing cover (5), and the magnetic poles on the opposite sides of the second magnetic member and the third magnetic member are opposite.

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