Auxiliary feeding device for sensors

Abstract

The utility model discloses an auxiliary sensor feeding device for thermometers. The device comprises a base and a tray arranged on the base, the tray is provided with a feeding groove, a transverse partition is arranged in the groove in the width direction, the transverse partition is provided with a plurality of pairs of wire lapping groove sets, the feeding groove is divided into a sensor assembly discharging area and a PCB discharging area, and each wire lapping groove set comprises two wire lapping grooves arranged at intervals; and a magnet for adsorbing and fixing the lead is arranged at the groove bottom or below the groove bottom. Guide hole sets are evenly distributed in the sensor assembly discharging area, and magnets are arranged below the sensor assembly discharging area. The wire lapping groove is in an inverted V shape, and a small hole is formed in the bottom of the wire lapping groove. A first enclosure is arranged on the peripheral side of the sensor assembly discharging area, a second enclosure is arranged on the PCB discharging area, the tray is detachably connected with the base, and the PCB discharging area is matched with a PCB in size. According to the utility model, the lead can be accurately positioned, the welding quality is improved, the feeding process is standard and orderly, the feeding effect is optimized, the device is convenient to maintain, replace and clean, and the use cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component soldering, and particularly relates to an auxiliary feeding device for soldering a temperature sensor of a thermometer and a PCB board. Background Art

[0002] In the production process of thermometers, the soldering of temperature sensors and PCB boards is a key process. The traditional soldering method is completed through manual operation. However, the probe and lead in the temperature sensor assembly, especially the lead part, are very thin, and it is difficult to stabilize their positions before soldering. That is, holding the lead by hand to make the end far away from the probe rest on the pin position of the PCB board for soldering, and it often runs off or leaves the pin position. This makes manual soldering not only inefficient, but also due to the instability of manual operation, it is easy to cause uneven soldering quality, affecting the performance and reliability of the thermometer.

[0003] Therefore, in order to solve the problems existing in the existing manual temperature sensor soldering technology, a sensor auxiliary feeding device with a simple structure and capable of stably fixing the position of the temperature sensor lead and effectively ensuring the soldering quality of the temperature sensor with high efficiency is developed. Summary of the Invention

[0004] In order to solve the above technical problems, the purpose of the utility model is to provide a sensor auxiliary feeding device with a simple structure, high efficiency and capable of effectively ensuring the soldering quality.

[0005] The technical solution of the utility model is realized as follows:

[0006] A sensor auxiliary feeding device includes:

[0007] A base and a tray arranged on the base. The tray is provided with a feeding groove. There is a cross partition in the middle of the feeding groove along the width direction of the tray. The cross partition is provided with multiple pairs of wire laying grooves for separating leads. And the cross partition divides the feeding groove into a sensor component feeding area and a PCB board feeding area. Each pair of wire laying grooves includes two wire laying grooves arranged at intervals, and a magnet for adsorbing and fixing the lead position is placed at the bottom or below the bottom of each wire laying groove; after the PCB board is placed in place in the PCB board feeding area, the lead of the sensor component first passes through the wire laying groove for adsorption positioning to rest on the pin position of the PCB board, and then the sensor component is placed in the sensor component feeding area for soldering operation.

[0008] Preferably, along the arrangement direction of the wire laying groove group, a plurality of guiding hole groups are evenly distributed on the sensor component feeding area. Each guiding hole group includes a plurality of guiding holes arranged at intervals along the length direction of the tray. A magnet for adsorbing and guiding the lead is placed below the guiding hole, so as to straighten the rear part of the sensor lead, thus ensuring the regularity and orderliness of the lead.

[0009] Preferably, the partition is a strip protruding from the bottom of the feeding trough, and the strip part between the two slot groups in each pair of slot groups forms a protrusion, and the position of each guiding hole group corresponds to the middle position of the protrusion. After the rear part of the sensor lead is straightened, the front part branches, thereby further significantly improving the regularity of the lead and making its arrangement more orderly.

[0010] Preferably, the magnet is installed between the base and the tray. Specifically, an embedding groove for the magnet is provided on the surface of the base 1, and a small hole exposing part of the magnet is provided at the bottom of the slot for the wire harness, eliminating the gravitational obstacle and increasing the adsorption force to adsorb the lead, ensuring the accurate and stable position of the lead.

[0011] Preferably, the partition is a strip protruding from the bottom of the feeding trough, and the slot for the wire harness is an inverted V-shaped slot. The wide position at the slot opening facilitates the smooth introduction of the lead, and the narrow position at the slot bottom helps to accurately position the sensor lead, thereby improving the accuracy and efficiency of the entire feeding process.

[0012] Preferably, a first enclosure is provided on the periphery of the feeding area of the sensor assembly for limiting the sensor assembly, and a second enclosure for limiting the PCB board is provided in the feeding area of the PCB board to prevent the PCB board from shifting in position during the operation.

[0013] Preferably, the connection between the tray and the base is detachable, making it more convenient and flexible during maintenance, replacement, cleaning and other operations. For example, when processing PCB boards of different sizes, the tray of different sizes can be replaced to achieve this.

[0014] Preferably, the feeding area of the PCB board matches the size of the PCB board to be welded, which can significantly improve the placement accuracy of the PCB board, avoid position deviation during the operation, and thus effectively improve the accuracy and efficiency of the entire welding operation.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] 1. By arranging the slot for the wire harness and the magnet, the utility model can accurately position the lead of the sensor assembly and significantly improve the welding quality.

[0017] 2. The clear division of the feeding area of the sensor assembly and the feeding area of the PCB board, as well as the setting of the enclosures, make the feeding process more standardized and orderly, effectively improving the production efficiency.

[0018] 3. The guiding hole group and the magnet below help to straighten the lead, and the inverted V-shaped slot for the wire harness facilitates the introduction and positioning of the lead, further optimizing the feeding effect.

[0019] 4. The detachable connection method between the tray and the base facilitates the cleaning, maintenance, and replacement of the device, reducing the usage cost. Brief Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of the present utility model;

[0021] Figure 2 is an enlarged partial view of the cross partition of the present utility model;

[0022] Figure 3 is an enlarged partial view of the tray of the present utility model;

[0023] Figure 4 is a schematic diagram of the pre-welding of the lead wire of the temperature sensor of the present utility model with the PCB board;

[0024] Figure 5 is a schematic diagram of the positional relationship between the temperature sensor assembly and the unit circuit board.

[0025] Each reference numeral is: 1 - base, 2 - tray, 3 - loading chute, 4 - cross partition, 5 - wire slot group, 5a - wire slot, 6 - sensor feeding area, 7 - PCB board feeding area, 8 - magnet, 9 - guiding hole group, 9a - guiding hole, 10 - small hole below the wire slot, 11 - first enclosure, 12 - second enclosure, 13 - protrusion between wire slots, 21 - sensor assembly, 21a - lead wire, 21b - probe, 22 - lead wire welding position, 23 - PCB board, 24 - unit circuit board. Detailed Embodiment

[0026] In order to more clearly understand the above-mentioned objects, features, and advantages of the present utility model, the present utility model will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0027] Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present utility model is not limited by the specific embodiments disclosed below.

[0028] The detailed embodiment of the present utility model is as follows:

[0029] As Figures 1 to 3As shown in the figure, the sensor-assisted feeding device of the present utility model is composed of a base 1 and a tray 2 arranged on the base 1. A feeding groove 3 is formed on the tray 2. A cross partition 4 higher than the bottom of the feeding groove 3 is arranged in the middle of the feeding groove 3 along the width direction of the tray. A plurality of pairs of wire laying groove groups 5 for separating leads are arranged on the cross partition 4, and the cross partition 4 divides the feeding groove 3 into a sensor component feeding area 6 and a PCB board feeding area 7. The size of the PCB board feeding area 7 can be determined according to the size of the PCB board to be welded. The PCB board 23 is jointly composed of a plurality of unit circuit boards 24 connected by dotted lines. In this embodiment, the PCB board 23 to be processed is composed of eight unit circuit boards 24. For example, when welding PCB boards 23 with different quantities and sizes, only the tray 2 of the PCB board feeding area 7 with the corresponding size needs to be replaced.

[0030] In this embodiment, each pair of wire laying groove groups 5 includes two wire laying grooves 5a arranged at intervals. In the same wire laying groove group 5, the distance between two adjacent wire laying grooves 5a is determined by the distance between two pin positions on the unit circuit board 24, and a magnet 8 specially used for adsorbing and fixing the lead position is placed at the bottom of or below the bottom of each wire laying groove 5a.

[0031] Furthermore, if the magnet 8 is fixed at the bottom of the wire laying groove 5a, theoretically, it can be achieved by means of inlaying or adhesive bonding. However, in order to adapt to the width of the lead, the bottom of the wire laying groove 5a should not be too wide. Therefore, the size of the magnet 8 installed in the above way is small and inconvenient to take. Therefore, in this embodiment, it is preferred to install the magnet 8 below the bottom of the wire laying groove 5a. The installation position of the magnet 8 is between the tray 2 and the base 1. Specifically, an embedding groove for installing the magnet 8 is arranged on the surface of the base 1. In this way, the magnet 8 can be larger, and it can span the bottom position of the wire laying groove 5a, which is convenient for taking and installing. As a preference of this embodiment, in order to eliminate the gravitational obstacle, increase the adsorption force to adsorb the lead, and ensure the accurate and stable position of the lead, a small hole 10 exposing the magnet 8 is arranged at the bottom of the wire laying groove 5a.

[0032] Along the arrangement direction of the wire laying groove groups 5, a plurality of guiding hole groups 9 are evenly distributed in the sensor component feeding area 6. The guiding hole groups 9 correspond to the number of sensor components 21 and the unit circuit boards 24 to be welded. Each guiding hole group 9 includes a plurality of guiding holes 9a distributed at intervals along the length direction of the tray 2 with appropriate spacing. A magnet for guiding the rear end of the sensor lead is arranged below the guiding hole 9a, so that after the rear part of the sensor lead is straightened, the front part is bifurcated, thereby further significantly improving the regularity of the lead and making its arrangement more orderly.

[0033] Furthermore, a rib portion between two wire slots 5a in each pair of wire slot groups 5 forms a protrusion 13. The wire slot 5a is an inverted V-shaped slot. The wide position of the slot opening facilitates the smooth introduction of the lead wire, and the narrow position of the slot bottom helps to accurately position the sensor lead wire, thereby improving the accuracy and efficiency of the entire feeding process. The position of each guiding hole group 9 corresponds to the middle position of the protrusion 13.

[0034] As Figure 1 shown, a first enclosure 11 is provided on the periphery of the sensor component feeding area 6, which can play a certain limiting role for the placed sensor component 21. A second enclosure 12 for limiting the PCB board 23 is provided in the PCB board feeding area 7 to ensure the stable and accurate position of the PCB board 23 during placement.

[0035] As Figure 4 、 5 shown, after the magnet 8 at the bottom of the wire slot 5a adsorbs and fixes the lead wire 21a to the wire slot 5a and coincides with the pin welding position 22 on the PCB board 23 of the plurality of unit circuit boards 24 connected by dotted lines, the welding operation can be carried out.

[0036] In actual operation, first, the PCB board 23 is accurately placed in the PCB board feeding area 7, and its position is ensured to be stable by relying on the second enclosure 12. Then, the lead wire 21a of the sensor component 21 passes through the wire slot 5a, and the position of the lead wire is fixed under the action of the magnet 8 and is placed on the pin welding position 22 of the PCB board. The sensor component 21 is placed in the sensor component feeding area 6. The lead wire 21a near the wire slot 5a end is adsorbed and fixed by the magnet 8 at the bottom of the wire slot, and the magnet under the guiding hole group 9 adsorbs the lead wire 21a between the sensor probe 21b and the pin, which can further straighten and guide. Since the tray 2 is detachably connected to the base 1, it is convenient for daily maintenance and cleaning. At the same time, the PCB board feeding area 7 matches the size of the PCB board 23 to be welded, improving the placement accuracy.

[0037] The above schematically describes the present invention and its implementation manners. This description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual structure is not limited thereto. Therefore, if those of ordinary skill in the art are inspired by it and design similar structural manners and embodiments without creative efforts without departing from the creative purpose of the present invention, they shall fall within the protection scope of the present invention.

Claims

1. A sensor-assisted feeding device, characterized in that: It includes a base (1) and a tray (2) arranged on the base (1). The tray (2) is provided with a loading groove (3). There is a cross partition (4) arranged along the width direction of the tray in the middle of the loading groove (3). Multiple pairs of wire laying groove groups (5) for separating leads are arranged on the cross partition (4). The cross partition (4) divides the loading groove (3) into a sensor component feeding area (6) and a PCB board feeding area (7). Each pair of wire laying groove groups (5) includes two wire laying grooves (5a) arranged at intervals. And a magnet (8) for adsorbing and fixing the position of the lead is placed at the bottom of each wire laying groove (5a) or below the bottom of the groove. After the PCB board is placed in place in the PCB board feeding area (7), the leads of the sensor component (21) first pass through the wire laying groove (5a) for wire passing and adsorption positioning to be laid on the pin positions of the PCB board, and then the sensor component (21) is placed in the sensor component feeding area (6) for welding operation.

2. The sensor-assisted loading device according to claim 1, wherein In the arrangement direction of the wire laying groove groups (5), a plurality of guiding hole groups (9) are evenly distributed on the sensor component feeding area (6). Each guiding hole group (9) includes a plurality of guiding holes (9a) spaced along the length direction of the tray (2). A magnet for adsorbing and guiding the lead is placed below the guiding hole (9a).

3. The sensor-assisted feeding device according to claim 2, wherein, The cross partition (4) is a rib protruding from the bottom of the loading groove (3). The rib part between the two wire laying grooves (5a) in each pair of wire laying groove groups (5) forms a protrusion. The position of each guiding hole group (9) corresponds to the middle position of the protrusion.

4. The sensor-assisted feeding device according to claim 1, wherein The magnet (8) is installed between the base (1) and the tray (2). The bottom of the wire laying groove (5a) is provided with a small hole (10) exposing part of the magnet.

5. The sensor-assisted feeding device according to claim 1, wherein The cross partition (4) is a rib protruding from the bottom of the loading groove (3). The wire laying groove (5a) is an inverted V-shaped groove.

6. The sensor-assisted feeding device according to claim 1, characterized in that A first enclosure (11) is provided on the periphery of the sensor component feeding area (6). A second enclosure (12) for limiting the PCB board is provided in the PCB board feeding area (7).

7. The sensor-assisted feeding device according to claim 1, characterized in that, The tray (2) and the base (1) are detachably connected.

8. The sensor-assisted feeding device according to claim 1, wherein The PCB board feeding area (7) matches the size of the PCB board.

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