Packaging structure and camera module

Abstract

The utility model discloses a packaging structure and a camera module group, and the packaging structure comprises a support, an optical filter disposed at the upper end of the support, a photosensitive chip disposed at the lower end of the support, a circuit board disposed at the lower end of the photosensitive chip, and a packaging colloid disposed between the support and the circuit board. The lower end of the support is provided with a connecting part which protrudes in the direction away from the optical filter and is connected with the photosensitive chip, the support is further provided with a light-transmitting cavity penetrating through the support and the connecting part in the optical axis direction, the size of the connecting part is smaller than that of the photosensitive chip, and after the connecting part is connected with the photosensitive chip, a packaging gap is formed between the support and the circuit board. A plurality of connecting wires with one ends connected with the photosensitive chip and the other ends connected with the circuit board are all located in the packaging gap, the packaging colloid in the packaging gap enables the connecting wires to be sealed in the packaging gap, the size of the connecting part is smaller than that of the photosensitive chip, a certain safety distance is not reserved between the support and the connecting wires any more, the placing space of the support is reduced, and the reliability of the support is improved. Therefore, the structure size can be reduced to realize lightening and thinning of equipment.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic products, and particularly relates to a packaging structure and a camera module. Background Art

[0002] With the development of electronic technology, the integration degree of components on a circuit board is getting higher and higher. Electronic devices such as mobile phones are generally equipped with camera modules, which include components such as a circuit board, a photosensitive chip, a filter, and a lens assembly. Among them, the photosensitive chip needs to be packaged on the circuit board to achieve electrical signal connection between the photosensitive chip and the circuit board.

[0003] Currently, usually, a filter is pasted on the upper end of a bracket for carrying the filter, the lower end of the bracket is connected to the circuit board, and the photosensitive chip is arranged between the bracket and the circuit board. Since both sides of the photosensitive chip are connected to the circuit board by wire bonding, when packaging the photosensitive chip, a certain safety distance needs to be reserved between the bracket, the connecting wire, and the components on the circuit board to prevent the bracket from contacting or hitting the wire and the components, resulting in functional failure. Therefore, a relatively large area for placing the bracket needs to be reserved on the circuit board for connecting the bracket to the circuit board. However, such a packaging method will result in a relatively large size of the overall packaging structure, which is not conducive to the thinning of the device. Summary of the Utility Model

[0004] Aiming at the technical problems in the prior art that the bracket requires a relatively large space for placement, and the size after packaging is relatively large, which is not conducive to the thinning of the device, the utility model provides a packaging structure and a camera module.

[0005] In order to achieve the above object, the utility model adopts the following technical solutions:

[0006] A packaging structure includes a bracket, a filter installed at the upper end of the bracket, a photosensitive chip arranged at the lower end of the bracket, a circuit board arranged at the lower end of the photosensitive chip, and a packaging colloid arranged between the bracket and the circuit board. The lower end of the bracket has a connecting portion protruding away from the filter and connected to the photosensitive chip. The bracket also has a light-transmitting cavity penetrating the bracket and the connecting portion along the optical axis direction. The size of the connecting portion is smaller than that of the photosensitive chip. After the connecting portion is connected to the photosensitive chip, a packaging gap is formed between the bracket and the circuit board. A plurality of connecting wires with one end connected to the photosensitive chip and the other end connected to the circuit board are all located in the packaging gap, and the packaging colloid is filled in the packaging gap so that the connecting wires are sealed in the packaging gap.

[0007] Furthermore, the upper end surface of the bracket is provided with a mounting groove which is recessed toward the connecting portion, and a light-transmitting hole communicating with the light-transmitting cavity is opened on the bottom surface of the mounting groove, and the filter is installed in the mounting groove and covers the light-transmitting hole.

[0008] Furthermore, the bottom surface of the mounting groove is defined as a first bonding surface, and the side wall of the mounting groove is defined as a second bonding surface. The second bonding surface is provided with a plurality of U-shaped grooves recessed toward the outside of the mounting groove, and the plurality of U-shaped grooves are distributed one-to-one at each corner position of the mounting groove.

[0009] Furthermore, the first bonding surface is provided with a U-shaped exhaust groove, and the notch of the U-shaped exhaust groove is communicated with the light-transmitting hole.

[0010] Furthermore, the second bonding surface is also provided with an avoidance groove for avoiding the U-shaped exhaust groove, and the avoidance groove is recessed toward the outside of the installation groove.

[0011] Furthermore, the axes of the light-transmitting hole and the light-transmitting cavity are on the same straight line, the shape of the light-transmitting hole is the same as that of the light-transmitting cavity, and each corner position of the light-transmitting hole and the light-transmitting cavity is in the shape of an arc chamfer.

[0012] Furthermore, the lower end surface of the bracket has a protrusion extending toward a direction away from the filter, and the lower end surface of the bracket and the side wall of the protrusion form two L-shaped bonding areas arranged at intervals, and a first sub-gap is formed between the L-shaped bonding area and the circuit board; the end surface of the protrusion on one side close to the filter is connected to the first end of the connecting portion, and the end surface of the protrusion on one side away from the filter forms a second sub-gap with the circuit board, and the first sub-gap and the second sub-gap together form the packaging gap.

[0013] Furthermore, the second end of the connecting portion is bonded to the non-photosensitive area of ​​the photosensitive chip.

[0014] Furthermore, the packaging colloid is a low-pressure injection molding colloid.

[0015] A camera module comprises a packaging structure and a lens assembly connected to the upper end of the packaging structure, wherein the lens assembly comprises a lens base with a lower end bonded to a bracket and a lens connected to the upper end of the lens base.

[0016] In summary, the beneficial effects of the present utility model are as follows: First, the bracket is connected to the photosensitive chip through a connecting portion smaller in size than the photosensitive chip. Therefore, when processing the ornament, the required space for the ornament is smaller. After the connecting portion is connected to the photosensitive chip, the bracket is above the connecting line, and the encapsulation colloid is filled between the bracket and the circuit board to seal the connecting line. There is no need to reserve space for the ornament on one side of the connecting line on the circuit board. Therefore, the size of the encapsulation structure can be reduced. Second, the installation groove is a concave groove, and the filter is bonded in the installation groove and connected to the bracket in a sunken manner, which can reduce the structural height and thus make the camera module more thin and light. Third, U-shaped grooves are provided at the respective corner positions in the installation groove, and the U-shaped grooves are recessed in the direction of the outside of the installation groove, which can leave a larger glue overflow space when pasting the filter to prevent the glue from being squeezed onto the surface of the filter to generate stray light. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. is a schematic structural diagram of an encapsulation structure provided by the present utility model.

[0018] Figure 2 is Figure 1 the top view of.

[0019] Figure 3 is Figure 2 the sectional view taken along the line A-A of.

[0020] Figure 4 is Figure 3 the schematic structural diagram when the encapsulation colloid is not filled in.

[0021] Figure 5 FIG. is a three-dimensional structural diagram of the bracket in the present utility model.

[0022] Figure 6 is Figure 5 the schematic structural diagram of the bottom surface of the bracket in.

[0023] Figure 7 FIG. is a schematic structural diagram of a camera module provided by the present utility model.

[0024] In the figure, 100 - bracket, 110 - connecting portion, 120 - light-transmitting cavity, 130 - installation groove, 131 - light-transmitting hole, 132 - first bonding surface, 1320 - U-shaped exhaust groove, 133 - second bonding surface, 1330 - U-shaped groove, 1331 - avoidance groove, 140 - protruding portion, 141 - L-shaped bonding area, 200 - filter, 300 - photosensitive chip, 310 - connecting line, 400 - circuit board, 500 - encapsulation colloid, 600 - encapsulation gap, 700 - lens assembly, 710 - lens base, 720 - lens. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The present utility model will be further described below in conjunction with specific illustrations.

[0026] The photosensitive chip needs to be encapsulated on the circuit board. The current bracket used has a free opening at the lower end, and the surrounding side walls enclose the photosensitive chip. Moreover, a certain safety distance needs to be reserved between the side wall of the bracket and the connecting wire.

[0027] Please refer to Figure 1 and Figure 2 The present utility model provides a packaging structure, including a bracket 100, a filter 200 installed at the upper end of the bracket 100, a photosensitive chip 300 disposed at the lower end of the bracket 100, a circuit board 400 disposed at the lower end of the photosensitive chip 300, and a packaging colloid 500 disposed between the bracket 100 and the circuit board 400. The lower end of the bracket 100 has a connecting portion 110 that protrudes away from the filter 200 and is connected to the photosensitive chip 300. The bracket 100 further has a light-transmitting cavity 120 that penetrates the bracket 100 and the connecting portion 110 along the optical axis direction. Please refer to Figure 3 The size of the connecting portion 110 is smaller than the size of the photosensitive chip 300. After the connecting portion 110 is connected to the photosensitive chip 300, please refer to Figure 4 A packaging gap 600 is formed between the bracket 100 and the circuit board 400. A plurality of connecting wires 310, one end of which is connected to the photosensitive chip 300 and the other end is connected to the circuit board 400, are all located in the packaging gap 600. The packaging colloid 500 is filled in the packaging gap 600 so that the connecting wires 310 are sealed in the packaging gap 600. The connecting portion 110 protrudes from the bottom surface of the bracket 100 towards the photosensitive chip 300. After the connecting portion 110 is connected to the photosensitive chip 300, there is a height difference between the circuit board 400 and the bracket 100, and the gap between the two is the packaging gap 600. The connecting wires 310 are accommodated in the packaging gap 600. After injecting the packaging colloid 500 into the packaging gap 600, it is possible to seal the connecting wires 310 and the components on the circuit board 400. The photosensitive chip 300 is encapsulated between the bracket 100 and the circuit board 400 to prevent dust from entering and affecting imaging. Moreover, the size of the connecting portion 110 connected to the photosensitive chip 300 is smaller than that of the photosensitive chip, and no larger placement space is required. The connecting wires 310 are located in the packaging gap 600, and no certain safety distance needs to be reserved between the bracket 100 and the connecting wires 310, further reducing the placement space of the bracket 100, so that the size of the bracket 100 can be reduced. Therefore, the overall size of the packaging structure can be reduced, which is beneficial to realizing the thinning of the device.

[0028] Please refer to Figure 5, a mounting groove 130 that is recessed toward the connecting portion 110 is provided on the top surface of the bracket 100, and a light-transmitting hole 131 communicating with the light-transmitting cavity 120 is formed on the bottom surface of the mounting groove 130. The filter 200 is installed in the mounting groove 130 and covers the light-transmitting hole 131. The mounting groove 130 is a recessed groove. After the filter 200 is installed in the mounting groove 130, compared with the conventional structure of installing the filter on the surface of the bracket, after the filter 200 is installed in the bracket 100 in a sunken manner, the height of the encapsulation structure can be reduced, and the thickness of the device can be reduced.

[0029] The bottom surface of the mounting groove 130 is defined as a first bonding surface 132, and the side wall of the mounting groove 130 is defined as a second bonding surface 133. The second bonding surface 133 is provided with a plurality of U-shaped grooves 1330 that are recessed toward the outside of the mounting groove 130, and the plurality of U-shaped grooves 1330 are distributed at the respective corner positions of the mounting groove 130 in a one-to-one correspondence. Glue is applied to the first bonding surface 132 to bond the filter 200 in the mounting groove 130. After the glue is squeezed, it will approach the second bonding surface 133. The U-shaped grooves 1330 provided on the second bonding surface 133 are used as an overflow space for glue to prevent the glue from being squeezed onto the surface of the filter 200, which will change the light transmittance of the filter 200 and cause stray light to be generated.

[0030] The axes of the light-transmitting hole 131 and the light-transmitting cavity 120 are on the same straight line, improving the light transmission efficiency. The shape of the light-transmitting hole 131 is the same as the shape of the light-transmitting cavity 120. The inner cavity of the light-transmitting hole 131 actually overlaps with a part of the light-transmitting cavity 120, so that the light can maintain good consistency when passing through, reducing the light distortion or loss caused by shape mismatch. The respective corner positions of the light-transmitting hole 131 and the light-transmitting cavity 120 are in an arc chamfer shape. When subjected to an external force, the arc chamfer can disperse the stress and reduce the risk of structural damage.

[0031] Please refer to Figure 6The lower end surface of the bracket 100 has a protruding portion 140 protruding in a direction away from the filter 200. The lower end surface of the bracket 100 and the side wall of the protruding portion 140 form two L-shaped bonding areas 141 arranged at intervals. A first sub-gap is formed between the L-shaped bonding area 141 and the circuit board 400. The end surface of the protruding portion 140 close to the filter 200 is connected to the first end of the connecting portion 110. The end surface of the protruding portion 140 away from the filter 200 forms a second sub-gap with the circuit board 400. The first sub-gap and the second sub-gap together form the packaging gap 600. The protruding portion 140 protrudes toward the photosensitive chip 300, and the connecting portion 110 is connected to the lower end of the protruding portion 140, which can reasonably increase the height difference between the circuit board 400 and the bracket 100, so as to facilitate the accommodation of the connecting wire 310.

[0032] The second end of the connecting portion 110 is bonded to the non-photosensitive area of ​​the photosensitive chip 300, and the first bonding surface 132 is provided with a U-shaped exhaust groove 1320, and the notch of the U-shaped exhaust groove 1320 is communicated with the light-transmitting hole 131. The second bonding surface 133 is also provided with an escape groove 1331 for avoiding the U-shaped exhaust groove 1320, and the escape groove 1331 is recessed toward the outside of the mounting groove 130, which can avoid a larger exhaust space. The U-shaped exhaust groove 1320 keeps the internal and external air pressure balanced to prevent the formation of a closed space in the light-transmitting hole 131 during bonding, which will affect the heating and curing of the glue at the position of the connecting portion 110.

[0033] The packaging colloid 500 is a low-pressure injection molding colloid, which usually has good insulation performance and can effectively isolate the electrical contact between the bracket 100 and the circuit board 400 to prevent electrical faults such as short circuits. The packaging colloid 500 can be tightly filled in the packaging gap 600 to form a solid packaging structure, effectively enhancing the structural strength of the entire packaging structure to prevent damage caused by vibration or impact, and has good sealing performance, which can effectively prevent external impurities such as dust and water vapor from entering the packaging structure, protecting the internal precision components from pollution and erosion.

[0034] See also Figure 7, A camera module, a packaging structure, and a lens assembly 700 connected to the upper end of the packaging structure. The lens assembly 700 includes a lens base 710 adhesively bonded to the lower end of the bracket 100 and a lens 720 connected to the upper end of the lens base 710. The bracket 100 is above the connection line 310, and it is no longer necessary for the side wall of the bracket 100 to be on one side of the connection line 310 and at a certain distance. Therefore, the placement space of the bracket 100 is reduced, and the size of the packaging structure connected to the lens base 710 can be reduced. The filter 200 is installed in the installation groove 130 in a sunken manner, which can also reduce the height of the camera module, making the device more lightweight and thinner.

[0035] For the above packaging structure and camera module, firstly, the bracket 100 is connected to the photosensitive chip 300 through a connecting portion 110 with a size smaller than that of the photosensitive chip 300. Therefore, when processing the placement, the required placement space is smaller. After the connecting portion 110 is connected to the photosensitive chip 300, the bracket 100 is above the connection line 310, and the encapsulation colloid 500 is filled between the bracket 100 and the circuit board 400 to seal the connection line 310. It is no longer necessary to reserve a placement space on one side of the connection line 310 on the circuit board 400. Therefore, the size of the packaging structure can be reduced. Secondly, the installation groove 130 is a recessed groove, and the filter 200 is adhesively bonded in the installation groove 130 and connected to the bracket 100 in a sunken manner, which can reduce the structural height, thereby making the camera module more lightweight and thinner. Thirdly, U-shaped grooves 1330 are provided at each corner position in the installation groove 130. The U-shaped grooves 1330 are recessed towards the outside of the installation groove 130, which can leave a larger glue overflow space when pasting the filter 200 to prevent the glue from being squeezed onto the surface of the filter 200 to generate stray light.

[0036] The above is only the implementation mode of the present invention, and it does not limit the patent scope of the present invention accordingly. All equivalent structures made by using the content of the specification and drawings of the present invention, directly or indirectly applied in other related technical fields, are equally within the patent protection scope of the present invention.

Claims

1. An encapsulation structure, characterized in that: The invention comprises a bracket, a filter installed at the upper end of the bracket, a photosensitive chip arranged at the lower end of the bracket, a circuit board arranged at the lower end of the photosensitive chip, and a packaging colloid arranged between the bracket and the circuit board. The lower end of the bracket has a connecting portion which protrudes away from the filter and is connected to the photosensitive chip. The bracket also has a light-transmitting cavity which passes through the bracket and the connecting portion along the optical axis direction. The size of the connecting portion is smaller than the size of the photosensitive chip. When the connecting portion is connected to the photosensitive chip, a packaging gap is formed between the bracket and the circuit board. A plurality of connecting wires with one end connected to the photosensitive chip and the other end connected to the circuit board are all located in the packaging gap. The packaging colloid is filled in the packaging gap so that the connecting wires are sealed in the packaging gap.

2. The encapsulated structure according to claim 1, characterized in that: The upper end surface of the bracket is provided with a mounting groove which is recessed toward the connecting portion, and a light-transmitting hole communicating with the light-transmitting cavity is opened on the bottom surface of the mounting groove. The filter is installed in the mounting groove and covers the light-transmitting hole.

3. The encapsulation structure according to claim 2, wherein: The bottom surface of the mounting groove is defined as a first bonding surface, and the side wall of the mounting groove is defined as a second bonding surface. The second bonding surface is provided with a plurality of U-shaped grooves recessed toward the outside of the mounting groove, and the plurality of U-shaped grooves are distributed one-to-one at each corner position of the mounting groove.

4. The encapsulation structure according to claim 3, wherein: The first bonding surface is provided with a U-shaped exhaust groove, and the notch of the U-shaped exhaust groove is communicated with the light-transmitting hole.

5. The encapsulation structure according to claim 4, wherein: The second bonding surface is also provided with an avoidance groove for avoiding the U-shaped exhaust groove, and the avoidance groove is recessed toward the outside of the installation groove.

6. The encapsulation structure according to claim 2, wherein: The axes of the light-transmitting hole and the light-transmitting cavity are on the same straight line, the shape of the light-transmitting hole is the same as that of the light-transmitting cavity, and each corner position of the light-transmitting hole and the light-transmitting cavity is in the shape of an arc chamfer.

7. The encapsulation structure according to claim 1, wherein: The lower end surface of the bracket has a protrusion protruding in a direction away from the filter, and the lower end surface of the bracket and the side wall of the protrusion form two L-shaped bonding areas arranged at intervals, and a first sub-gap is formed between the L-shaped bonding area and the circuit board; the end surface of the protrusion on one side close to the filter is connected to the first end of the connecting portion, and the end surface of the protrusion on one side away from the filter forms a second sub-gap with the circuit board, and the first sub-gap and the second sub-gap together form the packaging gap.

8. The encapsulation structure according to claim 7, wherein: The second end of the connecting portion is bonded to the non-photosensitive area of ​​the photosensitive chip.

9. The encapsulation structure according to any one of claims 1-8, characterized in that: The packaging colloid is a low-pressure injection molding colloid.

10. A camera module, characterized in that: It comprises a packaging structure as described in any one of claims 1 to 8 and a lens assembly connected to the upper end of the packaging structure, wherein the lens assembly comprises a lens base with a lower end bonded to the bracket and a lens connected to the upper end of the lens base.

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