Stainless steel semiconductor-grade cleaning treatment device
By introducing a loading mechanism and adjustment module into the stainless steel semiconductor cleaning device, combined with electric push rods and rack mechanisms, the problem of residual chemical polishing liquid on the surface of the stainless steel semiconductor is solved after cleaning, and the dual-station operation of efficient cleaning and drainage is achieved, improving the user experience of the device.
Patent Information
- Application Number
- CN202422459395.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-10-11
AI Technical Summary
The existing stainless steel semiconductor cleaning devices lack drainage operation after cleaning, resulting in residual chemical polishing liquid, affecting the cleaning effect and user experience.
A stainless steel semiconductor-level clean treatment device including a loading mechanism, a adjustment module and a loading module is designed. Dual-station work is realized through electric push rods and rack mechanisms, and draining operations are combined with slope plates and filters to ensure that the clean stainless steel semiconductor is cleaned and drained during loading and unloading.
The working efficiency and user experience of the device are improved. Through the alternately rising discharge box assists in loading and unloading, the efficient transportation and draining of the clean stainless steel semiconductor is achieved, and the cleaning effect is optimized.
Smart Images
Figure CN223087040U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of stainless steel semiconductor cleaning, in particular to a stainless steel semiconductor-level cleaning device. Background Technique
[0002] In the existing technology, the cleaning of stainless steel semiconductors is carried out by using a chemical polishing solution in cooperation with a power supply. For example, a stainless steel semiconductor-level cleaning device described in the publication number CN210736944U includes a support rod, and the upper end of the support rod is fixedly connected with a mounting rod. An electric guide rail is fixedly connected inside the mounting rod, and an electric slider is movably connected inside the electric guide rail. The upper end of the electric slider is fixedly connected with a first cylinder;
[0003] Although the above device performs loading and unloading by grasping with a second cylinder, it lacks a draining operation, resulting in a large amount of chemical polishing solution remaining on the surface of the cleaned stainless steel semiconductor. Directly transporting it through a belt conveyor affects the cleaning effect of the device and leads to a poor use experience of the device. Content of the Utility Model
[0004] The purpose of the utility model is to provide a stainless steel semiconductor-level cleaning device to solve the problems raised in the above background technique.
[0005] To achieve the above purpose, the utility model provides the following technical solution:
[0006] A stainless steel semiconductor-level cleaning device includes a workbench. A concave mounting part is arranged on the upper surface of the workbench. A second belt conveyor is fixedly connected to the upper surface of the workbench. A first belt conveyor is fixedly connected to the upper surface of the concave mounting part. A chemical polishing tank is embedded in the upper surface of the workbench. A power supply is fixedly connected to the outer surface of the chemical polishing tank;
[0007] A loading mechanism is arranged on the upper surface of the workbench near the second belt conveyor. An adjusting module is arranged on the upper surface of the workbench. A blanking module is placed inside the chemical polishing tank. The loading mechanism is used for loading the stainless steel semiconductor. The adjusting module is used for adjusting the height of the blanking module. The blanking module is used for filtrate blanking.
[0008] Furthermore: The lower surface of the workbench is fixedly connected with support legs.
[0009] Furthermore: The loading mechanism includes a loading seat. The loading seat is fixedly connected to the upper surface of the workbench, and the number of loading seats is two. A first electric push rod is fixedly connected to the rear surface of the loading seat. The output end of the first electric push rod is fixedly connected with a push plate.
[0010] Furthermore, a liquid outlet pipe is fixedly connected to the lower surface of the chemical polishing tank, and a threaded cap is threadedly connected to the lower end of the liquid outlet pipe.
[0011] Furthermore, the adjustment module includes an adjustment frame fixedly connected to the upper surface of the workbench. Two limit rods are fixedly connected to the lower surface of the adjustment frame. An insertion seat is embedded in the upper surface of the adjustment frame. A gear is rotatably connected to the inner surface of the insertion seat. A second electric push rod is fixedly connected to the upper surface of the adjustment frame. A first square rod is fixedly connected to the lower surface of the adjustment frame. A second square rod is fixedly connected to the lower surface of the adjustment frame.
[0012] Furthermore, the blanking module includes a blanking box placed inside the chemical polishing tank, and the number of blanking boxes is two. A slope plate is fixedly connected to the upper surface of the blanking box. A filter screen is fixedly connected to the lower surface of the blanking box. A first rack is nested and slidably connected to the outer surface of the second square rod. A second rack is nested and slidably connected to the outer surface of the first square rod.
[0013] Furthermore, the first rack is fixedly connected to one of the blanking boxes, the second rack is fixedly connected to the other blanking box. The blanking box is slidably connected to the limit rod. Both the first rack and the second rack are meshed with the gear. The output end of the second electric push rod is fixedly connected to the first rack.
[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0015] 1. Start the first electric push rod. The output end of the first electric push rod pushes the stainless steel semiconductor on the second belt conveyor into the blanking box through the push plate. The number of the first electric push rods is two corresponding to the two blanking boxes, realizing double-station work.
[0016] 2. The limit rod limits the lifting of the blanking box. The slope plate facilitates the stainless steel semiconductor to be pushed into the blanking box. When the second rack rises to the highest point, the stainless steel semiconductor moves along the sloped filter screen to the first belt conveyor, and the cleaned stainless steel semiconductor is conveyed through the first belt conveyor. This device assists in loading and unloading through the alternately rising blanking boxes, and completes cleaning and draining during the loading and unloading process, improving the working efficiency of the device and optimizing the use experience of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0018] Figure 2 is a schematic diagram of the structure of the present utility model from another angle;
[0019] Figure 3 is a schematic diagram of the adjustment module structure of the present utility model;
[0020] Figure 4 This is a schematic cross-sectional structure diagram of the chemical polishing box of the present utility model.
[0021] In the figure: 1. Workbench; 101. Support legs; 102. Concave mounting part; 2. Loading mechanism; 201. Loading seat; 202. First electric push rod; 203. Push plate; 3. First belt conveyor; 301. Second belt conveyor; 4. Chemical polishing box; 401. Liquid outlet pipe; 402. Threaded cap; 403. Power supply; 5. Adjustment module; 501. Adjustment frame; 502. Limit rod; 503. Insertion seat; 504. Gear; 505. Second electric push rod; 506. First square rod; 507. Second square rod; 6. Unloading module; 601. Unloading box; 602. Slope plate; 603. Filter screen; 604. First rack; 605. Second rack. Specific embodiments
[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0023] Please refer to Figures 1-4 , in the embodiment of the present utility model, a stainless steel semiconductor-level cleaning device includes a workbench 1. A concave mounting part 102 is provided on the upper surface of the workbench 1. A second belt conveyor 301 is fixedly connected to the upper surface of the workbench 1. A first belt conveyor 3 is fixedly connected to the upper surface of the concave mounting part 102. A chemical polishing box 4 is embedded in the upper surface of the workbench 1. A power supply 403 is fixedly connected to the outer surface of the chemical polishing box 4;
[0024] A loading mechanism 2 is provided on the upper surface of the workbench 1 near the second belt conveyor 301. An adjustment module 5 is provided on the upper surface of the workbench 1. An unloading module 6 is placed inside the chemical polishing box 4. The loading mechanism 2 is used for loading the stainless steel semiconductor. The adjustment module 5 is used for adjusting the height of the unloading module 6. The unloading module 6 is used for filtrate unloading. Support legs 101 are fixedly connected to the lower surface of the workbench 1.
[0025] Specifically, when in use, add chemical polishing liquid into the chemical polishing tank 4. Feed the stainless-steel semiconductor through the second belt conveyor 301. Push the stainless-steel semiconductor on the second belt conveyor 301 into the blanking module 6 through the feeding mechanism 2. Adjust the height of the blanking module 6 through the adjustment module 5 so that the blanking module 6 with the stainless-steel semiconductor is immersed in the chemical polishing tank 4. Raise the stainless-steel semiconductor after the cleaning process. After draining the water, it enters the first belt conveyor 3 from the opening position of the blanking box 601. The first belt conveyor 3 conveys the stainless-steel semiconductor after the cleaning process. This device is convenient for loading and unloading and can drain water during the cleaning process. The two working positions work simultaneously, which is convenient for the use of the device and improves the working efficiency of the device.
[0026] Embodiment 1
[0027] As Figures 1-3 shown, the feeding mechanism 2 includes a feeding base 201. The feeding base 201 is fixedly connected to the upper surface of the workbench 1, and the number of feeding bases 201 is two. The first electric push rod 202 is fixedly connected to the rear surface of the feeding base 201. The output end of the first electric push rod 202 is fixedly connected with a push plate 203. The lower surface of the chemical polishing tank 4 is fixedly connected with a liquid outlet pipe 401. The lower end of the liquid outlet pipe 401 is threadedly connected with a threaded cover 402.
[0028] In this embodiment, when feeding, start the first electric push rod 202. The output end of the first electric push rod 202 pushes the stainless-steel semiconductor on the second belt conveyor 301 into the blanking box 601 through the push plate 203. The number of the first electric push rods 202 is two, corresponding to the two blanking boxes 601, realizing double-station work. Manually rotate the threaded cover 402 to drain the chemical polishing liquid in the chemical polishing tank 4.
[0029] Embodiment 2
[0030] On the basis of Embodiment 1, in order to make up for the problem of draining water from the stainless-steel semiconductor in Embodiment 1.
[0031] As Figures 1-4As shown in the figure, the adjustment module 5 includes an adjustment frame 501. The adjustment frame 501 is fixedly connected to the upper surface of the workbench 1. Two limit rods 502 are fixedly connected to the lower surface of the adjustment frame 501. An insertion seat 503 is embedded and connected to the upper surface of the adjustment frame 501. A gear 504 is rotatably connected to the inner surface of the insertion seat 503. A second electric push rod 505 is fixedly connected to the upper surface of the adjustment frame 501. A first square rod 506 is fixedly connected to the lower surface of the adjustment frame 501. A second square rod 507 is fixedly connected to the lower surface of the adjustment frame 501. The blanking module 6 includes a blanking box 601. The blanking box 601 is placed inside the chemical polishing box 4, and the number of blanking boxes 601 is two. A slope plate 602 is fixedly connected to the upper surface of the blanking box 601. A filter screen 603 is fixedly connected to the lower surface of the blanking box 601. A first rack 604 is nested and slidably connected to the outer surface of the second square rod 507. A second rack 605 is nested and slidably connected to the outer surface of the first square rod 506. The first rack 604 is fixedly connected to one of the blanking boxes 601. The second rack 605 is fixedly connected to the other blanking box 601. The blanking box 601 is slidably connected to the limit rod 502. Both the first rack 604 and the second rack 605 are meshed with the gear 504. The output end of the second electric push rod 505 is fixedly connected to the first rack 604.
[0032] In this embodiment, when the second electric push rod 505 is started, the output end of the second electric push rod 505 pushes the first rack 604 downward, and the first rack 604 is limited by the second square rod 507, so that the first rack 604 drives the gear 504 to rotate. The gear 504 drives the second rack 605 to rise, and the first square rod 506 limits the rise of the second rack 605. During this process, the blanking box 601 connected to the first rack 604 cooperates with the feeding mechanism 2 for feeding and then descends into the chemical polishing solution. The blanking box 601 connected to the second rack 605 rises from the chemical polishing solution and cooperates with the filter screen 603 for draining. The limit rod 502 limits the lifting of the blanking box 601. The slope plate 602 facilitates the stainless steel semiconductor to be pushed into the blanking box 601. When the second rack 605 rises to the highest point, the stainless steel semiconductor moves along the sloped filter screen 603 onto the first belt conveyor 3, and the cleaned stainless steel semiconductor is conveyed through the first belt conveyor 3. This device uses the alternately rising blanking boxes 601 to assist in loading and unloading, and completes cleaning and draining during the loading and unloading process, improving the working efficiency of the device and optimizing the use experience of the device.
[0033] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claimed rights.
[0034] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A stainless steel semiconductor - level cleaning device, including a workbench (1). The upper surface of the workbench (1) is provided with a concave mounting part (102). The upper surface of the workbench (1) is fixedly connected with a second belt conveyor (301). The upper surface of the concave mounting part (102) is fixedly connected with a first belt conveyor (3). The upper surface of the workbench (1) is embedded with a chemical polishing tank (4). The outer surface of the chemical polishing tank (4) is fixedly connected with a power supply (403). It is characterized in that The upper surface of the workbench (1) is provided with a feeding mechanism (2) near the second belt conveyor (301). The upper surface of the workbench (1) is provided with an adjustment module (5). A blanking module (6) is placed inside the chemical polishing tank (4). The feeding mechanism (2) is used for feeding the stainless - steel semiconductor. The adjustment module (5) is used to adjust the height of the blanking module (6). The blanking module (6) is used for filtrating and blanking.
2. The stainless steel semiconductor-grade cleaning device according to claim 1, wherein The lower surface of the workbench (1) is fixedly connected with support legs (101).
3. The stainless steel semiconductor-grade cleaning device according to claim 1, wherein The feeding mechanism (2) includes: A feeding seat (201), fixedly connected to the upper surface of the workbench (1), and the number of the feeding seats (201) is two; A first electric push rod (202), fixedly connected to the rear surface of the feeding seat (201). The output end of the first electric push rod (202) is fixedly connected with a push plate (203).
4. The stainless steel semiconductor-grade cleaning device according to claim 1, wherein The lower surface of the chemical polishing tank (4) is fixedly connected with a liquid outlet pipe (401). The lower end of the liquid outlet pipe (401) is threadedly connected with a threaded cap (402).
5. The stainless steel semiconductor-grade cleaning device according to claim 1, wherein The adjustment module (5) includes: An adjustment frame (501), fixedly connected to the upper surface of the workbench (1). The lower surface of the adjustment frame (501) is fixedly connected with two limit rods (502); An insertion seat (503), embedded in the upper surface of the adjustment frame (501). The inner surface of the insertion seat (503) is rotatably connected with a gear (504); A second electric push rod (505), fixedly connected to the upper surface of the adjustment frame (501); A first square rod (506), fixedly connected to the lower surface of the adjustment frame (501). The lower surface of the adjustment frame (501) is fixedly connected with a second square rod (507).
6. The stainless steel semiconductor-grade cleaning device according to claim 5, wherein, The blanking module (6) includes: A blanking box (601), placed inside the chemical polishing tank (4), and the number of the blanking boxes (601) is two; A slope plate (602), fixedly connected to the upper surface of the blanking box (601). The lower surface of the blanking box (601) is fixedly connected with a filter screen (603); A first rack (604), nested and slidably connected to the outer surface of the second square rod (507); A second rack (605), nested and slidably connected to the outer surface of the first square rod (506).
7. The stainless steel semiconductor-grade cleaning device according to claim 6, characterized in that, The first rack (604) is fixedly connected to one of the blanking bins (601), the second rack (605) is fixedly connected to the other blanking bin (601), the blanking bin (601) is slidably connected to the limiting rod (502), both the first rack (604) and the second rack (605) are meshed and connected to the gear (504), and the output end of the second electric push rod (505) is fixedly connected to the first rack (604).