Semiconductor temperature difference power supply device for measuring anode current distribution of aluminum electrolysis cell
By introducing a combined structure of a water storage cooling box, a circulating water pump and a blower into the semiconductor temperature differential power supply device, the problem of high temperature aging of the shell is solved, and the long life and low maintenance costs of the equipment are achieved.
Patent Information
- Application Number
- CN202420666443.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-04-02
AI Technical Summary
In the measurement of the anode current distribution of the semiconductor temperature difference power supply device, the high temperature of the outer shell causes components to aging and damage, shorten the service life of the equipment and increase maintenance costs.
The semiconductor temperature difference power supply device is used to combine a water storage cooling box, a circulating water pump, a micro heat exchanger and a blower to reduce the shell temperature by circulating coolant and wind heat dissipation.
Effectively reduce the shell temperature of semiconductor temperature difference power supply device, extend the service life of the equipment, and reduce maintenance costs.
Smart Images
Figure CN223087943U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolysis cell. Background Art
[0002] The application of the anode current monitoring technology of an aluminum electrolysis cell in the aluminum electrolysis production process is an important achievement in the development of the aluminum industry. It can promote the production of the aluminum electrolysis cell to operate in an optimal state, thereby improving production performance and indicators. During the operation of the semiconductor thermoelectric power supply device, the outer shell will get hot, and the outer shell will accelerate the aging and damage of components at high temperatures, shorten the service life of the equipment, and increase the maintenance cost.
[0003] Therefore, we propose a semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolysis cell. Summary of the Utility Model
[0004] The main purpose of the utility model is to solve the technical problems existing in the above-mentioned prior art, and provide a semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolysis cell.
[0005] To achieve the above purpose, the utility model adopts the following technical solutions. A semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolysis cell includes a semiconductor thermoelectric power supply device. A controller is installed on the front surface of the semiconductor thermoelectric power supply device. A water storage cooling tank is fixedly connected to the semiconductor thermoelectric power supply device. A circulating water pump is fixedly connected to one side wall surface of the water storage cooling tank. The water outlet end of the circulating water pump is communicated with a circulating pipe. A micro heat exchanger is fixedly connected to the circulating pipe. A support plate is movably arranged below the semiconductor thermoelectric power supply device. A placement groove is formed at the top of the support plate. Heat dissipation holes are formed at the bottom of the inner cavity of the placement groove. Both ends of the bottom of the support plate are fixedly connected with connecting plates. A blower is fixedly connected to the middle position of the connecting plates. The air outlet end of the blower is communicated with a connecting pipe. An air outlet is communicated with the side wall surface of the top of the connecting pipe.
[0006] Preferably, the water inlet end of the circulating water pump is communicated with the water storage cooling tank, and the circulating pipe is fixedly connected around the side wall surface of the semiconductor thermoelectric power supply device.
[0007] Preferably, the placement groove is matched with the bottom of the semiconductor thermoelectric power supply device, and the semiconductor thermoelectric power supply device is placed in the inner cavity of the placement groove.
[0008] Preferably, the placement groove is matched with the bottom of the semiconductor thermoelectric power supply device, and the semiconductor thermoelectric power supply device is placed in the inner cavity of the placement groove.
[0009] Preferably, the other end of the connecting pipe is fixedly connected to the bottom of the support plate near the other connecting plate.
[0010] Preferably, the connecting plates are all of H-shaped structures.
[0011] Advantageous Effects
[0012] The present utility model provides a semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolysis cell. It has the following advantageous effects:
[0013] In the semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolysis cell, under the action of a circulating water pump, the coolant passes through a circulation pipe and exchanges heat with a micro heat exchanger and finally returns to the inner cavity of a water storage and cooling tank, which can reduce the temperature of the side wall surface of the semiconductor thermoelectric power supply device. The air blown out by a blower is blown out from an air outlet on a connecting pipe and blown into the inner cavity of a support plate by the support plate, dissipating heat from the bottom of the semiconductor thermoelectric power supply device, thereby reducing the temperature of the outer shell, increasing the service life of the device, and reducing the maintenance cost. Description of the Drawings
[0014] In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only exemplary. For those of ordinary skill in the art, without creative efforts, other implementation drawings can also be obtained based on the provided drawings.
[0015] The structures, ratios, sizes, etc. illustrated in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present utility model. Therefore, they do not have technical essential significance. Any modification of the structure, change in the ratio relationship, or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed by the present utility model.
[0016] Figure 1 It is a three-dimensional schematic diagram of the structure of the present utility model;
[0017] Figure 2 It is a rear view of the structure of the present utility model;
[0018] Figure 3 It is a bottom view of the support plate structure of the present utility model.
[0019] Legend Explanation:
[0020] 1. Semiconductor thermoelectric power supply device; 2. Support plate; 201. Placing groove; 202. Connecting plate; 203. Blower; 204. Connecting pipe; 205. Air outlet; 206. Heat dissipation holes; 3. Water storage and cooling tank; 301. Circulating water pump; 302. Circulating pipe; 303. Micro heat exchanger; 304. Controller. Detailed implementation mode
[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0022] Embodiment: A semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolysis cell, as Figures 1 - 3 shown, including a semiconductor thermoelectric power supply device 1. A controller 304 is installed on the front of the semiconductor thermoelectric power supply device 1. A water storage and cooling tank 3 is fixedly connected to the front of the semiconductor thermoelectric power supply device 1. A coolant is contained in the inner cavity of the water storage and cooling tank 3. A circulating water pump 301 is fixedly connected to one side wall surface of the water storage and cooling tank 3. The water inlet end of the circulating water pump 301 is communicated with the water storage and cooling tank 3. The water outlet end of the circulating water pump 301 is communicated with a circulating pipe 302. The circulating pipe 302 is fixedly connected around the side wall surface of the semiconductor thermoelectric power supply device 1. A plurality of micro heat exchangers 303 are fixedly connected to the circulating pipe 302.
[0023] A support plate 2 is movably arranged below the semiconductor thermoelectric power supply device 1. A placing groove 201 is opened at the top of the support plate 2. The placing groove 201 cooperates with the bottom of the semiconductor thermoelectric power supply device 1. The semiconductor thermoelectric power supply device 1 is placed in the inner cavity of the placing groove 201. A plurality of heat dissipation holes 206 are opened at the bottom of the inner cavity of the placing groove 201. Both ends of the bottom of the support plate 2 are fixedly connected with connecting plates 202. Both connecting plates 202 are of H-shaped structures. A blower 203 is fixedly connected to the middle position of one of the connecting plates 202. The air outlet end of the blower 203 is communicated with a connecting pipe 204. The other end of the connecting pipe 204 is fixedly connected to the bottom of the support plate 2 close to the other connecting plate 202. A plurality of air outlets 205 are communicated with the side wall surface of the top of the connecting pipe 204. The air outlet ends of the air outlets 205 face the heat dissipation holes 206. Through the cooperation of the blower 203, the connecting pipe 204 and the air outlets 205, the blown air can dissipate heat from the bottom of the support plate 2.
[0024] The working principle of the present invention:
[0025] In use, during the operation of the semiconductor thermoelectric power generation device 1, the housing of the semiconductor thermoelectric power generation device 1 will heat up. By placing a coolant in the inner cavity of the water storage and cooling tank 3, the coolant is circulated through the circulation pipe 302 under the action of the circulation water pump 301 and finally returns to the inner cavity of the water storage and cooling tank 3. While passing through the circulation pipe 302, heat exchange is carried out with the micro heat exchanger 303, and the temperature of the coolant is reduced again, which can reduce the temperature of the side wall surface of the semiconductor thermoelectric power generation device 1. At the same time, the blower 203 is started, and the air blown out by the blower 203 is blown out from the air outlet 205 on the connecting pipe 204 and blown into the inner cavity of the support plate 2 by the support plate 206 to dissipate heat from the bottom of the semiconductor thermoelectric power generation device 1.
[0026] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" etc. can be used here to describe the spatial positional relationship of one device or feature to other devices or features as shown in the figures. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figure is inverted, a device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientation of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.
[0027] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of this application are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of this application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.
[0028] The foregoing has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and the description in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and all these changes and improvements fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.
Claims
1. A semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolytic cell, comprising a semiconductor thermoelectric power supply device (1), characterized in that: A controller (304) is installed on the front of the semiconductor thermoelectric power supply device (1). The semiconductor thermoelectric power supply device (1) is fixedly connected to a water storage and cooling tank (3). A circulation water pump (301) is fixedly connected to one side wall surface of the water storage and cooling tank (3). The water outlet end of the circulation water pump (301) is communicated with a circulation pipe (302). A micro heat exchanger (303) is fixedly connected to the circulation pipe (302). A support plate (2) is movably arranged below the semiconductor thermoelectric power supply device (1). A placement groove (201) is formed in the top of the support plate (2). Heat dissipation holes (206) are formed in the bottom of the inner cavity of the placement groove (201). Connecting plates (202) are fixedly connected to both ends of the bottom of the support plate (2). A blower (203) is fixedly connected to the middle position of the connecting plate (202). The air outlet end of the blower (203) is communicated with a connecting pipe (204). An air outlet (205) is communicated with the side wall surface of the top of the connecting pipe (204).
2. The semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolytic cell according to claim 1, characterized in that: The water inlet end of the circulation water pump (301) is communicated with the water storage and cooling tank (3), and the circulation pipe (302) is fixedly connected around the side wall surface of the semiconductor thermoelectric power supply device (1).
3. The semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolytic cell according to claim 1, characterized in that: The placement groove (201) is matched with the bottom of the semiconductor thermoelectric power supply device (1), and the semiconductor thermoelectric power supply device (1) is placed in the inner cavity of the placement groove (201).
4. The semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolytic cell according to claim 1, characterized in that: The placement groove (201) is matched with the bottom of the semiconductor thermoelectric power supply device (1), and the semiconductor thermoelectric power supply device (1) is placed in the inner cavity of the placement groove (201).
5. The semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolytic cell according to claim 1, wherein: The other end of the connecting pipe (204) is fixedly connected to the bottom of the support plate (2) close to the other connecting plate (202).
6. The semiconductor thermoelectric power supply device for measuring the anode current distribution of an aluminum electrolytic cell according to claim 1, characterized in that: The connecting plates (202) are both of H-shaped structures.