Copper deposition electroplating device for PCB (Printed Circuit Board)
By using the driving motor and push plate structure of the adjustment component in the PCB board copper plating device, the problem of uneven flow of the plating solution is solved, the uniform distribution of current and the uniformity of the plating layer are achieved, and the circuit connection quality is ensured.
Patent Information
- Application Number
- CN202422186045.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-06
AI Technical Summary
In the existing PCB board copper plating device, the PCB board is placed in a standstill and causes uneven flow of the plating solution, resulting in uneven current distribution, affecting the uniformity of the plating layer and the quality of the circuit connection.
The driving motor, bidirectional screw and push plate structure in the adjustment component are adopted to promote the flow of the plating solution in the plating box through the opposite movement of the push plate, ensuring that the current is evenly distributed on the PCB board.
The consistency of the thickness of the electroplating layer is achieved, and the poor plating caused by uneven current distribution is avoided. The design of the electroplating rack and the slot prevents the clamping dead corners, ensuring complete electroplating of the PCB board.
Smart Images
Figure CN223087955U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of devices for PCB board processing, in particular to a copper immersion plating device for PCB boards. Background Technique
[0002] As a basic component of electronic products, the structure of a PCB board is composed of multiple layers of conductor materials and insulating materials stacked together. The conductor material is copper and is attached to the insulating board by electroplating, and then processes such as etching are carried out for circuit drawing.
[0003] A copper immersion plating device for PCB boards is disclosed in the prior art. This device has a plating tank body, a top cover is hinged at the upper end of the plating tank body, a bracket is arranged on the side wall inside the plating tank body, electrolytic raw materials are arranged on the bracket, a hanging basket is arranged inside the plating tank body, and a cylinder is arranged at the lower end of the plating tank body. The output shaft of the cylinder penetrates through the lower end of the plating tank body. By the combined use of the cylinder and the hanging basket, the installation and taking efficiency of the PCB board is greatly improved, and the PCB board is convenient to replace.
[0004] However, this device still has some defects. In this device, the PCB board is statically placed in the electroplating box. Since the PCB board is statically placed, when the PCB board is only placed in the electroplating box, the flow of the electroplating solution on the PCB board may not be uniform enough, resulting in uneven current distribution, which will lead to a decrease in the uniformity of the electroplating layer. Especially on the hole walls and bottoms of the PCB board, the coverage of the copper layer may be uneven, thus affecting the connection quality of the subsequent circuit.
[0005] Therefore, it is necessary to provide a copper immersion plating device for PCB boards to solve the above technical problems. Summary of the Utility Model
[0006] In view of the above situation, to overcome the defects of the prior art, the utility model provides a copper immersion plating device for PCB boards. Through the combined use of multiple parts in the provided adjusting component, the push plates at both ends in the electroplating box can move towards each other. By the opposite movement of the push plates, the flow of the electroplating solution in the electroplating box can be promoted, so that the current is more evenly distributed on the PCB board. This is beneficial to ensuring that the electroplating layer thicknesses at different parts are consistent and avoiding electroplating defects caused by uneven current distribution.
[0007] To achieve the above purpose, the technical scheme adopted by the utility model is as follows:
[0008] PCB board copper deposition electroplating device, comprising: an electroplating assembly, an adjustment assembly, and an auxiliary frame. The electroplating assembly includes an electroplating tank, and electroplating solution is provided inside the electroplating tank. The adjustment assembly includes two driving motors installed on the side ends of the electroplating tank. The two driving motors are symmetrically arranged on both sides of the electroplating tank. A bidirectional screw is further installed at the output ends of the two driving motors. The two bidirectional screws are installed on both sides of the inner cavity of the electroplating tank. A moving seat is jointly carried on the two bidirectional screws. A push plate is assembled at the lower end of the moving seat. The auxiliary frame includes an electroplating rack, and clamping grooves are installed on both sides inside the electroplating rack.
[0009] Preferably, the clamping grooves provided on the electroplating rack are arranged in an array distribution, and a plurality of through holes are provided on both sides of each clamping groove. The plurality of through holes penetrate through both sides of the clamping groove in an array.
[0010] Preferably, handles are further installed on both sides of the upper end of the electroplating rack. The handles and the electroplating rack are integrally welded.
[0011] Preferably, a positioning cavity is further provided at the upper end of the moving seat. Convex blocks are formed at both ends of the push plate. The push plate is clamped in the positioning cavity provided on the moving seat through the convex blocks at both ends.
[0012] Preferably, the positioning cavity provided on the moving seat is fitted with the push plate, and the push plate is detachably installed on the moving seat by means of a plug pin.
[0013] Preferably, a limiting groove is further provided in the inner cavity of the electroplating tank. The entire electroplating rack is fitted into the limiting groove provided on the electroplating tank.
[0014] Compared with the prior art, the utility model has the following beneficial effects:
[0015] (1) By the cooperative use of multiple parts in the adjustment assembly provided in the utility model, the push plates at both ends inside the electroplating tank can move towards each other. Compared with the traditional method of statically placing the PCB board in the electroplating tank, the movement of the push plates towards each other can promote the flow of the electroplating solution in the electroplating tank, so that the current is more evenly distributed on the PCB board. This is beneficial to ensuring that the thickness of the electroplating layer at different parts is consistent and avoiding electroplating defects caused by uneven current distribution.
[0016] (2) By the cooperation of the electroplating rack and the through holes provided on both end faces of the clamping grooves in the utility model, during use, the PCB board can be limited and fixed through the clamping grooves provided at both ends of the electroplating rack. By placing the entire electroplating rack into the electroplating tank until the electroplating solution is still, at this time, in cooperation with the use of the push plates at both ends, the movement of the push plates towards each other can promote the flow of the electroplating solution in the electroplating tank, so that the current is more evenly distributed on the PCB board. At the same time, in cooperation with the through holes provided at both ends of the clamping grooves, it is possible to prevent clamping dead corners from occurring in the clamping areas at both ends of the PCB board and ensure complete electroplating of the PCB board.
[0017] (3) In this utility model, through the provided electroplating rack and handle, during use, the staff can place and retrieve the electroplating rack only by using the handle, which can prevent the staff from touching the electroplating solution. Since the metal ions and other chemical substances contained in the electroplating solution may cause irritation to the skin of the operator or more serious health problems, by using the handle, direct contact with the electroplating solution can be avoided, reducing the occurrence of skin problems. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic structural diagram of the first perspective of the PCB board copper deposition electroplating device provided by this utility model;
[0019] Figure 2 is a schematic structural diagram of the second perspective of the PCB board copper deposition electroplating device provided by this utility model;
[0020] Figure 3 is a schematic structural diagram of the electroplating tank of the PCB board copper deposition electroplating device provided by this utility model;
[0021] Figure 4 is a schematic structural diagram of the push plate installation of the PCB board copper deposition electroplating device provided by this utility model.
[0022] Among them, the names corresponding to the reference numerals are: 100, electroplating assembly; 101, electroplating tank; 102, limit groove; 200, adjustment assembly; 201, drive motor; 202, bidirectional screw; 203, moving seat; 204, push plate; 205, slot; 206, bolt; 300, auxiliary frame; 301, electroplating rack; 302, card slot; 303, through hole; 304, handle. SPECIFIC EMBODIMENTS
[0023] The following further illustrates this utility model in conjunction with the drawings and embodiments. The implementation manners of this utility model include but are not limited to the following embodiments.
[0024] First Embodiment:
[0025] As Figures 1-4As shown in the figure, the PCB board electroless copper plating device provided by the present utility model includes: an electroplating assembly 100, an adjustment assembly 200, and an auxiliary frame 300. The electroplating assembly 100 includes an electroplating tank 101, and an electroplating solution is provided in the electroplating tank 101. The adjustment assembly 200 includes two drive motors 201 installed on the side end of the electroplating tank 101. The two drive motors 201 are symmetrically arranged on both sides of the electroplating tank 101. A bidirectional screw 202 is further installed at the output end of the two drive motors 201. The two bidirectional screws 202 are installed on both sides of the inner cavity of the electroplating tank 101. A moving seat 203 is jointly carried on the two bidirectional screws 202. A push plate 204 is assembled at the lower end of the moving seat 203. The auxiliary frame 300 includes an electroplating rack 301, and card slots 302 are installed on both sides inside the electroplating rack 301. During actual use, the staff first place the PCB boards into the electroplating rack 301 in sequence, limit the PCB boards through the card slots 302 provided on both sides of the electroplating rack 301, and then place the electroplating rack 301 into the electroplating tank 101 until the electroplating solution is still to the electroplating rack 301. At this time, the staff starts the drive motor 201. Through the drive of the drive motor 201, the moving seats 203 at both ends are driven to move towards each other. Through the opposite movement of the moving seats 203, the push plates 204 move towards each other. Through the movement of the push plates 204 at both ends, the electroplating solution in the electroplating tank 101 flows reciprocally.
[0026] Through the combined use of multiple parts in the adjustment assembly 200 provided, the push plates 204 at both ends in the electroplating tank 101 can be made to move towards each other. Compared with the traditional method of statically placing the PCB board in the electroplating tank 101, the opposite movement of the push plates 204 can promote the flow of the electroplating solution in the electroplating tank 101, so that the current is more evenly distributed on the PCB board. This is beneficial to ensuring that the electroplating layer thicknesses of different parts are consistent and avoiding electroplating defects caused by uneven current distribution.
[0027] Second Embodiment:
[0028] As Figure 3 shown, the card slots 302 provided on the electroplating rack 301 are arranged in an array, and a plurality of through holes 303 are provided on both sides of the card slots 302. The plurality of through holes 303 are arrayed and drilled through both sides of the card slots 302.
[0029] Through the cooperation of the provided electroplating rack 301 and the through holes 303 provided on both end faces of the card slot 302, during use, the PCB board can be limited and fixed through the card slots 302 provided at both ends of the electroplating rack 301. By placing the entire electroplating rack 301 into the electroplating tank 101 until the electroplating solution is static, at this time, in cooperation with the use of the push plates 204 at both ends, the electroplating solution can be promoted to flow in the electroplating tank 101 by the opposite movement of the push plates 204, so that the current is more evenly distributed on the PCB board. At the same time, in cooperation with the through holes 303 provided at both ends of the card slot 302, it is possible to prevent clamping dead corners from appearing in the clamping areas at both ends of the PCB board, ensuring complete electroplating of the PCB board.
[0030] Third Embodiment:
[0031] As Figure 3 shown, handle 304 is also installed on both sides of the upper end of the electroplating rack 301, and the handle 304 and the electroplating rack 301 are welded into an integral structure design.
[0032] Through the provided electroplating rack 301 and handle 304, during use, the staff can place and take the electroplating rack 301 only through the handle 304, which can prevent the staff from touching the electroplating solution. Since the metal ions and other chemical substances contained in the electroplating solution may cause irritation to the skin of the operator or more serious health problems, by using the handle 304, direct contact with the electroplating solution can be avoided, reducing the occurrence of skin problems.
[0033] Fourth Embodiment:
[0034] As Figure 4 shown, a positioning cavity is also provided at the upper end of the moving seat 203, and convex blocks are formed at both ends of the push plate 204. The push plate 204 is clamped in the positioning cavity provided in the moving seat 203 through the convex blocks at both ends.
[0035] Fifth Embodiment:
[0036] As Figure 2 、 Figure 4 shown, the positioning cavity provided in the moving seat 203 is fitted with the push plate 204, and the push plate 204 is detachably installed in the moving seat 203 in cooperation with the insertion pin 206 and the slot 205 provided in the moving seat 203. During use, the staff only needs to clamp the push plate 204 into the positioning groove provided in the moving seat 203, and then in cooperation with the use of the insertion pin 206, the push plate 204 is fixed in the slot 205 provided in the moving seat 203.
[0037] Through the cooperation of the slot 205 and the insertion pin 206, the quick installation of the push plate 204 can be achieved. When the push plate 204 is used for a long time, through the installation method of quick disassembly, it is convenient for the subsequent staff to replace and clean it.
[0038] Working principle: During use, the staff first place the PCB boards into the electroplating rack 301 in sequence, limit the PCB boards through the card slots 302 provided on both sides of the electroplating rack 301, and then place the electroplating rack 301 into the electroplating tank 101 until the electroplating solution is static up to the electroplating rack 301. At this time, the staff starts the driving motor 201. Driven by the driving motor 201, the moving seats 203 at both ends move towards each other. Through the opposite movement of the moving seats 203, the push plates 204 move towards each other. Through the movement of the push plates 204 at both ends, the electroplating solution in the electroplating tank 101 flows back and forth.
[0039] The above embodiments are only one of the preferred embodiments of the present invention and should not be used to limit the protection scope of the present invention. Any meaningless changes or touch-ups made on the main design concept and spirit of the present invention, as long as the technical problems solved are still the same as those of the present invention, should be included in the protection scope of the present invention.
Claims
1. A PCB board copper immersion plating device, characterized in that, Including: A plating assembly (100), an adjustment assembly (200), and an auxiliary frame (300). The plating assembly (100) includes a plating tank (101) with plating solution disposed therein. The adjustment assembly (200) includes two drive motors (201) mounted on the side ends of the plating tank (101). The two drive motors (201) are symmetrically arranged on both sides of the plating tank (101). The output ends of the two drive motors (201) are further mounted with a bidirectional screw rod (202). The two bidirectional screw rods (202) are mounted on both sides of the inner cavity of the plating tank (101). A moving seat (203) is jointly carried on the two bidirectional screw rods (202). A push plate (204) is assembled at the lower end of the moving seat (203). The auxiliary frame (300) includes a plating rack (301), and clamping grooves (302) are mounted on both sides inside the plating rack (301).
2. The PCB board electroless copper plating and electroplating device according to claim 1, wherein, The clamping grooves (302) provided on the plating rack (301) are arranged in an array distribution, and a plurality of through holes (303) are provided on both sides of each clamping groove (302). The plurality of through holes (303) are arrayed and penetrate through both sides of the clamping groove (302).
3. The copper deposition electroplating device for a PCB board according to claim 2, characterized in that, Two handles (304) are further mounted on both sides of the upper end of the plating rack (301). The handles (304) and the plating rack (301) are welded into an integral structure design.
4. A PCB board electroless copper plating and electroplating device according to claim 1, characterized in that, A positioning cavity is further provided at the upper end of the moving seat (203). Protrusions are formed at both ends of the push plate (204). The push plate (204) is clamped in the positioning cavity provided in the moving seat (203) through the protrusions at both ends.
5. A PCB board electroless copper plating and electroplating device according to claim 4, characterized in that, The positioning cavity provided in the moving seat (203) is fitted with the push plate (204), and the push plate (204) is detachably mounted in the moving seat (203) by cooperating with a plug pin (206) and a slot (205) provided in the moving seat (203).
6. The copper deposition electroplating device for a PCB board according to claim 1, wherein A limiting groove (102) is further provided in the inner cavity of the plating tank (101). The entire plating rack (301) is fitted into the limiting groove (102) provided in the plating tank (101).