Semiconductor chilling plate inspection device based on heat dissipation mechanism

Abstract

The utility model relates to the technical field of semiconductor chilling plate inspection, and discloses a semiconductor chilling plate inspection device based on a heat dissipation mechanism, which comprises a sealing device and an air tightness detection device, a semiconductor chilling plate to be detected is arranged in the air tightness detection device, and the air tightness detection device is inserted into the surface of the inner wall of the sealing device. The sealing device comprises a to-be-detected base, a supporting frame and a sealing assembly, the supporting frame is installed on the surface of the bottom end of the to-be-detected base, and the supporting frame is inserted into the lower end of the sealing assembly. According to the semiconductor chilling plate inspection device based on the heat dissipation mechanism, the clamping air bag, the metal shell and the limiting threaded rods are arranged, the limiting threaded rods are inserted into the four corners of the clamping air bag, the position of the clamping air bag can be determined, and when the clamping air bag is damaged, the limiting threaded rods can be pulled out to be separated from the clamping air bag; the clamping air bag is fast and convenient to replace, and the clamping air bag is fast and convenient to maintain.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration sheet inspection, in particular to a semiconductor refrigeration sheet inspection device based on a heat dissipation mechanism. Background Technique

[0002] A semiconductor refrigeration sheet, also known as a thermoelectric refrigeration sheet or a Peltier, is a heat pump that uses the Peltier effect of semiconductor materials to achieve refrigeration. When direct current passes through an electric couple formed by two different semiconductor materials connected in series, heat absorption and heat release phenomena will occur at both ends of the electric couple respectively, thereby achieving refrigeration.

[0003] The prior art discloses a semiconductor refrigeration sheet inspection device based on a heat dissipation mechanism with an application number of: CN202121709266.5. Sealing strips are provided at the inner ring holes of the first airbag and the second airbag, and air filling pipes are provided on the outer walls of the first airbag and the second airbag. A through hole is provided on the side wall of the detection base, and the air filling pipes extend out from the through hole. The inner ring holes of the first airbag and the second airbag are inserted with a semiconductor refrigeration sheet to be detected. The semiconductor refrigeration sheet inspection device based on a heat dissipation mechanism of the utility model belongs to the field of semiconductor refrigeration sheet inspection devices. The airbag, the air filling pipe and the sealing strip cooperate with each other. After the airbag expands, the sealing strip tightly contacts the side wall of the semiconductor refrigeration sheet to be detected, realizing the sealing of the semiconductor refrigeration sheet to be detected, and further realizing the clamping of the semiconductor refrigeration sheet to be detected, which is convenient for users to use. Through the mutual cooperation of the limit frame, the limit frame and the airbag, the airbag can expand towards the side wall of the semiconductor refrigeration sheet to be detected, further improving the sealing effect.

[0004] The above-mentioned first airbag is fixedly connected to the first limit frame. When the first airbag is damaged, cutting operations need to be performed on the first airbag and the first limit frame, making the disassembly and replacement of the first airbag relatively troublesome and taking a lot of time for replacement. Content of the Utility Model

[0005] The purpose of the utility model is to provide a semiconductor refrigeration sheet inspection device based on a heat dissipation mechanism to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A semiconductor refrigeration sheet inspection device based on a heat dissipation mechanism includes a sealing device and an airtightness detection device. The semiconductor refrigeration sheet to be detected is installed inside the airtightness detection device, and the airtightness detection device is inserted into the inner wall surface of the sealing device.

[0007] The sealing device includes a base to be detected, a support frame and a sealing component. The support frame is installed on the bottom surface of the base to be detected, and the support frame is inserted into the lower end of the sealing component.

[0008] Preferably, the sealing assembly includes an insert threaded rod, a clamping airbag, a metal shell, a movable roller group, a coil spring, a limiting threaded rod and a limiting metal plate, the insert threaded rod is fixedly connected to the upper end of the limiting metal plate, the limiting metal plate is movably connected to the top surface of the clamping airbag, the clamping airbag is inserted into the inner wall surface of the metal shell, the coil spring is fixedly connected to the inward side surface of the clamping airbag, the limiting threaded rod is inserted into the outward end of the clamping airbag, the movable roller group is threadedly connected to the inward side surface of the limiting metal plate, the clamping airbag consists of an inflatable bladder body and a metal plate, the inflatable bladder body is inserted into the inner wall surface of the metal shell, and at the same time, the bottom surface of the metal plate is connected to the bottom surface and the top surface of the metal shell, so that the position of the inflatable bladder body can be determined.

[0009] Preferably, the plug-in threaded rod is inserted into the middle position of the air-tightness detection device, and the limiting metal plate is inserted into the inner wall surface of the upper end of the air-tightness detection device. The limiting metal plate moves downward to allow the limiting metal plate to be inserted into the inner wall surface of the air-tightness detection device. The limiting metal plate can drive the plug-in threaded rod to move downward to allow the plug-in threaded rod to be inserted into the middle position of the air-tightness detection device. Then the nut is rotated, and the nut rotates on the threaded end surface of the plug-in threaded rod, so that the air-tightness detection device and the limiting metal plate can be threadedly fixed.

[0010] Preferably, the semiconductor refrigeration plate to be tested is inserted into the bottom surface inside the airtightness testing device, the base to be tested is installed on the bottom surface inside the airtightness testing device, and the support frame is slidably connected to the inner lower end of the airtightness testing device to push the base to be tested downward so that the bottom surface of the base to be tested is connected to the bottom surface inside the airtightness testing device, and then the support frame is pushed so that the support frame moves downward along the inner wall surface of the airtightness testing device, thereby determining the positions of the support frame and the base to be tested.

[0011] Preferably, the coil spring is located in the middle of the metal shell, and the limiting threaded rod is located inside the coil spring. When the coil spring starts to rebound, the coil spring can push the clamping airbag to move outward, making it easy for the clamping airbag to detach from the metal shell, and the clamping airbag can be disassembled and replaced.

[0012] Preferably, the clamping airbag is movably connected to the inner wall surface of the airtightness detection device, the metal shell is movably connected to the inner wall surface of the airtightness detection device, and the metal shell is movably connected to the upper end of the support frame, pushing the metal shell to move downward. The metal shell moves downward on the inner wall surface of the airtightness detection device, and the metal shell can drive the clamping airbag to move downward, so that the lower end of the metal shell and the upper end of the support frame are movably connected, and the position of the metal shell can be determined.

[0013] Preferably, the number of the moving roller groups is two, and the two moving roller groups are distributed left and right. The moving roller groups are movably connected to the surface of the semiconductor refrigeration sheet to be detected, and the semiconductor refrigeration sheet to be detected slides on the surface of the moving roller groups, which can protect the safety of the semiconductor refrigeration sheet to be detected.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. For the semiconductor refrigeration sheet inspection device based on the heat dissipation mechanism, by providing the clamping airbag, the metal shell and the limit threaded rod, the limit threaded rod is inserted into the four corners of the clamping airbag, so that the position of the clamping airbag can be determined. When the clamping airbag is damaged, the limit threaded rod can be pulled out of the clamping airbag, making the replacement of the clamping airbag fast and convenient, and making the maintenance of the clamping airbag fast and convenient, which can increase the service time of the device.

[0016] 2. For the semiconductor refrigeration sheet inspection device based on the heat dissipation mechanism, by providing the plug-in threaded rod, the limit metal plate and the airtightness detection device, the limit metal plate can push the plug-in threaded rod downward, so that the plug-in threaded rod penetrates through the middle position of the airtightness detection device, which is convenient for the limit metal plate to be separated from the airtightness detection device, and the position of the clamping airbag can be determined, which can increase the service time of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is an overall three-dimensional schematic diagram of the present utility model;

[0018] Figure 2 is a front schematic diagram of the present utility model;

[0019] Figure 3 is the present utility model Figure 2 is a schematic cross-sectional view taken along line A-A in the present utility model;

[0020] Figure 4 is a three-dimensional schematic diagram of the sealing device and the semiconductor refrigeration sheet to be detected of the present utility model;

[0021] Figure 5 is the present utility model Figure 4 is a partially enlarged schematic diagram of the structure at A in the present utility model.

[0022] In the figure: 1. Sealing device; 11. Base to be detected; 12. Support frame; 13. Sealing assembly; 131. Plug-in threaded rod; 132. Clamping airbag; 133. Metal shell; 134. Moving roller group; 135. Helical spring; 136. Limit threaded rod; 137. Limit metal plate; 2. Airtightness detection device; 3. Semiconductor refrigeration sheet to be detected. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figures 1-5 , the present utility model provides the following technical solutions:

[0025] A semiconductor refrigeration chip inspection device based on a heat dissipation mechanism, including a sealing device 1 and an airtightness detection device 2. The airtightness detection device 2 has a semiconductor refrigeration chip 3 to be detected installed inside it, and the airtightness detection device 2 is inserted into the inner wall surface of the sealing device 1.

[0026] The sealing device 1 includes a base 11 to be detected, a support frame 12, and a sealing assembly 13. The support frame 12 is installed on the bottom surface of the base 11 to be detected. The semiconductor refrigeration chip 3 to be detected is inserted into the bottom surface inside the airtightness detection device 2. The base 11 to be detected is installed on the bottom surface inside the airtightness detection device 2. The support frame 12 is slidably connected to the lower end inside the airtightness detection device 2. Push the base 11 to be detected downward so that the bottom surface of the base 11 to be detected is connected to the bottom surface inside the airtightness detection device 2. Then push the support frame 12 so that the support frame 12 moves downward along the inner wall surface of the airtightness detection device 2, thereby being able to determine the positions of the support frame 12 and the base 11 to be detected. The support frame 12 is inserted into the lower end of the sealing assembly 13.

[0027] The sealing component 13 includes a plug-in threaded rod 131, a clamping airbag 132, a metal shell 133, a moving roller group 134, a spiral spring 135, a limit threaded rod 136 and a limit metal plate 137. The plug-in threaded rod 131 is fixedly connected to the upper end of the limit metal plate 137. The plug-in threaded rod 131 is plugged into the middle position of the airtightness detection device 2. The limit metal plate 137 is plugged into the inner wall surface of the upper end of the airtightness detection device 2. The limit metal plate 137 moves downward, so that the limit metal plate 137 is plugged into the inner wall surface of the airtightness detection device 2. The limit metal plate 137 can drive the plug-in threaded rod 131 to move downward, so that the plug-in threaded rod 131 is plugged into the middle position of the airtightness detection device 2. Then rotate the nut, and the nut rotates on the threaded end surface of the plug-in threaded rod 131, and the airtightness detection device 2 and the limit metal plate 137 can be fixed by threads. The limit metal plate 137 is movably connected to the top surface of the clamping airbag 132. The clamping airbag 132 is plugged into the inner wall surface of the metal shell 133. The spiral spring 135 is fixedly connected to the inner side surface of the clamping airbag 132. The spiral spring 135 is located in the middle of the metal shell 133. The limit threaded rod 136 is located inside the spiral spring 135. The spiral spring 135 starts to rebound, and the spiral spring 135 can push the clamping airbag 132 to move outward, which is convenient for the clamping airbag 132 to be detached from the metal shell 133, and the clamping airbag 132 can be disassembled and replaced. The limit threaded rod 136 is plugged into the outer end of the clamping airbag 132. The clamping airbag 132 is movably connected to the inner wall surface of the airtightness detection device 2. The metal shell 133 is movably connected to the inner wall surface of the airtightness detection device 2. The metal shell 133 is movably connected to the upper end of the support frame 12. Push the metal shell 133 downward, and the metal shell 133 moves downward on the inner wall surface of the airtightness detection device 2. The metal shell 133 can drive the clamping airbag 132 to move downward, so that the lower end of the metal shell 133 and the upper end of the support frame 12 are movably connected, and the position of the metal shell 133 can be determined. The moving roller group 134 is threadedly connected to the inner side surface of the limit metal plate 137. The number of the moving roller groups 134 is two, and the two moving roller groups 134 are distributed left and right. The moving roller group 134 is movably connected to the surface of the semiconductor refrigeration chip 3 to be detected. The semiconductor refrigeration chip 3 to be detected slides on the surface of the moving roller group 134, which can protect the safety of the semiconductor refrigeration chip 3 to be detected. The clamping airbag 132 is composed of an air-filled balloon body and a metal plate. The air-filled balloon body is plugged into the inner wall surface of the metal shell 133. At the same time, the bottom surface of the metal plate is connected to the bottom surface and the top surface of the metal shell 133, and the position of the air-filled balloon body can be determined.

[0028] During use, push the base 11 to be detected downward, so that the base 11 to be detected moves downward along the inner wall surface of the airtightness detection device 2, making the bottom surface of the base 11 to be detected connected to the inner bottom surface of the airtightness detection device 2.

[0029] Push the support frame 12 downward. The support frame 12 moves downward a little along the inner wall surface of the airtightness detection device 2, making the lower end of the support frame 12 movably connected to the upper end of the base 11 to be detected, so that the positions of the base 11 to be detected and the support frame 12 can be determined.

[0030] Push the clamping airbag 132 into the inside of the metal shell 133. Two clamping airbags 132 are inserted into the upper end and the lower end of the metal shell 133, and the position of the clamping airbag 132 can be determined.

[0031] The clamping airbag 132 is inserted into the inside of the metal shell 133. The two clamping airbags 132 can compress the spiral spring 135 inside the metal shell 133, and the position of the spiral spring 135 can be determined.

[0032] The metal plate in the clamping airbag 132 is movably connected to the surface of the metal shell 133, and the position of the clamping airbag 132 can be determined.

[0033] Push the limit threaded rod 136 into the four corners of the clamping airbag 132, and then rotate the nut. The nut rotates on the threaded end surface of the limit threaded rod 136, and the position of the clamping airbag 132 can be determined, effectively preventing the clamping airbag 132 from detaching from the metal shell 133.

[0034] Push the metal shell 133 downward. The metal shell 133 can drive the clamping airbag 132 to move downward, and make the lower end of the metal shell 133 inserted and fixed to the upper end of the support frame 12, and the position of the clamping airbag 132 can be determined.

[0035] Push the limit metal plate 137 downward. The limit metal plate 137 drives the moving roller group 134 to move downward. The bottom surface of the limit metal plate 137 is connected to the top surface of the clamping airbag 132, and the position of the limit metal plate 137 can be initially determined.

[0036] When the limit metal plate 137 moves downward, the limit metal plate 137 can drive the inserted threaded rod 131 to move downward, and make the inserted threaded rod 131 inserted into the middle position of the airtightness detection device 2, and the position of the limit metal plate 137 can be determined.

[0037] Push the semiconductor refrigeration chip 3 to be detected downward. The semiconductor refrigeration chip 3 to be detected slides on the surface of the moving roller group 134, so that the semiconductor refrigeration chip 3 to be detected penetrates through the middle position of the clamping airbag 132, and the clamping airbag 132 is inserted into the interior of the base 11 to be detected, so that the position of the semiconductor refrigeration chip 3 to be detected can be determined.

[0038] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor refrigerating sheet inspection device based on a heat dissipation mechanism, comprising a sealing device (1) and an airtightness detection device (2), characterized in that: Inside the airtightness detection device (2), a semiconductor refrigeration chip (3) to be detected is installed, and the airtightness detection device (2) is plugged into the inner wall surface of the sealing device (1). The sealing device (1) includes a base to be detected (11), a support frame (12) and a sealing component (13). The support frame (12) is installed on the bottom surface of the base to be detected (11), and the support frame (12) is plugged into the lower end of the sealing component (13).

2. The semiconductor refrigerating sheet inspection device based on a heat dissipation mechanism according to claim 1, characterized in that: The sealing component (13) includes a plugging threaded rod (131), a clamping airbag (132), a metal shell (133), a moving roller group (134), a spiral spring (135), a limiting threaded rod (136) and a limiting metal plate (137). The plugging threaded rod (131) is fixedly connected to the upper end of the limiting metal plate (137), the limiting metal plate (137) is movably connected to the top surface of the clamping airbag (132), the clamping airbag (132) is plugged into the inner wall surface of the metal shell (133), the spiral spring (135) is fixedly connected to the inner side surface of the clamping airbag (132), the limiting threaded rod (136) is plugged into the outer end of the clamping airbag (132), and the moving roller group (134) is threadedly connected to the inner side surface of the limiting metal plate (137).

3. The semiconductor refrigerating sheet inspection device based on a heat dissipation mechanism according to claim 2, characterized in that: The plugging threaded rod (131) is plugged into the middle position of the airtightness detection device (2), the limiting metal plate (137) is plugged into the upper inner wall surface of the airtightness detection device (2). When the limiting metal plate (137) moves downward, the limiting metal plate (137) is plugged into the inner wall surface of the airtightness detection device (2). The limiting metal plate (137) can drive the plugging threaded rod (131) to move downward, so that the plugging threaded rod (131) is plugged into the middle position of the airtightness detection device (2). Then, turn the nut, and the nut rotates on the threaded end surface of the plugging threaded rod (131), so that the airtightness detection device (2) and the limiting metal plate (137) can be threadedly fixed.

4. The inspection device for a semiconductor refrigerating sheet based on a heat dissipation mechanism according to claim 3, characterized in that: The semiconductor refrigeration chip (3) to be detected is plugged into the bottom surface inside the airtightness detection device (2), the base to be detected (11) is installed on the bottom surface inside the airtightness detection device (2), and the support frame (12) is slidably connected to the lower end inside the airtightness detection device (2).

5. The inspection device for a semiconductor refrigerating sheet based on the heat dissipation mechanism according to claim 4, characterized in that: The spiral spring (135) is located at the middle position of the metal shell (133), and the limiting threaded rod (136) is located inside the spiral spring (135).

6. The inspection device for a semiconductor refrigerating sheet based on a heat dissipation mechanism according to claim 5, characterized in that: The clamping airbag (132) is movably connected to the inner wall surface of the airtightness detection device (2), the metal shell (133) is movably connected to the inner wall surface of the airtightness detection device (2), and the metal shell (133) is movably connected to the upper end of the support frame (12).

7. The inspection device for a semiconductor refrigerating sheet based on a heat dissipation mechanism according to claim 6, characterized in that: The number of the moving roller groups (134) is two, the two moving roller groups (134) are distributed left and right, and the moving roller groups (134) are movably connected to the surface of the semiconductor refrigeration chip (3) to be detected.

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