Clamp and chip aging experiment equipment

Abstract

The utility model discloses a clamp and chip aging experiment equipment, relates to the chip testing technical field, the clamp comprises a pedestal and a cover plate, the pedestal is provided with a plurality of fixing grooves, the fixing grooves are used for placing chips, the pedestal is provided with a power supply joint, the cover plate is covered on the pedestal, the cover plate is provided with a plurality of probes facing the pedestal, and the probes are arranged on the cover plate. Each probe corresponds to one fixing groove, part of the structure of each probe is located in the opening direction of the corresponding fixing groove, and the multiple probes are connected with the power connector; in the technical scheme provided by the utility model, when a chip aging experiment is carried out, a plurality of chips are respectively fixed in the plurality of fixing grooves, the cover plate is pressed down to enable the probes to be in contact with the P electrodes of the chips, and the aging experiment can be realized by electrifying after the power supply connector is plugged, so that the equipment can meet the aging experiment requirements of the plurality of chips at the same time, and has higher experiment efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and particularly relates to a fixture and a chip aging experiment device. Background Art

[0002] The aging experiment of the chip heat sink is an important reliability test, aiming to simulate the thermal behavior and performance degradation of the chip under long-term operating conditions. By applying high temperature and / or power load to the chip in a controlled environment and for a predetermined time, potential material defects, thermal interface problems or packaging deficiencies can be accelerated and exposed, so as to evaluate and improve the thermal stability and long-term reliability of the chip. This experiment is crucial for ensuring that the chip can work continuously and stably in actual applications, especially under high temperature or high load conditions. The results of the aging experiment help to optimize the thermal design of the chip and improve its durability and performance retention ability in electronic devices.

[0003] Currently, when the detector chip conducts a power-on aging experiment at high temperature, the commonly used method is to use a single power supply to supply power to each chip. Although this one-to-one power supply mode ensures the accuracy of the test, it brings significant challenges when aging a large number of chips: it requires a large number of power supply devices, resulting in a substantial increase in cost and space requirements; at the same time, the complex pinning and wiring method not only increases the difficulty and error rate of wiring, but also reduces the overall test efficiency. Summary of the Utility Model

[0004] The main purpose of the utility model is to propose a fixture and a chip aging experiment device, aiming to provide a fixture that can simultaneously satisfy the aging test of multiple chips.

[0005] To achieve the above purpose, the fixture proposed by the utility model, which is applied to the chip aging experiment, includes:

[0006] A base, the base is formed with a plurality of fixing grooves for placing chips, and the base is provided with a power connector; and

[0007] A cover plate, the cover plate is covered on the base, the cover plate is provided with a plurality of probes facing the base, each probe is arranged corresponding to one of the fixing grooves, a part of the structure of the probe is located in the opening direction of the fixing groove, and the plurality of probes are all connected to the power connector.

[0008] In an embodiment, the plurality of fixing grooves are uniformly arranged on both sides of the cover plate, two first conductive bars are provided on the side of the cover plate facing away from the base, the two first conductive bars are arranged at intervals, the two first conductive bars are respectively connected to the plurality of probes, and the two first conductive bars are both connected to the power connector.

[0009] In one embodiment, a second conductive rod is provided between the two first conductive rods, and two ends of the second conductive rod are respectively connected to the first conductive rod and the power supply connector.

[0010] In one embodiment, a plurality of abutting protrusions are provided on a side of the cover plate facing the base, and the plurality of abutting protrusions are respectively arranged on two sides of the cover plate and are evenly spaced.

[0011] In one embodiment, the fixture further includes two pressing plates, and the two pressing plates are respectively arranged on two sides of the cover plate and cover the plurality of fixing grooves.

[0012] In one embodiment, the base is provided with a plurality of fixing holes facing the pressing plate, each pressing plate is provided with at least two waist-shaped holes, each waist-shaped hole corresponds to one fixing hole, and the fixture further includes a plurality of fixing columns, and one fixing column passes through one waist-shaped hole and is fixed in the fixing hole.

[0013] In one embodiment, two vertical plates are spaced on the base, the plurality of fixing grooves are arranged between the two vertical plates, and the power supply connector is arranged on one of the vertical plates.

[0014] In one embodiment, the material of the base is brass.

[0015] In one embodiment, the material of the probe is tungsten.

[0016] The present utility model further provides a chip aging experiment device, and the chip aging experiment device includes a fixture, and the fixture includes:

[0017] A base, the base is formed with a plurality of fixing grooves for placing chips, and the base is provided with a power supply connector; and

[0018] A cover plate, the cover plate covers the base, the cover plate is provided with a plurality of probes facing the base, each probe corresponds to one fixing groove, a partial structure of the probe is in the opening direction of the fixing groove, and the plurality of probes are all connected to the power supply connector.

[0019] In the technical solution of the present utility model, a fixture and a chip aging experiment device are proposed. Among them, the fixture includes a base and a cover plate. The base is formed with a plurality of fixing grooves for placing chips. The base is provided with a power connector. The cover plate is covered on the base. The cover plate is provided with a plurality of probes facing the base. Each probe corresponds to a fixing groove. A part of the structure of the probe is located in the opening direction of the fixing groove. The plurality of probes are all connected to the power connector. When conducting a chip aging experiment, a plurality of chips are respectively fixed in the plurality of fixing grooves, the cover plate is pressed down so that the probes are in contact with the P electrodes of the chips, and the power connector is plugged in to energize and realize the aging experiment. This device can simultaneously meet the aging experiment requirements of multiple chips and has higher experimental efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.

[0021] Figure 1 FIG. 1 is a schematic structural diagram of an embodiment of the fixture provided by the present utility model;

[0022] Figure 2 FIG. 2 is a schematic structural diagram of the fixture from another angle;

[0023] Figure 3 FIG. 3 is a top view of the fixture;

[0024] Figure 4 For Figure 3 FIG. 4 is a partial enlarged view of part A in FIG. 3.

[0025] DESCRIPTION OF THE REFERENCE NUMERALS IN THE DRAWINGS:

[0026] 1000, fixture; 1, base; 11, fixing groove; 12, power connector; 13, vertical plate; 2, cover plate; 21, first conductive rod; 211, connecting rod; 22, second conductive rod; 3, probe; 4, pressing plate; 41, kidney-shaped hole; 42, abutting protrusion; 5, fixing column.

[0027] The realization of the object, functional features and advantages of the present utility model will be further described with reference to the embodiments and the drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0029] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0031] The aging experiment of the chip heat sink is an important reliability test, aiming to simulate the thermal behavior and performance degradation of the chip under long-term operating conditions. By applying high temperature and / or power load to the chip in a controlled environment and for a predetermined time, potential material defects, thermal interface problems, or packaging deficiencies can be accelerated and exposed, thereby evaluating and improving the thermal stability and long-term reliability of the chip. This experiment is crucial for ensuring that the chip can continuously and stably operate in actual applications, especially under high temperature or high load conditions. The results of the aging experiment help optimize the thermal design of the chip and improve its durability and performance retention ability in electronic devices.

[0032] Currently, when the detector chip is undergoing power-on aging experiments at high temperatures, the commonly used method is to supply power to each chip using a single power source. Although this one-to-one power supply mode ensures the accuracy of the test, when faced with a large number of chips for aging, it brings significant challenges: it requires a large number of power supply devices, resulting in a substantial increase in costs and space requirements; at the same time, the complex needle-poking and wire-leading method not only increases the difficulty of wiring and the error rate but also reduces the overall test efficiency.

[0033] To solve the above problems, the present utility model proposes a fixture, aiming to provide a fixture that can simultaneously meet the aging test requirements of multiple chips. Figures 1 to 4 The structural schematic diagram of an embodiment provided by the fixture of the present utility model.

[0034] Please refer to Figures 1 to 4 As shown in the figure, the present utility model proposes a fixture 1000, which is applied to chip aging experiments and includes a base 1 and a cover plate 2. The base 1 is formed with a plurality of fixing grooves 11 for placing chips. The base 1 is provided with a power connector 12. The cover plate 2 is covered on the base 1. The cover plate 2 is provided with a plurality of probes 3 facing the base 1. Each probe 3 is arranged corresponding to a fixing groove 11. A part of the structure of the probe 3 is located in the opening direction of the fixing groove 11. The plurality of probes 3 are all connected to the power connector 12.

[0035] In the technical solution of the present utility model, a fixture 1000 and a chip aging experimental device are proposed. Among them, the fixture 1000 includes a base 1 and a cover plate 2. The base 1 is formed with a plurality of fixing grooves 11 for placing chips. The base 1 is provided with a power connector 12. The cover plate 2 is covered on the base 1. The cover plate 2 is provided with a plurality of probes 3 facing the base 1. Each probe 3 is arranged corresponding to a fixing groove 11. A part of the structure of the probe 3 is located in the opening direction of the fixing groove 11. The plurality of probes 3 are all connected to the power connector 12. When conducting chip aging experiments, a plurality of chips are respectively fixed in the plurality of fixing grooves 11, the cover plate 2 is pressed down so that the probes 3 are in contact with the P electrodes of the chips, and the power connector 12 is plugged in to energize and realize the aging experiment. This device can simultaneously meet the aging experiment requirements of multiple chips and has higher experimental efficiency.

[0036] To make the probes 3 conductive, two first conductive rods 21 are provided on the side of the cover plate 2 facing away from the base 1. Specifically, please further refer to Figure 1, the two first conductive rods 21 are arranged at intervals. The two first conductive rods 21 are respectively connected to a plurality of probes 3 through the protruding connecting rods 211, realizing the simultaneous power supply to the plurality of probes 3, improving the efficiency and throughput of the aging experiment, and allowing the simultaneous testing of multiple chips. Secondly, by centrally supplying power through the first conductive rods 21, the number of wires directly connected to the chips can be reduced, the wiring is simplified, and the wiring complexity and potential poor contact problems are reduced. In addition, this design can also improve the accuracy and consistency of the contact between the probes 3 and the chips by optimizing the position and layout of the conductive rods, ensuring that each probe 3 can stably transmit current. Finally, the centralized management of the power connection can also facilitate power distribution and control, facilitating the realization of automation and remote monitoring, and further improving the convenience and reliability of the aging test.

[0037] Further, a second conductive rod 22 is provided between the two first conductive rods 21. The two ends of the second conductive rod 22 are respectively connected to the first conductive rod 21 and the power connector 12. The advantages of adding the second conductive rod 22 and connecting its two ends to the first conductive rod 21 and the power connector 12 respectively include: This design provides a more direct and simplified electrical path, which helps to reduce the loss of current during transmission and ensures a stable and uniform current supply to the probes 3. Secondly, the electrical connection realized through the second conductive rod 22 can improve the reliability of the overall conductive system, reduce the contact resistance, and thus improve the electrical performance of the contact points between the probes 3 and the chips. In addition, this layout can optimize the power distribution, making the connection of the power connector 12 more compact and convenient, and simplifying the power management. At the same time, it may also reduce electromagnetic interference because the shorter conduction path helps to reduce the loop area, thereby reducing the sensitivity to external electromagnetic fields.

[0038] To prevent the cover plate 2 from contacting the probes 3 and causing compression to the probes 3, a plurality of abutting protrusions 42 are provided on the side of the cover plate 2 facing the base 1. Specifically, please further refer to Figure 2 , the plurality of abutting protrusions 42 are respectively arranged on both sides of the cover plate 2 and are evenly spaced. Each two abutting protrusions 42 and the cover plate 2 enclose a receiving space, and each receiving space corresponds to placing a probe 3, avoiding damage or deformation of the probes 3 caused by physical contact, ensuring the mechanical stability and test accuracy of the probes 3. Secondly, the receiving space formed by the abutting protrusions 42 provides accurate positioning for the probes 3, ensuring the alignment of the contact points between the probes 3 and the chips, and improving the consistency and repeatability of the test. In addition, this design also helps to achieve the uniform distribution and heat dissipation of the probes 3 because each probe 3 is independently placed in its own space, reducing the mutual interference and thermal influence between the probes 3. Finally, this structure also facilitates the maintenance and replacement of the probes 3 because each probe 3 is independently fixed and protected, simplifying the replacement process of the probes 3, thereby improving the convenience and reliability of the aging experiment.

[0039] For the fixed chip, the fixture 1000 further includes two pressing plates 4. Specifically, please further refer to Figure 1 , the two pressing plates 4 are respectively arranged on both sides of the cover plate 2 and cover a plurality of fixing grooves 11. By the combined use of the pressing plate 4 and the fixing grooves 11, it can ensure that the chip remains stable during the aging experiment and avoid displacement or misalignment caused by thermal expansion or mechanical vibration. Secondly, this bilateral pressing method helps to evenly distribute the pressure and reduce the local stress concentration on the chip, thereby reducing the risk of damage. Especially for sensitive semiconductor devices, this is particularly important. In addition, the design of the fixing grooves 11 allows for quick positioning and replacement of the chip, improving the efficiency of the experiment and the convenience of operation. At the same time, this structure also helps to achieve automation and batch processing because the standardized fixing grooves 11 can be compatible with automated equipment, facilitating the automation of large-scale chip aging tests. Finally, the design of the pressing plate 4 and the fixing grooves 11 can also provide a good heat conduction path, helping the chip to dissipate heat during the high-temperature aging experiment and ensuring the thermal stability of the chip and the reliability of the test. The base 1 is provided with a plurality of fixing holes facing the pressing plate 4. Each pressing plate 4 is provided with at least two waist-shaped holes 41, and each waist-shaped hole 41 corresponds to a fixing hole. The fixture 1000 further includes a plurality of fixing columns 5. A fixing column 5 passes through a waist-shaped hole 41 and is fixed in the fixing hole. The position of the pressing plate 4 can be adjusted through the waist-shaped hole 41 to adapt to chips of different sizes.

[0040] Furthermore, two vertical plates 13 are spaced apart on the base 1, and a plurality of fixing grooves 11 are arranged between the two vertical plates 13. The power connector 12 is arranged on one of the vertical plates 13. It should be noted that the base 1 can be made of aluminum alloy or brass, and the present utility model does not limit this. In an embodiment of the present utility model, the base 1 is made of brass. Due to its high thermal conductivity, brass can effectively dissipate the heat generated by the chip during the aging test and keep the chip temperature stable; at the same time, brass has good electrical conductivity; in addition, the corrosion resistance and cost-effectiveness of brass also make it an economical and practical choice. The combination of these characteristics of brass provides a stable and reliable basic platform for the chip aging test, helping to ensure the accuracy and repeatability of the test. In an embodiment of the present utility model, the probe 3 is made of tungsten needle. The tungsten needle has extremely high hardness and wear resistance, and can maintain the stability of shape and size during a long-term aging test, reducing wear; the low coefficient of thermal expansion of tungsten helps to maintain the precise alignment of the contact point between the probe 3 and the chip under temperature changes; in addition, the excellent electrical conductivity of tungsten ensures a stable and reliable electrical connection with the chip. The high-temperature resistance of tungsten also makes it perform excellently in a high-temperature aging test environment and is not prone to material degradation.

[0041] The present utility model further provides a chip aging experiment device, which includes a fixture 1000. The specific structure of the fixture 1000 refers to the above-mentioned embodiments. Since this chip aging experiment device adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be elaborated here one by one.

[0042] The above is only an exemplary embodiment of the present utility model, and does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.

Claims

1. A fixture, applied to chip aging experiments, characterized in that, Comprising: A base, the base is formed with a plurality of fixing grooves for placing chips, and the base is provided with a power connector; And A cover plate, the cover plate is covered on the base, the cover plate is provided with a plurality of probes facing the base, each probe is arranged corresponding to one of the fixing grooves, a part of the structure of the probe is located in the opening direction of the fixing groove, and the plurality of probes are all connected to the power connector.

2. The fixture according to claim 1, wherein The plurality of fixing grooves are uniformly arranged on both sides of the cover plate, and two first conductive rods are provided on the side of the cover plate facing away from the base, the two first conductive rods are arranged at intervals, the two first conductive rods are respectively connected to the plurality of probes, and the two first conductive rods are both connected to the power connector.

3. The fixture according to claim 2, characterized in that A second conductive rod is arranged between the two first conductive rods, and two ends of the second conductive rod are respectively connected to the first conductive rod and the power connector.

4. The fixture according to claim 2, wherein The cover plate is provided with a plurality of abutting protrusions on the side facing the base, and the plurality of abutting protrusions are arranged on both sides of the cover plate and are evenly spaced.

5. The fixture according to any one of claims 1 to 4, characterized in that, The fixture further includes two pressing plates, and the two pressing plates are respectively arranged on both sides of the cover plate and cover the plurality of fixing grooves.

6. The fixture according to claim 5, wherein The base is provided with a plurality of fixing holes facing the pressing plate, each pressing plate is provided with at least two waist-shaped holes, each waist-shaped hole corresponds to one of the fixing holes, and the fixture further includes a plurality of fixing columns, and one fixing column passes through one of the waist-shaped holes and is fixed in the fixing hole.

7. The fixture according to any one of claims 1 to 4, characterized in that, Two vertical plates are arranged at intervals on the base, the plurality of fixing grooves are arranged between the two vertical plates, and the power connector is arranged on one of the vertical plates.

8. The jig according to any one of claims 1 to 4, characterized in that, The material of the base is brass.

9. The fixture according to any one of claims 1 to 4, characterized in that, The material of the probe is tungsten.

10. A chip aging experiment device, characterized in that, Comprising the fixture according to any one of claims 1 to 9.

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