Needle die performance detection tool

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By designing needle mold performance testing tooling, the detection problems of probe modules and functional circuit boards in electronic product testing equipment are solved, the stability and flexibility of performance and quality inspection are achieved, and the inspection cost is reduced.

CN223092025UActive Publication Date: 2025-07-11INTELLIGENT AUTOMATION ZHUHAI CO LTD

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Patent Information

Application Number: CN202421877265.5
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2024-08-05
Publication Date: 2025-07-11
Estimated Expiration: 2034-08-05

AI Technical Summary

Technical Problem

During the inspection process of existing electronic product testing equipment, it is difficult to effectively detect the performance and quality problems of probe modules and functional circuit boards, especially quality problems such as false welding and circuit damage.

Method used

A needle mold performance detection tool is designed, including a probe module and a performance detection module. The product probe on the probe module is in contact with the conductive contacts, and combined with the SIP and B2B signal ends of the functional circuit board, the performance and quality detection of electronic products is realized, and the detachable functional circuit board is used to adapt to different detection needs.

Benefits of technology

The performance and quality inspection of electronic product testing equipment during factory and R&D process is realized, the inspection cost is reduced, and the design of floating springs and limit blocks ensures stable contact and protection of the probe to avoid damage.

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Abstract

The utility model provides a probe die performance detection tool, so that when an electronic product detection device leaves a factory and in the process of research and development of the electronic product detection device, the base can be placed on a probe module located in the electronic product detection device, and a product probe on the probe module penetrates through a needle passing hole to be in contact with a conductive contact to be electrified; therefore, the product probe, the probe module, the electronic product detection equipment and the functional circuit board are electrified. The functional circuit board can detect the performance and the quality of the electronic product detection equipment, detect whether the probe module and the product probes on the probe module have quality problems such as pseudo soldering and circuit damage, and perform performance and quality tests by performing simulation work on the functional circuit board through the electronic product detection equipment. The utility model belongs to the technical field of test equipment.

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Description

Technical Field

[0001] The utility model belongs to the technical field of testing equipment, and particularly relates to a needle die performance detection tooling. Background Art

[0002] Electronic product testing equipment is a device used to test the performance and quality of electronic products. With the development of the times and the continuous replacement of various high-tech products, in order to prevent unqualified products from being released to the market, these devices are widely used in various industrial and production environments to ensure the quality and performance of products. And when electronic product testing equipment is sold, it is also necessary to inspect the performance and quality of the "electronic product testing equipment". Summary of the Utility Model

[0003] The purpose of the utility model is to provide a needle die performance detection tooling to realize the detection of electronic product testing equipment.

[0004] A needle die performance detection tooling includes a probe module and a performance detection module. The probe module is applied to the electronic product testing equipment. The probe module is provided with product probes for contacting the product to be detected. The performance detection module includes a base and a functional circuit board. A transfer board is installed on the top of the base. The functional circuit board is provided with a SIP signal terminal and a B2B signal terminal that are electrically connected to the transfer board. The functional circuit board is detachably installed on the transfer board. The transfer board is provided with conductive contacts. A through-hole for the needle is provided at the bottom of the base. When the base is placed on the probe module, the product probes pass through the through-hole for the needle and contact the conductive contacts to conduct electricity.

[0005] According to the above technical solution, the utility model can achieve the following beneficial effects:

[0006] When the electronic product testing equipment leaves the factory and during the process of developing the electronic product testing equipment, by placing the base on the probe module located inside the electronic product testing equipment, the product probes on the probe module pass through the through-hole for the needle and contact the conductive contacts to conduct electricity, so as to energize the product probes, the probe module, and the electronic product testing equipment and the functional circuit board, enabling the functional circuit board to detect the performance and quality of the electronic product testing equipment, and detecting whether there are quality problems such as false soldering and circuit breakage of the probe module and the product probes thereon, and performing performance and quality tests by simulating the operation of the functional circuit board through the electronic product testing equipment.

[0007] In order to further optimize the above technical solution, one or more of the following embodiments can be optionally combined without conflict.

[0008] In some embodiments, a SIP module base is installed on the functional circuit board. The SIP module base is provided with a SIP support plate and SIP probes. The SIP support plate has a SIP slot for placing the functional circuit board. The SIP probes are electrically connected to the adapter board. The needle tips of the SIP probes are used to pass through the SIP slot to contact and energize the SIP signal terminals. The adapter board is provided with B2B probes for contacting and energizing the B2B signal terminals.

[0009] According to the above technical solution, the functional circuit board can be conveniently separated from and connected to the adapter board, so as to facilitate the replacement of the adapted functional circuit board according to the different functions and performances of the detection electronic product detection equipment. In addition, when it is necessary to detect different functions and performances of the electronic product detection equipment respectively, there is no need to prepare multiple sets of performance detection modules, thus reducing the detection cost.

[0010] In some embodiments, a B2B module base is installed on the functional circuit board. The B2B module base is provided with a B2B support plate. The B2B support plate is provided with a B2B slot. The SIP slot is used to support the part of the functional circuit board provided with the SIP signal terminal. The B2B slot is used to support the part of the functional circuit board provided with the B2B signal terminal. The needle tip of the B2B probe is used to pass through the B2B slot to contact and energize the B2B signal terminal.

[0011] According to the above technical solution, the local position of the functional circuit board is supported by the B2B slot and the SIP slot, so as to leave a larger area for the functional circuit board to dissipate heat.

[0012] In some embodiments, the SIP module base is provided with a SIP floating spring for supporting the SIP support plate. The B2B module base is provided with a B2B floating spring for supporting the B2B support plate. The base is installed with a pressing block for pressing the functional circuit board into the SIP slot and the B2B slot.

[0013] According to the above technical solution, the present invention further realizes the following beneficial effects:

[0014] 1. After the functional circuit board is supported by the SIP slot and the B2B slot, the pressing block presses down the functional circuit board. The functional circuit board pushes the SIP support plate and the B2B support plate to descend, so that the needle tips of the SIP probes pass through the SIP slot to contact and energize the SIP signal terminals, and the needle tips of the B2B probes pass through the B2B slot to contact and energize the B2B signal terminals. At this time, the pressing block fixes the functional circuit board, so that the functional circuit board is more stably energized with the adapter board.

[0015] 2. When the pressing block does not press down on the functional circuit board, the SIP floating spring pushes the SIP support plate upward, and the needle tip of the SIP probe retracts from the SIP slot. At the same time, the B2B floating spring raises the B2B support plate, and the needle tip of the B2B probe retracts from the B2B slot, so as to protect the SIP probe and the B2B probe when picking and placing the functional circuit board and when there is no functional circuit board placed in the SIP slot and the B2B slot.

[0016] In some embodiments, the base is provided with a limit block, and the limit block is located beside the B2B slot for supporting, limiting, and positioning the functional circuit board.

[0017] According to the above technical solution, after the functional circuit board is placed in the B2B slot and the SIP slot, the limit block provides support, limit, and positioning for the functional circuit board, so that the B2B signal terminal can be aligned with the needle tip of the B2B probe. At the same time, the SIP signal terminal can also be aligned with the needle tip of the SIP probe, so that when the pressing block presses down on the functional circuit board, the functional circuit board can be more stably energized with the adapter board.

[0018] In some embodiments, the probe module is provided with a probe base, and the product probe is located on the probe base. The bottom of the base is provided with a positioning notch for sleeving down onto the probe base.

[0019] According to the above technical solution, during the process of placing the base on the probe module located in the electronic product detection device, the product probe on the probe module can be aligned with the via hole, thus avoiding damage to the product probe.

[0020] In some embodiments, a wing screw for clamping and fixing to the probe base is provided on the positioning notch.

[0021] According to the above technical solution, after the base is placed on the probe module located in the electronic product detection device, the base is fixed to the probe base by the wing screw, so that the product probe can be more stably in contact with the conductive contact for power supply.

[0022] In some embodiments, a handle is installed on the base; according to the above technical solution, it is convenient to place the base on the probe module or take it out from the probe module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific embodiments in the present invention, the following will briefly describe the drawings and reference numerals required in the description of the specific embodiments.

[0024] Figure 1 It is a schematic structural diagram of the probe module of the present invention when the performance detection module is not placed.

[0025] Figure 2It is a schematic structural diagram during the process of the probe module placement performance detection module of the present utility model;

[0026] Figure 3 It is a schematic structural diagram after the probe module placement performance detection module of the present utility model;

[0027] Figure 4 It is an exploded view of the performance detection module of the present utility model;

[0028] Figure 5 It is an exploded view of the SIP module base and its surrounding components of the present utility model

[0029] Figure 6 It is an exploded view of the B2B module base and its surrounding components of the present utility model.

[0030] Reference numerals:

[0031] 1. Probe module; 11. Product probe; 12. Probe base; 2. Base; 21. Adapter board; 22. Through-hole for the needle; 23. Pressure block; 24. Positioning notch; 25. Wing screw; 26. Handle; 3. SIP module base; 31. SIP support plate; 32. SIP probe; 33. SIP slot; 34. SIP floating spring; 4. B2B module base; 41. B2B support plate; 42. B2B probe; 43. B2B slot; 44. B2B floating spring; 45. Limit block; 5. Functional circuit board. Detailed implementation manners

[0032] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the following detailed implementation manners will further elaborate on the present utility model with reference to the accompanying drawings. In addition, in the following descriptions, the descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present utility model.

[0033] As Figures 1 to 6 shown, the following detailed implementation manners provide a needle die performance detection tooling, which includes a probe module 1 and a performance detection module.

[0034] The probe module 1 is applied to an electronic product detection device. The probe module 1 is provided with a probe base 12, and a product probe 11 is provided on the probe base 12. The electronic product detection device is in contact with and energized to the electronic product to be detected through the product probe 11, so that the electronic product detection device can detect the electronic product.

[0035] The performance detection module includes a functional circuit board 5 and a base 2. The functional circuit board 5 is provided with a SIP signal terminal and a B2B signal terminal that are electrically connected to the adapter board 21. The bottom of the base 2 is provided with a positioning notch 24 for sleeving down onto the probe base 12, and a butterfly screw 25 for clamping and fixing to the probe base 12 is arranged on the positioning notch 24. A through-hole 22 is arranged at the bottom of the base 2 and is located within the positioning notch 24.

[0036] A handle 26, an adapter board 21, a limit block 45, and a pressing block 23 are installed on the top of the base 2; the handle 26 is used to lift the entire base 2; the adapter board 21 is provided with conductive contacts, a SIP module seat 3, and a B2B module seat 4; when the base 2 is placed on the probe module 1, the product probe 11 passes through the through-hole 22 and contacts the conductive contacts to conduct electricity; the SIP module seat 3 is provided with a SIP support plate 31, a SIP floating spring 34, and a SIP probe 32. The SIP support plate 31 has a SIP slot 33, and the SIP slot 33 is used to support the part of the functional circuit board 5 provided with the SIP signal terminal. The SIP floating spring 34 is used to support the SIP support plate 31. The SIP probe 32 is electrically connected to the adapter board 21, and the tip of the SIP probe 32 is used to pass through the SIP slot 33 and contact the SIP signal terminal to conduct electricity; the B2B module seat 4 is provided with a B2B support plate 41, a B2B floating spring 44, and a B2B probe 42. The B2B support plate 41 is provided with a B2B slot 43, and the B2B slot 43 is used to support the part of the functional circuit board 5 provided with the B2B signal terminal. The B2B floating spring 44 is used to support the B2B support plate 41. The B2B probe 42 is electrically connected to the adapter board 21, and the tip of the B2B probe 42 is used to pass through the B2B slot 43 and contact the B2B signal terminal to conduct electricity.

[0037] The limit block 45 is located beside the B2B slot 43, and the limit block 45 is used to support, limit, and position the functional circuit board 5. The pressing block 23 is used to press the functional circuit board 5 into the SIP slot 33 and the B2B slot 43. The pressing block 23 can drive the pressing block 23 to descend by setting screws or buckles that can be locked at a certain position of the chute, or by setting a lead screw module, so that the pressing block 23 can press and fix the functional circuit board 5.

[0038] The following is the usage instruction of the above-mentioned needle die performance detection tooling.

[0039] When installing the functional circuit board 5, the functional circuit board 5 is placed in the B2B slot 43 and the SIP slot 33. At this time, the limiting block 45 provides support, limitation and positioning for the functional circuit board 5. At the same time, the SIP slot 33 supports the part of the functional circuit board 5 where the SIP signal terminals are provided, and the B2B slot 43 supports the part of the functional circuit board 5 where the B2B signal terminals are provided. After that, the pressing block 23 presses down the functional circuit board 5, and the circuit board pushes the SIP support plate 31 and the B2B support plate 41 to descend. The needle tip of the SIP probe 32 passes through and enters the SIP slot 33 to contact and conduct electricity with the SIP signal terminals, and the needle tip of the B2B probe 42 passes through and enters the B2B slot 43 to contact and conduct electricity with the B2B signal terminals. At this time, the pressing block 23 fixes the functional circuit board 5.

[0040] When disassembling the functional circuit board 5, the pressing block 23 stops pressing and fixing the functional circuit board 5 and rises. After that, the SIP floating spring 34 pushes the SIP support plate 31 to rise, and the needle tip of the SIP probe 32 retracts from the SIP slot 33. At the same time, the B2B floating spring 44 pushes the B2B support plate 41 to rise, and the needle tip of the B2B probe 42 retracts from the B2B slot 43. At this time, the functional circuit board 5 can be taken out from the B2B slot 43 and the SIP slot 33.

[0041] When testing the electronic product testing equipment, the base 2 is placed on the probe module 1 located inside the electronic product testing equipment through the handle 26. At this time, the positioning notch 24 is sleeved down onto the probe base 12. At the same time, the product probe 11 on the probe module 1 passes through the through-hole 22 to contact and conduct electricity with the conductive contact, so that the product probe 11, the probe module 1 and the electronic product testing equipment are energized with the functional circuit board 5. After that, it is clamped onto the probe base 12 through the wing screw 25 to fix the base 2. After that, the functional circuit board 5 tests the performance and quality of the electronic product testing equipment. At the same time, the functional circuit board 5 detects whether there are quality problems such as false soldering and circuit breakage of the probe module 1 and the product probe 11 thereon. In addition, the performance and quality test can be carried out by the electronic product testing equipment through simulating the operation of the functional circuit board 5.

Claims

1. A needle die performance detection tooling, which comprises a probe module (1) and a performance detection module. The probe module (1) is applied to an electronic product detection device, and the probe module (1) is provided with a product probe (11) for contacting the product to be detected. It is characterized in that: The performance detection module includes a base (2) and a functional circuit board (5). A transfer board (21) is mounted on the top of the base (2). The functional circuit board (5) is provided with a SIP signal terminal and a B2B signal terminal that are electrically connected to the transfer board (21). The functional circuit board (5) is detachably mounted on the transfer board (21). The transfer board (21) is provided with conductive contacts. A via hole (22) is provided at the bottom of the base (2). When the base (2) is placed on the probe module (1), the product probe (11) passes through the via hole (22) and contacts the conductive contacts to conduct electricity.

2. The performance detection tooling for a needle die according to claim 1, wherein: The functional circuit board (5) is mounted with a SIP module base (3). The SIP module base (3) is provided with a SIP support plate (31) and a SIP probe (32). The SIP support plate (31) is provided with a SIP slot (33) for placing the functional circuit board (5). The SIP probe (32) is electrically connected to the transfer board (21). The tip of the SIP probe (32) is used to pass through the SIP slot (33) and contact the SIP signal terminal to conduct electricity. The transfer board (21) is provided with a B2B probe (42) for contacting and conducting electricity with the B2B signal terminal.

3. The performance detection tooling for a needle die according to claim 2, wherein: The functional circuit board (5) is mounted with a B2B module base (4). The B2B module base (4) is provided with a B2B support plate (41). The B2B support plate (41) is provided with a B2B slot (43). The SIP slot (33) is used to support the part of the functional circuit board (5) where the SIP signal terminal is provided. The B2B slot (43) is used to support the part of the functional circuit board (5) where the B2B signal terminal is provided. The tip of the B2B probe (42) is used to pass through the B2B slot (43) and contact the B2B signal terminal to conduct electricity.

4. A needle die performance detection tooling according to claim 3, characterized in that: The SIP module base (3) is provided with a SIP floating spring (34) for supporting the SIP support plate (31). The B2B module base (4) is provided with a B2B floating spring (44) for supporting the B2B support plate (41). A pressing block (23) for pressing the functional circuit board (5) into the SIP slot (33) and the B2B slot (43) is mounted on the base (2).

5. A needle die performance detection tooling according to claim 4, characterized in that: A limiting block (45) is mounted on the base (2). The limiting block (45) is located beside the B2B slot (43) for supporting, limiting and positioning the functional circuit board (5).

6. A needle die performance detection tooling according to any one of claims 1 to 5, characterized in that: The probe module (1) is provided with a probe base (12). The product probe (11) is located on the probe base (12). A positioning notch (24) for sleeving down onto the probe base (12) is provided at the bottom of the base (2).

7. The performance detection tooling for a needle die according to claim 6, wherein: A butterfly screw (25) for clamping and fixing onto the probe base (12) is provided on the positioning notch (24).

8. A needle die performance detection tooling according to claim 6, characterized in that: A handle (26) is mounted on the base (2).