Withstand voltage tester

By combining air-cooling and water-cooling heat dissipation methods, the problem of poor heat dissipation effect of the pressure-resistant tester is solved, and more efficient heat dissipation effect is achieved and testing efficiency is improved.

CN223092067UActive Publication Date: 2025-07-11WUHAN NANXING POWER TECH CO LTD
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Patent Information

Application Number
CN202421384684.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-17
Publication Date
2025-07-11
Estimated Expiration
2034-06-17

AI Technical Summary

Technical Problem

The existing pressure withstand testers have poor heat dissipation during work, which affects the testing efficiency.

Method used

The heat dissipation method of combining air cooling and water cooling is adopted to dissipate the test module in all aspects through the semiconductor refrigeration plate and cooling pipe network and the cooling fan.

Benefits of technology

It achieves more efficient heat dissipation and improves the working efficiency of the test module.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223092067U_ABST
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Abstract

The utility model discloses a withstand voltage tester, which comprises a shell, a test module, a wiring panel and a heat dissipation assembly, the test module and the heat dissipation assembly are arranged in the shell, and the wiring panel is arranged on the front surface of the shell; the cooling assembly comprises a cooling fan, a water tank, a semiconductor chilling plate, a water pump, a cooling pipe network, a water inlet pipe and a water recycling pipe, the water tank is arranged on the side face of the shell, the semiconductor chilling plate is arranged in the water tank, the cooling pipe network is wound around the testing module, one end of the water inlet pipe extends into the bottom of the water recycling pipe, and the other end of the water inlet pipe is connected to the water inlet end of the cooling pipe network; the water pump is arranged on the water inlet pipe, one end of the recycling water pipe is connected to the water outlet end of the cooling pipe network, the other end of the recycling water pipe is connected to the water tank, and the cooling fan is arranged in the shell through a support and close to the side face of the shell. Compared with the prior art, the water-cooling and air-cooling combined heat dissipation assembly is arranged, the test module is wrapped by the cooling pipe network, all-around water-cooling heat dissipation can be achieved, the heat dissipation effect is good in cooperation with air cooling, and the test efficiency is higher.
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Description

Technical Field

[0001] The utility model relates to a withstand voltage tester. Background Art

[0002] As a commonly used test component in the tests of electrical insulation strength and dielectric strength, the withstand voltage tester is widely used. In the existing withstand voltage tester, during the working process, the internal electronic components will generate heat, so heat dissipation is required. For the existing heat dissipation methods, for example, the withstand voltage tester with the patent number ZL202321323415.3 uses air cooling for heat dissipation, but its heat dissipation effect is not good, which will affect the test efficiency. Content of the Utility Model

[0003] In view of the above, the utility model provides a withstand voltage tester to solve the problems existing in the above prior art.

[0004] According to one aspect of the utility model, a withstand voltage tester is provided, which includes a housing, a test module, a wiring panel, and a heat dissipation component that uses a combination of air cooling and water cooling to dissipate heat from the test module. The test module and the heat dissipation component are both arranged inside the housing, and the wiring panel is arranged on the front of the housing;

[0005] The heat dissipation component includes a cooling fan, a water tank, a semiconductor refrigeration sheet that can cool the water in the water tank, a water pump, a cooling pipe network that can cool the test module, a water inlet pipe, and a recovery water pipe that recovers water into the water tank. The water tank is arranged on the side of the housing, the semiconductor refrigeration sheet is arranged inside the water tank, the cooling pipe network is wound around the test module, one end of the water inlet pipe extends into the bottom of the recovery water pipe, and the other end is connected to the water inlet end of the cooling pipe network. The water pump is arranged on the water inlet pipe, one end of the recovery water pipe is connected to the water outlet end of the cooling pipe network, and the other end is connected to the water tank. The cooling fan is arranged inside the housing through a bracket and is close to the side of the housing;

[0006] The cooling pipe network is a mesh structure that can wrap the heating elements of the test module.

[0007] Preferably, a dust-proof back panel that can be opened for heat dissipation during heat dissipation is also arranged on the side of the housing.

[0008] Preferably, the dust-proof back panel is connected to the housing through an electric hinge.

[0009] Preferably, an external power cord and a heat dissipation switch are also arranged on the housing.

[0010] The beneficial effects of the utility model are as follows:

[0011] By setting a heat dissipation component that combines water cooling and air cooling, and wrapping the test module with the cooling pipe network, comprehensive water cooling heat dissipation can be achieved. Combined with air cooling, the heat dissipation effect is good and the test efficiency is higher. Description of the Drawings

[0012] Figure 1 This is a cross-sectional view of the present utility model;

[0013] Figure 2 This is a schematic diagram of the cooling pipe network structure;

[0014] In the figure, 1 is the outer shell; 2 is the test module; 3 is the cooling fan; 4 is the bracket; 5 is the water tank; 6 is the semiconductor refrigeration sheet; 7 is the water pump; 8 is the cooling pipe network; 9 is the water inlet pipe; 10 is the recovery water pipe; 11 is the dust-proof back panel; 12 is the electric hinge; 13 is the cooling switch. Specific embodiments

[0015] The present utility model will be further described below with reference to the accompanying drawings and some embodiments.

[0016] Figure 1-2 Among them, a withstand voltage tester includes an outer shell 1, a test module 2, a wiring panel, and a heat dissipation component that uses a combination of air cooling and water cooling to dissipate heat from the test module 2. The test module 2 and the heat dissipation component are both arranged inside the outer shell 1, and the wiring panel is arranged on the front of the outer shell 1;

[0017] The heat dissipation component includes a cooling fan 3, a water tank 5, a semiconductor refrigeration sheet 6 that can cool the water in the water tank 5, a water pump 7, a cooling pipe network 8 that can cool the test module 2, a water inlet pipe 9, and a recovery water pipe 10 that returns water to the water tank 5. The water tank 5 is arranged on the side of the outer shell 1, the semiconductor refrigeration sheet 6 is arranged inside the water tank 5, the cooling pipe network 8 is wound around the test module 2, one end of the water inlet pipe 9 extends into the bottom of the recovery water pipe 10, and the other end is connected to the water inlet end of the cooling pipe network 8. The water pump 7 is arranged on the water inlet pipe 9. One end of the recovery water pipe 10 is connected to the water outlet end of the cooling pipe network 8, and the other end is connected to the water tank 5. The cooling fan 3 is arranged inside the outer shell 1 through a bracket 4 and is close to the side of the outer shell 1;

[0018] The cooling pipe network 8 is a mesh structure that can wrap the heating elements of the test module 2; the test module 2 has the same structure and principle as the test module 2 of the withstand voltage tester in the prior art.

[0019] In this embodiment, a dust-proof back panel 11 that can be opened for heat dissipation during heat dissipation is further arranged on the side of the outer shell 1; the dust-proof back panel 11 is connected to the outer shell 1 through an electric hinge 12; an external power cord and a cooling switch 13 are also arranged on the outer shell 1.

[0020] When this embodiment is specifically implemented:

[0021] During the operation of the test module 2, by turning on the heat dissipation switch 13, the water pump 7, the semiconductor refrigeration sheet 6, and the heat dissipation fan 3 are started. The water pump 7 transports water into the cooling pipe network 8, and then flows back into the water tank 5 through the return water pipe. After being cooled by the semiconductor refrigeration sheet 6, the temperature of the water flowing into the cooling pipe network 8 in each cycle is relatively low, which can achieve a good cooling effect. Coupled with the operation of the heat dissipation fan 3, the cooling effect of the test module 2 is good, and the working efficiency of the test module 2 is improved.

[0022] In this embodiment, the control circuit of the present utility model is a common circuit in the field of circuits. The device of the present utility model can be connected to an external power supply or an internal battery through a power cord to provide electrical energy for the device, which can be achieved by those skilled in the art and will not be elaborated here.

[0023] It should be noted that: in the description of the present utility model, the meaning of "a plurality of" is two or more, unless otherwise specifically defined. In the present utility model, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; the circuits described in the present utility model are all common circuits in the field, and other related components are all existing common components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0024] For those skilled in the art, it is obvious that the patent of the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the patent of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the patent of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the same elements of the claims are intended to be included in the patent of the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A withstand voltage tester, characterized in that: It includes a housing, a test module, a wiring panel, and a heat dissipation component that uses a combination of air cooling and water cooling to dissipate heat from the test module. The test module and the heat dissipation component are both arranged inside the housing, and the wiring panel is arranged on the front of the housing; The heat dissipation component includes a cooling fan, a water tank, a semiconductor refrigeration sheet that can cool the water in the water tank, a water pump, a cooling pipe network that can cool the test module, a water inlet pipe, and a recovery water pipe that recovers water into the water tank. The water tank is arranged on the side of the housing, the semiconductor refrigeration sheet is arranged inside the water tank, the cooling pipe network is wound around the test module, one end of the water inlet pipe extends into the bottom of the recovery water pipe, and the other end is connected to the water inlet end of the cooling pipe network. The water pump is arranged on the water inlet pipe, one end of the recovery water pipe is connected to the water outlet end of the cooling pipe network, and the other end is connected to the water tank. The cooling fan is arranged inside the housing through a bracket and is close to the side of the housing; The cooling pipe network is a mesh structure that can wrap the heating elements of the test module inside.

2. The withstand voltage tester according to claim 1, wherein: A dust-proof back panel that can be opened for heat dissipation during heat dissipation is also arranged on the side of the housing.

3. A withstand voltage tester according to claim 2, characterized in that: The dust-proof back panel is connected to the housing through an electric hinge.

4. The withstand voltage tester according to claim 3, characterized in that: An external power cord and a heat dissipation switch are also arranged on the housing.

Citation Information

Patent Citations

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