Backlight FPC binding structure

Abstract

The utility model relates to a backlight FPC binding structure. The backlight FPC binding structure comprises a first FPC board, a display assembly, a second FPC board and an ITO wire, the display assembly comprises a first glass substrate, and the first FPC board is arranged on the first glass substrate; the second FPC board is arranged on the first glass substrate; the first end of the ITO wire is electrically connected with the first FPC board, and the second end of the ITO wire is electrically connected with the second FPC board. According to the scheme provided by the invention, the exposed area of the backlight FPC board can be reduced, so that the occupied space is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display, in particular to a backlight FPC binding structure. Background Technique

[0002] At present, for a liquid crystal display module with a backlight, the backlight FPC board usually needs to be soldered to the LCD screen FPC board. This requires a protruding part on the LCD screen FPC board for soldering the backlight FPC board. At the same time, the space required for the parallel arrangement of the backlight FPC board and the LCD screen FPC board is relatively wide, resulting in a relatively large space required for the terminal where the liquid crystal display module is applied to store the backlight FPC board and the LCD screen FPC board. Content of the Utility Model

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a backlight FPC binding structure that can reduce the exposed area of the backlight FPC board, thereby reducing the occupied space.

[0004] The purpose of the utility model is achieved through the following technical solutions:

[0005] A first aspect of the present application provides a backlight FPC binding structure, including: a first FPC board; a display component including a first glass substrate, the first FPC board being disposed on the first glass substrate; a second FPC board, the second FPC board being disposed on the first glass substrate; an ITO trace, a first end of the ITO trace being electrically connected to the first FPC board, and a second end of the ITO trace being electrically connected to the second FPC board.

[0006] It further includes a first conduction pin disposed on the first FPC board, the first conduction pin being electrically connected to the first end of the ITO trace.

[0007] It further includes a second conduction pin disposed on the second FPC board, the second conduction pin being electrically connected to the second end of the ITO trace.

[0008] The display component further includes a protective glue disposed on the first FPC board.

[0009] The display component further includes a second glass substrate disposed on the first glass substrate.

[0010] The display component further includes a first polarizer disposed on the first glass substrate.

[0011] The display component further includes a second polarizer disposed on the second glass substrate.

[0012] The display component further includes a chip, and the chip is disposed on the first glass substrate.

[0013] It further includes a backlight module, the backlight module is disposed on the first polarizer, and the first FPC board is disposed on the backlight module.

[0014] The first FPC board has a first side edge, the second FPC board has a second side edge, and the first side edge is parallel to the second side edge.

[0015] Compared with the prior art, the present utility model has at least the following advantages:

[0016] In this application, the length of the first FPC board is shortened and then bonded to the first glass substrate, and the ITO trace is used to electrically connect the first FPC board and the second FPC board, thereby replacing the traditional method of soldering the first FPC board to the second FPC board, reducing the exposed area of the first FPC board and the occupied space, so that the terminal does not need to additionally increase the storage space. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below.

[0018] Figure 1 It is a schematic structural diagram of a backlight FPC bonding structure in an embodiment of the present utility model;

[0019] Figure 2 It is a schematic structural diagram of another embodiment of a backlight FPC bonding structure in an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The embodiments of the present application will be described in more detail with reference to the accompanying drawings. Although the embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0022] Unless otherwise clearly specified and defined, terms such as "install", "connect", "link", "fix", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] Currently, for a liquid crystal display module with a backlight, the backlight FPC board usually needs to be soldered to the LCD screen FPC board. This makes it necessary for the LCD screen FPC board to protrude a part for soldering the backlight FPC board. At the same time, the space required for the parallel arrangement of the backlight FPC board and the LCD screen FPC board is relatively wide, thus resulting in a relatively large space required for the terminal where the liquid crystal display module is applied to store the backlight FPC board and the LCD screen FPC board.

[0024] In view of the above problems, an embodiment of the present application provides a backlight FPC binding structure, which can reduce the exposed area of the backlight FPC board, thereby reducing the occupied space.

[0025] The technical solutions of the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0026] See Figure 1 and Figure 2 , a backlight FPC binding structure, including: a first FPC board 100, a display component 200, a second FPC board 300 and an ITO trace 400. The display component 200 includes a first glass substrate 210, and the first FPC board 100 is disposed on the first glass substrate 210; the second FPC board 300 is disposed on the first glass substrate 210; the first end of the ITO trace 400 is electrically connected to the first FPC board 100, and the second end of the ITO trace 400 is electrically connected to the second FPC board 300.

[0027] Specifically, the first FPC board 100 has a first side 110, the second FPC board 300 has a second side 310, and the first side 110 is parallel to the second side 310.

[0028] It should be noted that the first FPC board 100 is a backlight FPC board, and the second FPC board 300 is an LCD screen FPC board. In this application, the length of the first FPC board 100 is shortened and then bonded to the first glass substrate 210. The ITO trace 400 is used to electrically connect the first FPC board 100 and the second FPC board 300, thereby replacing the traditional method of soldering the first FPC board 100 to the second FPC board 300, reducing the exposed area of the first FPC board 100 and the occupied space, so that the terminal does not need to additionally increase the storage space.

[0029] See Figure 1 , in an embodiment, the backlight FPC bonding structure further includes a first conduction pin 500. The first conduction pin 500 is disposed on the first FPC board 100 and is electrically connected to the first end of the ITO trace 400. Specifically, the backlight FPC bonding structure further includes a second conduction pin 600. The second conduction pin 600 is disposed on the second FPC board 300 and is electrically connected to the second end of the ITO trace 400.

[0030] It should be noted that the first conduction pin 500 is the pin for electrically connecting the first FPC board 100 and the ITO trace 400, and the second conduction pin 600 is the pin for electrically connecting the second FPC board 300 and the ITO trace 400.

[0031] See Figure 2 , in an embodiment, the display component 200 further includes a protective glue 220. The protective glue 220 is disposed on the first FPC board 100.

[0032] It should be noted that the protective glue 220 covers the first FPC board 100 and the second FPC board 300, serving the function of dust prevention.

[0033] See Figure 2 , in an embodiment, the display component 200 further includes a second glass substrate 230. The second glass substrate 230 is disposed on the first glass substrate 210.

[0034] It should be noted that a liquid crystal cell is formed between the second glass substrate 230 and the first glass substrate 210 for injecting liquid crystal.

[0035] See Figure 2 , in an embodiment, the display component 200 further includes a first polarizer 240. The first polarizer 240 is disposed on the first glass substrate 210. Specifically, the display component 200 further includes a second polarizer 250. The second polarizer 250 is disposed on the second glass substrate 230.

[0036] It should be noted that the polarizer serves the function of polarizing light.

[0037] See Figure 2 , in one embodiment, the display component 200 further includes a chip 260, and the chip 260 is disposed on the first glass substrate 210.

[0038] It should be noted that the chip 260 is used to control the display of the images on the display screen.

[0039] See Figure 2 , in one embodiment, the backlight FPC bonding structure further includes a backlight module 700, the backlight module 700 is disposed on the first polarizer 240, and the first FPC board 100 is disposed on the backlight module 700.

[0040] It should be noted that the backlight module 700 is used to provide a backlight source.

[0041] The solutions of the present application have been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments. Those skilled in the art should also know that the actions and modules involved in the specification are not necessarily essential to the present application. In addition, it can be understood that the steps in the method embodiments of the present application can be adjusted, combined, and deleted according to actual needs, and the modules in the device embodiments of the present application can be combined, divided, and deleted according to actual needs.

[0042] The various embodiments of the present application have been described above. The above description is exemplary and not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles of the embodiments, the practical application, or the improvement of the technology in the market, or to enable other ordinary skilled in the art in the technical field to understand the embodiments disclosed herein.

Claims

1. A backlight FPC binding structure, characterized in that, Including: The first FPC board; A display component, including a first glass substrate, and the first FPC board is disposed on the first glass substrate; The second FPC board, and the second FPC board is disposed on the first glass substrate; ITO traces, a first end of the ITO traces is electrically connected to the first FPC board, and a second end of the ITO traces is electrically connected to the second FPC board.

2. The backlight FPC bonding structure according to claim 1, wherein It further includes a first conduction pin, the first conduction pin is disposed on the first FPC board, and the first conduction pin is electrically connected to the first end of the ITO traces.

3. The backlight FPC bonding structure according to claim 1, wherein It further includes a second conduction pin, the second conduction pin is disposed on the second FPC board, and the second conduction pin is electrically connected to the second end of the ITO traces.

4. The backlight FPC binding structure according to claim 1, wherein The display component further includes a protective glue, and the protective glue is disposed on the first FPC board.

5. The backlight FPC binding structure according to claim 1, wherein, The display component further includes a second glass substrate, and the second glass substrate is disposed on the first glass substrate.

6. The backlight FPC binding structure according to claim 1, wherein The display component further includes a first polarizer, and the first polarizer is disposed on the first glass substrate.

7. The backlight FPC bonding structure according to claim 5, wherein, The display component further includes a second polarizer, and the second polarizer is disposed on the second glass substrate.

8. The backlight FPC bonding structure according to claim 1, wherein, The display component further includes a chip, and the chip is disposed on the first glass substrate.

9. The backlight FPC binding structure according to claim 6, wherein, It further includes a backlight module, the backlight module is disposed on the first polarizer, and the first FPC board is disposed on the backlight module.

10. The backlight FPC binding structure according to claim 1, wherein, The first FPC board has a first side edge, the second FPC board has a second side edge, and the first side edge is parallel to the second side edge.

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