Display assembly

Abstract

The utility model discloses a display assembly of head-mounted equipment, and relates to the field of AR head-mounted equipment. Comprising a supporting plate and a display chip, the back face of the display chip is attached to the supporting plate, an electric connection area is arranged on the front face of the display chip, and the electric connection area is adjacent to the first side edge of the display chip; the first connecting end of the circuit board is connected with the supporting plate, the first connecting end of the circuit board is adjacent to the first side edge of the display chip and is provided with a circuit board electric connecting position, and the circuit board electric connecting position is electrically connected with the electric connecting area.

Description

Technical Field

[0001] The present application relates to the technical field of display components. Specifically, the present application relates to a display component. Background Art

[0002] In recent years, the development of virtual reality (VR) / augmented reality (AR) technology has met the user's demand for immersive experience. One of the core components of the near-eye display system of a head-mounted device is a projection module. The projection module generally includes a display component and a projection lens. The display component includes a display chip for outputting image light rays and a circuit board for supplying power to the display chip. Generally, the display chip is mounted on the circuit board and electrically connected to the circuit board through conduction methods such as wire bonding and solder ball soldering. Specifically, wire bonding means designing corresponding pads on the display chip and the circuit board, and then conducting the above pads with a wire such as a gold wire. The projection lens is used to receive and magnify the image light rays from the display chip.

[0003] However, the existing projection module is large in volume, resulting in a bulky head-mounted device. Moreover, when the display chip works, it will generate a large amount of heat, causing the head-mounted device to heat seriously and affecting the user experience. Therefore, the miniaturization of the projection module and the optimization design of heat dissipation are imminent. Summary of the Invention

[0004] One or more embodiments of the present application provide a display component, which designs the structure of the display component and the layout of the wires in the display component to solve at least part of or alleviate the above at least one problem or requirement.

[0005] The other advantages and features of the present application are fully reflected by the following detailed description and can be achieved by the combination of the means and devices specifically pointed out in the appended claims.

[0006] According to one aspect of the present application, the display component of the present application that can achieve the foregoing purpose and other purposes and advantages includes:

[0007] A support plate;

[0008] A display chip, the back surface of which is mounted on the support plate, and an electrical connection area is provided on the front surface of the display chip, and the electrical connection area is adjacent to the first side edge of the display chip;

[0009] A circuit board, the first connection end of which is engaged with the support plate, the circuit board is adjacent to the first side edge of the display chip and is provided with a circuit board electrical connection position, and the circuit board electrical connection position is electrically connected to the electrical connection area.

[0010] In one embodiment, the surface where the light-emitting region of the display chip is located has a first side region, and the circuit board assembly has a second side region and is arranged adjacent to the first side region; at least two groups of chip electrical connection bit groups are arranged on the first side region of the display chip along a direction perpendicular to the length extension direction of the first side region, and each chip electrical connection bit group includes a plurality of chip electrical connection bits arranged in sequence along the extension direction of the first side; on the circuit board assembly, at least three groups of circuit board electrical connection bit groups are distributed on the second side region along a direction perpendicular to the length extension direction of the first side, and each circuit board electrical connection bit group includes a plurality of circuit board electrical connection bits distributed along the length extension direction of the first side region; and a plurality of wires, both ends of the wire are electrically connected to a chip electrical connection bit and a circuit board electrical connection bit respectively, at least 50% or more of the wires are distributed wires, and the length of the distributed wire is at least different from that of the adjacent wire on one side.

[0011] In one embodiment, a plurality of the chip electrical connection bits in the chip electrical connection bit group on the display chip are staggeredly distributed in the length extension direction of the first side region with respect to a plurality of the chip electrical connection bits in the adjacent chip electrical connection bit group.

[0012] In one embodiment, the number of the circuit board electrical connection bit groups is more than the number of the chip electrical connection bit groups.

[0013] In one embodiment, both ends of the adjacent wires are respectively connected to different chip electrical connection bit groups and different circuit board electrical connection bit groups.

[0014] In one embodiment, when the number of the chip electrical connection bit groups is 2, the number of the circuit board electrical connection bit groups is 3 to 5.

[0015] In one embodiment, the circuit board assembly includes a circuit board and a support board; the display chip is configured on the support board, and the circuit board electrical connection bit groups are configured on the circuit board.

[0016] In one embodiment, the material of the support board is metal.

[0017] In one embodiment, the circuit board has a circuit board body, a second connection end and a first connection end located at both ends of the circuit board body; a capacitor component for power supply is configured in the second connection end, the circuit board electrical connection bit groups are located at the first connection end, the second connection end is electrically connected to the first connection end, and the circuit board is connected to the surface of the support board where the display chip is installed through the first connection end.

[0018] In one embodiment, the circuit board body is a flexible circuit board, and the circuit board body can be flexibly bent so that the first connecting end and the second connecting end at both ends of the circuit board body can adjust the relative orientation.

[0019] In one embodiment, a bracket is further included, in which the chip electrical connection bit group of the display chip and the circuit board electrical connection bit group of the circuit board assembly are enclosed, and the bracket is formed with a channel for the wire to pass through, and the wire is inserted into the channel.

[0020] In one embodiment, the surface of the display chip has a luminous area and a non-luminous area, the second side area is located in the non-luminous area, the support plate has a covering area reserved around the display chip, and the bracket also covers the non-luminous area and the covering area of ​​the support plate.

[0021] In one embodiment, the bracket is made of resin.

[0022] In one embodiment, the surface of the support plate in contact with the bracket is provided with a roughened structure; or the surface flatness of the support plate in contact with the bracket is less than 30 μm; or the surface of the support plate in contact with the bracket is coated with ink, and the thickness of the ink is 1 μm-9 μm.

[0023] In one embodiment, the chip electrical connection bits in the chip electrical connection bit group are arranged in parallel with the chip electrical connection bits in other chip electrical connection bit groups.

[0024] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of a projection module according to a preferred embodiment of the present application.

[0026] Figure 2 It is a schematic structural diagram of a display component according to a preferred embodiment of the present application.

[0027] Figure 3 It is a schematic diagram of the arrangement of the chip electrical connection bit group and the circuit board electrical connection bit group in this application.

[0028] Figure 4 It is another schematic diagram of the arrangement of the chip electrical connection bit group and the circuit board electrical connection bit group in the present application.

[0029] Figure 5 This is a schematic diagram of the structure of a display component from another viewing angle according to a preferred embodiment of the present application.

[0030] Figure 6 Schematic structural diagram of a display component with a bracket installed according to a preferred embodiment of the present application.

[0031] Figure 7 Cross-sectional view of a display component according to a preferred embodiment of the present application. Detailed implementation manners

[0032] The following description is used to disclose the present application so that those skilled in the art can implement the present application. The preferred embodiments in the following description are only examples, and other obvious variations can be thought of by those skilled in the art. The basic principles defined in the following description of the present application can be applied to other implementation schemes, variant schemes, improvement schemes, equivalent schemes, and other technical schemes that do not depart from the spirit and scope of the present application.

[0033] Those skilled in the art should understand that in the disclosure of the present application, the orientation or positional relationships indicated by the terms "longitudinal", "transverse", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on the present application.

[0034] On the one hand, the present application discloses a head-mounted device, which at least includes a projection module 1. The head-mounted device is, for example, glasses, and the projection module is configured on the temple of the glasses. The real scene transmitted by the glasses lens and the virtual image transmitted by the projection module jointly form an image projected into the user's eyes.

[0035] Since this head-mounted device is worn on the human head, the weight and size of the head-mounted device will directly affect the user's experience. To meet the user's experience, the size and weight of the head-mounted device need to be reduced as much as possible, so that the user can have a better experience when wearing the head-mounted device.

[0036] For this reason, the present application discloses a projection module 1, which further includes a plurality of display components 10. The circuit board component 12 in the display component 10 can be bent, so that in the installation of the projection lens 30 and the display component 10 in the projection module 1, by bending the circuit board and combined installation, the size of the projection lens 30 can be reduced as much as possible, thereby reducing the overall volume of the head-mounted device and improving the user's experience.

[0037] In some specific embodiments of the present application, the projection module 1 includes a frame 20, a projection lens 30, a dichroic prism (not shown in the figure), and three display components 10. The projection lens 30 is mounted at one end of the frame 20, that is, the light-emitting side, and a first side and a second side parallel to each other are set on the frame 20 along the extending direction of the optical axis of the projection lens 30. The projection lens 30 is disposed on the second side of the frame 20 and fixedly connected to the frame 20. Further, the frame 20 has at least four peripheral walls opposite to each other in pairs, and the space between the at least four peripheral walls is the light transmission direction. The dichroic prism is fixedly installed between the at least four peripheral walls. At least three of the peripheral walls are provided with through grooves. In other words, the frame 20 has four side surfaces parallel to the extending direction of the optical axis of the projection lens 30 and perpendicular to the first side and the second side of the above frame 20, corresponding to the third side, the fourth side, the fifth side, and the sixth side respectively. Through grooves are provided in the directions of the first side, the third side, the fourth side, the fifth side, and the sixth side of the frame 20. That is, the directions of the first side, the third side, the fourth side, the fifth side, and the sixth side of the frame 20 are in an open state. The dichroic prism is disposed within the frame 20 and at least one outer surface of the dichroic prism faces the first side, the third side, the fourth side, the fifth side, and the sixth side. A display component 10 is disposed in each of the through grooves on the third side, the fourth side, and the fifth side of the frame 20. These display components 10 are used to provide virtual images or information by emitting light. The virtual images or information provided by the light emission of these display components 10 are projected onto the projection lens 30 through the dichroic prism. The projection lens 30 precisely focuses or diffuses the light, and ensures that the image is clearly projected onto the user's eyes via a waveguide device or other optical path diffusion elements. The display component 10, the dichroic prism, and the projection lens 30 together form an optical system, and the frame 20 provides support for the display component 10, the dichroic prism, and the projection lens 30. These structures are the basic components of the projection module 1.

[0038] The overall size of the projection module 1 is reduced by the assembly method of the display component 10 and the projection lens 30, which is achieved through the following design of the display component 10.

[0039] Such as Figure 1 and Figure 2As shown in the figure, the display component 10 includes a display chip 11 and a circuit board component 12. The display chip 11 is mounted on the circuit board component 12. The circuit board component 12 has a circuit board 121, and the circuit board 121 includes a circuit board body 1211, a first connection end 1212 and a second connection end 1213 located at both ends of the circuit board body 1211 respectively. The display chip 11 is fixedly connected and electrically connected to the first connection end 1212 of the circuit board body 1211. Since one side of the display chip 11 required by the display component 10 needs to be miniaturized as much as possible to save the size of the projection module 1, some electronic components arranged on the first connection end 1212 side of the circuit board body 1211 need to be arranged at other positions to save the projection side surface area of the display component 10. Therefore, a capacitor component 12131 and a connector 12132 are configured on the second connection end 1213 of the circuit board body 1211. The capacitor component 12131 is used to supply power to the display chip 11 or implement other electronic adjustment functions, and the connector 12132 is used to be electrically connected to the circuit component of the head-mounted device. The circuit board body 1211 is a flexible circuit board, and the circuit board body 1211 can be bent so that the first connection end 1212 and the second connection end 1213 at both ends of the circuit board body 1211 are arranged at different angles and positions. In this way, multiple display components 10 can be arranged opposite to the color-combining prism in the frame 20 through the through grooves on the third side, fourth side and fifth side of the frame 20, and the multiple circuit board components 12 thereof can be bent to the second side of the frame 20, that is, bent and extended to the rear of the projection lens 30, so as to reduce the space of the projection module 1 on the light-emitting side of the projection lens 30. As Figure 1 As shown in the figure, in some optional embodiments, the second connection end 1213 configured with the connector 12132 on the circuit board body 1211 can be arbitrarily placed and combined through the bending of the circuit board body 1211. The three second connection ends 1213 of the three circuit boards 121 of the three circuit board components 12 in the three display components 10 can all be stacked on the second side of the frame 20 through the bending of the circuit board body 1211. Such an arrangement method can reduce the overall size or installation space of the projection module 1, and further reduce the size of the head-mounted device, especially the occupied space on the temple side of the head-mounted device, and improve the wearing comfort of the user.

[0040] By assembling the display component 10 and the projection lens 30 to reduce the size of the head-mounted device to improve the user experience, the excessive heat dissipated by the projection module 1 during operation will also affect the user experience. The heat dissipated by the projection module 1 during operation mainly comes from the display component 10 therein. The heat generation of the display component 10 is due to the heat generation of the display chip 11 therein, and the heat dissipation structure around the chip needs to be optimized. At the same time, optimizing the architecture of the display component 10 can also reduce the size of the projection module 1, and further reduce the overall size of the head-mounted device, and further improve the user experience.

[0041] Therefore, referring to Figure 3 As shown, the present application discloses a display component 10. By optimizing the layout between the display chip 11 and the circuit board component 12, the heat dissipation of the display component 10 is improved, and the overall size and the local size of the display area of the display component 10 are reduced.

[0042] In some embodiments of the present application, the display component 10 includes a display chip 11, a circuit board component 12, and multiple wires 13. The display chip 11 is mounted on the circuit board component 12, and the display chip 11 and the circuit board component 12 are electrically connected through the multiple wires 13. It should be understood that the electrical connection between the circuit board component 12 and the display chip 11 is used for supplying energy and signal transmission to the display chip 11 in the common sense.

[0043] Since the solder joint size or manufacturing process of the chip electrical connection position 1131 can produce relatively smaller pads or electrical connection positions, and the corresponding circuit board component 12 is limited by the circuit board processing technology, the line width and line pitch should be 150% or more of the chip. At the same time, if the gaps between the multiple wires 13 are too close, there are risks such as electromagnetic interference or wire swing short circuit. Therefore, it is necessary to optimize the circuit design to reduce the risks.

[0044] The display chip 11 is mounted on the circuit board component 12 through a back surface. The opposite surface of this surface of the display chip 11, that is, the upper surface, has a light-emitting area 111. The light-emitting area 111 is the area where the display chip 11 displays images or texts in the common sense. Around the light-emitting area 111 of the display chip 11 is a non-light-emitting area. The front surface of the display chip 11 is provided with an electrical connection area. One side of the display chip 11 in the light-emitting area 111 is configured with a first side area 112 parallel to the light-emitting area 111. The length extension direction of the first side area 112 is perpendicular to the length extension direction of the light-emitting area 111, that is, the first side area 112 extends along the short side of the light-emitting area 111. At least two groups of chip electrical connection position groups 113 are configured along the direction perpendicular to its length extension on the first side area 112. Each group of chip electrical connection position groups 113 may include multiple chip electrical connection positions 1131 arranged in sequence along the length extension direction of the first side area 112. That is, the first side area 112 of the display chip 11 has at least two rows of chip electrical connection positions 1131. These chip electrical connection positions 1131 generally refer to the points on the chip used to connect to the external circuit, and these chip electrical connection positions 1131 allow current and signals to be transmitted between the inside of the chip and the external circuit.

[0045] The circuit board assembly 12 has a second side region 12121, and the second side region 12121 of the circuit board assembly 12 is adjacently arranged with the first side region 112 of the display chip 11. At least three groups of circuit board electrical connection position groups 1214 are configured on the second side region 12121 along the length extension direction perpendicular to the first side region 112. Each circuit board electrical connection position group 1214 may include a plurality of circuit board electrical connection positions 12141 arranged in sequence along the length extension direction of the first side region 112. That is, at least three rows of circuit board electrical connection positions 12141 are configured on the second side region 12121 of the circuit board assembly 12. In other words, in some optional embodiments, the number of the circuit board electrical connection position groups 1214 is more than the number of the chip electrical connection position groups 113.

[0046] At least two rows of chip electrical connection positions 1131 on the display chip 11 may be arranged in parallel with each other. They may also be arranged with a certain mutual dislocation but extend along the same length direction. At least three rows of circuit board electrical connection positions 12141 on the circuit board assembly 12 may be arranged in parallel with each other, or may be arranged with a certain mutual dislocation but extend along the same length direction. However, the above-mentioned dislocation does not extend beyond the extension direction of the electrical connection positions of the adjacent group. At least two rows of chip electrical connection positions 1131 of the display chip 11 and at least three rows of circuit board electrical connection positions 12141 of the circuit board assembly 12 extend along the same length direction.

[0047] Based on the above design, all the chip electrical connection positions 1131 of the display chip 11 are located on the short side of the display chip 11. At the same time, the second side region 12121 of the circuit board assembly 12 is adjacently arranged with the first side region 112 of the display chip 11. Therefore, the area occupied by the chip electrical connection position group 113 of the display chip 11 and the circuit board electrical connection position group 1214 of the circuit board assembly 12 is the smallest, so that the size of the display chip 11 and the size of the circuit board assembly 12 can be reduced, and further the overall size of the display assembly 10 can be reduced, especially the head size on the display chip 11 side of the display assembly 10. While the size of the display assembly 10 is reduced, the size of the projection module 1 and the head-mounted device can also be reduced, improving the user experience.

[0048] The chip electrical connection positions 1131 on the display chip 11 and the circuit board electrical connection positions 12141 on the circuit board assembly 12 are electrically connected by a plurality of wires 13. The wires 13 and the chip electrical connection positions 1131 and / or the circuit board electrical connection positions 12141 are coupled together by soldering or by conductive adhesive. Both ends of each wire 13 are electrically connected to a chip electrical connection position 1131 of the display chip 11 and a circuit board electrical connection position 12141 of the circuit board assembly 12 respectively, so that the circuit board assembly 12 and the display chip 11 are electrically connected.

[0049] The above are the basic components and connection methods of the display chip 11 and the circuit board assembly. The layout of the wires connecting them is as follows:

[0050] Among the multiple wires 13, at least 50% or more are distributed wires. The definition of these distributed wires is that the length of a certain wire is at least different from the length of the adjacent wire 13 on one side and does not overlap in the height space, that is, the wire arcs do not overlap in the space of the front top-down view angle of the display chip 11. That is, these distributed wires and the wires 13 on at least one side are one long and one short. That is, one of the distributed wires is a long wire, and the adjacent wire 13 on one side of the distributed wire is a short wire. Or the distributed wire is a short wire, and the adjacent wire 13 on one side of the distributed wire is a long wire. Among them, "overlap" includes two situations. The first situation is that, in the front top-down view of the display chip 11, a certain wire does not coincide with at least one adjacent wire 13 on one side; the second situation is that, in the front top-down view of the display chip 11, a certain wire does not cross at least one adjacent wire 13 on one side. This means that, in the front top-down view of the display chip 11, a certain wire is spaced from at least one adjacent wire 13 on one side. This solution only limits the relative position of a certain wire and at least one adjacent wire 13 in the front top-down view of the display chip 11, and does not limit the gap in height between a certain wire and at least one adjacent wire 13. That is, in the side view, a certain wire and at least one adjacent wire 13 can be at the same height or at different heights.

[0051] It is worth mentioning that the wires between the display chip and the circuit board are usually arranged on one of the sides of the chip. As the pixels of the display chip become larger and larger, more wiring is required. The pads on the display chip have changed from a single row to two rows, and may even become multiple rows in the future, resulting in dense wires. Dense wires are likely to cause signal interference, and it is necessary to reasonably arrange the ultra-dense wiring to reduce wire crossing and shorten the wire arcs.

[0052] The above distributed wire layout can maintain signal integrity while balancing the packaging requirements during the later packaging process, such as reducing the risk of chip swing or short circuit during packaging, assembly, and use. And it can better adapt to the distance and layout requirements between different chip electrical connection positions 1131 and circuit board electrical connection positions 12141.

[0053] In some alternative embodiments, the distances between the different chip electrical connection positions 1131 and the circuit board electrical connection positions 12141 conducted by the wire 13 are different. The edge of the display chip 11 close to the circuit board electrical connection position group 1214 is set as the first side edge. In the direction of gradually moving away from the defining line on the display chip 11, the chip electrical connection position group 113 is set as the first chip electrical connection position group 1132, the second chip electrical connection position group 1133, and the Nth chip electrical connection position group. Among them, the first chip electrical connection position group 1132 is a chip electrical connection position group 113 closest to the circuit board electrical connection position group 1214, and the second chip electrical connection position group 1133 and the Nth chip electrical connection position group are gradually moving away from the circuit board electrical connection position group 1214. In the direction of gradually moving away from the defining line on the circuit board assembly 12, the circuit board electrical connection position group 1214 is set as the first circuit board electrical connection position group 12142, the second circuit board electrical connection position group 12143, the third circuit board electrical connection position group 12144, and the Nth circuit board electrical connection position group. Among them, the first circuit board electrical connection position group 12142 is a group of circuit board electrical connection positions 1214 closest to the display chip 11, and the second circuit board electrical connection position group 12143, the third circuit board electrical connection position group 12144, and the Nth circuit board electrical connection position group are gradually moving away from the display chip 11.

[0054] Connect one chip electrical connection position 1131 in the first chip electrical connection position group 1132 with the shortest distance to one circuit board electrical connection position 12141 in the first circuit board electrical connection position group 12142, which is the shortest wire 13. Connect one chip electrical connection position 1131 in the Nth chip electrical connection position group farthest from the defining line to one circuit board electrical connection position 12141 in the Nth circuit board electrical connection position group farthest from the defining line, which is the longest wire 13.

[0055] In the distribution of these distributed wires, the lengths of the distributed wire and its adjacent wires 13 on at least one side are different, that is, the chip electrical connection positions 1131 and the circuit board electrical connection positions 12141 connected by the distributed wire and its adjacent wires 13 on at least one side are located in different chip electrical connection position groups 113 and circuit board electrical connection position groups 1214.

[0056] Such a connection method of the wire 13 can make the wires 13 more evenly distributed on the display component 10, avoiding the connection ends of the wires 13 being densely arranged in some areas, so that multiple wires 13 gather in a certain area on the display chip 11 or the circuit board component 12, avoiding overheating or wire bonding risks in local areas, and reducing the risks that affect the thermal stability and lifespan of the display chip 11 and the circuit board component 12. For example, one end of adjacent wires 13 is connected to two chip electrical connection positions 1131 in the first chip electrical connection position group 1132, and the other end of the adjacent wires 13 is connected to one circuit board electrical connection position 12141 in the first circuit board electrical connection position group 12142 and one circuit board electrical connection position 12141 in the second circuit board electrical connection position group 12143.

[0057] By designing the lengths of adjacent wires 13, local overheating that may occur in the display component 10 can be reduced. Additionally, the overall heat of the display component 10 can be reduced by arranging the wires 13 as follows.

[0058] In some embodiments, the number of circuit board electrical connection position groups 1214 is greater than the number of chip electrical connection position groups 113. For example, the number of chip electrical connection position groups 113 is two, and the number of circuit board electrical connection position groups 1214 is three. This can provide more electrical connection positions for the wires 13, facilitating the dispersion of the wires 13, thereby being able to increase the wire pitch between the wires 13 in the ultra-dense wire 13 structure, being conducive to arranging the wires 13 apart, increasing the wire pitch between the wires 13, and reducing the difficulty of the wiring design of the circuit board 12.

[0059] At the same time, the number of circuit board electrical connection position groups 1214 being greater than the number of chip electrical connection position groups 113 is also conducive to the spaced distribution of the wires 13. Two adjacent wires 13 connected to the chip electrical connection position 1131 at one end and belonging to different chip electrical connection position groups 113 form a pair of wires 13. In a pair of wires 13, both ends of the wire 13 connected to the chip electrical connection position 1131 and the circuit board electrical connection position 12141 are located on the same side of the adjacent wires 13. Such a distribution of the wires 13 can make at least some of the wires 13 arranged in sequence, minimizing the crossing of the wires 13 in the ultra-dense wire 13 structure, shortening the wire arc length of the wires 13, and thus minimizing problems such as slow heat dissipation caused by too close wire pitch of the wires 13 and chip failure caused by short circuit of the wires 13.

[0060] When the number of circuit board electrical connection bit groups 1214 is greater than the number of chip electrical connection bit groups 113, the number of wire 13s belonging to wire 13 pairs accounts for 65% - 99% (excluding the endpoint values) of the total number of wire 13s. When there are two chip electrical connection bit groups 113, the number of circuit board electrical connection bit groups 1214 is three to five to avoid excessive wire 13 length and difficult conduction. When the number of circuit board electrical connection bit groups 1214 is five, the number of wire 13 pairs reaches the upper limit value, and when the number of circuit board electrical connection bit groups 1214 is three, the number of wire 13 pairs reaches the lower limit value. As shown in FIGS. 3 and Figure 4 When there are two sets of circuit board electrical connection bits 12141 and chip electrical connection bits 1131 as shown, there are 22 pairs of wires 13 that cross. When there are only two sets of chip electrical connection bits 1131 and five sets of circuit board electrical connection bits 12141, there is only 1 pair of wires 13 that cross, and the number of wire 13s is 57 in both cases. The greater the number of wire pairs, the more regular the arrangement of wire 13s, and the more regular the arrangement of wire 13s is, the more conducive it is to the heat dissipation of wire 13s and the reduction of the short - circuit risk.

[0061] Such an arrangement of wire 13s is conducive to meeting the requirements of distributed wires and different lengths of adjacent wires 13 on at least one side. And because the adjacent chip electrical connection bits 1131 in adjacent chip electrical connection bit groups 113 are stagger - distributed, when the ends of two adjacent wires 13 are respectively connected to chip electrical connection bits 1131 in different chip electrical connection bit groups 113, the corresponding wires 13 can also be stagger - distributed. Such an arrangement is conducive to spreading out the wires 13, increasing the wire distance between wires 13, and at the same time minimizing the wire 13 crossing phenomenon as much as possible to avoid the heating phenomenon caused by wire 13 density or excessive crossing.

[0062] In some embodiments, the chip electrical connection bits 1131 in adjacent chip electrical connection bit groups 113 are stagger - distributed along the length extension direction of the first side region 112. In this way, when one end of two wires 13 is respectively connected to chip electrical connection bits 1131 in adjacent chip electrical connection bit groups 113, and the two chip electrical connection bits 1131 are adjacent in the direction perpendicular to the length extension direction of the first side region 112, the ends of the two wires 13 connected to the chip electrical connection bit groups 113 will not cross and overlap, further avoiding the crossing or dense distribution of wires 13.

[0063] For example, one end of each of the two wires 13 is respectively connected to the chip electrical connection bit 1131 of the first chip electrical connection bit group 1132 and the second chip electrical connection bit group 1133, and these two chip electrical connection bits 1131 are adjacent in the length extension direction perpendicular to the first side region 112. At this time, since these two adjacent chip electrical connection bits 1131 are staggeredly distributed and are not located on the same straight line in the length extension direction perpendicular to the first side region 112, the wires 13 can also be staggeredly connected to the chip electrical connection bits 1131, without causing the wires 13 to coincide or cross at the chip electrical connection bits 1131, so that the wires 13 are spaced apart, facilitating wire bonding.

[0064] In some optional embodiments of the present application, the circuit board assembly 12 further includes a support plate 122 and a circuit board 121. The display chip 11 is mounted on the surface of the support plate 122. The circuit board 121 has a circuit board body 1211 and a first connection end 1212 and a second connection end 1213 respectively located at both ends of the circuit board body 1211. The first connection end 1212 of the circuit board body 1211 is mounted on the surface of the support plate 122 where the display chip 11 is mounted. Among them, the second side region 12121 is located at the first connection end 1212 of the circuit board body 1211, and the second side region 12121 of the circuit board 121 is adjacent to the first side region 112 of the display chip 11, that is, the chip electrical connection bit group 113 of the display chip 11 is adjacent to the circuit board electrical connection bit group 1214.

[0065] The circuit board electrical connection bit group 1214 is arranged at the first connection end 1212 of the circuit board body 1211, and the capacitor component 12131 is arranged at the second connection end 1213 of the circuit board body 1211. Such a design can enable the first connection end 1212 of the circuit board body 1211 not to need to set aside space for arranging the capacitor component 12131, so that more space can be reserved at the first connection end 1212 of the circuit board body 1211 for arranging the circuit board electrical connection bit group 1214. The larger the reserved space, the more circuit board electrical connection bit groups 1214 can be arranged. The more the number of circuit board electrical connection bit groups 1214, when connecting the chip electrical connection bits 1131 of the chip electrical connection bit group 113 and the circuit board electrical connection bits 12141 of the circuit board electrical connection bit group 1214, there can be more choices for the connection method of the wires 13, thereby better controlling the wire pitch and the distribution of the wires 13, making the wires 13 arranged orderly, and avoiding the wires 13 being too dense or crossed, which may cause local overheating and difficult heat dissipation.

[0066] By designing the distribution mode of the electrical connection positions in the display chip 11 and the circuit board assembly 12, the wire 13 can have a better layout, so that the heat dissipation effect of the wire 13 is good. At the same time, in the display assembly 10 provided by the present application, the selection of the material of the support plate 122 and the material of the circuit board body 1211 enables the display assembly 10 to have a better heat dissipation effect and support effect, and can reduce the size of the display assembly 10.

[0067] In some embodiments of the support plate 122, the support plate 122 is preferably a metal plate or a heat sink. By arranging the electrical connection positions of the display chip 11 on the short side and arranging the circuit board electrical connection position group 1214 configured at the first connection end 1212 of the circuit board body 1211 adjacent thereto, while meeting the circuit design requirements of the display assembly 10, the head size of the display assembly 10 can be reduced. At the same time, the support plate 122 adopts a substrate structure such as a metal plate or other heat sinks, which has better flatness and strength than the traditional circuit board structure.

[0068] At the same time, the material of the support plate 122 is selected as metal, such as stainless steel or steel sheet. While ensuring the support performance of the support plate 122, the support plate 122 can be designed to be thinner. Compared with the thickness of the traditional circuit board, it can be reduced, further reducing the thickness of the display assembly 10, and thus reducing the size of the display assembly 10.

[0069] In some optional embodiments, the surface of the display chip 11 has a light-emitting area 111, and the non-light-emitting areas are around the light-emitting area 111. These non-light-emitting areas are three narrow areas 114 and one wide area 115 along the four sides of the light-emitting area 111 respectively. In some optional embodiments, the area of these narrow areas 114 is smaller than the area of the wide area 115. The wide area 115 is the side of the light-emitting area 111 of the display chip 11 close to the circuit board assembly 12. The chip electrical connection position group 113 is located in the wide area 115, that is, the light-emitting area 111 is eccentrically arranged on the surface of the display chip 11. During the assembly of the display assembly 10 into the projection module 1, the narrow areas 114 of the display chip 11 and the corresponding packaging areas are used to be clamped on the frame 20. Since the circuit board body 1211 of the circuit board assembly 12 needs to be bent during the assembly process, the display chip 11 does not need to control the size on the side close to the circuit board body 1211, and more space can be reserved to configure the chip electrical connection position group 113. The narrow areas 114 of the display chip 11 should be as short as possible to reduce the size of the frame 20, and thus reduce the overall size of the projection module 1.

[0070] The design of the support plate 122 and the display chip 11 can reduce the size of the display component 10. At the same time, this application also designs the circuit board assembly 12, which can reduce the overall size of the projection module 1.

[0071] In some embodiments of the circuit board assembly 12, the circuit board body 1211 is a flexible circuit board. During the bending process of the circuit board body 1211, the first connection end 1212 and the second connection end 1213 at both ends of the circuit board body 1211 are allowed to approach each other or be adjusted to different angles. When assembling the projection module 1 to install the display component 10, the circuit board body 1211 can be bent so that the first connection end 1212 and the second connection end 1213 at both ends of the circuit board body 1211 approach each other or are adjusted to different angles, thereby reducing the overall space occupied by the display component 10. It avoids the problem of the large space occupied by the display component 10 caused by the increase in the area of the first connection end 1212 of the circuit board 121 due to the configuration of more circuit board electrical connection bit groups 1214. And the circuit board body 1211 being a flexible circuit board is more flexible in later installation and has higher adaptability in different installation scenarios.

[0072] At the same time, the support plate 122 is a metal plate, and the hard material of the support plate 122 also solves the problem that the flexible circuit board of the circuit board body 1211 cannot provide sufficient support for the display chip 11, and the support plate 122 provides an installation foundation for the display chip 11.

[0073] In some alternative embodiments of the present application, in order to ensure the firm connection of the display chip 11, the first connection end 1212 of the circuit board 121, and the support plate 122 and further improve the reliability and heat dissipation performance, the display component 10 further includes a packaging bracket 14. The packaging bracket 14 is integrally formed on the non-photosensitive area of the display chip 11 and the circuit board assembly 12 and covers the wire 13, ensuring that the display chip 11 and the first connection end 1212 of the circuit board 121 are firmly and reliably electrically connected, reducing the possibility of being interfered by the external environment. And the wire 13 for electrical connection between the chip electrical connection bit group 113 on the display chip 11 and the circuit board electrical connection bit group 1214 on the first connection end 1212 of the circuit board 121 is not interfered by the outside either.

[0074] In some alternative embodiments, such as Figure 6 and Figure 7 shown, the packaging bracket 14 further covers the support plate 122, firmly connecting the support plate 122, the display chip 11, and the first connection end 1212 of the circuit board assembly 12 together. In an alternative embodiment, the display chip 11 is directly disposed on the surface of the support plate 122 and is electrically connected to the circuit board assembly 12 through a wire 13.

[0075] In detail, in some embodiments of the package support 14, the package support 14 can cover the first side region 112 of the display chip 11, the second side region 12121 of the first connection end 1212 of the circuit board 121 of the circuit board assembly 12, and the exposed area on the support plate 122. That is, the package support 14 can cover the chip electrical connection bit group 113 of the display chip 11 and the circuit board electrical connection bit group 1214 of the circuit board assembly 12, and the package support 14 is formed with a channel for the wire 13 connecting the chip electrical connection bit group 113 and the circuit board electrical connection bit group 1214 to pass through, and the wire 13 is arranged in the channel. In other words, the display chip 11 and the first connection end 1212 of the circuit board 121 are arranged on the surface of the support plate 122, and the package support 14 covers the display chip 11 and the first connection end 1212 of the circuit board 121 on the surface, and is formed integrally with the support plate 122.

[0076] In some embodiments, a light-emitting area 111 is set on one surface of the display chip 11. In the four side directions of the light-emitting area 111, the edge of the display chip 11 and the light-emitting area 111 enclose four areas. In order to configure the chip electrical connection bit group 113, one of the areas needs to reserve an area that is larger than the areas in the other three directions, namely the first side area 112 (also the wide area 115). The areas in the other three directions are set as narrow areas 114. At the same time, the support plate 122 also reserves a covering area 1222 around the display chip 11. When covering the display chip 11, the packaging bracket 14 covers the narrow area 114 of the display chip 11, the first side area 112, the reserved area of ​​the support plate 122, and the first connection end 1212 of the circuit board 121, so as to fix the support plate 122, the display chip 11 and the first connection end 1212 of the circuit board 121 together.

[0077] Furthermore, by selecting the material of the packaging bracket 14, the heat dissipation effect of the display component 10 can also be improved. In some embodiments of the packaging bracket 14, the material of the packaging bracket 14 is resin. Its thermal conductivity is better than that of air or traditional plastic or glue materials, which can accelerate the heat dissipation of the display chip 11 and ensure the working performance of the display chip 11.

[0078] In some alternative embodiments, the encapsulation bracket 14 is molded and encapsulated, and the process uses thermosetting encapsulation molding. When the encapsulation bracket 14 is encapsulated on the support plate 122, it can also provide strong support for the support plate 122. On the premise that the support plate 122 and the encapsulation bracket 14 jointly meet the support performance, the thickness of the support plate 122 and the thickness of the display component 10 are reduced as much as possible, thereby reducing the overall weight and size of the display component 10. At the same time, by virtue of the precision advantage of the molding die for molding encapsulation, the encapsulation bracket 14 can be processed into a flat upper surface and a flat side edge after cutting, and the size tolerance and assembly work of the projection lens 30 can also be reduced in the subsequent assembly with the frame 20, thereby reducing the overall size and weight of the projection module 1.

[0079] In some alternative embodiments, the material of the encapsulation bracket 14 is selected as resin. When the encapsulation bracket 14 encapsulates and covers the first connection end 1212 of the display chip 11 and the circuit board 121, injection molding can be used. In the way of injection molding and condensation, the encapsulation bracket 14 is made to fit the shapes of the display chip 11, the first connection end 1212 of the circuit board 121, and the wire 13 on the support plate 122.

[0080] In some alternative embodiments, the first side region 112 of the display chip 11, the second side region 12121 of the circuit board assembly 12, and the wire 13 on the support plate 122 are completely encapsulated in the encapsulation bracket 14, and there is no gap between these regions and the wire 13 and the encapsulation bracket 14. Compared with the traditional way of mounting the display chip 11 to the circuit board 121 using a base, the display chip 11 and the circuit board 121 can be integrally formed and protected on both sides and above the display chip 11 and the circuit board 121, reducing the overall volume of the display component 10 as much as possible, and thus reducing the volume of the projection module 1 in the subsequent installation, improving the satisfaction of users.

[0081] In some experimental tests, when using a base to support the display chip 11 and the circuit board 121, the heat dissipation channel of the display component 10 only passes through the circuit board 121, with a heat dissipation coefficient of 0.35 W / m·K and a heat dissipation area only at the bottom of the chip. While adopting the way of using the support plate 122 to support the display chip 11 and encapsulating with the resin material encapsulation bracket 14, the bottom of the display chip 11 is changed to a metal plate or a steel plate, and the heat dissipation coefficient is increased to 16.3 W / m·K. The heat dissipation channels are the support plate 122 at the bottom of the chip and the resin material encapsulation bracket 14, greatly improving the heat dissipation performance.

[0082] In addition, the display component 10 is integrally formed by the encapsulation bracket 14. Compared with the traditional method of using a base to support the display chip 11, there is no need to classify and transport the display chip 11, the circuit board component 12, the base, etc. for reassembly during subsequent transportation and circulation. Moreover, the risk of fragmentation or variation during transportation is reduced, thereby reducing the losses of the display component 10 during transportation.

[0083] In some optional embodiments, selecting resin as the material of the encapsulation bracket 14 can bring good heat dissipation effects. However, due to the large difference in the material between the encapsulation bracket 14 and the metal material of the support plate 122, the interfacial bonding force between the encapsulation bracket 14 and the support plate 122 is poor. When the encapsulation bracket 14 is formed, it is prone to separation from the support plate 122, and even causes the support plate 122 to separate and fall off from the encapsulation bracket 14. Moreover, since the layout design of the wires 13 between the display chip 11 and the circuit board component 12 is already very limited, the separation of the encapsulation bracket 14 from the support plate 122 will pull the wires 13, affecting the firmness of the coupling between the wires 13 and the chip electrical connection positions 1131 and the circuit board electrical connection positions 12141, and easily causing the display component 10 to fail. Therefore, the reliability of the bonding between the support plate 122 and the encapsulation bracket 14 is particularly important for the yield of the assembly of the display component 10.

[0084] For this reason, as shown in Figure 7 it is necessary to provide a bonding strengthening structure between the support plate 122 and the encapsulation bracket 14. In some embodiments of the support plate 122, the surface of the support plate 122 in contact with the encapsulation bracket 14 has a roughened structure, such as laser engraving. By means of the roughened structure, the surface roughness of the support plate 122 is increased, and the surface area of the support plate 122 is enlarged, thereby increasing the reliability of the bonding between the support plate 122 and the encapsulation bracket 14.

[0085] In some embodiments of the support plate 122, the flatness of the surface of the support plate 122 in contact with the encapsulation bracket 14 is preferably ≤30 μm. In this way, the contact area between the support plate 122 and the encapsulation bracket 14 is increased, and the reliability of the combination between the encapsulation bracket 14 and the support plate 122 is improved.

[0086] In some embodiments of the support plate 122, an ink is coated on the surface of the support plate 122 in contact with the encapsulation bracket 14. By means of the ink, the surface performance of the support plate 122 is improved. The ink has a low modulus and will not affect the size of the display component 10, and the ink has better compatibility with the thermosetting resin. The thickness of the ink is 1 μm - 4 μm. It can take into account the thinness and lightness of the display component 10 and the interfacial bonding property between the support plate 122 and the encapsulation bracket 14.

[0087] In order to improve production efficiency, the manufacture of the display component 10 is usually carried out in batches. Multiple display components 10 are produced in the same batch, and multiple molding cavities 51 are configured for the production of multiple display components 10, thereby improving production efficiency.

[0088] The implementation manners of multiple embodiments can be freely combined, and this application is not restricted by any limitations.

[0089] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and illustrated in the embodiments, and the implementation manners of the present invention can have any deformations or modifications without departing from the principles.

Claims

1. A display component, characterized in that, Comprising: Support plate; A display chip, the back surface of which is mounted on the support plate, and an electrical connection area is provided on the front surface of the display chip, and the electrical connection area is adjacent to the first side edge of the display chip; A circuit board, the first connection end of which is joined to the support plate, the first connection end of the circuit board is adjacent to the first side edge of the display chip and is provided with a circuit board electrical connection position, and the circuit board electrical connection position is electrically connected to the electrical connection area.

2. The display component according to claim 1, wherein: Further comprising a packaging bracket, the packaging bracket integrally connects the display chip and the circuit board assembly, and at the same time, the chip electrical connection position group of the display chip and the circuit board electrical connection position group of the circuit board assembly are integrally coated in the packaging bracket.

3. The display component according to claim 2, wherein: The material of the support plate is metal.

4. The display component according to claim 3, characterized in that: A bonding strengthening structure is provided between the support plate and the packaging bracket, selected from: the surface of the support plate in contact with the bracket is provided with a roughening structure; or the flatness of the surface of the support plate in contact with the bracket is less than 30 μm; or the surface of the support plate in contact with the bracket is coated with ink, and the thickness of the ink is 1 μm - 9 μm.

5. The display component according to claim 2, wherein: The material of the packaging bracket is a resin material.

6. The display component according to claim 2, wherein: The circuit board is a flexible circuit board, and the circuit board has a circuit board body, a second connection end and a first connection end located at both ends of the circuit board body; a capacitor component for power supply is configured in the second connection end.

7. The display component according to any one of claims 1 to 6, characterized in that: The surface where the light-emitting area of the display chip is located has a first side area, the circuit board assembly has a second side area and is arranged adjacent to the first side area; at least two groups of chip electrical connection position groups are arranged on the first side area of the display chip along the length extension direction perpendicular to the first side area, and each group of chip electrical connection position groups includes a plurality of chip electrical connection positions arranged in sequence along the extension direction of the first side; at least three groups of circuit board electrical connection position groups are distributed on the second side area of the circuit board assembly along the length extension direction perpendicular to the first side, and each group of circuit board electrical connection position groups includes a plurality of circuit board electrical connection positions distributed along the length extension direction of the first side area; and a plurality of wires, both ends of the wire are respectively electrically connected to a chip electrical connection position and a circuit board electrical connection position, and at least 50% or more of the wires are distributed wires, and the length of the distributed wire is at least different from that of the adjacent wire on one side.

8. The display component according to claim 7, wherein: All the electrical connection position groups on the display chip are arranged on the short side of the display chip.

9. The display component according to claim 8, wherein: A plurality of the chip electrical connection positions in the chip electrical connection position group on the display chip and a plurality of the chip electrical connection positions in the adjacent chip electrical connection position group are staggeredly distributed in the length extension direction of the first side area.

10. The display component according to claim 7, wherein: The number of the circuit board electrical connection position groups is more than the number of the chip electrical connection position groups.

11. The display component according to claim 7, wherein: Both ends of the adjacent wires of the distributed wire are respectively connected to different chip electrical connection position groups and different circuit board electrical connection position groups.

12. The display component according to claim 11, wherein: When the number of the chip electrical connection position groups is 2 groups, the number of the circuit board electrical connection position groups is 3 groups to 5 groups.

13. The display component according to claim 7, characterized in that: The chip electrical connection bits in the chip electrical connection bit group are distributed in parallel with the chip electrical connection bits in other chip electrical connection bit groups.

14. The display component according to claim 7, characterized in that: The chip electrical connection bits in the chip electrical connection bit group are distributed in parallel with the circuit board electrical connection bits in the circuit board electrical connection bit group.

Images