Bunch-cluster-shaped heat pipe with enhanced heat dissipation and efficient radiator

Abstract

The technical scheme of the utility model discloses a heat dissipation enhanced bundle-cluster-shaped heat pipe and a high-efficiency radiator, which are characterized in that a support heat pipe and an extension heat pipe are assembled and connected through a communicating vessel to form a bundle-cluster-shaped heat pipe structure of which one end is in contact with a heat source heat conduction surface in a same plane and the other end extends in a heat dissipation laminated body in a dispersed topology shape; the improvement key points are transferred to the length and the path of the heat pipe from the number, the diameter and the like of the heat pipe, the contact surface thermal resistance is reduced, the effective heat dissipation length of the heat pipe is increased, the heat pipe extension path can be freely customized according to needs, and the heat dissipation efficiency of the heat pipe radiator is improved. And the conditions that the direct contact surface of the heat source is small and the heat dissipation requirement is high due to miniaturization design and high-density integration of the current heat source are matched.

Description

Technical Field

[0001] The utility model belongs to the field of radiators, and particularly relates to a cluster-shaped heat pipe with enhanced heat dissipation and an efficient radiator. Background Art

[0002] The heat pipe in a radiator is a heat transfer device that quickly transfers heat through the phase change process of the internal cooling liquid, and is used to cool electronic components such as computer processors, graphics cards, and power supplies to prevent performance degradation or damage caused by overheating. With the miniaturized design and high-density integration of electronic components, the heat conduction surface between the heat source and the heat pipe radiator is reduced and the heat dissipation requirement increases. However, the heat pipe is limited by a single heat transfer path and cannot meet complex heat dissipation requirements. Summary of the Utility Model

[0003] To overcome the above defects described in the background art, the technical solution of the utility model provides a cluster-shaped heat pipe with enhanced heat dissipation. The heat pipe includes a support heat pipe, at least two extension heat pipes, and a connector for connecting the heat pipes. The connector has at least two-way openings, and the shape and size of the openings match those of the heat pipes. The extension heat pipes are grouped and connected with the support heat pipe through the connector. The heat pipe is hollow and filled with copper powder and coolant. The support heat pipe is in contact with the heat source, and the extension heat pipes extend away from the heat source in a topological shape.

[0004] In one embodiment, the support heat pipe is a U-shaped heat pipe, and connectors are installed at both ends with openings. Two cluster-shaped branches are formed on both sides of the support heat pipe of the heat pipe.

[0005] In one embodiment, the connector is made of copper or silver, gold, aluminum, tungsten, iron materials with a thermal conductivity stronger than that of copper or is connected with a heat distribution device.

[0006] In one embodiment, the openings of the connector expand outward compared with the inner wall of the main body of the connector and match the diameter of the heat pipe. The inner wall of the heat pipe after assembly and the inner wall of the main body of the connector are on the same plane.

[0007] The present application also provides an efficient radiator, which is configured with a heat pipe group composed of multiple heat pipes, and also configured with a heat dissipation laminate body with the heat pipe group passing through inside, and a heat conduction plate that contacts the heat pipe group and the heat dissipation element on both sides respectively. One end of the heat pipe group is composed of closely arranged support heat pipes to form a heat conduction surface that is grouped and connected with the heat conduction plate on the same plane, and the other end is arranged in a multi-way extension and dispersion inside the heat dissipation laminate body.

[0008] In one embodiment, the radiator is configured with at least two heat dissipation laminate bodies, and heat pipe channels adapted to the heat pipe group are provided inside the heat dissipation laminate bodies. The heat dissipation laminate bodies are arranged opposite to each other and a ventilation isthmus is reserved between them.

[0009] In one embodiment, the heat dissipation laminate is a heat dissipation fin group composed of multiple fins. A heat dissipation fan is provided at the ventilation isthmus, and the air outlet direction of the heat dissipation fan is parallel to the fin plane.

[0010] In one embodiment, the heat dissipation fan is a single fan or a fan group formed by combining multiple fan units.

[0011] In one embodiment, the radiator is further configured with a heat pipe vapor chamber, which is connected to the heat conduction plate group, and a support heat pipe is placed inside the structure surrounded by the two.

[0012] In one embodiment, an installation seat for installing the heat dissipation fan is further provided above the heat pipe vapor chamber.

[0013] The present application provides a heat dissipation enhanced cluster-shaped heat pipe and an efficient radiator. By connecting the support heat pipes and the extension heat pipes through a communicating device to form a cluster-shaped heat pipe structure in which one end of the heat pipe contacts the heat source heat conduction surface in the same plane and the other end extends in a dispersed topological shape in the heat dissipation laminate, the focus of improvement is shifted from the number and diameter of the heat pipes to the length and path of the heat pipes, which is beneficial to reducing the contact surface thermal resistance, increasing the effective heat dissipation length of the heat pipes, and being able to freely customize the heat pipe extension path as needed. Furthermore, the heat dissipation efficiency of the heat pipe radiator is improved to match the current situation where the heat source has a small direct contact surface and high heat dissipation requirements due to miniaturization design and high-density integration. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art.

[0015] Figure 1 It is a schematic structural diagram of the cluster-shaped heat pipe provided by the embodiment of the present application;

[0016] Figure 2 It is a schematic structural diagram of the efficient radiator provided by the embodiment of the present application;

[0017] Figure 3 It is an exploded schematic diagram of the efficient radiator provided by the embodiment of the present application.

[0018] IDENTIFICATION OF KEY ELEMENTS:

[0019] 1. Heat pipe; 11. Support heat pipe; 12. Extension heat pipe; 13. Communicating device; 131. Communicating device opening; 132. Communicating device main body;

[0020] 2. Heat dissipation laminate;

[0021] 3. Heat conduction plate;

[0022] 4. Ventilation isthmus;

[0023] 5. Heat dissipation fan;

[0024] 6. Heat pipe; 61. Mounting base. Detailed implementation manner

[0025] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0026] In the present utility model, unless otherwise clearly specified and limited, terms such as "installation", "connection", "coupling", "fixed connection", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] In the present utility model, unless otherwise clearly specified and limited, the first feature may be in direct contact with the second feature "on" or "under" the second feature, or the first and second features may be indirectly in contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature may be directly above or obliquely above the second feature, or merely indicate that the first feature has a higher horizontal height than the second feature. The first feature "under", "beneath" and "under" the second feature may be directly below or obliquely below the second feature, or merely indicate that the first feature has a lower horizontal height than the second feature.

[0028] The heat pipe in a radiator is a heat transfer device that quickly transfers heat through the phase change process of the internal cooling liquid, and is used to cool electronic components such as computer processors, graphics cards, power supplies, etc., to prevent performance degradation or damage caused by overheating. With the miniaturized design and high-density integration trend of electronic components, the heat conduction surface between the heat source and the heat pipe radiator shrinks and the heat dissipation demand increases. However, the heat pipe is limited by a single heat transfer path and cannot meet complex heat dissipation requirements.

[0029] To solve the above technical deficiencies, the present application provides a heat pipe with enhanced heat dissipation in a bundle shape and an efficient radiator. By connecting a support heat pipe and extending heat pipes through a connector group to form a bundle-shaped heat pipe structure where one end of the heat pipe is in planar contact with the heat source heat conduction surface and the other end extends in a dispersed topological shape within the heat dissipation laminate, the focus of improvement is shifted from the number and diameter of heat pipes to the length and path of the heat pipes. This is beneficial for reducing the thermal resistance of the contact surface, increasing the effective heat dissipation length of the heat pipe, and being able to freely customize the heat pipe extension path as needed, thereby enhancing the heat dissipation efficiency of the heat pipe radiator and matching the current situation where the heat source has a small direct contact surface and high heat dissipation requirements due to miniaturization design and high-density integration.

[0030] The following combines the attached Figures 1 - 3 drawings and specific embodiments to further elaborate on the technical solution content of the present utility model.

[0031] The present application provides a heat pipe solution with enhanced heat dissipation in a bundle shape. Referring to Figure 1 , the heat pipe 1 includes a support heat pipe 11, at least two extending heat pipes 12, and a connector 13 for connecting the heat pipes. The connector 13 has at least two-way openings, and the shape and size of the openings match those of the heat pipe 1. The extending heat pipes 12 are connected in groups by the connector 13, and / or the extending heat pipes 12 and the support heat pipe 11 are connected in groups by the connector 13. The heat pipe 1 is hollow and filled with copper powder and a coolant inside. The support heat pipe 11 contacts the heat source, and the extending heat pipes 12 extend in a topological shape away from the heat source. Thus, the support heat pipe 11 absorbs the heat of the heat source and causes the internal coolant to evaporate and vaporize, forming high-temperature gas that flows away from the heat source to the distal end of the extending heat pipes 12 to condense and release heat. The condensed liquid returns to the support heat pipe 11 through capillary action and forms a heat conduction cycle, achieving heat transfer through the phase change of the coolant within the heat pipe 1. The present application focuses on the bundle-shaped layout structure of the heat pipe 1. Through the topological extension of the heat pipe 1, the layout, length, and concentration area of the heat pipes in the radiator can be adjusted, accelerating the heat transfer from the heat source to the heat pipe 1 and from the heat pipe 1 to the external environment.

[0032] In an embodiment of the present application, referring to Figure 1 , the support heat pipe 11 is a U-shaped heat pipe with connectors 13 installed at both open ends. The bottom of the U-shaped support heat pipe 11 contacts the heat source, and the two ends are respectively connected to the extending heat pipes 12. The extending heat pipes 12 form two cluster-shaped branches extending away from the heat source on both sides of the support heat pipe 11, thereby providing a simplified bundle-shaped heat pipe structure and being able to flexibly match different heat source heat dissipation conditions by controlling the layout, path length, and concentration area of the heat pipe cluster-shaped branches.

[0033] In an embodiment of the present application, referring to Figure 1, the communicating vessel 13 is made of copper or silver, gold, aluminum, tungsten, or iron with a thermal conductivity stronger than that of copper, or is connected with a heat distribution device, which can provide heat for the communicating vessel 13. In this application, controlling the material of the communicating vessel 13 or selecting a heat distribution device can keep the temperature of the communicating vessel 13 not lower than that of the heat pipe 1, so as to avoid premature condensation and heat release of the coolant in the heat pipe 1 due to the over-cooling of the communicating vessel 13, thereby ensuring that a preset amount of coolant reaches the distal end of the cluster-shaped extended heat pipe 12 and matching the length of the heat pipe of the radiator in this application. Optionally, the heat distribution device can generate heat or concentrate the heat of the heat pipe to the communicating vessel 13, so that the temperature of the communicating vessel 13 rises due to heat absorption and is not lower than the temperature of the heat pipe 1. Thus, the heat distribution device continuously heats the communicating vessel 13 and uses the communicating vessel 13 as a relay heater to transport the vaporized coolant to the distal end of the extended heat pipe 12.

[0034] In an embodiment of this application, referring to Figure 1 , the opening 131 of the communicating vessel expands outward compared with the inner wall of the communicating vessel body 132 and matches the diameter of the heat pipe 1. After the heat pipe 1 is assembled, the inner wall of the heat pipe 1 and the inner wall of the communicating vessel body 132 are in the same plane, which is conducive to uniformly filling copper powder into the cavity of the heat pipe 1 when filling copper powder.

[0035] Considering that the current heat pipe radiators mainly strengthen heat dissipation by increasing the number of heat pipes, thickening the diameter, installing a heat spreader, or using a double-layer heat pipe design, etc. However, these improvement methods focus on the heat transfer at the contact surface between the heat pipe and the heat source, and are limited by the heat conduction surface area, large contact thermal resistance, single heat transfer path, volume occupation, and cost issues, which to a certain extent limit the improvement of the heat dissipation effect of the radiator and are difficult to meet the increasing heat dissipation requirements of electronic components.

[0036] To solve the above technical defects, this application also provides an efficient radiator. Referring to Figures 1 - 3 , the radiator is configured with a heat pipe group composed of multiple heat pipes 1, and is also configured with a heat dissipation laminate 2 with the heat pipe group passing through it internally and a heat conduction plate 3 with two sides respectively contacting the heat pipe group and the heat dissipation element. One end of the heat pipe group forms a heat conduction surface that is coplanar with the heat conduction plate 3 by closely arranged supporting heat pipes 11, and the other end is arranged in a multi-path extended and dispersed manner inside the heat dissipation laminate 2. On the one hand, in this application, the supporting heat pipes 11 are coplanarly connected to the heat conduction plate 3, enabling heat to be directly transferred from the heat conduction plate 3 to the supporting heat pipes 11 with higher efficiency without passing through a heat spreader or high thermal resistance transfer between heat pipes, thus ensuring the heat conduction efficiency per unit area of the heat conduction surface. On the other hand, this application focuses on the cluster-shaped layout structure formed by the heat pipes inside the heat dissipation laminate 2. Through the topological extension of the heat pipes, the layout, length, and concentration area of the heat pipes of the radiator can be adjusted, accelerating the heat transfer from the heat pipes to the external environment, and further accelerating the heat transfer of the heat conduction surface. By efficiently dissipating the heat of the heat pipes and transferring the heat at the contact surface, it matches the heat dissipation requirements of the heat dissipation element and ensures the working performance of the heat dissipation element.

[0037] In one embodiment of the present application, referring to Figures 1 - 3 , the radiator is configured with at least two heat dissipation laminates 2, and heat pipe channels adapted to the heat pipe group are provided inside the heat dissipation laminates 2. The heat dissipation laminates 2 are arranged oppositely, and a ventilation isthmus 4 is reserved between the heat dissipation laminates, so as to accelerate the heat conduction of the heat pipe by increasing air circulation. The heat dissipation laminates 2 are correspondingly arranged around the outside of the heat pipe group. Among them, the heat dissipation laminates 2 can be integrally arranged or separately arranged. Optionally, the heat dissipation laminate 2 is a heat dissipation fin group composed of multiple fins. A heat dissipation fan 5 is provided in the ventilation isthmus 4, and the air outlet direction of the heat dissipation fan 5 is parallel to the fin plane. The heat dissipation fan 5 is a single fan or a fan group formed by combining multiple fan units. A heat dissipation fan 5 is installed in the ventilation isthmus 4, and the heat dissipation fan 5 blows air in a direction parallel to the fin plane, so as to strengthen the air circulation around the heat pipe and accelerate the heat dissipation of the heat pipe to the external environment, and further enhance the acceleration of the heat conduction of the heat pipe.

[0038] In one embodiment of the present application, referring to Figure 2 , Figure 3 , the radiator is further configured with a vapor chamber 6. The vapor chamber 6 is connected to the heat conduction plate 3, and a support heat pipe 11 is placed inside the structure surrounded by the two. The support heat pipe 11 is located in the same plane and directly contacts the vapor chamber 6, which can not only reduce the thermal resistance but also achieve uniform distribution and efficient conduction of the heat of the heat source through the vapor chamber 6.

[0039] In one embodiment of the present application, referring to Figure 2 , Figure 3 , an installation seat 61 for installing the heat dissipation fan 5 is further provided above the vapor chamber 6. The bottom of the heat dissipation fan 5 is directly in contact with the vapor chamber 6, so that the heat dissipation fan 5 is stably installed in the ventilation isthmus 4 between the two heat dissipation fin groups.

[0040] The above has introduced in detail a heat dissipation enhanced cluster-shaped heat pipe and an efficient radiator provided by the present utility model. Specific examples are used in this article to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the core idea of the present utility model; at the same time, for those of ordinary skill in the art, according to the idea and method of the present utility model, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present utility model.

Claims

1. A cluster-shaped heat pipe with enhanced heat dissipation, characterized in that The heat pipe includes a support heat pipe, at least two extended heat pipes, and a connector for connecting the heat pipes. The connector has at least two-way openings, and the shape and size of the openings match those of the heat pipes. The extended heat pipes are grouped by the connector between them and / or between the extended heat pipe and the support heat pipe. The heat pipe is hollow and filled with copper powder and a coolant inside. The support heat pipe is in contact with the heat source, and the extended heat pipes are arranged in a topological shape extending away from the heat source direction.

2. The heat dissipation enhanced cluster-shaped heat pipe according to claim 1, characterized in that, The support heat pipe is a U-shaped heat pipe, and the connector is installed at both ends with openings. The heat pipe forms two cluster-shaped branches on both sides of the support heat pipe.

3. The heat dissipation enhanced cluster-shaped heat pipe according to claim 1, wherein The connector is made of copper or materials such as silver, gold, aluminum, tungsten, and iron with a thermal conductivity stronger than that of copper, or is connected with a heat distribution device.

4. The heat dissipation enhanced cluster-shaped heat pipe according to claim 1, wherein, The opening of the connector expands outward compared to the inner wall of the main body of the connector and matches the diameter of the heat pipe. The inner wall of the heat pipe after assembly is in the same plane as the inner wall of the main body of the connector.

5. An efficient radiator, characterized in that, The radiator is configured with a heat pipe group composed of multiple heat pipes as described in any one of claims 1-4. It is also configured with a heat dissipation stack body with a heat pipe channel internally passing through and adapted to the heat pipe group, and a heat conducting plate that contacts the heat pipe group and the heat dissipation element on both sides respectively. One end of the heat pipe group is composed of closely arranged support heat pipes to form a heat conducting surface that is grouped and connected in the same plane as the heat conducting plate, and the other end is arranged in a multi-way extended and dispersed manner inside the heat dissipation stack body.

6. The high-efficiency radiator according to claim 5, characterized in that, The radiator is configured with at least two heat dissipation stack bodies, and a heat pipe channel adapted to the heat pipe group is internally passed through the heat dissipation stack bodies. The heat dissipation stack bodies are arranged oppositely, and a ventilation isthmus is reserved between them.

7. The high-efficiency radiator according to claim 6, wherein, The heat dissipation stack body is a heat dissipation fin group composed of multiple fins. A heat dissipation fan is provided in the ventilation isthmus, and the air outlet direction of the heat dissipation fan is parallel to the fin plane of the heat dissipation fins.

8. The high-efficiency radiator according to claim 7, characterized in that, The heat dissipation fan is a single fan or a fan group formed by combining multiple fan units.

9. The high-efficiency radiator according to claim 5, wherein The radiator is also configured with a heat spreader. The heat spreader is grouped and connected with the heat conducting plate, and the support heat pipe is placed inside the structure surrounded by the two.

10. The high-efficiency radiator according to claim 9, characterized in that, An installation seat for installing the heat dissipation fan is further provided above the heat spreader.

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