Testing device for chip processing and manufacturing

Abstract

The utility model relates to the technical field of detection devices, and discloses a testing device for chip processing and manufacturing. The testing device for chip processing and manufacturing comprises a testing device body, a blocking rod and a clamping block, a fixing block is welded to the top of the testing device body, a plurality of sliding grooves are formed in the fixing block, sliding blocks are movably embedded in the sliding grooves, supporting rods are arranged in the sliding grooves, and the clamping block is connected with the blocking rod. The supporting rod penetrates through the sliding block and is movably embedded into the sliding block, the two stop levers are welded to the bottom of the sliding block, when the semiconductor is pushed into the movable groove, the semiconductor makes contact with the two stop levers firstly, then the semiconductor pushes the stop levers to drive the sliding block to compress the first elastic piece, and the semiconductor is pushed into the movable groove. The two stop levers are arranged, so that the semiconductor is always supported by the two stop levers in the process of moving towards the contact, the semiconductor is prevented from skewing in the moving process, the probability of detection failure is reduced, and the success rate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of detection devices, in particular to a testing device for chip processing and manufacturing. Background Technique

[0002] Semiconductors refer to materials with electrical conductivity between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. From the perspective of both technology and economic development, semiconductors are of great importance, and detection devices are required for semiconductor detection.

[0003] Patent document CN218727777U discloses a semiconductor testing device, and the protected claim is "including a testing component. The testing component includes a limiting block, a connecting plate, an elastic member, a pressing plate and a tester. When in use, the semiconductor to be tested can be inserted into the through groove from one end close to the pressing plate of the through groove. Semiconductors can be inserted into several through grooves. Then, the connecting plate can be pushed towards the through groove, and then the elastic member and the pressing plate can be pushed towards the through groove. Then, the pressing plate can be pushed into the through groove, so that the pressing plate can push the semiconductor in the through groove to move. The pressing plate pushes the semiconductor towards the elastic contact, so that the semiconductor can be in contact with the elastic contact, and then the tester can test the semiconductor. Then, multiple semiconductors can be tested simultaneously, and the efficiency is relatively high and the practicability is relatively high during large-batch testing", but when the device is detecting, the semiconductor is likely to be skewed in the through groove, resulting in the semiconductor being unable to contact the contact, causing the detection to fail. And after the detection is completed, the semiconductors need to be taken out one by one manually, and the feeding efficiency is relatively low. Content of the Utility Model

[0004] The purpose of the utility model is to provide a testing device for chip processing and manufacturing to solve the problems raised in the above background technique.

[0005] To solve the above technical problems, the utility model provides the following technical solution: A testing device for chip processing and manufacturing, including a testing device main body, a retaining rod and a clamping block. A fixing block is welded on the top of the testing device main body. Several sliding grooves are arranged inside the fixing block. Sliding blocks are movably fitted in the sliding grooves. A support rod is arranged in the sliding groove. The support rod penetrates through the sliding block and the support rod is movably fitted with the sliding block. Two of the retaining rods are welded to the bottom of the sliding block. An activity groove is arranged in the testing device main body below the sliding groove. The retaining rod is movably fitted in the activity groove. A clamping block is movably fitted above the sliding groove in the fixing block. The clamping block penetrates through the fixing block. An inclined opening is arranged at the bottom of the clamping block, and the inclined opening is located in the sliding groove.

[0006] Preferably, a first elastic member is movably and fittingly attached between the support rod near the sliding groove and the slider, and limiting grooves are provided on both sides of the fixing block near the clamping block.

[0007] Preferably, limiting blocks are welded on both sides of the fixing block, the limiting blocks are movably fitted into the limiting grooves, a second elastic member is provided on the top of the limiting blocks, and the second elastic member is movably and fittingly attached to the limiting grooves.

[0008] Preferably, a pull ring is provided on the top of the fixing block, and the bottom of the pull ring is welded to the top of the clamping block.

[0009] Preferably, a fixing plate is provided on one side of the moving groove, and the fixing plate is welded and connected to one side of the test device main body through a fastener.

[0010] Preferably, a contact is provided at one end of the moving groove near the fixing plate, and the contact is connected to the fixing plate through a fastener.

[0011] Preferably, a guide rail is provided on one side of the test device main body away from the fixing plate, the guide rail is welded to the test device main body, and the guide rail is located below the moving groove.

[0012] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows:

[0013] First, when the semiconductor is pushed into the moving groove, the semiconductor will first contact the two stop rods, and then the semiconductor will push the stop rods to drive the slider to compress the first elastic member, so that the semiconductor is always supported by the two stop rods during the process of moving towards the contact, preventing the semiconductor from skewing during the movement, reducing the probability of detection failure, and improving the success rate.

[0014] Second, after the detection is completed, by manually pulling the pull ring, the pull ring drives the clamping block to move upward, so that the clamping block no longer blocks the slider, and the first elastic member will push the slider through its own elastic force, and then push the semiconductor through the stop rods, so that the semiconductor slides out of the moving groove and falls into the guide rail below, and then falls into the collection container along the guide rail, facilitating the removal of the detected semiconductor and improving the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a three-dimensional view of the present utility model;

[0016] Figure 2 is a sectional view of the present utility model;

[0017] Figure 3 is a structural diagram of the first elastic member of the present utility model.

[0018] Figure 4 Structural diagram of the clamping block of the present utility model.

[0019] Figure 5 For the present utility model Figure 4 Structural diagram of part A.

[0020] Wherein: 1. Main body of the test device; 2. Fixed block; 3. Movable groove; 4. Guide rail; 5. Pull ring; 6. Support rod; 7. Fixed plate; 8. Contact; 9. First elastic member; 10. Slide block; 11. Stop bar; 12. Clamping block; 13. Oblique opening; 14. Limit groove; 15. Limit block; 16. Second elastic member; 17. Slide groove. Specific embodiments

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1-5 , a test device for chip processing and manufacturing, including a main body 1 of the test device, a stop bar 11, and a clamping block 12. A fixed block 2 is welded to the top of the main body 1 of the test device. Several slide grooves 17 are provided inside the fixed block 2. A slide block 10 is movably fitted inside the slide grooves 17. A support rod 6 is provided inside the slide grooves 17. The support rod 6 penetrates through the slide block 10 and the support rod 6 is movably fitted with the slide block 10. Two stop bars 11 are welded to the bottom of the slide block 10. A movable groove 3 is provided inside the main body 1 of the test device near the lower part of the slide grooves 17. The stop bar 11 is movably fitted with the movable groove 3. A clamping block 12 is movably fitted above the slide grooves 17 inside the fixed block 2. The clamping block 12 penetrates through the fixed block 2. An oblique opening 13 is provided at the bottom of the clamping block 12. The oblique opening 13 is located inside the slide grooves 17. The main body 1 of the test device is an original device. The slide block 10 can slide inside the slide grooves 17, thereby driving the stop bar 11 to move. The stop bar 11 is used to support the semiconductor. The clamping block 12 can move inside the fixed block 2. When the semiconductor is pushed into the movable groove 3, the semiconductor will first contact the two stop bars 11, and then the semiconductor pushes the stop bar 11 to drive the slide block 10 to compress the first elastic member 9, so that during the process of the semiconductor moving towards the contact 8, the semiconductor is always supported by the two stop bars 11, preventing the semiconductor from being skewed during the moving process, reducing the probability of detection failure, and improving the success rate.

[0023] Specifically, a first elastic member 9 is movably attached between the support rod 6 and the slide block 10 near the slide grooves 17. Limit grooves 14 are provided on both sides of the fixed block 2 near the clamping block 12.

[0024] Through the above technical solution, the first elastic member 9 can push the slider 10 by its own elastic force.

[0025] Specifically, limiting blocks 15 are welded to both sides of the fixed block 2. The limiting blocks 15 are movably fitted into the limiting grooves 14. A second elastic member 16 is provided on the top of the limiting blocks 15, and the second elastic member 16 is movably attached to the limiting grooves 14.

[0026] Through the above technical solution, the limiting blocks 15 can move within the limiting grooves 14. The second elastic member 16 can push the limiting blocks 15 by its own elastic force, thereby pushing the locking blocks 12.

[0027] Specifically, a pull ring 5 is provided on the top of the fixed block 2, and the bottom of the pull ring 5 is welded to the top of the locking block 12.

[0028] Through the above technical solution, the pull ring 5 can drive the locking block 12 to move.

[0029] Specifically, a fixing plate 7 is provided on one side of the movable groove 3. The fixing plate 7 is welded and connected to one side of the test device main body 1 through a fastener.

[0030] Through the above technical solution, the fixing plate 7 fits the movable groove 3, and the fixing plate 7 is used to fix the contact 8.

[0031] Specifically, a contact 8 is provided at one end of the movable groove 3 close to the fixing plate 7. The contact 8 is connected to the fixing plate 7 through a fastener.

[0032] Through the above technical solution, the contact 8 is an original component. The contact 8 is electrically connected to the test device main body 1 and is used to connect a semiconductor for detection.

[0033] Specifically, a guide rail 4 is provided on the side of the test device main body 1 away from the fixing plate 7. The guide rail 4 is welded to the test device main body 1, and the guide rail 4 is located below the movable groove 3.

[0034] Through the above technical solution, the guide rail 4 is used to collect the semiconductors falling from the movable groove 3 and guide them to one side.

[0035] In use, first place the collection container below the lower edge of the guide rail 4, and then test the semiconductor through the main body 1 of the testing device. When the semiconductor is pushed into the movable slot 3, the semiconductor will first contact the two stop rods 11, and then the semiconductor will push the stop rods 11 to drive the slider 10 to compress the first elastic member 9. So that during the process of the semiconductor moving towards the contact 8, it is always supported by the two stop rods 11, preventing the semiconductor from skewing during the movement. When the slider 10 contacts the latch 12, the slider 10 will push the latch 12 upward by squeezing the inclined opening 13, driving the limiting block 15 to squeeze the second elastic member 16. When the slider 10 passes over the latch 12, the second elastic member 16 will push the limiting block 15 through its own elastic force, thereby driving the latch 12 to move downward, so that the latch 12 blocks the slider 10 to prevent the slider 10 from resetting. At this time, the semiconductor and the contact 8 are engaged, and the main body 1 of the testing device starts to detect the semiconductor. The component that pushes the semiconductor backward resets. When the detection is completed, manually pull the pull ring 5. The pull ring 5 drives the latch 12 to move upward, so that the latch 12 no longer blocks the slider 10. The first elastic member 9 will push the slider 10 through its own elastic force, and then push the semiconductor through the stop rods 11, so that the semiconductor slides out of the movable slot 3 and falls into the lower guide rail 4, and then falls into the collection container along the guide rail 4.

[0036] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0037] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A testing device for chip processing and manufacturing, comprising a testing device main body (1), a blocking rod (11) and a clamping block (12), characterized in that: At the top of the main body (1) of the test device, a fixing block (2) is welded. Inside the fixing block (2), there are several sliding grooves (17). A slider (10) is movably fitted in the sliding groove (17). A support rod (6) is arranged in the sliding groove (17). The support rod (6) penetrates through the slider (10) and the support rod (6) is movably fitted with the slider (10). At the bottom of the slider (10), two stop rods (11) are welded. Inside the main body (1) of the test device, near the lower part of the sliding groove (17), there is a movable groove (3). The stop rod (11) is movably fitted in the movable groove (3). Above the sliding groove (17) in the fixing block (2), a clamping block (12) is movably fitted. The clamping block (12) penetrates through the fixing block (2). At the bottom of the clamping block (12), there is an inclined opening (13). The inclined opening (13) is located in the sliding groove (17).

2. The test device for chip processing and manufacturing according to claim 1, wherein: A first elastic member (9) is movably attached between the support rod (6) and the slider (10) near the sliding groove (17). On both sides of the fixing block (2) near the clamping block (12), there are limit grooves (14).

3. The testing device for chip processing and manufacturing according to claim 2, characterized in that: On both sides of the fixing block (2), limit blocks (15) are welded. The limit blocks (15) are movably fitted in the limit grooves (14). At the top of the limit blocks (15), there is a second elastic member (16). The second elastic member (16) is movably attached to the limit grooves (14).

4. A testing device for chip processing and manufacturing according to claim 3, characterized in that: At the top of the fixing block (2), a pull ring (5) is provided. The bottom of the pull ring (5) is welded to the top of the clamping block (12).

5. A testing device for chip processing and manufacturing according to claim 1, characterized in that: On one side of the movable groove (3), there is a fixing plate (7). The fixing plate (7) is welded and connected to one side of the main body (1) of the test device through fasteners.

6. The test device for chip processing and manufacturing according to claim 5, characterized in that: Near one end of the fixing plate (7) in the movable groove (3), there is a contact (8). The contact (8) is connected to the fixing plate (7) through fasteners.

7. The test device for chip processing and manufacturing according to claim 6, wherein: On the side of the main body (1) of the test device away from the fixing plate (7), there is a guide rail (4). The guide rail (4) is welded to the main body (1) of the test device. The guide rail (4) is located below the movable groove (3).

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