Crimping type semiconductor sub-module

Abstract

The utility model relates to the technical field of semiconductor sub-modules, and discloses a crimping type semiconductor sub-module, which comprises a mounting seat and an IGBT sub-module fixedly mounted in the middle of the top of the mounting seat, a clamping assembly is jointly mounted on two sides of the top of the mounting seat, and a packaging frame is attached to the middle of the top of the mounting seat. The packaging frame is arranged on the outer side of the IGBT sub-module in a sleeving mode, and rapid clamping and fixing between the packaging frame and the mounting plate can be achieved through mutual cooperation of the adjusting plate, the clamping rod, the connecting rod, the threaded sleeve, the threaded rod A, the threaded rod B, the driven bevel gear, the driving bevel gear, the rotating disc and the T-shaped bolt. The IGBT sub-module packaging device solves the problem that in the prior art, connection is conducted through welding, and disassembly is difficult, connection between the packaging frame and the IGBT sub-module can be achieved through mutual cooperation of the connecting plate, the sliding plate, the telescopic spring and the square rod, operation is convenient and fast, and packaging efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor sub-modules, and particularly relates to a press-fit type semiconductor sub-module. Background Technique

[0002] Insulated gate bipolar transistors have good characteristics and a wide range of application fields because they integrate the advantages of power transistors and power field effect transistors. As a common packaging method for IGBT modules, the press-fit type semiconductor module has the characteristics of double-sided heat dissipation, a wider safe operating area (SOA), a higher operating junction temperature, no solder layer, no wire bonding, high reliability, etc. Especially, its special characteristic of fail-to-short makes it have very significant competitive advantages in the application fields such as the direct series connection of devices in flexible DC transmission converters, harsh application environments, and railway locomotive converters with high reliability requirements compared with BJT thyristors and traditional wire bonding / welding type IGBT modules.

[0003] When the existing press-fit type semiconductor sub-module is in use, it needs to be packaged to improve the use effect. However, during packaging, it is fixedly connected by welding, which not only reduces the packaging efficiency of the semiconductor sub-module but also makes it inconvenient to overhaul the IGBT sub-module inside the packaging structure.

[0004] Therefore, we propose a press-fit type semiconductor sub-module to solve the problems raised above. Content of the Utility Model

[0005] The purpose of the utility model is to provide a press-fit type semiconductor sub-module to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A press-fit type semiconductor sub-module includes a mounting base and an IGBT sub-module fixedly installed in the middle of the top of the mounting base. Both sides of the top of the mounting base are jointly provided with a clamping component, and a packaging frame is attached to the middle of the top of the mounting base. The packaging frame is sleeved outside the IGBT sub-module, and connection components are respectively installed on both sides of the top of the packaging frame;

[0007] The clamping assembly includes adjusting plates slidably mounted on both sides of the top of the mounting base respectively, and clamping rods fixedly mounted on the front and rear sides of the inner sides of the adjusting plates respectively. Connecting rods are fixedly mounted in the middle of the bottoms of the adjusting plates respectively, and moving openings are respectively formed on both sides of the top of the mounting base. The lower ends of the connecting rods respectively extend into the inner cavity of the mounting base through the moving openings, and threaded sleeves are fixedly mounted on the lower ends of the connecting rods respectively. Threaded rods A and B are respectively threaded through the threaded sleeves, the outer ends of the threaded rods A and B are respectively movably mounted on the inner walls of the inner cavity of the mounting base, and the inner ends of the threaded rods A and B are fixedly mounted with a transmission rod together. A driven bevel gear is fixedly sleeved on the output shaft of the transmission rod, a driving bevel gear is meshed with the rear side of the driven bevel gear, and a transmission shaft is fixedly mounted in the middle of the rear side of the driving bevel gear. The rear end of the transmission shaft movably penetrates and extends to the outside of the mounting base, and a turntable is fixedly mounted on the rear end of the transmission shaft.

[0008] Preferably, a T-shaped bolt is threaded through the turntable near the top.

[0009] Preferably, mounting plates are fixedly mounted on the front and rear sides of both sides of the mounting base respectively, and a plurality of slots are formed in the middle of the rear side of the mounting base. The plurality of slots are arranged in an annular array with the center of the turntable as the axis, and the output end of the T-shaped bolt is inserted into the inner cavity of one of the slots.

[0010] Preferably, slots are respectively formed on both sides of the top of the encapsulation frame, clamping grooves are respectively formed on the front and rear sides below both sides of the encapsulation frame, and the output ends of the clamping rods are respectively inserted into the inner cavities of the clamping grooves.

[0011] Preferably, the connecting assembly includes a connecting plate slidably penetrating through one side of the top of the encapsulation frame and a square groove formed above the inner side of the connecting plate. A sliding plate is arranged above the inner side of the connecting plate, and the bottom of the sliding plate extends into the inner cavity of the adjacent slot. A square rod is fixedly mounted on the outer side of the sliding plate, and the output end of the square rod is inserted into the inner cavity of the square groove.

[0012] Preferably, the inner side of the sliding plate and the inner wall of the inner cavity of the slot are elastically connected by a telescopic spring.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] 1. Through the mutual cooperation among the adjusting plate, clamping rod, connecting rod, threaded sleeve, threaded rod A, threaded rod B, driven bevel gear, driving bevel gear, turntable and T-shaped bolt, the rapid clamping and fixing between the encapsulation frame and the mounting plate can be realized, and the problem that the existing connection is carried out by welding and is difficult to disassemble is solved.

[0015] 2. Through the mutual cooperation among components such as the connecting plate, sliding plate, telescopic spring and square rod, the connection between the encapsulation frame and the IGBT sub-module can be realized, with convenient operation and high encapsulation efficiency. Brief Description of the Drawings

[0016] Figure 1 is the overall three-dimensional view of the present utility model;

[0017] Figure 2 is the partial sectional three-dimensional view of the present utility model;

[0018] Figure 3 is the partial rear side view expanded three-dimensional view of the present utility model;

[0019] Figure 4 is the partial rear side view sectional three-dimensional view of the present utility model;

[0020] Figure 5 is of the present utility model Figure 1 enlarged view of part A in;

[0021] Figure 6 is the partial sectional three-dimensional view of the encapsulation frame of the present utility model;

[0022] Figure 7 is the expanded structure three-dimensional view of the IGBT sub-module of the present utility model;

[0023] Figure 8 is the partial bottom view three-dimensional view of the IGBT sub-module of the present utility model.

[0024] In the figure: 1. Mounting base; 11. Mounting plate; 12. Slot; 2. IGBT sub-module; 3. Clamping component; 31. Adjusting plate; 32. Clamping rod; 33. Connecting rod; 34. Threaded sleeve; 35. Threaded rod A; 36. Threaded rod B; 37. Driven bevel gear; 38. Driving bevel gear; 39. Turntable; 391. T-shaped bolt; 4. Encapsulation frame; 41. Groove; 42. Clamping groove; 5. Connection component; 51. Connecting plate; 52. Sliding plate; 521. Telescopic spring; 53. Square rod. Detailed Embodiments

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0026] Embodiment 1: Please refer to Figure 1-8, A press - fit semiconductor sub - module, including a mounting base 1 and an IGBT sub - module 2 fixedly installed in the middle of the top of the mounting base 1. On both sides of the top of the mounting base 1, a clamping component 3 is jointly installed. And in the middle of the top of the mounting base 1, a packaging frame 4 is attached. The packaging frame 4 is sleeved outside the IGBT sub - module 2. On both sides of the top of the packaging frame 4, connection components 5 are respectively installed. Through the setting of the clamping component 3, the quick clamping between the mounting base 1 and the packaging frame 4 can be realized, and through the setting of the connection component 5, the connection between the packaging frame 4 and the IGBT sub - module 2 can be realized.

[0027] The clamping component 3 includes adjusting plates 31 respectively slidably installed on both sides of the top of the mounting base 1 and clamping rods 32 respectively fixedly installed on the front and rear sides of the inner sides of the adjusting plates 31. In the middle of the bottom of the adjusting plates 31, connecting rods 33 are respectively fixedly installed. And on both sides of the top of the mounting base 1, moving openings are respectively opened. The lower ends of the connecting rods 33 respectively extend into the inner cavity of the mounting base 1 through the moving openings. And at the lower ends of the connecting rods 33, threaded sleeves 34 are respectively fixedly installed. Threaded through the threaded sleeves 34 are respectively a threaded rod A35 and a threaded rod B36. The outer ends of the threaded rod A35 and the threaded rod B36 are respectively movably installed on the inner wall of the inner cavity of the mounting base 1. And the inner ends of the threaded rod A35 and the threaded rod B36 are jointly fixedly installed with a transmission rod. On the output shaft of the transmission rod, a driven bevel gear 37 is fixedly sleeved. The rear side of the driven bevel gear 37 is meshed with a driving bevel gear 38. And in the middle of the rear side of the driving bevel gear 38, a transmission shaft is fixedly installed. The rear end of the transmission shaft movably penetrates and extends to the outside of the mounting base 1. And at the rear end of the transmission shaft, a turntable 39 is fixedly installed, realizing the quick installation and clamping between the mounting base 1 and the packaging frame 4, with convenient operation.

[0028] Threaded through the turntable 39 near the top is a T - shaped bolt 391, which is beneficial for the limit of the turntable 39.

[0029] On the front and rear sides of both sides of the mounting base 1, mounting plates 11 are respectively fixedly installed. And in the middle of the rear side of the mounting base 1, a number of slots 12 are opened. The number of slots 12 is arranged in an annular array with the center of the turntable 39 as the axis. The output end of the T - shaped bolt 391 is inserted into the inner cavity of one of the slots 12, which is beneficial for the installation of the mounting base 1 and also beneficial for the insertion of the T - shaped bolt 391.

[0030] On both sides of the top of the packaging frame 4, slots 41 are respectively opened. On the front and rear sides below both sides of the packaging frame 4, clamping grooves 42 are respectively opened. And the output ends of the clamping rods 32 are respectively inserted into the inner cavities of the clamping grooves 42, which is beneficial for the development of the clamping and connection work.

[0031] In this embodiment: during use, the IGBT sub-module 2 is welded to the mounting base 1, and then the mounting base 1 is mounted through the mounting plate 11. Immediately afterwards, the encapsulation frame 4 is placed on the mounting base 1. After placement, the T-shaped bolt 391 can be rotated to move it away from the inner cavity of the slot 12. Then, the turntable 39 is rotated to drive the transmission shaft to rotate. When the transmission shaft rotates, it drives the driving bevel gear 38 to rotate. When the driving bevel gear 38 rotates, it drives the driven bevel gear 37 to rotate. When the driven bevel gear 37 rotates, it drives the threaded rods A 35 and threaded rod B 36 on both sides to rotate through the transmission rod. When the threaded rods A 35 and threaded rod B 36 rotate, they drive the threaded sleeves 34 to move relatively. When the threaded sleeves 34 move relatively, they drive the adjusting plate 31 to move relatively through the connecting rod 33. When the adjusting plate 31 moves relatively, it drives the clamping rod 32 to move relatively, and then it can be inserted into the inner cavity of the clamping groove 42 to realize the clamping and fixing of the encapsulation frame 4 and prevent the encapsulation frame 4 from falling off.

[0032] Embodiment 2: This embodiment is an improvement based on Embodiment 1. Specifically, please refer to Figure 1-4 and Figure 6-8 , the connecting component 5 includes a connecting plate 51 slidably penetrating and installed on one side of the top of the encapsulation frame 4 and a square groove opened above the inner side of the connecting plate 51. And the bottom of the connecting plate 51 is fixedly installed on the IGBT sub-module 2. Above the inner side of the connecting plate 51, there is a sliding plate 52. And the bottom of the sliding plate 52 extends into the inner cavity of the adjacent slot 41. A square rod 53 is fixedly installed on the outer side of the sliding plate 52. The output end of the square rod 53 is inserted into the inner cavity of the square groove, which is beneficial to the connection between the encapsulation frame 4 and the IGBT sub-module 2.

[0033] The inner side of the sliding plate 52 and the inner wall of the inner cavity of the slot 41 are elastically connected through a telescopic spring 521, which is beneficial to the movement and restoration of the sliding plate 52.

[0034] In this embodiment: when the encapsulation frame 4 is placed on the mounting base 1, the connecting plate 51 on the IGBT sub-module 2 will slide to the outside of the encapsulation frame 4. And before placement, the sliding plates 52 on both sides can be moved relatively and the telescopic spring 521 can be compressed. And when the placement of the encapsulation frame 4 is completed, the pulled sliding plates 52 can be released, and then they can drive the square rods 53 to be inserted into the inner cavities of the square grooves respectively under the action of the resilience of the telescopic spring 521, realizing the connection and fixation between the encapsulation frame 4 and the IGBT sub-module 2.

[0035] Working principle: During use, the IGBT sub-module 2 is welded to the mounting base 1, and then the mounting base 1 is mounted through the mounting plate 11. Immediately afterwards, the encapsulation frame 4 is placed on the mounting base 1. After placement, the T-shaped bolt 391 can be rotated to move it away from the inner cavity of the slot 12, and then the turntable 39 is rotated to drive the transmission shaft to rotate. When the transmission shaft rotates, it will drive the driving bevel gear 38 to rotate. When the driving bevel gear 38 rotates, it will drive the driven bevel gear 37 to rotate. When the driven bevel gear 37 rotates, it will drive the threaded rods A35 and B36 on both sides to rotate through the transmission rod. When the threaded rods A35 and B36 rotate, they will drive the threaded sleeves 34 to move relatively. When the threaded sleeves 34 move relatively, they will drive the adjusting plate 31 to move relatively through the connecting rod 33. When the adjusting plate 31 moves relatively, it will drive the clamping rod 32 to move relatively, and then it can be inserted into the inner cavity of the clamping groove 42 to realize the clamping and fixing of the encapsulation frame 4 and prevent the encapsulation frame 4 from falling. When the encapsulation frame 4 is placed on the mounting base 1, the connecting plate 51 on the IGBT sub-module 2 will slide to the outside of the encapsulation frame 4. Before placement, the sliding plates 52 on both sides can be moved relatively and the telescopic springs 521 can be compressed. When the encapsulation frame 4 is placed, the pulled sliding plates 52 can be released, and then they can drive the square rods 53 to be inserted into the inner cavities of the square grooves respectively under the action of the resilience of the telescopic springs 521, realizing the connection and fixing between the encapsulation frame 4 and the IGBT sub-module 2.

[0036] The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0037] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A press-fit semiconductor sub-module, comprising a mounting base (1) and an IGBT sub-module (2) fixedly mounted in the middle of the top of the mounting base (1), characterized in that: On both sides of the top of the mounting base (1), a clamping component (3) is jointly installed, and in the middle of the top of the mounting base (1), a packaging frame (4) is attached. The packaging frame (4) is sleeved outside the IGBT sub-module (2), and on both sides of the top of the packaging frame (4), connection components (5) are respectively installed; The clamping component (3) includes adjusting plates (31) respectively slidably installed on both sides of the top of the mounting base (1) and clamping rods (32) respectively fixedly installed on the front and rear sides of the inner sides of the adjusting plates (31). In the middle of the bottom of the adjusting plates (31), connecting rods (33) are respectively fixedly installed. On both sides of the top of the mounting base (1), moving openings are respectively opened. The lower ends of the connecting rods (33) respectively extend into the inner cavity of the mounting base (1) through the moving openings, and threaded sleeves (34) are respectively fixedly installed at the lower ends of the connecting rods (33). A threaded rod A (35) and a threaded rod B (36) are respectively threaded through the threaded sleeves (34). The outer ends of the threaded rod A (35) and the threaded rod B (36) are respectively movably installed on the inner wall of the inner cavity of the mounting base (1), and the inner ends of the threaded rod A (35) and the threaded rod B (36) are jointly fixedly installed with a transmission rod. A driven bevel gear (37) is fixedly sleeved on the output shaft of the transmission rod. A driving bevel gear (38) is engaged with the rear side of the driven bevel gear (37). In the middle of the rear side of the driving bevel gear (38), a transmission shaft is fixedly installed. The rear end of the transmission shaft movably penetrates and extends to the outside of the mounting base (1), and a turntable (39) is fixedly installed at the rear end of the transmission shaft.

2. The crimp-type semiconductor sub-module according to claim 1, wherein: A T-shaped bolt (391) is threaded through the turntable (39) near the top.

3. The crimped semiconductor sub-module according to claim 2, characterized in that: On the front and rear sides of both sides of the mounting base (1), mounting plates (11) are respectively fixedly installed, and a plurality of slots (12) are opened in the middle of the rear side of the mounting base (1). The plurality of slots (12) are arranged in a circular array with the center of the turntable (39) as the axis. The output end of the T-shaped bolt (391) is inserted into the inner cavity of one of the slots (12).

4. The crimped semiconductor sub-module according to claim 1, wherein: On both sides of the top of the packaging frame (4), slots (41) are respectively opened. On the front and rear sides of the lower parts of both sides of the packaging frame (4), clamping grooves (42) are respectively opened, and the output ends of the clamping rods (32) are respectively inserted into the inner cavities of the clamping grooves (42).

5. The crimped semiconductor sub-module according to claim 4, wherein: The connection component (5) includes a connecting plate (51) slidably penetrating and installed on one side of the top of the packaging frame (4) and a square groove opened above the inner side of the connecting plate (51). Above the inner side of the connecting plate (51), a sliding plate (52) is arranged. The bottom of the sliding plate (52) extends into the inner cavity of the adjacent slot (41). A square rod (53) is fixedly installed on the outer side of the sliding plate (52). The output end of the square rod (53) is inserted into the inner cavity of the square groove.

6. The crimp type semiconductor sub-module according to claim 5, wherein: Between the inner side of the sliding plate (52) and the inner wall of the inner cavity of the slot (41), it is elastically connected through a telescopic spring (521).

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