Liquid cooling heat dissipation module and chip packaging structure

Abstract

The utility model relates to the technical field of radiators, and discloses a liquid cooling heat dissipation module and a chip packaging structure. The liquid cooling heat dissipation module comprises an upper cover; a first accommodating cavity is formed in the bottom surface of the upper cover, and a water inlet and a water outlet are formed in the top surface of the upper cover; a base; a plurality of radiating fins are arranged on the top surface of the shell, and a second accommodating cavity is formed in the bottom surface of the shell; a sealing part; the sealing part surrounds the first accommodating cavity and is arranged between the upper cover and the base, and the sealing part is used for preventing the cooling liquid in the first accommodating cavity from overflowing; with the adoption of the structure, the risk that the cooling liquid overflows is reduced by the liquid cooling heat dissipation module; on the other hand, the utility model further provides a chip packaging structure which comprises the liquid cooling heat dissipation module and a chip packaged below the liquid cooling heat dissipation module, and the liquid cooling heat dissipation module is simple in structure and small in size after being packaged, so that the applicability of the liquid cooling heat dissipation module is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a liquid cooling heat dissipation module and a chip packaging structure. Background Technique

[0002] In recent years, with the development of science and technology, the rise of technologies such as convenient mobile technology, 5G mobile communication, cloud computing, data centers, blockchain systems, and artificial intelligence, the amount of data generated in various industries has been increasing day by day. Especially the rise of high-density servers promoted by the application of each technology node, the core chips, graphics cards, etc. in the server need efficient heat dissipation. How to balance efficient computing and efficient heat dissipation is a key issue to be considered in server construction. Liquid cooling heat dissipation is one of the best solutions that has developed most rapidly in the industry in recent years and can solve chip heat dissipation.

[0003] In traditional liquid cooling heat dissipation technology, there is a certain probability that the coolant overflows when the liquid cooling radiator is used, resulting in the risk of damage to electronic components. On the other hand, after the existing liquid cooling radiator and the chip are packaged, the structure is complex and the volume is relatively large, resulting in poor applicability and inability to meet a wide range of application scenarios.

[0004] Therefore, there is an urgent need for a liquid cooling heat dissipation module and a chip packaging structure to solve the above problems. Content of the Utility Model

[0005] Based on the above, the purpose of the utility model is to provide a liquid cooling heat dissipation module and a chip packaging structure to solve the problems of poor sealing of the traditional liquid cooling radiator, easy overflow of the coolant resulting in damage to electronic components, and complex structure and large volume of the radiator resulting in poor applicability.

[0006] To solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A liquid cooling heat dissipation module provided by the utility model includes:

[0008] An upper cover; a first accommodation cavity is provided on its bottom surface, and a water inlet and a water outlet penetrating through the first accommodation cavity are symmetrically provided on the top surface of the upper cover;

[0009] A base; a plurality of heat dissipation fins are provided on its top surface, and a second accommodation cavity is provided on its bottom surface;

[0010] A sealing part; it is arranged between the upper cover and the base around the first accommodation cavity, and the sealing part is used to prevent the coolant in the first accommodation cavity from overflowing;

[0011] Wherein, the upper cover and the base are fixedly connected by threads, and the abutting surface between the bottom surface of the upper cover and the top surface of the base is adhesively connected, and a plurality of the heat dissipation fins are placed in the first accommodation cavity.

[0012] As an alternative technical solution of the liquid cooling heat dissipation module, the sealing portion is a first sealing groove formed around the first accommodating cavity and a second sealing groove formed around a plurality of the heat dissipation fins; a glue injection cavity is formed between the first sealing groove and the second sealing groove.

[0013] As an alternative technical solution of the liquid cooling heat dissipation module, a glue injection through hole penetrating through the first sealing groove is provided on the top surface of the upper cover.

[0014] As an alternative technical solution of the liquid cooling heat dissipation module, a plurality of convex teeth are provided at the bottom of the first sealing groove and the bottom of the second sealing groove; when the upper cover and the base are tightly connected, the upper and lower convex teeth are meshed and abutted against each other.

[0015] As an alternative technical solution of the liquid cooling heat dissipation module, raised portions are provided upward on both sides of the first sealing groove, and steps are provided downward on both sides of the second sealing groove; when the upper cover and the base are tightly connected, the raised portions and the steps are abutted against each other.

[0016] As an alternative technical solution of the liquid cooling heat dissipation module, the height of the raised portion is the same as the height of the step.

[0017] As an alternative technical solution of the liquid cooling heat dissipation module, the sealing portion is a plurality of third sealing grooves formed around the first accommodating cavity, and a sealing strip is provided in the third sealing groove.

[0018] As an alternative technical solution of the liquid cooling heat dissipation module, the diameter of the sealing strip is greater than the depth of the third sealing groove, and when the sealing strip is installed in the third sealing groove, the sealing strip protrudes from the bottom surface of the upper cover.

[0019] As an alternative technical solution of the liquid cooling heat dissipation module, a shoulder is provided by downward extension of the circumferential edge of the upper cover, and the inner side wall of the shoulder is welded and sealed and fixed to the circumferential side surface of the base.

[0020] On the other hand, the present invention further provides a chip packaging structure, including a liquid cooling heat dissipation module according to any one of the above, further including a chip and a PCB substrate, the chip is electrically connected to the PCB substrate, the PCB substrate is adhesively connected to the bottom surface of the base, and the chip is placed in the second accommodating cavity and is thermally conductively connected to the bottom of the second accommodating cavity.

[0021] The beneficial effects of the present invention are as follows:

[0022] A liquid cooling heat dissipation module provided by the present invention includes an upper cover and a base, and a sealing portion is provided between the upper cover and the base;

[0023] When the structure of the sealing part is a glue injection cavity formed by a first sealing groove and a second sealing groove, first close the upper cover and the base. At this time, the fixing screws between the upper cover and the base are in a loose state. Inject glue into the glue injection cavity through the glue injection hole. When the target glue injection volume is reached, tighten the fixing screws between the upper cover and the base. At this time, multiple convex teeth between the first sealing groove and the second sealing groove are engaged and abutted, the protruding parts on both sides of the first sealing groove and the steps on both sides of the second sealing groove are abutted, and the sealant in the glue injection cavity generates a certain resilience under compression to closely fit the inner wall of the entire glue injection cavity; in this structure, the setting of multiple convex teeth, protruding parts and steps increases the sealing area between the upper cover and the base, and at the same time improves the bonding stability between the sealant and the upper cover and the base, further enhancing the sealing effect of the liquid cooling heat dissipation module;

[0024] When the structure of the sealing part is multiple third sealing grooves, install a sealing strip in the third sealing groove. Since the diameter of the sealing strip is greater than the depth of the third sealing groove, when the sealing strip is installed in the third sealing groove, it will protrude from the bottom surface of the upper cover. After the upper cover and the base are thread-locked, the protruding part of the sealing strip from the bottom surface of the upper cover abuts and compresses against the top surface of the base. Under the resilience of the sealing strip itself and the locking force of the upper cover and the base, the sealing strip closely fits between the third sealing groove and the top surface of the base to form a "sealing wall", effectively preventing the risk of coolant in the first accommodation cavity from overflowing; on the other hand, a shoulder is provided at the circumferential edge of the upper cover, and the inner side wall of the shoulder and the outer side wall of the circumference of the base are welded and sealed to further improve the sealing effect of the liquid cooling heat dissipation module;

[0025] In the above structure, the liquid cooling heat dissipation module is directly adhesively connected to the PCB substrate. Compared with the traditional liquid cooling radiator, the structure of the entire chip package is simpler, thus reducing its volume, making the application range of the liquid cooling heat dissipation module larger and its applicability stronger. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is an exploded view of the chip package structure in Embodiment 3 of the present invention;

[0027] Figure 2 is a bottom view of the upper cover in Embodiment 1 of the present invention;

[0028] Figure 3 In the present invention Figure 2 sectional view;

[0029] Figure 4 In the present invention Figure 3 is an enlarged view of part A in;

[0030] Figure 5 is a top view of the base in Embodiment 1 of the present invention;

[0031] Figure 6 is the sectional view of the present utility model; Figure 5

[0032] Figure 7 is the enlarged schematic view of part B in the present utility model; Figure 6

[0033] Figure 8 is the exploded schematic view of the liquid cooling heat dissipation module in the second embodiment of the present utility model;

[0034] Figure 9 is the bottom view of the upper cover in the second embodiment of the present utility model;

[0035] Figure 10 is the sectional view of the present utility model; Figure 9

[0036] Figure 11 is the enlarged schematic view of part C in the present utility model. Figure 10

[0037] In the figure:

[0038] 1. Upper cover; 11. Water inlet; 12. Water outlet; 13. First sealing groove; 131. Convex teeth; 132. Protruding part; 14. Glue injection hole; 15. First accommodating cavity; 16. Third sealing groove; 17. Shoulder;

[0039] 2. Base; 21. Second sealing groove; 210. Step; 22. Heat dissipation fins; 23. Second accommodating cavity;

[0040] 3. PCB substrate; 4. Chip. Detailed implementation manners

[0041] The present utility model will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the convenience of description, only parts related to the present utility model are shown in the drawings, rather than all the structures.

[0042] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0043] ​​​​In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may also include the situation where the first and second features are not in direct contact but are in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0044] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left" and "right" are based on the orientation or positional relationships shown in the drawings. They are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0045] In the description of the present utility model, unless otherwise stated, the meaning of "a plurality of" is two or more. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0046] As Figure 1-11 shown, the present utility model provides a liquid cooling heat dissipation module. The heat dissipation device includes an upper cover 1; a first accommodation cavity 15 is provided on its bottom surface, and a water inlet 11 and a water outlet 12 penetrating through the first accommodation cavity 15 are symmetrically provided on the top surface of the upper cover 1; a base 2; a plurality of heat dissipation fins 22 are provided on its top surface, and a second accommodation cavity 23 is provided on its bottom surface; a sealing part; which is arranged between the upper cover 1 and the base 2 around the first accommodation cavity 15, and the sealing part is used to prevent the coolant in the first accommodation cavity 15 from overflowing; wherein, the upper cover 1 and the base 2 are fixedly connected by threads, and the abutting surface between the bottom surface of the upper cover 1 and the top surface of the base 2 is adhesively connected, and a plurality of heat dissipation fins 22 are placed in the first accommodation cavity 15.

[0047] A liquid cooling heat dissipation module provided by the utility model. When the structure of the sealing part is a glue injection cavity formed by a first sealing groove 13 and a second sealing groove 21, first close the upper cover 1 and the base 2. At this time, the fixing screws between the upper cover 1 and the base 2 are in a loose state. Inject glue into the glue injection cavity through the glue injection hole 14. When the target glue injection amount is reached, then tighten the fixing screws between the upper cover 1 and the base 2. At this time, multiple convex teeth 131 between the first sealing groove 13 and the second sealing groove 21 are engaged and abutted, and the protruding parts 132 on both sides of the first sealing groove 13 and the steps 210 on both sides of the second sealing groove 21 are abutted. The sealant in the glue injection cavity generates a certain resilience under compression to closely fit the inner wall of the entire glue injection cavity; in this structure, the settings of the multiple convex teeth 131, the protruding parts 132 and the steps 210 increase the sealing area between the upper cover 1 and the base 2, and at the same time improve the adhesion stability between the sealant and the upper cover 1 and the base 2, further enhancing the sealing effect of the liquid cooling heat dissipation module;

[0048] When the sealing part is multiple third sealing grooves 16, install a sealing strip in the third sealing groove 16. Since the diameter of the sealing strip is greater than the depth of the third sealing groove 16, when the sealing strip is installed in the third sealing groove 16, it will protrude from the bottom surface of the upper cover 1. After the upper cover 1 and the base 2 are screwed and locked, the protruding part of the sealing strip from the bottom surface of the upper cover 1 abuts and compresses against the top surface of the base 2. Under the resilience of the sealing strip itself and the locking force of the upper cover 1 and the base 2, the sealing strip closely fits between the third sealing groove 16 and the top surface of the base 2 to form a "sealing wall", effectively preventing the risk of coolant in the first accommodation cavity 15 from overflowing; on the other hand, a shoulder 17 is provided on the circumferential edge of the upper cover 1, and the inner side wall of the shoulder 17 and the outer side wall of the circumference of the base 2 are welded and sealed to further improve the sealing effect of the liquid cooling heat dissipation module;

[0049] In the above structure, the liquid cooling heat dissipation module is directly adhesively connected to the PCB substrate 3. Compared with the traditional liquid cooling radiator, the structure of the entire chip 4 package is simpler, thereby reducing its volume, making the application range of the liquid cooling heat dissipation module larger and its applicability stronger.

[0050] Embodiment 1

[0051] In this embodiment, as Figure 1 and Figure 2As shown, a plurality of through holes for screws to pass through are provided near the circumferential edge of the upper cover 1, and the through holes near one end of the top surface of the upper cover 1 are provided with tapered counterbores. Each side of the upper cover 1 is provided with three through holes at equal intervals. Similarly, threaded counterbores are provided at opposite positions on the top surface of the base 2. Under the above structure, when the upper cover 1 and the base 2 are locked by screws, the circumferential edge of the upper cover 1 can be evenly and tightly attached to the base 2, further strengthening the sealing performance of the liquid cooling heat dissipation module. On the other hand, since the nut part of the screw is usually of a tapered structure, when the end of the through hole near the top surface of the upper cover 1 is a matching tapered counterbore structure, after the screw is locked, the nut can be tightly attached to the tapered counterbore, that is, the risk of coolant leaking from the gap between the through hole and the screw is prevented, further improving the sealing performance of the liquid cooling heat dissipation module.

[0052] Furthermore, as Figure 3-4 and Figure 6-7 shown, the structure of the sealing part is a glue injection cavity formed by the first sealing groove 13 and the second sealing groove 21. A plurality of convex teeth 131 are respectively provided at the bottoms of the first sealing groove 13 and the second sealing groove 21, preferably two, and the convex teeth 131 in the first sealing groove 13 and the second sealing groove 21 are arranged in relative dislocation. After the upper cover 1 and the base 2 are locked and installed, the plurality of convex teeth 131 are engaged and abutted against each other. That is to say, the setting of the convex teeth 131 increases the sealing area between the upper cover 1 and the base 2 on the one hand, and improves the adhesion stability between the sealant and the upper cover 1 and the base 2 on the other hand, further enhancing the sealing effect of the liquid cooling heat dissipation module. In addition, raised portions 132 are respectively provided upward on both sides of the first sealing groove 13, and steps 210 are respectively provided downward on both sides of the second sealing groove 21, and the height of the raised portions 132 is the same as the depth of the steps 210 sinking, and the size range is preferably 0.3 mm - 0.5 mm. Under this structure, the setting of the raised portions 132 and the steps 210 can play a positioning role when the upper cover 1 and the base 2 are installed and fitted on the one hand. On the other hand, before the screws are locked after the upper cover 1 and the base 2 are installed and fitted, sealant is injected into the glue injection cavity formed between the first sealing groove 13 and the second sealing groove 21 through the glue injection hole 14. When the sealant reaches the target glue volume, the screws are locked. The raised portions 132 and the steps 210 are engaged and abutted against each other, and there is also sealant at the abutting portion between the two. Therefore, the possibility of a gap existing after the raised portions 132 and the steps 210 are locked is avoided, and the risk of coolant overflow is prevented. Moreover, the sealant generates a certain resilience with the locking compression between the upper cover 1 and the base 2 to seal and fill the entire glue injection cavity, making the sealing performance of the liquid cooling heat dissipation module better.

[0053] Specifically, as Figure 1As shown in the figure, the base 2 and several heat dissipation fins 22 are of an integrally formed structure, and equal-spacing coolant flow channels are formed between the heat dissipation fins 22. The coolant inlet 11 and the outlet 12 on the top surface of the upper cover 1 are symmetrically arranged above both ends of the heat dissipation fins 22. After the upper cover 1 and the base 2 are installed, the heat dissipation fins 22 are placed in the first accommodation cavity 15. In this way, the coolant can flow into from one end of the heat dissipation fins 22, take away the heat, and then flow out from the other end of the heat dissipation fins 22, forming a liquid cooling cycle system, effectively improving the heat dissipation effect of the liquid cooling heat dissipation module. Among them, the heat dissipation fins 22 can also be equivalently replaced by heat dissipation components of different shapes. For example, heat dissipation copper columns, square columns, diamond columns, etc.

[0054] Embodiment 2

[0055] As Figure 8-11 shown, the difference from Embodiment 1 is that in this embodiment, the sealing part is that the upper cover 1 is provided with a plurality of third sealing grooves 16 around the first accommodation cavity 15 on the bottom surface, preferably two, and sealing strips are installed in the third sealing grooves 16. The sealing strips are made of materials with good anti-aging and elastic force such as rubber and silica gel; the diameter of the sealing strips is larger than the width and depth of the third sealing grooves 16, and the sealing strips protrude from the bottom surface of the upper cover 1. After the upper cover 1 and the base 2 are installed, the sealing strips will closely fit with the third sealing grooves 16 and the upper end surface of the base 2 under their own elastic force, forming a "sealing wall".

[0056] Specifically, as Figure 10-11 shown, a shoulder 17 is provided by extending downward at the circumferential edge of the upper cover 1. After the upper cover 1 and the base 2 are installed, the inner side surface of the shoulder 17 surrounds the circumferential side surface of the base 2, and the inner wall of the shoulder 17 and the circumferential side surface of the base 2 are welded and sealed and fixed by laser. Under this structure, the sealing performance of the liquid cooling heat dissipation module is further enhanced.

[0057] Embodiment 3

[0058] As Figure 1 and Figure 8 shown, this embodiment provides a chip 4 packaging structure, including the liquid cooling module in the above Embodiment 1 and Embodiment 2. The chip 4 battery core is connected to the PCB substrate 3, and the PCB substrate 3 is adhesively connected to the bottom surface of the base 2. At this time, the chip 4 is in thermal conduction connection with the bottom of the second accommodation cavity 23. The thermal conduction material therebetween can be indium sheet, but not limited to indium sheet. The chip packaging structure provided in this embodiment enables the chip 4, the PCB substrate 3 and the liquid cooling heat dissipation module to form a structure similar to an integrated one, effectively reducing the volume of the liquid cooling heat dissipation module and the chip packaging structure. Therefore, this structure is relatively simpler than the traditional liquid cooling heat dissipation structure, occupies less volume, and can be applied to various application environments and scenarios.

[0059] The above are only the preferred embodiments of the present utility model, and do not impose any form of limitation on the present utility model. Although the present utility model is disclosed above in the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art, without departing from the scope of the technical solution of the present utility model, when making some changes or modifications using the above-disclosed technical content into equivalent embodiments of equivalent changes, as long as it does not depart from the content of the technical solution of the present utility model, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the present utility model shall fall within the scope of the technical solution of the present utility model.

Claims

1. A liquid cooling heat dissipation module, characterized in that, Including: An upper cover; a first accommodating cavity is provided on its bottom surface, and a water inlet and a water outlet penetrating through the first accommodating cavity are symmetrically provided on the top surface of the upper cover; A base; a plurality of heat dissipation fins are provided on its top surface, and a second accommodating cavity is provided on its bottom surface; A sealing part; it is arranged between the upper cover and the base around the first accommodating cavity, and the sealing part is used to prevent the coolant in the first accommodating cavity from overflowing; Wherein, the upper cover and the base are fixedly connected, the abutting surface between the bottom surface of the upper cover and the top surface of the base is adhesively connected, and a plurality of the heat dissipation fins are placed in the first accommodating cavity.

2. The liquid cooling heat dissipation module according to claim 1, wherein The sealing part is a first sealing groove opened around the first accommodating cavity and a second sealing groove opened relatively around a plurality of the heat dissipation fins; a glue injection cavity is formed between the first sealing groove and the second sealing groove.

3. The liquid cooling heat dissipation module according to claim 2, characterized in that, A glue injection through hole penetrating through the first sealing groove is provided on the top surface of the upper cover.

4. A liquid cooling heat dissipation module according to claim 3, characterized in that, A plurality of convex teeth are provided at the bottom of the first sealing groove and the bottom of the second sealing groove; when the upper cover and the base are tightly connected, the upper and lower convex teeth are meshed and abutted.

5. The liquid cooling heat dissipation module according to claim 3, wherein Raised parts are provided upward on both sides of the first sealing groove, and steps are provided downward on both sides of the second sealing groove; when the upper cover and the base are tightly connected, the raised parts and the steps are abutted against each other.

6. The liquid cooling heat dissipation module according to claim 5, characterized in that, The height of the raised part is the same as the height of the step.

7. The liquid cooling heat dissipation module according to claim 1, characterized in that, The sealing part is a plurality of third sealing grooves opened around the first accommodating cavity, and sealing strips are provided in the third sealing grooves.

8. The liquid cooling heat dissipation module according to claim 7, wherein, The diameter of the sealing strip is greater than the depth of the third sealing groove. When the sealing strip is installed in the third sealing groove, the sealing strip protrudes from the bottom surface of the upper cover.

9. The liquid cooling heat dissipation module according to claim 8, wherein, A shoulder extends downward from the circumferential edge of the upper cover, and the inner side wall of the shoulder is welded and sealed and fixed to the circumferential side surface of the base.

10. A chip packaging structure, comprising a liquid cooling heat dissipation module according to any one of claims 1-9, characterized in that, It further includes a chip and a PCB substrate. The chip is electrically connected to the PCB substrate. The PCB substrate is adhesively connected to the bottom surface of the base. The chip is placed in the second accommodating cavity and is thermally conductively connected to the bottom of the second accommodating cavity.

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