Chip receiving head assembly

Abstract

The utility model provides a patch receiving head assembly which comprises a patch receiving head body, a photosensitive element, an IC piece and a plurality of supports, the photosensitive element is used for receiving external optical signals, the IC piece is electrically connected with the photosensitive element, and the supports are arranged in the annular direction of the patch receiving head body and inserted into the same patch receiving head body. Each bracket comprises a positioning part and a bending part, the bending part and the positioning part are integrally connected, the bending part is positioned on the peripheral side of the patch receiving head main body and is arranged in a bending manner, the positioning part is arranged in the patch receiving head main body, and the positioning part is in positioning connection with the patch receiving head main body and is clamped on the patch receiving head main body; therefore, the bracket can be positioned and connected relative to the patch receiving head main body through the positioning part, the position precision of the positioning part relative to the patch receiving head main body is ensured, the bending part is prevented from being connected to the patch receiving head main body through glue, and the bending part is prevented from being separated from the patch receiving head main body when bearing external force.

Description

Technical Field

[0001] The utility model relates to the technical field of patch receiving head components, in particular to a patch receiving head component. Background Art

[0002] With the development of science and technology, patch receiving head components are used in film and television equipment, household appliances, smart sensing products, remote control toys, instruments and meters. The patch receiving head components are used to receive infrared signals and decode them to realize functions such as remote control, data transmission, environmental monitoring and human recognition.

[0003] In the prior art, the existing patch receiving head assembly includes a patch receiving head body, a photosensitive element, an IC component and a bracket. The photosensitive element is built into the patch receiving head body, and the photosensitive element is used to receive external light signals. The IC component is built into the patch receiving head body and is electrically connected to the photosensitive element. The bracket is provided with a bending portion, and the bending portion is located on the outer peripheral side of the patch receiving head body and is connected to the patch receiving head body by glue. However, the bending portion is arranged in a bending shape, and the bending portion is easy to detach from the patch receiving head body when subjected to external force, resulting in poor stability of the bracket of the existing patch receiving head assembly relative to the patch receiving head body. Utility Model Content

[0004] The purpose of the utility model is to provide a patch receiving head assembly, wherein a photosensitive element is built into a patch receiving head body, the photosensitive element is used to receive external light signals, an IC component is built into the patch receiving head body and electrically connected to the photosensitive element, a plurality of brackets are arranged along the annular direction of the patch receiving head body and are plugged into the same patch receiving head body, each bracket comprises a positioning portion and a bending portion, the bending portion is integrally connected with the positioning portion, the bending portion is located on the outer peripheral side of the patch receiving head body and is arranged in a bent manner, the positioning portion is built into the patch receiving head body, the positioning portion is positioned and connected to the patch receiving head body, and is engaged with the patch receiving head body, so that the bracket can be positioned and connected relative to the patch receiving head body through the positioning portion, the position accuracy of the positioning portion relative to the patch receiving head body is ensured, the bending portion is prevented from being connected to the patch receiving head body by glue, the bending portion is prevented from being separated from the patch receiving head body when subjected to external force, the stability of the bracket relative to the patch receiving head body is ensured, and the overall strength and bearing capacity of the bracket are improved.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A patch receiving head assembly, comprising:

[0007] Patch receiving head body;

[0008] A photosensitive element is built into the patch receiving head body; the photosensitive element is used to receive external light signals;

[0009] An IC component, which is built into the patch receiving head body and electrically connected to the photosensitive element;

[0010] A plurality of brackets, which are arranged along the circumferential direction of the patch receiving head body and inserted into the same patch receiving head body; each of the brackets includes a positioning portion and a bending portion, the bending portion is integrally connected to the positioning portion, the bending portion is located on the outer peripheral side of the patch receiving head body and is bent; the positioning portion is built into the patch receiving head body, the positioning portion is positioned and connected to the patch receiving head body and is engaged with the patch receiving head body.

[0011] Optionally, the patch receiving head body is provided with an engaging groove;

[0012] The positioning portion is located in the engaging groove and is positioned and engaged by the inner side wall of the engaging groove; the patch receiving head body wraps the positioning portion.

[0013] Optionally, the positioning portion is provided with a positioning hole, a positioning post protrudes from the side wall of the engaging groove facing the positioning hole, the positioning post passes through the positioning hole and is in close fit with the inner side wall of the positioning hole.

[0014] Optionally, there are a plurality of the positioning holes, the plurality of positioning holes are arranged at intervals and are arranged in a staggered manner along the horizontal direction.

[0015] Optionally, the positioning portion is bent and bent along the horizontal direction.

[0016] Optionally, the bending portion is integrally connected to the positioning portion and both are conductive parts, the positioning portion is connected to the IC component through a conductive wire and is electrically connected to the IC component.

[0017] Optionally, the patch receiving head assembly further includes a shielding cover, the shielding cover is built into the patch receiving head body and supports the photosensitive element and the IC component;

[0018] The shielding cover is arranged in a U shape and is arranged along the horizontal direction.

[0019] Optionally, the shielding cover is provided with a through hole, and the through hole is arranged relative to the photosensitive element.

[0020] Optionally, the patch receiving head assembly further includes an induction head, the induction head is connected to the patch receiving head body and is located outside the patch receiving head body; the induction head is exposed to the external environment and allows optical signals to pass through along the spherical direction;

[0021] The induction head is arranged relative to the photosensitive element.

[0022] Optionally, the induction head is hemispherical.

[0023] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0024] The present utility model provides a patch receiving head assembly. A photosensitive element is built into the patch receiving head main body. The photosensitive element is used to receive external optical signals. An IC component is built into the patch receiving head main body and is electrically connected to the photosensitive element. A plurality of brackets are arranged along the circumferential direction of the patch receiving head main body and are inserted into the same patch receiving head main body. Each bracket includes a positioning portion and a bending portion. The bending portion is integrally connected to the positioning portion. The bending portion is located on the outer peripheral side of the patch receiving head main body and is bent. The positioning portion is built into the patch receiving head main body. The positioning portion is positioned and connected to the patch receiving head main body and is clamped to the patch receiving head main body. In this way, the bracket can be positioned and connected to the patch receiving head main body through the positioning portion, ensuring the position accuracy of the positioning portion relative to the patch receiving head main body. It avoids connecting the bending portion to the patch receiving head main body with glue, preventing the bending portion from detaching from the patch receiving head main body when subjected to external forces, ensuring the stability of the bracket relative to the patch receiving head main body, and improving the overall strength and bearing capacity of the bracket. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] In order to more completely understand the present application and its beneficial effects, the following will be described in conjunction with the drawings. Among them, the same reference numerals in the following description represent the same parts.

[0027] Figure 1 Shows a schematic diagram of a patch receiving head assembly according to an embodiment of the present application.

[0028] Figure 2 Shows a top view of a patch receiving head assembly according to an embodiment of the present application.

[0029] Figure 3 Shows Figure 2 A cross-sectional view in the direction A in

[0030] Figure 4 Shows a schematic diagram of the internal structure of a patch receiving head assembly according to an embodiment of the present application.

[0031] Figure 5 Shows a cross-sectional view of the internal structure of a patch receiving head assembly according to an embodiment of the present application.

[0032] Figure 6Shows a schematic diagram of a bracket of a patch receiving head component according to an embodiment of the present application.

[0033] Reference numeral

[0034] 100, patch receiving head component;

[0035] 10, patch receiving head body; 10a, engaging groove;

[0036] 20, photosensitive element;

[0037] 30, IC component;

[0038] 40, bracket; 41, positioning portion; 41a, positioning hole; 42, bending portion;

[0039] 50, shielding cover; 50a, via hole;

[0040] 60, induction head. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0042] Please refer to the attached Figures 1 to 3 , the embodiments of the present application provide a patch receiving head component 100. The patch receiving head component 100 is applied to film and television equipment, household appliances, intelligent sensing products, remote control toys, instruments and meters. The patch receiving head component 100 is used to receive infrared signals and perform decoding processing to achieve remote control, data transmission, environmental monitoring and human body recognition.

[0043] Please refer to the attached Figures 1 to 4, in the embodiment of the present application, the patch receiving head assembly 100 includes a patch receiving head main body 10, a photosensitive element 20, an IC component 30, and a plurality of brackets 40. The photosensitive element 20 and the IC component 30 are both arranged inside the patch receiving head main body 10, and the plurality of brackets 40 are arranged outside the patch receiving head main body 10. Each bracket 40 includes a positioning portion 41 and a bending portion 42. The bending portion 42 is integrally connected to the positioning portion 41. The bending portion 42 is located on the outer peripheral side of the patch receiving head main body 10 and is bent. The positioning portion 41 is built into the patch receiving head main body 10. The positioning portion 41 is positioned and connected to the patch receiving head main body 10 and is clamped to the patch receiving head main body 10. So that the bracket 40 can be positioned and connected to the patch receiving head main body 10 through the positioning portion 41, ensuring the position accuracy of the positioning portion 41 relative to the patch receiving head main body 10, avoiding connecting the bending portion 42 to the patch receiving head main body 10 with glue, preventing the bending portion 42 from detaching from the patch receiving head main body 10 when subjected to external force, ensuring the stability of the bracket 40 relative to the patch receiving head main body 10, and improving the overall strength and bearing capacity of the bracket 40.

[0044] Please refer to the attached Figures 1 to 4 , in the embodiment of the present application, the patch receiving head main body 10 serves as a support component of the patch receiving head assembly 100, and the patch receiving head main body 10 is used to support the photosensitive element 20, the IC component 30, and the plurality of brackets 40.

[0045] Please refer to the attached Figure 3 , in the embodiment of the present application, the photosensitive element 20 is built into the patch receiving head main body 10, the photosensitive element 20 is fixed to the inner side of the patch receiving head main body 10, and the photosensitive element 20 is used to receive external optical signals, so as to convert the light entering the lens into an electronic component of an analog electrical signal.

[0046] Please refer to the attached Figure 3 , in the embodiment of the present application, the IC component 30 is built into the patch receiving head main body 10 and is arranged adjacent to the IC component 30. The IC component 30 is fixed to the inner side of the patch receiving head main body 10 and is electrically connected to the photosensitive element 20. By the lens principle of the encapsulating colloid, the external light is filtered and condensed onto the photosensitive element 20, converted from light to electricity and input into the IC component 30. After pre-amplification, filtering and frequency discrimination network and digital shaping inside the IC component 30, pulse signals of different widths are output to provide function identification signals for the micro control unit.

[0047] Please refer to the attached Figures 3 to 5 , in the embodiment of the present application, the plurality of brackets 40 are arranged along the circumferential direction of the patch receiving head main body 10 and are inserted into the same patch receiving head main body 10. By arranging the plurality of brackets 40, the connection stability of the brackets 40 relative to the component to be installed is increased, so that the component to be installed can be clamped to the plurality of brackets 40.

[0048] Please refer to the attachedFigures 3 to 6 , at this time, each bracket 40 includes a positioning portion 41 and a bending portion 42. The bending portion 42 is integrally connected to the positioning portion 41, ensuring the connection stability between the bending portion 42 and the positioning portion 41, improving the connection strength between the bending portion 42 and the positioning portion 41. The bending portion 42 is located on the outer peripheral side of the patch receiving head main body 10 and is bent. The positioning portion 41 is built into the patch receiving head main body 10. The positioning portion 41 is positioned and connected to the patch receiving head main body 10 and is engaged with the patch receiving head main body 10, so that the bracket 40 can be positioned and connected to the patch receiving head main body 10 through the positioning portion 41, ensuring the position accuracy of the positioning portion 41 relative to the patch receiving head main body 10, avoiding the bending portion 42 being connected to the patch receiving head main body 10 by glue, preventing the bending portion 42 from detaching from the patch receiving head main body 10 when subjected to external forces, ensuring the stability of the bracket 40 relative to the patch receiving head main body 10, and improving the overall strength and load-bearing capacity of the bracket 40.

[0049] Please refer to the appendix Figures 3 to 6 , the patch receiving head main body 10 is provided with a engaging groove 10a. The engaging groove 10a is recessed from top to bottom in the patch receiving head main body 10. The positioning portion 41 is located in the engaging groove 10a and is positioned and engaged by the inner side wall of the engaging groove 10a. The patch receiving head main body 10 wraps the positioning portion 41, so that the inner side wall of the engaging groove 10a restricts the positioning portion 41, thereby facilitating the positioning and connection of the positioning portion 41 to the patch receiving head main body 10 through the engaging groove 10a, ensuring the position accuracy of the positioning portion 41 relative to the patch receiving head main body 10, avoiding the bending portion 42 being connected to the patch receiving head main body 10 by glue, preventing the bending portion 42 from detaching from the patch receiving head main body 10 when subjected to external forces, ensuring the stability of the bracket 40 relative to the patch receiving head main body 10, and improving the overall strength and load-bearing capacity of the bracket 40.

[0050] Please refer to the appendix Figures 3 to 6 , the positioning portion 41 is provided with a positioning hole 41a. A positioning post protrudes from the side wall of the engaging groove 10a facing the positioning hole 41a. The positioning post passes through the positioning hole 41a and is in close contact with the inner side wall of the positioning hole 41a, so as to facilitate the positioning connection between the positioning hole 41a and the positioning post, thereby facilitating the positioning post to restrict the position of the positioning hole 41a. The positioning portion 41 is positioned and connected to the engaging groove 10a through the positioning hole 41a and the positioning post, ensuring the position accuracy of the positioning portion 41 relative to the patch receiving head main body 10, avoiding the bending portion 42 being connected to the patch receiving head main body 10 by glue, preventing the bending portion 42 from detaching from the patch receiving head main body 10 when subjected to external forces, ensuring the stability of the bracket 40 relative to the patch receiving head main body 10, and improving the overall strength and load-bearing capacity of the bracket 40.

[0051] Please refer to the appendix Figure 6The positioning holes 41a have multiple positioning holes 41a, which are arranged at intervals and staggered along the horizontal direction. By arranging multiple positioning holes 41a, the positioning effect of the positioning holes 41a relative to the positioning column is increased, and the stability of the positioning holes 41a relative to the positioning column is improved.

[0052] Please refer to the attached Figure 6 The positioning portion 41 is bent and bent in the horizontal direction, so that the positioning portion 41 extends to the bending portion 42, thereby facilitating the positioning portion 41 and the bending portion 42 to be gradually bent in the horizontal direction from a horizontal state.

[0053] Please refer to the attached Figure 6 The bending portion 42 is integrally connected with the positioning portion 41, which ensures the connection stability between the bending portion 42 and the positioning portion 41 and improves the connection strength between the bending portion 42 and the positioning portion 41. The bending portion 42 and the positioning portion 41 are both conductive parts. The positioning portion 41 is connected to the IC component 30 through a conductive wire and is electrically connected to the IC component 30, so that the bending portion 42 receives external current and flows to the IC component 30 through the positioning portion 41, thereby facilitating the IC component 30 to be powered on.

[0054] Please refer to the attached Figure 4 The patch receiving head assembly 100 also includes a shielding cover 50, which is built into the patch receiving head body 10 and supports the photosensitive element 20 and the IC component 30. The shielding cover 50 is arranged in a U shape and arranged along the horizontal direction so that the shielding cover 50 increases the lateral area to improve the light resistance and electromagnetic wave resistance of the photosensitive element 20.

[0055] Please refer to the attached Figure 4 The shielding cover 50 is provided with a through hole 50a, which is arranged relative to the photosensitive element 20 so that the photosensitive element 20 is exposed to the shielding cover 50 through the through hole 50a, thereby facilitating the photosensitive element 20 to receive external light signals through the hole 50a.

[0056] Please refer to Figure 1, the head receiving component 100 also includes a sensing head 60, which is connected to the patch receiving head body 10 and is located on the outside of the patch receiving head body 10. The sensing head 60 is exposed to the external environment and is provided along a spherical direction for the light signal to pass through. The sensing head 60 is arranged relative to the photosensitive element 20 so that the external light signal can be transmitted to the photosensitive element 20 through the sensing head 60, thereby facilitating the photosensitive element 20 to receive the external light signal. Optionally, the sensing head 60 is hemispherical so as to expand the sensing area of ​​the sensing head 60.

[0057] Please refer to the attached Figure 1 The sensing head 60 is integrally connected to the patch receiving head body 10 , which ensures the connection stability between the sensing head 60 and the patch receiving head body 10 and improves the connection strength between the sensing head 60 and the patch receiving head body 10 .

[0058] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0059] The present utility model provides a patch receiving head assembly 100. A photosensitive element 20 is built into a patch receiving head main body 10. The photosensitive element 20 is used to receive an external optical signal. An IC component 30 is built into the patch receiving head main body 10 and is electrically connected to the photosensitive element 20. A plurality of brackets 40 are arranged along the circumferential direction of the patch receiving head main body 10 and are inserted into the same patch receiving head main body 10. Each bracket 40 includes a positioning portion 41 and a bending portion 42. The bending portion 42 is integrally connected to the positioning portion 41. The bending portion 42 is located on the outer peripheral side of the patch receiving head main body 10 and is bent. The positioning portion 41 is built into the patch receiving head main body 10. The positioning portion 41 is positioned and connected to the patch receiving head main body 10 and is engaged with the patch receiving head main body 10. In this way, the bracket 40 can be positioned and connected to the patch receiving head main body 10 through the positioning portion 41, ensuring the position accuracy of the positioning portion 41 relative to the patch receiving head main body 10. The situation that the bending portion 42 is connected to the patch receiving head main body 10 by glue is avoided, preventing the bending portion 42 from detaching from the patch receiving head main body 10 when subjected to an external force, ensuring the stability of the bracket 40 relative to the patch receiving head main body 10, and improving the overall strength and bearing capacity of the bracket 40.

[0060] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more such features.

[0061] Specific examples are used in this article to elaborate on the principles and implementation manners of the present application. The descriptions of the above embodiments are only used to help understand the method and its core idea of the present application. At the same time, for those skilled in the art, based on the idea of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A patch receiver head assembly, characterized in that, Comprising: Patch receiver head body; A photosensitive element built into the patch receiver head body; the photosensitive element is used to receive external optical signals; An IC component built into the patch receiver head body and electrically connected to the photosensitive element; A plurality of brackets arranged along the circumferential direction of the patch receiver head body and inserted into the same patch receiver head body; each of the brackets includes a positioning portion and a bending portion, the bending portion is integrally connected to the positioning portion, the bending portion is located on the outer peripheral side of the patch receiver head body and is bent; the positioning portion is built into the patch receiver head body, the positioning portion is positioned and connected to the patch receiver head body and is engaged with the patch receiver head body.

2. The patch receiver head assembly according to claim 1, wherein The patch receiver head body is provided with an engaging groove; The positioning portion is located in the engaging groove and is positioned and engaged by the inner side wall of the engaging groove; the patch receiver head body wraps the positioning portion.

3. The patch receiving head assembly according to claim 2, wherein, The positioning portion is provided with a positioning hole, and a positioning post protrudes from the side wall of the engaging groove facing the positioning hole, and the positioning post passes through the positioning hole and is in close contact with the inner side wall of the positioning hole.

4. The patch receiving head assembly according to claim 3, characterized in that, There are a plurality of the positioning holes, and the plurality of positioning holes are arranged at intervals and are arranged in a staggered manner along the horizontal direction.

5. The patch receiving head component according to claim 4, characterized in that, The positioning portion is bent and bent along the horizontal direction.

6. The patch receiving head assembly according to claim 3, wherein, The bending portion is integrally connected to the positioning portion and both are conductive members, and the positioning portion is connected to the IC component through a conductive wire and is electrically connected to the IC component.

7. The patch receiving head component according to claim 1, characterized in that, The patch receiver head assembly further includes a shielding cover, the shielding cover is built into the patch receiver head body and supports the photosensitive element and the IC component; The shielding cover is arranged in a U shape and is arranged along the horizontal direction.

8. The patch receiving head component according to claim 7, wherein, The shielding cover is provided with a through hole, and the through hole is arranged relative to the photosensitive element.

9. The patch receiving head component according to claim 1, characterized in that, The patch receiver head assembly further includes a sensing head, the sensing head is connected to the patch receiver head body and is located outside the patch receiver head body; the sensing head is exposed to the external environment and allows optical signals to pass through along the spherical direction; The sensing head is arranged relative to the photosensitive element.

10. The patch receiving head assembly according to claim 9, characterized in that, The sensing head is hemispherical.

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