PCB (Printed Circuit Board) assembly with SMD (Surface Mount Device) heating element and radiator
By setting up an SMD heating element on the back of the PCB board and using the bumps and thermal conduction glue of the heat dissipation member, combined with auxiliary heat dissipation covers and blocks, the cost problem in the prior art is solved, and efficient heat dissipation and low-cost heat dissipation effects are achieved.
Patent Information
- Application Number
- CN202421523367.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-06-28
AI Technical Summary
In the prior art, the SMD heating elements of the adapter circuit board and the power circuit board need to be equipped with a heat dissipation device, resulting in higher costs.
The SMD heating element is arranged on the back of the PCB board, and the bumps of the heat dissipation member are used to oppose the heating element, and the thermal resistance is reduced by thermally conductive glue or thermally conductive silicone grease, and supplemented with auxiliary heat dissipation cover and heat dissipation block to form a large area of heat dissipation structure.
It realizes efficient heat dissipation, reduces production costs, avoids interference to other electronic components, and improves heat dissipation efficiency.
Smart Images
Figure CN223093941U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of PCB board heat dissipation. More specifically, it is directed to a PCB board assembly with SMD heating elements and a radiator. Background Art
[0002] Currently, in some adapter circuit boards and power circuit boards, there are generally several components with relatively large heat generation, such as heating resistors, etc. To enable these circuit boards to work properly and safely, a heat dissipation structure generally needs to be set up so that heat can be dissipated in a timely manner. Secondly, in some circuit boards such as adapter circuit boards and power circuit boards, in order to improve the heat dissipation efficiency, the heating elements are set as SMD structures, so that the heating elements are more closely attached to the circuit board. At the same time, corresponding heat dissipation devices, such as small radiators, are set on the circuit board to assist in accelerating heat dissipation through the heat dissipation devices to avoid heat concentration and damage to the circuit board. However, adopting this method will inevitably result in a relatively high cost. Summary of the Utility Model
[0003] The purpose of this application is to provide a PCB board assembly with SMD heating elements. This PCB board assembly does not need to set heat dissipation devices on the circuit board, and the manufacturing cost is low.
[0004] Another purpose of this application is to provide a radiator, which is applied to the above-mentioned PCB board assembly to facilitate heat dissipation of the PCB board.
[0005] To achieve the above purpose, the technical solution adopted in this application is: to provide a PCB board assembly with SMD heating elements, which includes: a PCB board, and SMD heating elements are arranged on the back of the PCB board; it also includes a heat dissipation part, the heat dissipation part includes a lower bottom plate, and an insulating sheet for isolating the PCB board from the lower bottom plate is arranged above the lower bottom plate. A convex block is arranged on the inner side surface of the lower bottom plate, and the insulating sheet is provided with a through hole for the convex block to pass through, and the convex block passes through the through hole and abuts against the SMD heating element.
[0006] Preferably, a heat-conducting adhesive or heat-conducting silicone grease is arranged between the convex block and the SMD heating element.
[0007] Further, the heat dissipation part also includes lower side plates located on both sides of the lower bottom plate; the heat dissipation part is connected with an auxiliary heat dissipation cover, and the auxiliary heat dissipation cover includes an upper bottom plate, and upper side plates are respectively arranged on both sides of the upper bottom plate, and the upper side plates are correspondingly connected with the lower side plates.
[0008] Further, auxiliary heat dissipation blocks are respectively connected to both sides of the PCB, and the auxiliary heat dissipation blocks abut against the adjacent lower side plates.
[0009] Furthermore, the middle part of the upper side plate bends outward, and the upper side plate is divided into three sections, namely: an upper vertical section, an intermediate transition section, and a lower vertical section; the upper vertical section is arranged opposite to the lower side plate, the upper vertical section abuts against the outer side of the upper end of the auxiliary heat dissipation block, the lower vertical section is located on the outer side of the upper end of the lower side plate, and the inner side surface of the lower vertical section abuts against the outer side surface of the upper end of the lower side plate.
[0010] Furthermore, a convex block is arranged on the outer side surface of the lower side plate, and a clamping hole matched with the convex block is arranged on the lower vertical section, and the convex block is clamped into the clamping hole.
[0011] Preferably, inclined surfaces are respectively formed at the upper and lower ends of the convex block, that is, the upper end surface and the lower end surface of the convex block are inclined; of course, it can also be arc-shaped, that is, arc surfaces are respectively formed at the upper and lower ends of the convex block. In this way, when the upper side plate is connected to the lower side plate, the lower vertical section of the upper side plate first contacts the upper inclined surface of the convex block and gradually abuts against the convex block until the convex block is clamped into the clamping hole. The lower end is also set as an inclined surface, which is convenient for the upper side plate to be separated from the lower side plate.
[0012] As another structural deformation, an inward convex block is arranged on the lower vertical section, and a clamping hole matched with the convex block is arranged on the lower side plate. Similarly, inclined surfaces can also be respectively formed at the upper and lower ends of the convex block.
[0013] A radiator includes: a heat dissipation member, the heat dissipation member includes a lower bottom plate, an insulating sheet for isolating the PCB board from the lower bottom plate is arranged on the lower bottom plate, a through hole matched with the SMD heating element on the back of the PCB board is arranged on the insulating sheet, a convex block opposite to the SMD heating element is arranged on the inner side surface of the lower bottom plate, and the convex block abuts against the SMD heating element.
[0014] Furthermore, the radiator further includes: an auxiliary heat dissipation cover, the auxiliary heat dissipation cover includes an upper bottom plate, upper side plates are respectively arranged on both sides of the upper bottom plate, and the heat dissipation member further includes lower side plates located on both sides of the lower bottom plate; the upper side plates are correspondingly connected to the lower side plates.
[0015] Furthermore, the middle part of the upper side plate bends outward, and the upper side plate is divided into three sections, namely: an upper vertical section, an intermediate transition section, and a lower vertical section; the upper vertical section is arranged opposite to the lower side plate, the upper vertical section abuts against the outer side of the upper end of the auxiliary heat dissipation block, the lower vertical section is located on the outer side of the upper end of the lower side plate, and the inner side surface of the lower vertical section abuts against the outer side surface of the upper end of the lower side plate.
[0016] The beneficial effect of this application is that: compared with the prior art, the SMD heating element is arranged on the back of the PCB board, a convex block corresponding to the SMD heating element is arranged on the lower bottom plate of the heat dissipation member, and an insulating sheet is arranged between the heat dissipation member and the PCB board; the SMD heating element passes through the insulating sheet and abuts against the convex block, and the heat is transferred from the SMD heating element to the heat dissipation member, and the heat dissipation effect is good. Description of the Drawings
[0017] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for describing the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0018] Figure 1 It is a schematic structural diagram of a PCB board assembly with an SMD heating element provided by an embodiment of the present application.
[0019] Figure 2 It is an exploded structural schematic diagram of a PCB board assembly with an SMD heating element provided by an embodiment of the present application.
[0020] Figure 3 It is a schematic structural diagram of a PCB board provided by an embodiment of the present application.
[0021] Among them, the reference numerals in the figures are as follows:
[0022] 1 - Auxiliary heat dissipation cover: 11 - Upper side plate; 12 - Upper bottom plate; 111 - Lower vertical section; 112 - Intermediate transition section; 113 - Upper vertical section; 114 - Card hole; 2 - Auxiliary heat dissipation block; 3 - PCB board; 31 - SMD heating element; 4 - Insulating sheet; 41 - Perforation; 5 - Heat dissipation member; 51 - Lower bottom plate; 52 - Lower side plate; 511 - Protrusion; 512 - Threaded post; 521 - Card block. Detailed implementation manners
[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0024] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0025] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.
[0026] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.
[0027] Please refer to Figures 1 to 3 , now for a PCB board assembly with an SMD heating element 31 provided by an embodiment of the present application, refer to Figure 1 ; it includes: a PCB board 3, and an SMD heating element 31 is provided on the back surface of the PCB board 3; it further includes a heat dissipation member 5, the heat dissipation member 5 includes a lower bottom plate 51, an insulating sheet 4 for isolating the PCB board 3 from the lower bottom plate 51 is provided above the lower bottom plate 51, a convex block 511 opposite to the SMD heating element is provided on the inner side surface of the lower bottom plate 51, the insulating sheet 4 is provided with a through hole 41 for the convex block 511 to pass through, and the convex block 511 passes through the through hole 41 and abuts against the SMD heating element 31.
[0028] The technical solution of the present application arranges the SMD heating element 31 on the back surface of the PCB board 3, so that the SMD heating element 31 and other electronic components are located on both sides of the PCB board 3 respectively. When setting up a heat dissipation structure for the SMD heating element 31, other electronic components can be avoided, thus avoiding interference with other resistor components. Again, when dissipating heat from the SMD heating element 31, the technical solution of the present application adopts the heat dissipation member 5, and the surface area of the heat dissipation member 5 is relatively large, and the area of its lower bottom plate 51 can be made slightly larger than that of the PCB board 3; therefore, there is no need to set up other structures, such as fin structures, etc., making the structure simple and the manufacturing cost low. During operation, most of the heat generated on the PCB board 3 is concentrated on the SMD heating element 31, and the SMD heating element 31 emits a large amount of heat. Since the SMD heating element 31 is directly in contact with the heat dissipation member 5, the heat is directly transferred to the heat dissipation member 5 through heat conduction, and the heat dissipation member 5 dissipates heat to the outside as a whole through heat radiation, accelerating the heat dissipation speed. Secondly, the lower bottom plate 51 is provided with a connection structure for fixedly connecting with the PCB board 3 to assist in fixing the PCB board 3. The connection structure can be a card strip, a threaded post 512, etc., which are well-known technologies and will not be elaborated here.
[0029] Preferably, the heat dissipation member 5 is made of a metal material, and an aluminum product is used in this embodiment. The electronic components on the PCB board 3 are generally installed by plugging. First, the electronic components are plugged onto the PCB board 3 by a plugging machine, and then the pins are spot-welded; therefore, most of the solder feet on the PCB board 3 are located on the back side of the PCB board 3. To avoid the solder feet contacting the lower bottom plate 51 of the heat dissipation member 5 and forming a short circuit of the electronic components, an insulating sheet 4 is provided in this technical solution to isolate the PCB board 3 from the lower bottom plate 51 of the heat dissipation member 5. A through hole 41 is provided on the insulating sheet 4 for the SMD heating element 31 to pass through.
[0030] See Figure 2 , in this embodiment, a convex block 511 opposite to the SMD heating element is provided on the inner side surface of the lower bottom plate 51, and the convex block 511 abuts against the SMD heating element.
[0031] The insulating sheet 4 is generally made of plastic or rubber material. In order to improve the insulation performance, the thickness of the insulating sheet 4 is generally set relatively large, so that the pins of the electronic components on the PCB board 3 still cannot penetrate after being inserted into the insulating sheet 4; therefore, it may make the thickness of the SMD heating element smaller than the thickness of the insulating sheet 4, resulting in a gap between the SMD heating element and the inner side surface of the lower bottom plate 51 of the heat dissipation member 5, with a large thermal resistance and affecting heat dissipation. For this reason, the technical solution of this application adopts stamping at the position corresponding to the SMD heating element on the lower bottom plate 51, so that a part of the area of the lower bottom plate 51 bends inward to form a convex block 511, and a concave hole is formed at the position opposite to the convex block 511; the convex block 511 passes through the through hole 41 on the insulating sheet 4 and abuts against the SMD heating element.
[0032] Secondly, since the convex block 511 is formed by bending deformation, the convex block 511 itself has a certain elasticity; therefore, in the design, the sum of the thickness of the convex block 511 and the thickness of the SMD heating element is slightly larger than the thickness of the insulating sheet 4, so that after installation, a pressing force is formed between the SMD heating element and the convex block 511, and the contact between the SMD heating element and the convex block 511 is closer, thus avoiding the formation of a gap between the SMD heating element and the convex block 511 during use.
[0033] Preferably, there is thermal conductive glue or thermal conductive silicone grease (not shown in the figure) between the bump 511 and the SMD heating element. Since the SMD heating element generates a large amount of heat during operation, in order to enable the heat generated by the SMD heating element to be quickly transferred to the heat sink 5, during design, it is necessary to reduce the thermal resistance between the SMD heating element and the bump 511 on the lower bottom plate 51; only by the way of abutment, the thermal resistance between the SMD heating element and the bump 511 is still large; for this reason, the technical solution of this application adopts the method of setting thermal conductive glue or thermal conductive silicone grease. During installation, a layer of thermal conductive glue or thermal conductive silicone grease is applied to the surface of the SMD heating element, and then the SMD heating element abuts against the bump 511, and a thermal conductive glue layer or a thermal conductive silicone grease layer is formed around the SMD heating element and the bump 511, effectively reducing the thermal resistance between the SMD heating element and the bump 511.
[0034] Please refer to Figure 2 ; on both sides of the lower bottom plate 51, there are provided a plurality of hollow threaded posts 512 and auxiliary heat dissipation blocks 2 respectively, and the two auxiliary heat dissipation blocks 2 are respectively connected to both sides of the PCB board; see Figure 1 , the lower end of the auxiliary heat dissipation block 2 abuts against the PCB board 3, and the auxiliary heat dissipation block 2 abuts against the adjacent lower side plate 52, that is, one side surface of the auxiliary heat dissipation block 2 fits against the inner surface of a lower side plate 52 of the heat sink 5. The insulating sheet 4 and the PCB board 3 are both provided with avoidance holes (not shown in the figure) that cooperate with the threaded posts 512; the PCB board is fixed to the lower bottom plate 51 through connecting screws or bolts.
[0035] When dissipating heat from the PCB board 3, not only the SMD heating element needs to be dissipated, but also the PCB board 3 needs to be assisted in heat dissipation; when performing auxiliary heat dissipation, the technical solution of this application provides an auxiliary heat dissipation block 2. The lower end surface of the auxiliary heat dissipation block 2 abuts against both ends of the two sides of the PCB board 3. The auxiliary heat dissipation block 2 is generally made of a metal material such as an aluminum block. Therefore, during design, there are no circuits and electronic components at the abutting parts of both ends of the two sides of the PCB board 3 and the auxiliary heat dissipation block 2; to facilitate fixing the auxiliary heat dissipation block 2 to the PCB board 3.
[0036] During operation, the electronic components on the PCB board 3 generate heat, and this heat is transferred to the auxiliary heat dissipation block 2 through the PCB board 3. The side surface of the auxiliary heat dissipation block 2 fits against the inner surface of a corresponding lower side plate 52 of the heat sink 5, and the auxiliary heat dissipation block 2 transfers the heat to the heat sink 5; avoiding most of the heat being transferred to the heat sink 5 through the SMD heating element 31; increasing the heat transfer path from the PCB board 3 to the heat sink 5, and the contact area between the auxiliary heat dissipation block 2 and the PCB board 3 is large, and the heat transfer effect is better.
[0037] The SMD heating element 31 is fixed to the back of the PCB board 3. After installation, it needs to be in contact with the bump 511 on the lower bottom plate 51 of the heat sink 5. To make the SMD heating element 31 fixed firmly and not be affected by the bump 511 or be less affected by the bump 511; preferably, a fixing structure for assisting in fixing the SMD heating element 31 is provided on the lower end surface of the PCB board 3. The SMD heating element 31 is fixed by the fixing structure.
[0038] See Figure 1 、 Figure 2 ; The heat sink 5 further includes lower side plates 52 located on both sides of the lower bottom plate 51. The heat sink 5 is connected with an auxiliary heat dissipation cover 1. The auxiliary heat dissipation cover 1 includes an upper bottom plate 12. Upper side plates 11 are respectively provided on both sides of the upper bottom plate 12. The upper side plates 11 are correspondingly connected to the lower side plates 52; and the upper end surface of the auxiliary heat dissipation block 2 abuts against the inner side surface of the upper bottom plate 12.
[0039] In this embodiment, in order to further enhance heat dissipation, an auxiliary heat dissipation cover 1 is provided; the upper side plates 11 on both sides of the auxiliary heat dissipation cover 1 are connected to the lower side plates 52; when dissipating heat, part of the heat enters the upper side plates 11 and the upper bottom plate 12 through the lower side plates 52, and the upper side plates 11 and the upper bottom plate 12 assist in heat dissipation; thus, the heat dissipation area is greatly increased.
[0040] Secondly, the lower end surface of the upper bottom plate 12 of the auxiliary heat dissipation cover 1 abuts against the upper end surface of the auxiliary heat dissipation block 2, so that the auxiliary heat dissipation cover 1 plate, the auxiliary heat dissipation block 2 and the heat sink 5 form a protective shell with openings at both ends, and the PCB board 3 is located inside the protective shell to avoid external interference and damage.
[0041] See Figure 1 、 Figure 2 ; The middle part of the upper side plate 11 is bent outward. The upper side plate 11 is divided into three sections, which are distributed as: an upper vertical section 113, an intermediate transition section 112, and a lower vertical section 111; the upper vertical section 113 is disposed opposite to the lower side plate 52, the upper vertical section 113 abuts against the outer side of the upper end of the auxiliary heat dissipation block 2, the lower vertical section 111 is located on the outer side of the upper end of the lower side plate 52, and the inner side surface of the lower vertical section 111 abuts against the outer side surface of the upper end of the lower side plate 52.
[0042] To improve the heat dissipation efficiency, an auxiliary heat dissipation cover 1 and an auxiliary heat dissipation block 2 are added. It is necessary to increase the contact area between the auxiliary heat dissipation block 2 and the auxiliary heat dissipation cover 1. Therefore, in the technical solution of this application, the upper vertical section 113 of the upper side plate 11 is arranged opposite to the lower side plate 52, that is, the distance between the upper side plates 11 on both sides is the same as that between the lower side plates 52 on both sides; the upper and lower ends of the outer side of the auxiliary heat dissipation block 2 are respectively abutted against the inner side of the upper vertical section 113 of the upper side plate 11 and the inner side of the lower side plate 52, effectively increasing the contact area; secondly, in order to increase the contact area between the upper side plate 11 and the lower side plate 52, the technical solution of this application is provided with an intermediate transition section 112. The lower vertical section 111 is located outside the upper end of the lower side plate 52 and abuts against it, increasing the contact area between the upper side plate 11 and the lower side plate 52. The intermediate transition section 112 can be an inclined section, an arc section or a folded section; the specific shape can be set according to needs.
[0043] See Figure 2 ; The outer side of the lower side plate 52 is provided with an outwardly convex clamping block 521, and the lower vertical section 111 is provided with a clamping hole 114 that cooperates with the clamping block 521, and the clamping block 521 is clamped into the clamping hole 114.
[0044] To conveniently connect the lower side plate 52 and the upper side plate 11, the technical solution of this application adopts a clamping method to relatively fixedly connect the lower side plate 52 and the upper side plate 11; specifically: several clamping blocks 521 are arranged on the outer side of the lower side plate 52, and the clamping blocks 521 can be formed by stamping. The lower vertical section 111 of the upper side plate 11 is provided with a clamping hole 114 that cooperates with the clamping block 521; when the lower vertical section 111 of the upper side plate 11 is sleeved outside the lower side plate 52, the clamping block 521 is clamped into the clamping hole 114.
[0045] Preferably, to prevent the lower end of the upper side plate 11 from being stuck by the clamping block 521, inclined surfaces are respectively formed at the upper and lower ends of the clamping block 521, that is, the upper end surface and the lower end surface of the clamping block 521 are inclined; of course, it can also be arc-shaped, that is, arc surfaces are respectively formed at the upper and lower ends of the clamping block 521. In this way, when the upper side plate 11 is connected to the lower side plate 52, the lower vertical section 111 of the upper side plate 11 first contacts the upper inclined surface of the clamping block 521 and gradually abuts against the clamping block 521 until the clamping block 521 is clamped into the clamping hole 114. The lower end is also set as an inclined surface to facilitate the separation of the upper side plate 11 and the lower side plate 52.
[0046] As another structural deformation, the lower vertical section 111 is provided with an inwardly convex clamping block 521, and the lower side plate 52 is provided with a clamping hole 114 that cooperates with the clamping block 521. Similarly, inclined surfaces can also be respectively formed at the upper and lower ends of the clamping block 521. Through the cooperation of the clamping block 521 and the clamping hole 114, the lower vertical section 111 is clamped to the lower side plate 52.
[0047] Example 2: See Figures 1 to 2; A radiator, which comprises: a heat dissipation member 5, the heat dissipation member 5 includes a lower bottom plate 51, the lower bottom plate 51 is provided with an insulating sheet 4 for isolating the PCB board 3 from the lower bottom plate 51, the insulating sheet 4 is provided with a perforation 41 for the SMD heating element 31 on the back of the PCB board 3 to pass through, and a bump 511 opposite to the SMD heating element is provided on the inner side surface of the lower bottom plate 51, and the bump 511 abuts against the SMD heating element.
[0048] This radiator is mainly used for dissipating heat from the SMD heating element 31 arranged on the back of the PCB board 3. By arranging the bump 511 on the bottom plate to abut against the SMD heating element 31, the heat generated by the SMD heating element 31 is transferred to the heat dissipation member 5 through the bump 511, and the heat is dissipated through the heat dissipation member 5.
[0049] Among them, the radiator further comprises: an auxiliary heat dissipation cover 1, the auxiliary heat dissipation cover 1 includes an upper bottom plate 12, and the heat dissipation member 5 further includes lower side plates 52 located on both sides of the lower bottom plate 51; upper side plates 11 are respectively provided on both sides of the upper bottom plate 12, and the upper side plates 11 are correspondingly connected to the lower side plates 52.
[0050] After the auxiliary heat dissipation cover 1 is provided, it can play an auxiliary heat dissipation role; at the same time, it forms a protective shell together with the heat dissipation member 5 to protect the internal PCB board.
[0051] Among them, the middle part of the upper side plate 11 is bent outwards, and the upper side plate 11 is divided into three sections, which are distributed as: an upper vertical section 113, a middle transition section 112, and a lower vertical section 111; the upper vertical section 113 is arranged opposite to the lower side plate 52, the upper vertical section 113 abuts against the outer side of the upper end of the auxiliary heat dissipation block 2, the lower vertical section 111 is located on the outer side of the upper end of the lower side plate 52, and the inner side surface of the lower vertical section 111 abuts against the outer side surface of the upper end of the lower side plate 52.
[0052] By dividing the upper side plate 11 into three parts, the auxiliary heat dissipation cover 1 can use the same raw material as the heat dissipation member 5 and then be processed later, which reduces the processing procedures and saves costs.
[0053] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included within the protection scope of the present application.
Claims
1. A PCB board assembly with an SMD heating element, comprising: PCB board, characterized in that: an SMD heating element is provided on the back surface of the PCB board; further comprising a heat dissipation member, the heat dissipation member includes a lower bottom plate, an insulating sheet for isolating the PCB board from the lower bottom plate is provided above the lower bottom plate, a convex block is provided on the inner side surface of the lower bottom plate, and the insulating sheet is provided with a through hole for the convex block to pass through, and the convex block passes through the through hole and abuts against the SMD heating element.
2. The PCB board assembly with SMD heating elements as described in claim 1, characterized in that: The heat dissipation member further includes lower side plates located on both sides of the lower bottom plate; an auxiliary heat dissipation cover is connected to the heat dissipation member, the auxiliary heat dissipation cover includes an upper bottom plate, upper side plates are respectively provided on both sides of the upper bottom plate, and the upper side plates are correspondingly connected to the lower side plates.
3. The PCB board assembly with SMD heating elements as described in claim 2, characterized in that: Auxiliary heat dissipation blocks are respectively connected to both sides of the PCB, and the auxiliary heat dissipation blocks abut against the adjacent lower side plates.
4. The PCB board assembly with SMD heating elements as described in claim 3, characterized in that: The middle part of the upper side plate is bent outward, and the upper side plate is divided into three sections, which are distributed as: an upper vertical section, an intermediate transition section, and a lower vertical section; the upper vertical section is arranged opposite to the lower side plate, the upper vertical section abuts against the outer side of the upper end of the auxiliary heat dissipation block, the lower vertical section is located on the outer side of the upper end of the lower side plate, and the inner side surface of the lower vertical section abuts against the outer side surface of the upper end of the lower side plate.
5. The PCB board assembly with SMD heating elements according to claim 4, characterized in that: A convex block protruding outward is provided on the outer side surface of the lower side plate, and the lower vertical section is provided with a card hole matching the convex block, and the convex block is snapped into the card hole.
6. A radiator, comprising: Heat dissipation member, the heat dissipation member includes a lower bottom plate, characterized in that: the lower bottom plate is provided with an insulating sheet for isolating the PCB board from the lower bottom plate, the insulating sheet is provided with a through hole for the SMD heating element on the back surface of the PCB board to pass through, a convex block opposite to the SMD heating element is provided on the inner side surface of the lower bottom plate, and the convex block abuts against the SMD heating element.
7. The radiator according to claim 6, characterized in that: The radiator further includes: an auxiliary heat dissipation cover, the auxiliary heat dissipation cover includes an upper bottom plate, upper side plates are respectively provided on both sides of the upper bottom plate, the heat dissipation member further includes lower side plates located on both sides of the lower bottom plate, and the upper side plates are correspondingly connected to the lower side plates.
8. A radiator according to claim 7, characterized in that: The middle part of the upper side plate is bent outward, and the upper side plate is divided into three sections, which are distributed as: an upper vertical section, an intermediate transition section, and a lower vertical section; the upper vertical section is arranged opposite to the lower side plate, the upper vertical section abuts against the outer side of the upper end of the auxiliary heat dissipation block, the lower vertical section is located on the outer side of the upper end of the lower side plate, and the inner side surface of the lower vertical section abuts against the outer side surface of the upper end of the lower side plate.