Multilayer substrate

Abstract

The utility model provides a multilayer substrate capable of inhibiting short circuit, comprising a first laminated body which is laminated with a plurality of first insulator layers in a Z-axis direction and is provided with a plurality of first conductor layers; and a second laminate which is fixed to the first laminate in the positive direction of the Z-axis and in which a plurality of second insulator layers are laminated in the Z-axis direction, and which, when viewed in the Z-axis direction, has: a first region in which the first laminate and the second laminate are present; and a second region in which the first laminated body is present and the second laminated body is not present, the first laminated body is divided into three equal parts in the Z-axis direction into a positive region, an intermediate region, and a negative region which are sequentially arranged in the negative direction of the Z-axis, and the plurality of first conductor layers include: one or more positive region first conductor layers, at least a portion of which is located in the positive region; and one or more intermediate region first conductor layers located in the intermediate region as a whole, the thickness of the at least one positive region first conductor layer in the Z-axis direction being greater than the thickness of the intermediate region first conductor layer.

Description

Technical Field

[0001] The present utility model relates to a multi-layer substrate having a structure in which insulator layers are stacked. Background Art

[0002] As a conventional invention related to a multi-layer substrate, for example, a stacked substrate described in Patent Document 1 is known. This stacked substrate has a structure in which a plurality of dielectric layers are stacked in the vertical direction. Moreover, a cavity for mounting an electronic component is provided on the upper surface of the stacked substrate.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2006-19643 Summary of the Utility Model

[0006] Problems to be Solved by the Utility Model

[0007] However, in the stacked substrate described in Patent Document 1, the thickness in the vertical direction of the portion of the stacked substrate where the cavity is provided is smaller than the thickness in the vertical direction of the portion of the stacked substrate where the cavity is not provided. Therefore, the strength of the portion of the stacked substrate where the cavity is provided is low. As a result, in the thermal compression bonding process of the stacked substrate, the stacked substrate may be deformed and the cavity may be deformed. In this case, a short circuit may occur between the conductors provided near the cavity.

[0008] Therefore, an object of the present utility model is to suppress the occurrence of a short circuit in a multi-layer substrate in which a second stacked body is fixed to a first stacked body.

[0009] Technical Solution for Solving the Problem

[0010] A multi-layer substrate according to one aspect of the present utility model includes:

[0011] A first stacked body having a structure in which a plurality of first insulator layers are stacked in the Z-axis direction;

[0012] A second stacked body having a structure in which a plurality of second insulator layers are stacked in the Z-axis direction; and

[0013] A plurality of first conductor layers provided on the first stacked body,

[0014] The second stacked body is located in the positive direction of the Z-axis of the first stacked body,

[0015] The second stacked body is fixed to the first stacked body by bonding the first insulator layer and the second insulator layer.

[0016] There exist: a first region where, when observed in the Z-axis direction, the first laminate and the second laminate are present; and a second region where, when observed in the Z-axis direction, the first laminate is present and the second laminate is not present.

[0017] A region obtained by equally dividing the first laminate in the Z-axis direction is defined as a positive region, a middle region, and a negative region.

[0018] The positive region, the middle region, and the negative region are arranged in this order toward the negative direction of the Z-axis.

[0019] The plurality of first conductor layers include one or more first conductor layers in the positive region and one or more first conductor layers in the middle region.

[0020] At least a part of each of the one or more first conductor layers in the positive region is located in the positive region.

[0021] The entirety of each of the one or more first conductor layers in the middle region is located in the middle region.

[0022] The thickness in the Z-axis direction of at least one of the one or more first conductor layers in the positive region is greater than the thickness in the Z-axis direction of the one or more first conductor layers in the middle region.

[0023] Effect of the utility model

[0024] In the multilayer substrate according to the present utility model, in a multilayer substrate in which a second laminate is fixed to a first laminate, short circuit occurrence is suppressed. Description of the drawings

[0025] Figure 1 It is a cross-sectional view of the multilayer substrate 10.

[0026] Figure 2 It is a top view of the multilayer substrate 10.

[0027] Figure 3 It is a top view of the multilayer substrate 10a.

[0028] Figure 4 It is a top view of the multilayer substrate 10b.

[0029] Figure 5 It is a top view of the multilayer substrate 10c.

[0030] Figure 6 It is a top view of the multilayer substrate 10d.

[0031] Figure 7 It is a cross-sectional view of the multilayer substrate 10e.

[0032] Figure 8It is a cross-sectional view of the multi-layer substrate 10f.

[0033] Figure 9 It is a cross-sectional view of the multi-layer substrate 10g.

[0034] Figure 10 It is a cross-sectional view of the multi-layer substrate 10h.

[0035] Figure 11 It is a cross-sectional view of the multi-layer substrate 10i.

[0036] Figure 12 It is a cross-sectional view of the multi-layer substrate 10j.

[0037] Figure 13 It is a cross-sectional view of the multi-layer substrate 10k.

[0038] Figure 14 It is a cross-sectional view of the multi-layer substrate 10l.

[0039] Figure 15 It is a cross-sectional view of the multi-layer substrate 10m.

[0040] Figure 16 It is a top view of the multi-layer substrate 10m. Detailed implementation mode

[0041] (Implementation mode)

[0042] [Structure of multi-layer substrate]

[0043] Hereinafter, the structure of the multi-layer substrate 10 according to the embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a cross-sectional view of the multi-layer substrate 10. Figure 2 It is a top view of the multi-layer substrate 10.

[0044] In this specification, the directions are defined as follows. The direction in which the first insulator layers 16a to 16f are stacked is defined as the vertical direction. The vertical direction coincides with the Z-axis direction. The directions orthogonal to the vertical direction are defined as the left-right direction and the front-back direction. The left-right direction and the front-back direction are orthogonal. In addition, the vertical direction, the front-back direction, and the left-right direction in this embodiment may not coincide with the vertical direction, the front-back direction, and the left-right direction when the multi-layer substrate 10 is in use.

[0045] Hereinafter, X is a component or member of the multilayer substrate 10. In this specification, unless otherwise specified, each part of X is defined as follows. The front part of X means the first half part of X. The rear part of X means the second half part of X. The left part of X means the left half part of X. The right part of X means the right half part of X. The upper part of X means the upper half part of X. The lower part of X means the lower half part of X. The front end of X means the end in the front direction of X. The rear end of X means the end in the rear direction of X. The left end of X means the end in the left direction of X. The right end of X means the end in the right direction of X. The upper end of X means the end in the upper direction of X. The lower end of X means the end in the lower direction of X. The front end portion of X means the front end of X and its vicinity. The rear end portion of X means the rear end of X and its vicinity. The left end portion of X means the left end of X and its vicinity. The right end portion of X means the right end of X and its vicinity. The upper end portion of X means the upper end of X and its vicinity. The lower end portion of X means the lower end of X and its vicinity.

[0046] First, refer to Figure 1 and Figure 2 to describe the structure of the multilayer substrate 10. The multilayer substrate 10 is used for wireless communication terminals such as smart phones. As Figure 1 shown, the multilayer substrate 10 includes a first laminate 12a, a second laminate 12b, a protective layer 18, first conductor layers 20a to 20f, and second conductor layers 21a to 21e.

[0047] As Figure 2 shown, the first laminate 12a has a plate shape with an upper main surface and a lower main surface arranged in the vertical direction. As Figure 1 shown, the first laminate 12a has a structure in which first insulator layers 16a to 16f are laminated in the vertical direction (Z-axis direction). The first insulator layers 16a to 16f are arranged in order from top to bottom. Regarding the first insulator layers 16a to 16f, the adjacent first insulator layers in the vertical direction are fused to each other. The material of the first insulator layers 16a to 16f is, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer.

[0048] The first conductor layers 20a to 20f are provided in the first laminate 12a. The first conductor layers 20a to 20f are arranged in order from top to bottom. The first conductor layer 20a (the first conductor layer closest to the positive side) is located at the uppermost position (closest to the positive direction of the Z axis) among the conductor layers in the first laminate 12a. In the present embodiment, the first conductor layers 20a to 20f are each adhered to the lower main surface of the first insulator layers 16a to 16f. Therefore, each of the first conductor layers 20a to 20f has a first main surface S1 and a second main surface S2, and the second main surface S2 has a surface roughness greater than that of the first main surface S1. The surface roughness is, for example, an arithmetic surface roughness. In the present specification, the main surface having a large surface roughness is represented by a thick line. In the present embodiment, the first main surface S1 is located below the second main surface S2. The second main surfaces S2 of the first conductor layers 20a to 20f are respectively in contact with the lower main surfaces of the first insulator layers 16a to 16f. Thus, all of the first insulator layers 16a to 16f are in contact with the second main surface S2 of any one of the first conductor layers 20a to 20f. Each of the first conductor layers 20a to 20f is adhered to the first insulator layers 16a to 16f by an anchoring effect.

[0049] The first conductor layers 20a to 20f are connected by an interlayer connection conductor (not shown). Thus, the first conductor layers 20a to 20f form a circuit.

[0050] The first conductor layers 20a to 20f are formed by patterning a metal foil adhered to the lower main surfaces of the first insulator layers 16a to 16f. The metal foil is, for example, a copper foil.

[0051] The protective layer 18 serves to protect the first conductor layer 20f described later. The protective layer 18 covers the lower surface (the surface located in the negative direction of the Z axis) of the first laminate 12a. However, the protective layer 18 is not in contact with the second main surface S2 of the first conductor layers 20a to 20f. The material of the protective layer 18 is different from that of the first insulator layers 16a to 16f. In addition, the protective layer 18 is not included in the first laminate 12a.

[0052] As Figure 2 shown, the second laminate 12b has a plate shape having an upper main surface and a lower main surface arranged in the vertical direction. As Figure 1 shown, the second laminate 12b has a structure in which the second insulator layers 17a to 17e are laminated in the vertical direction (Z axis direction). The second insulator layers 17a to 17e are arranged in order from top to bottom. Regarding the second insulator layers 17a to 17e, the adjacent second insulator layers in the vertical direction are fused to each other. The material of the second insulator layers 17a to 17e is, for example, a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer.

[0053] The second laminate 12b is located on the first laminate 12a (in the positive direction of the Z axis). The second laminate 12b is fixed to the first laminate 12a by joining the first insulator layer 16a and the second insulator layer 17e. In the present embodiment, the first insulator layer 16a and the second insulator layer 17e are fused.

[0054] When viewed in the vertical direction, the second laminate 12b has an annular shape. In the present embodiment, when viewed in the vertical direction, the second laminate 12b has an outer edge and an inner edge having a rectangular shape. Moreover, when viewed in the vertical direction, the second laminate 12b overlaps a part of the first laminate 12a. Accordingly, there are a first region A1 and a second region A2. In the first region A1, when viewed in the vertical direction (Z-axis direction), the first laminate 12a and the second laminate 12b exist. In the second region A2, when viewed in the vertical direction (Z-axis direction), the first laminate 12a exists and the second laminate 12b does not exist. When viewed in the vertical direction, the second region A2 is surrounded by the first region A1. Accordingly, a cavity C is formed in the multilayer substrate 10.

[0055] The second conductor layers 21a to 21e are provided on the second laminate 12b. In the present embodiment, the second conductor layers 21a to 21e are each adhered to the lower main surface of the second insulator layers 17a to 17e. The second conductor layers 21a to 21e are electrically connected by an interlayer connection conductor (not shown). Accordingly, the second conductor layers 21a to 21e form, for example, one or more coils. In this case, the second conductor layers 21a to 21e in the first region A1 on the left side form one coil. The second conductor layers 21a to 21e in the first region A1 on the right side form one coil. In addition, the second conductor layers 21a to 21e are electrically connected to at least one of the first conductor layers 20a to 20f by an interlayer connection conductor (not shown).

[0056] The second conductor layers 21a to 21e are formed by patterning a metal foil adhered to the lower main surface of the second insulator layers 17a to 17e. The metal foil is, for example, a copper foil.

[0057] In addition, the regions obtained by equally dividing the first laminate 12a into three in the vertical direction (Z-axis direction) are defined as a positive region A11, an intermediate region A12, and a negative region A13. The positive region A11, the intermediate region A12, and the negative region A13 are arranged in this order toward the lower direction (negative direction of the Z axis).

[0058] The first conductor layers 20a to 20f include one or more positive-region first conductor layers, one or more intermediate-region first conductor layers, and one or more negative-region first conductor layers. In the present embodiment, the one or more positive-region first conductor layers are the first conductor layers 20a and 20b. The one or more intermediate-region first conductor layers are the first conductor layer 20c. The one or more negative-region first conductor layers are the first conductor layers 20d to 20f.

[0059] At least a part of each of the first conductor layers 20a and 20b (the one or more positive-region first conductor layers) is located in the positive region A11. In the present embodiment, the entirety of the first conductor layer 20a is located in the positive region A11. A part of the first conductor layer 20b is located in the positive region A11. Further, at least one of the first conductor layers 20a and 20b (the one or more positive-region first conductor layers) overlaps with the boundary B between the first region A1 and the second region A2 when viewed in the vertical direction (Z-axis direction). In the present embodiment, the first conductor layers 20a and 20b overlap with the boundary B between the first region A1 and the second region A2 when viewed in the vertical direction.

[0060] The entirety of the first conductor layer 20c (the intermediate-region first conductor layer) is located in the intermediate region A12.

[0061] At least a part of each of the first conductor layers 20d to 20f (the one or more negative-region first conductor layers) is located in the negative region A13. In the present embodiment, the entirety of the first conductor layer 20e is located in the negative region A13. A part of the first conductor layers 20d and 20f is located in the negative region A13.

[0062] The thickness of the first conductor layers 20a (the most positive-side first conductor layer, the one or more positive-region first conductor layers) and 20b (the one or more positive-region first conductor layers) in the vertical direction (Z-axis direction) is greater than the thickness of the first conductor layer 20c (the one or more intermediate-region first conductor layers) in the vertical direction (Z-axis direction). In the present specification, the thickness of a conductor layer in the vertical direction means the thickness in the normal direction of the main surface of the conductor layer. Therefore, when the conductor layer is bent, the vertical direction deviates from the vertical direction in the drawings. The thickness of the first conductor layers 20d to 20f in the vertical direction is the same as the thickness of the first conductor layer 20c in the vertical direction. Further, in the present specification, the statement that the thickness of the first conductor layers 20a and 20b in the vertical direction is greater than the thickness of the first conductor layer 20c in the vertical direction does not include the case where the thickness of the first conductor layers 20a and 20b in the vertical direction becomes greater than the thickness of the first conductor layer 20c in the vertical direction due to manufacturing errors. The manufacturing error is, for example, 10% of the thickness of the first conductor layer 20c in the vertical direction.

[0063] [Effect]

[0064] In the multilayer substrate 10, in which the second laminate 12b is fixed to the first laminate 12a, a short circuit can be suppressed. More specifically, the thickness in the vertical direction of the portion provided with the cavity C in the multilayer substrate 10 is smaller than the thickness in the vertical direction of the portion not provided with the cavity C in the multilayer substrate 10. Therefore, the strength of the portion provided with the cavity C in the multilayer substrate 10 is liable to become low.

[0065] Therefore, at least a part of each of the first conductor layers 20a and 20b is located in the positive region A11. Moreover, the thickness in the vertical direction of the first conductor layers 20a and 20b is larger than the thickness in the vertical direction of the first conductor layer 20c. As a result, the first conductor layers 20a and 20b having high strength are located near the upper main surface of the first laminate 12a. That is, the first conductor layers 20a and 20b having high strength come to be located near the bottom surface of the cavity C. As a result, in the thermal compression bonding process or the like of the first laminate 12a and the second laminate 12b, the vicinity of the bottom surface of the cavity C is less likely to be deformed, and thus the cavity C is less likely to be deformed. Accordingly, a short circuit between the first conductor layers 20a to 20f provided near the cavity C can be suppressed.

[0066] In the multilayer substrate 10, in the thermal compression bonding process of the first laminate 12a and the second laminate 12b, a large deformation of the multilayer substrate 10 can be suppressed. More specifically, in the thermal compression bonding process of the first laminate 12a and the second laminate 12b, a large force is concentrated at the boundary B between the first region A1 and the second region A2. Therefore, the multilayer substrate 10 is liable to be greatly deformed at the boundary B.

[0067] Therefore, the first conductor layers 20a and 20b overlap the boundary B between the first region A1 and the second region A2 when viewed in the vertical direction. The thickness in the vertical direction of the first conductor layers 20a and 20b is larger than the thickness in the vertical direction of the first conductor layer 20c, and thus the first conductor layers 20a and 20b have high strength. As a result, a large deformation of the multilayer substrate 10 at the boundary B can be suppressed.

[0068] (First modification example - Fourth modification example)

[0069] Hereinafter, the multilayer substrates 10a to 10d according to the first modification example to the fourth modification example will be described with reference to the drawings. Figures 3 to 6 It is a top view of the multilayer substrates 10a to 10d.

[0070] As Figure 3 shown, in the multilayer substrate 10a, when viewed in the vertical direction, the second laminate 12b has an angled U shape. As a result, when viewed in the vertical direction, a part of the first region A1 is located around the second region A2. The first region A1 is not located in front of the second region A2.

[0071] As Figure 4 shown, in the multi-layer substrate 10b, when observed in the vertical direction, the second laminate 12b has an L shape. Thus, when observed in the vertical direction, the first region A1 is located around a part of the second region A2. The first region A1 is not located in front of and to the right of the second region A2.

[0072] As Figure 5 shown, in the multi-layer substrate 10c, when observed in the vertical direction, the first region A1 and the second region A2 are arranged side by side in the left-right direction.

[0073] As Figure 6 shown, in the multi-layer substrate 10d, when observed in the vertical direction, there are two first regions A1a, A1b. When observed in the vertical direction, the second region A2 is located between the first region A1a and the first region A1b.

[0074] (Fifth modification example)

[0075] Hereinafter, the multi-layer substrate 10e according to the fifth modification example will be described with reference to the drawings. Figure 7 is a cross-sectional view of the multi-layer substrate 10e.

[0076] The difference between the multi-layer substrate 10e and the multi-layer substrate 10 is that the thickness of the first conductor layer 20a in the vertical direction is smaller than the thickness of the first conductor layer 20b in the vertical direction. The thickness of the first conductor layer 20a in the vertical direction is equal to the thickness of the first conductor layers 20c to 20f in the vertical direction. Other configurations of the multi-layer substrate 10e are the same as those of the multi-layer substrate 10. The multi-layer substrate 10e can achieve the same effects as the multi-layer substrate 10.

[0077] In addition, according to the multi-layer substrate 10e, among the first conductor layers 20a and 20b located in the positive region A11, the thickness of the lower first conductor layer 20b in the vertical direction is large. Thus, it becomes possible to suppress the deformation of the first laminate 12a in the intermediate region A12 and the negative region A13 of the first laminate 12a. In addition, since the deformation of the first laminate 12a can be suppressed near the first conductor layer 20b, short circuits are less likely to occur in the first conductor layer 20a located above the first conductor layer 20b.

[0078] (Sixth modification example)

[0079] Hereinafter, the multi-layer substrate 10f according to the sixth modification example will be described with reference to the drawings. Figure 8 is a cross-sectional view of the multi-layer substrate 10f.

[0080] The difference between the multilayer substrate 10f and the multilayer substrate 10e is that the thickness of the first conductor layer 20e in the vertical direction located in the negative region A13 is larger than the thickness of the first conductor layer 20c in the vertical direction located in the intermediate region A12. In this way, other structures of the multilayer substrate 10f are the same as those of the multilayer substrate 10e, so the description thereof is omitted. The multilayer substrate 10f can achieve the same effects as the multilayer substrate 10e.

[0081] In addition, according to the multilayer substrate 10f, the thickness of the first conductor layer 20e in the vertical direction located in the negative region A13 is large. As a result, deformation of the first stacked body 12a in the negative region A13 of the first stacked body 12a can be suppressed.

[0082] In the multilayer substrate 10f, the thickness of the first conductor layers 20b and 20e in the vertical direction is larger than the thickness of the first conductor layer 20c in the vertical direction. As a result, the first region A1 has an upper and lower symmetric structure, so warping is less likely to occur in the first stacked body 12a.

[0083] (The seventh modification example)

[0084] Hereinafter, the multilayer substrate 10g according to the seventh modification example will be described with reference to the drawings. Figure 9 It is a cross-sectional view of the multilayer substrate 10g.

[0085] The difference between the multilayer substrate 10g and the multilayer substrate 10f is that the thickness of the second conductor layers 21a and 21e at both ends in the vertical direction (Z-axis direction) of the second conductor layers 21a to 21e is larger than the thickness of the remaining second conductor layers 21b to 21d in the vertical direction (Z-axis direction). As a result, the second stacked body 12b is less likely to deform. Other structures of the multilayer substrate 10g are the same as those of the multilayer substrate 10f, so the description thereof is omitted. The multilayer substrate 10g can achieve the same effects as the multilayer substrate 10f.

[0086] In the multilayer substrate 10g, the thickness of the first conductor layers 20b and 20e in the vertical direction is larger than the thickness of the first conductor layer 20c in the vertical direction. As a result, the first region A1 has an upper and lower symmetric structure, so warping is less likely to occur in the first stacked body 12a.

[0087] (The eighth modification example)

[0088] Hereinafter, the multilayer substrate 10h according to the eighth modification example will be described with reference to the drawings. Figure 10 It is a cross-sectional view of the multilayer substrate 10h.

[0089] The difference between the multilayer substrate 10h and the multilayer substrate 10f is that the thicknesses in the vertical direction of the first conductor layers 20a and 20b located in the positive region A11 and the first conductor layers 20d to 20f located in the negative region A13 are larger than the thickness in the vertical direction of the first conductor layer 20c located in the intermediate region A12. Thus, the first laminate 12a becomes less likely to deform. Other configurations of the multilayer substrate 10h are the same as those of the multilayer substrate 10f, and thus the description thereof is omitted. The multilayer substrate 10h can achieve the same effects as the multilayer substrate 10f.

[0090] (The 9th modified example)

[0091] Hereinafter, the multilayer substrate 10i according to the 9th modified example will be described with reference to the drawings. Figure 11 It is a cross-sectional view of the multilayer substrate 10i.

[0092] The difference between the multilayer substrate 10i and the multilayer substrate 10 is that the thickness in the vertical direction of the first conductor layer 20a is larger than the thicknesses in the vertical direction of the first conductor layers 20b to 20f. Thus, the vicinity of the upper main surface of the first conductor layer 20a becomes less likely to deform. As a result, deformation of the cavity C can be effectively suppressed. Other configurations of the multilayer substrate 10i are the same as those of the multilayer substrate 10, and thus the description thereof is omitted. The multilayer substrate 10i can achieve the same effects as the multilayer substrate 10.

[0093] (The 10th modified example)

[0094] Hereinafter, the multilayer substrate 10j according to the 10th modified example will be described with reference to the drawings. Figure 12 It is a cross-sectional view of the multilayer substrate 10j.

[0095] The difference between the multilayer substrate 10j and the multilayer substrate 10 is that it further includes a third laminate 12c. The third laminate 12c has the same configuration as the second laminate 12b. The third laminate 12c is located below (in the negative Z direction) the first laminate 12a. By bonding the first insulator layer 16f and the third insulator layer 19a, the third laminate 12c is fixed to the first laminate 12a. In the present embodiment, the first insulator layer 16f and the third insulator layer 19a are fused. Other configurations of the multilayer substrate 10j are the same as those of the multilayer substrate 10, and thus the description thereof is omitted. The multilayer substrate 10j can achieve the same effects as the multilayer substrate 10.

[0096] (The 11th modified example)

[0097] Hereinafter, the multilayer substrate 10k according to the 11th modified example will be described with reference to the drawings. Figure 13 It is a cross-sectional view of the multilayer substrate 10k.

[0098] The multilayer substrate 10k differs from the multilayer substrate 10 in the following aspects.

[0099] · The first conductor layer 20a is located on the upper main surface (the main surface in the positive Z-axis direction) of the first insulating layer 16a, which is the uppermost (closest to the positive direction of the Z-axis) among the first insulating layers 16a to 16f.

[0100] · The first conductor layer 20f is located on the lower main surface (the main surface in the negative Z-axis direction) of the first insulating layer 16f, which is the lowermost (closest to the negative direction of the Z-axis) among the first insulating layers 16a to 16f.

[0101] More specifically, the first conductor layer 20a is bonded to the upper main surface of the first insulating layer 16a. The first conductor layer 20f is bonded to the lower main surface of the first insulating layer 16f. Moreover, a protective layer 18a is laminated above the first insulating layer 16a. A protective layer 18b is laminated below the first insulating layer 16f. However, no conductor layer is provided on the upper main surface of the protective layer 18a and the lower main surface of the protective layer 18b. Other structures of the multi-layer substrate 10k are the same as those of the multi-layer substrate 10. The multi-layer substrate 10k can achieve the same effects as the multi-layer substrate 10.

[0102] (The 12th modification example)

[0103] Hereinafter, the multi-layer substrate 10l according to the 12th modification example will be described with reference to the drawings. Figure 14 is a cross-sectional view of the multi-layer substrate 10l.

[0104] The difference between the multi-layer substrate 10l and the multi-layer substrate 10 is that the thickness T1 in the vertical direction of the portion of the first insulating layer 16a (the first insulating layer closest to the positive side) that is in contact with the first conductor layer 20a (the first conductor layer adjacent to the negative side) is smaller than the thickness in the vertical direction of the first conductor layer 20a.

[0105] More specifically, the first insulating layer 16a is the uppermost among the insulating layers in the first laminate 12a. That is, the first insulating layer 16a is joined to the second insulating layer 17e of the second laminate 12b to form the bottom surface of the cavity C. The first conductor layer 20a is in contact with the lower main surface of the first insulating layer 16a and is located directly below the first insulating layer 16a. The first insulating layers 16a and 16b are provided such that the thickness T1 in the vertical direction of the portion of the first insulating layer 16a that is in contact with the first conductor layer 20a is smaller than the thickness in the vertical direction of the first conductor layer 20a. As a result, the rigidity near the bottom surface of the cavity C is increased. As a result, when stress is applied to the multi-layer substrate 10l, during the thermocompression bonding of the first laminate 12a and the second laminate 12b, etc., the effect of suppressing the deformation of the cavity C is improved. Other structures of the multi-layer substrate 10l are the same as those of the multi-layer substrate 10, so the description thereof is omitted. The multi-layer substrate 10l can achieve the same effects as the multi-layer substrate 10.

[0106] (13th Modified Example)

[0107] Hereinafter, the multi-layer substrate 10m according to the 13th modified example will be described with reference to the accompanying drawings. Figure 15 It is a cross-sectional view of the multi-layer substrate 10m. Figure 16 It is a top view of the multi-layer substrate 10m.

[0108] The multi-layer substrate 10m is mainly different from the multi-layer substrate 10 in the following aspects.

[0109] · The thickness of the first laminate 12a in the vertical direction is smaller than the thickness of the second laminate 12b in the vertical direction.

[0110] · When observed in the vertical direction, the second region A2 surrounds the first region A1.

[0111] More specifically, the first laminate 12a includes first insulator layers 16a to 16d laminated in the vertical direction and first conductor layers 20a to 20d bonded to the lower main surfaces of the first insulator layers 16a to 16d. The second laminate 12b includes second insulator layers 17a to 17f laminated in the vertical direction and second conductor layers 21a to 21f bonded to the lower main surfaces of the second insulator layers 17a to 17f. With such a structure, the thickness of the first laminate 12a in the vertical direction is smaller than the thickness of the second laminate 12b in the vertical direction. As Figure 16 shown, when observed in the vertical direction, the first laminate 12a surrounds the second laminate 12b. Thus, when observed in the vertical direction, the second region A2 surrounds the first region A1. In the multi-layer substrate 10m, since the thickness of the first laminate 12a in the vertical direction is smaller than the thickness of the second laminate 12b in the vertical direction, the flexibility of the second region A2 is improved. The other structures of the multi-layer substrate 10m are the same as those of the multi-layer substrate 10, so the description thereof is omitted. The multi-layer substrate 10m can achieve the same effects as the multi-layer substrate 10.

[0112] (Other Embodiments)

[0113] The multi-layer substrate according to the present utility model is not limited to the multi-layer substrates 10, 10a to 10m, and can be changed within the scope of its gist. In addition, the structures of the multi-layer substrates 10, 10a to 10m can be arbitrarily combined.

[0114] In addition, the number of the first conductor layers 20c (intermediate region first conductor layers) located in the intermediate region A12 can also be two or more. In this case, the whole of each of the two or more intermediate region first conductor layers is located in the intermediate region A12.

[0115] In addition, it is only necessary that the thickness in the vertical direction of at least one of the first conductor layers in the positive region is greater than the thickness in the vertical direction of one or more of the first conductor layers in the intermediate region. Therefore, the thickness in the vertical direction of one first conductor layer in the positive region may be greater than the thickness in the vertical direction of one or more of the first conductor layers in the intermediate region, or the thickness in the vertical direction of two or more first conductor layers in the positive region may be greater than the thickness in the vertical direction of one or more of the first conductor layers in the intermediate region.

[0116] In addition, the first insulator layers 16a to 16f may not be of a single material. For example, the first insulator layer 16b may be an adhesive layer that bonds the first insulator layer 16a and the first insulator layer 16c. In this case, the materials of the first insulator layers 16a and 16c are different from the material of the first insulator layer 16b.

[0117] In addition, the number of the first conductor layers in the positive region is not limited to two. The number of the first conductor layers in the positive region may also be one, or may be three or more.

[0118] In addition, the number of the first conductor layers in the negative region is not limited to three. The number of the first conductor layers in the negative region may also be one or two, or may be four or more.

[0119] For example, in the multilayer substrate 10, the thicknesses in the vertical direction of the first insulator layers 16a to 16f and the thicknesses in the vertical direction of the second insulator layers 17a to 17e are equal. In the multilayer substrate 10l, the thicknesses in the vertical direction of the first insulator layers 16a and 16b are different from each other, and are also different from the first insulator layers 16c to 16f and the second insulator layers 17a to 17e. Thus, the thicknesses in the vertical direction of the first insulator layers 16a to 16f and the thicknesses in the vertical direction of the second insulator layers 17a to 17f may be equal or may not be equal.

[0120] Openings exposing the conductor layers may be provided in the protective layers 18, 18a, and 18b for connection to other components.

[0121] The present utility model has the following structure. (1)

[0123] A multilayer substrate, comprising:

[0124] A first laminate having a structure in which a plurality of first insulator layers are laminated in the Z-axis direction;

[0125] A second laminate having a structure in which a plurality of second insulator layers are laminated in the Z-axis direction; and

[0126] A plurality of first conductor layers provided in the first laminate

[0127] The second laminate is located in the positive direction of the Z-axis of the first laminate.

[0128] By bonding the first insulator layer and the second insulator layer, the second laminate is fixed to the first laminate.

[0129] There are: a first region where the first laminate and the second laminate are present when observed in the Z-axis direction; and a second region where the first laminate is present and the second laminate is not present when observed in the Z-axis direction.

[0130] The regions obtained by equally dividing the first laminate into three parts in the Z-axis direction are defined as a positive region, an intermediate region, and a negative region.

[0131] The positive region, the intermediate region, and the negative region are arranged in this order toward the negative direction of the Z-axis.

[0132] The plurality of first conductor layers include one or more first conductor layers in the positive region and one or more first conductor layers in the intermediate region.

[0133] At least a part of each of the one or more first conductor layers in the positive region is located in the positive region.

[0134] The entirety of each of the one or more first conductor layers in the intermediate region is located in the intermediate region.

[0135] The thickness of at least one of the one or more first conductor layers in the positive region in the Z-axis direction is larger than the thickness of the one or more first conductor layers in the intermediate region in the Z-axis direction. (2)

[0137] The multilayer substrate according to (1), wherein

[0138] The plurality of first insulator layers include the first insulator layer closest to the positive side, and the first insulator layer closest to the positive side is located closest to the positive direction of the Z-axis among the insulator layers in the first laminate.

[0139] The plurality of first conductor layers include a first conductor layer adjacent to the negative side, and the first conductor layer adjacent to the negative side is in contact with the main surface of the first insulator layer closest to the positive side located in the negative direction of the Z-axis.

[0140] The thickness of the portion of the first insulator layer closest to the positive side that is in contact with the first conductor layer adjacent to the negative side in the Z-axis direction is smaller than the thickness of the first conductor layer adjacent to the negative side in the Z-axis direction. (3)

[0142] The multilayer substrate according to (1) or (2), wherein

[0143] the plurality of first conductor layers include a most positive-side first conductor layer, and the most positive-side first conductor layer is located in the most positive direction of the Z-axis among the conductor layers in the first laminate.

[0144] The thickness of the most positive-side first conductor layer in the Z-axis direction is larger than the thickness of the one or more intermediate-region first conductor layers in the Z-axis direction. (4)

[0146] The multilayer substrate according to any one of (1) to (3), wherein

[0147] each of the plurality of first conductor layers has a first main surface and a second main surface, and the second main surface has a surface roughness larger than that of the first main surface.

[0148] All of the plurality of first insulator layers are in contact with the second main surface of any one of the plurality of first conductor layers. (5)

[0150] The multilayer substrate according to any one of (1) to (4), wherein

[0151] a first conductor layer is provided on the main surface in the positive direction of the Z-axis of the first insulator layer located in the most positive direction of the Z-axis among the plurality of first insulator layers.

[0152] a first conductor layer is provided on the main surface in the negative direction of the Z-axis of the first insulator layer located in the most negative direction of the Z-axis among the plurality of first insulator layers. (6)

[0154] The multilayer substrate according to (4), wherein

[0155] the multilayer substrate further includes:

[0156] a protective layer that covers the surface of the first laminate in the negative direction of the Z-axis, and the protective layer is not in contact with the second main surface of the first conductor layer. (7)

[0158] The multilayer substrate according to any one of (1) to (6), wherein

[0159] the plurality of first conductor layers include one or more negative-region first conductor layers,

[0160] at least a part of each of the one or more negative-region first conductor layers is located in the negative region,

[0161] The thickness in the Z-axis direction of at least one of the one or more negative region first conductor layers is greater than the thickness in the Z-axis direction of the one or more intermediate region first conductor layers. (8)

[0163] The multilayer substrate according to any one of (1) to (7), wherein

[0164] At least one of the one or more positive region first conductor layers overlaps with the boundary between the first region and the second region when observed in the Z-axis direction. (9)

[0166] The multilayer substrate according to any one of (1) to (8), wherein

[0167] The multilayer substrate further includes:

[0168] A plurality of second conductor layers provided in the second laminate

[0169] The thickness in the Z-axis direction of the second conductor layers located at both ends in the Z-axis direction of the plurality of second conductor layers is greater than the thickness in the Z-axis direction of the remaining second conductor layers. (10)

[0171] The multilayer substrate according to any one of (1) to (9), wherein

[0172] The thickness in the Z-axis direction of the first laminate is smaller than the thickness in the Z-axis direction of the second laminate.

[0173] Explanation of reference numerals

[0174] 10, 10a to 10m: Multilayer substrate;

[0175] 12a: First laminate;

[0176] 12b: Second laminate;

[0177] 12c: Third laminate;

[0178] 16a to 16f: First insulator layer;

[0179] 17a to 17f: Second insulator layer;

[0180] 18, 18a, 18b: Protective layer;

[0181] 19a: Third insulator layer;

[0182] 20a to 20f: First conductor layer;

[0183] 21a~21f: Second conductor layer;

[0184] A1: First region;

[0185] A11: Positive region;

[0186] A12: Intermediate region;

[0187] A13: Negative region;

[0188] A2: Second region;

[0189] B: Boundary;

[0190] C: Cavity;

[0191] S1: First main surface;

[0192] S2: Second main surface.

Claims

1. A multilayer substrate, characterized in that, Comprising: A first laminate having a structure in which a plurality of first insulator layers are laminated in the Z-axis direction; A second laminate having a structure in which a plurality of second insulator layers are laminated in the Z-axis direction; And A plurality of first conductor layers provided in the first laminate, The second laminate is located in the positive direction of the Z-axis of the first laminate, By joining the first insulator layer and the second insulator layer, the second laminate is fixed to the first laminate, There exists: a first region where the first laminate and the second laminate exist when observed in the Z-axis direction; And a second region where the first laminate exists and the second laminate does not exist when observed in the Z-axis direction, The region obtained by equally dividing the first laminate into three in the Z-axis direction is set as a positive region, a middle region, and a negative region, The positive region, the middle region, and the negative region are arranged in order toward the negative direction of the Z-axis, The plurality of first conductor layers include one or more positive-region first conductor layers and one or more middle-region first conductor layers, At least a part of each of the one or more positive-region first conductor layers is located in the positive region, The entirety of each of the one or more middle-region first conductor layers is located in the middle region, The thickness of at least one of the one or more positive-region first conductor layers in the Z-axis direction is larger than the thickness of the one or more middle-region first conductor layers in the Z-axis direction.

2. The multi-layer substrate according to claim 1, wherein The plurality of first insulator layers include the most positive-side first insulator layer, and the most positive-side first insulator layer is located closest to the positive direction of the Z-axis among the insulator layers in the first laminate, The plurality of first conductor layers include a negative-side adjacent first conductor layer, and the negative-side adjacent first conductor layer is in contact with the main surface of the most positive-side first insulator layer located in the negative direction of the Z-axis, The thickness of the portion of the most positive-side first insulator layer in contact with the negative-side adjacent first conductor layer in the Z-axis direction is smaller than the thickness of the negative-side adjacent first conductor layer in the Z-axis direction.

3. The multi-layer substrate according to claim 1 or claim 2, wherein The plurality of first conductor layers include the most positive-side first conductor layer, and the most positive-side first conductor layer is located closest to the positive direction of the Z-axis among the conductor layers in the first laminate, The thickness of the most positive-side first conductor layer in the Z-axis direction is larger than the thickness of the one or more middle-region first conductor layers in the Z-axis direction.

4. The multi-layer substrate according to claim 1 or claim 2, wherein Each of the plurality of first conductor layers has a first main surface and a second main surface, and the second main surface has a larger surface roughness than the first main surface, All of the plurality of first insulator layers are in contact with the second main surface of any one of the plurality of first conductor layers.

5. The multi-layer substrate according to claim 1 or claim 2, wherein On the main surface of the first insulating layer among the plurality of first insulating layers that is closest to the positive direction of the Z-axis and is located in the positive direction of the Z-axis, the first conductor layer is provided. On the main surface of the first insulating layer among the plurality of first insulating layers that is closest to the negative direction of the Z-axis and is located in the negative direction of the Z-axis, the first conductor layer is provided.

6. The multi-layer substrate according to claim 4, wherein: The multi-layer substrate further includes: A protective layer that covers the surface of the first laminate located in the negative direction of the Z-axis. The protective layer does not contact the second main surface of the first conductor layer.

7. The multi-layer substrate according to claim 1 or claim 2, wherein: The plurality of first conductor layers include one or more first conductor layers in the negative region. At least a part of each of the one or more first conductor layers in the negative region is located in the negative region. The thickness of at least one of the one or more first conductor layers in the negative region in the Z-axis direction is greater than the thickness of the one or more first conductor layers in the intermediate region in the Z-axis direction.

8. The multi-layer substrate according to claim 1 or claim 2, wherein: At least one of the one or more first conductor layers in the positive region overlaps with the boundary between the first region and the second region when observed in the Z-axis direction.

9. The multi-layer substrate according to claim 1 or claim 2, wherein: The multi-layer substrate further includes: A plurality of second conductor layers provided in the second laminate. The thickness of the second conductor layers at both ends in the Z-axis direction among the plurality of second conductor layers is greater than the thickness of the remaining second conductor layers in the Z-axis direction.

10. The multi-layer substrate according to claim 1 or claim 2, wherein: The thickness of the first laminate in the Z-axis direction is smaller than the thickness of the second laminate in the Z-axis direction.

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