PCBA circuit board with heat dissipation structure

Abstract

The utility model relates to the technical field of heat dissipation of PCBA circuit boards, and discloses a PCBA circuit board with a heat dissipation structure, which comprises a shell, two first connectors are arranged on the front side of the shell, two second connectors are arranged on the front side of the shell, a board body is fixedly connected inside the shell, a heat dissipation assembly is arranged on the periphery of the board body, and the heat dissipation assembly is fixedly connected with the board body. The heat dissipation assembly is used for prolonging the service life of equipment and improving the performance, a fan is fixedly connected to one side of the plate body, a plurality of evenly-distributed ventilation openings are formed in the shell, and filter plates are slidably connected to the left side and the right side of the interior of the shell. According to the utility model, the fixing of the filter plate can be removed by pushing the push rod, so that the filter plate is convenient to clean, the ventilation and heat dissipation effects are prevented from being influenced by blockage, and the PCBA circuit board can be protected from being influenced by the environment and the heat dissipation performance can be improved by arranging the heat dissipation film and the hot-dip coating on the periphery of the plate body, so that the service life of equipment is prolonged and the performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of PCBA circuit boards, in particular to a PCBA circuit board with a heat dissipation structure. Background Art

[0002] PCBA circuit boards are used to realize electronic control and processing functions. When PCBA circuit boards work, they will generate heat. If these heats cannot be effectively dissipated, it will cause the temperature of components to rise, thereby affecting their stability and service life, resulting in circuit instability and failures.

[0003] The PCBA circuit board with a heat dissipation structure includes a heat sink. The heat sink helps to conduct heat to the surrounding air more quickly by increasing the surface area. The PCBA circuit board with a heat dissipation structure includes a fan. The fan can increase air flow and accelerate the heat dissipation effect by forcing the air to circulate.

[0004] In order to prevent dust from falling on the surface of the circuit board and causing damage to the circuit board, a dust-proof board can be added to the existing PCBA circuit board. The existing dust-proof board is not easy to disassemble, resulting in inconvenient cleaning. The blockage of the dust-proof board will affect the ventilation and heat dissipation effect of the circuit board. Therefore, a PCBA circuit board with a heat dissipation structure is proposed to solve the above problems. Summary of the Utility Model

[0005] In order to make up for the above deficiencies, the utility model provides a PCBA circuit board with a heat dissipation structure, aiming to improve the problem that the dust-proof board in the existing technology is not easy to disassemble and clean, resulting in blockage and affecting the ventilation effect.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A PCBA circuit board with a heat dissipation structure includes a housing. There are two connectors I arranged on the front side of the housing, and two connectors II arranged on the front side of the housing. A board body is fixedly connected inside the housing. A heat dissipation component is arranged on the periphery of the board body. The heat dissipation component is used to extend the service life of the device and improve the performance. A fan is fixedly connected to one side of the board body. A plurality of uniformly distributed ventilation openings are opened inside the housing. Filter plates are slidably connected to both the left and right sides inside the housing. A handle is fixedly connected to the front side of the filter plate. Push rods are slidably connected to both the left and right sides at the rear of the housing. A fixing rod I is slidably connected to the front side of the push rod. A limiting block I is fixedly connected to the front side of the fixing rod I. Two fixing rods II are fixedly connected to the rear side inside the filter plate. The end of the fixing rod II away from the filter plate is slidably connected to a limiting block II. A spring I is fixedly connected to the side of the limiting block II away from the fixing rod I. The end of the spring I away from the limiting block II is fixedly connected inside the filter plate. The spring I is sleeved on the periphery of the fixing rod II.

[0008] As a further description of the above technical solution:

[0009] The heat dissipation component includes a heat dissipation film, the heat dissipation film is arranged on the outer periphery of the plate body, and a heat dipping coating is arranged on the outer periphery of the heat dissipation film;

[0010] As a further description of the above technical solution:

[0011] The material of the heat dissipation film is aluminum oxide, and the material of the heat dipping coating is epoxy resin;

[0012] As a further description of the above technical solution:

[0013] The front side of the push rod is slidably connected inside the filter plate, and the front side of the second limiting block abuts against the rear side of the first limiting block;

[0014] As a further description of the above technical solution:

[0015] One end of the second fixing rod is fixedly connected with a first limiting plate, and the outer periphery of the first limiting plate is slidably connected inside the second limiting block;

[0016] As a further description of the above technical solution:

[0017] The outer periphery of the first fixing rod is fixedly connected with a second limiting plate, and the outer periphery of the second limiting plate is slidably connected inside the push rod;

[0018] As a further description of the above technical solution:

[0019] One side of the second limiting plate away from the first limiting block is fixedly connected with a second spring, one end of the second spring away from the second limiting plate is fixedly connected inside the push rod, and the second spring is sleeved on the outer periphery of the first fixing rod;

[0020] As a further description of the above technical solution:

[0021] The material of the outer shell is aluminum alloy.

[0022] The utility model has the following beneficial effects:

[0023] 1. In the present utility model, by pushing the push rod, the second limiting block can be driven to move. By moving the second limiting block, the fixation of the filter plate can be released. After the fixation of the filter plate is released, the filter plate can be pulled out by pulling the handle. After the filter plate is pulled out, it can be cleaned to prevent blockage from affecting its ventilation and heat dissipation effect. After the push rod is released, the push rod can be driven to reset by the elastic force of the second spring. After the push rod is reset, the second limiting block can be driven to reset by the elastic force of the first spring. After the second limiting block is reset, it can cooperate with the first limiting block to fix the filter plate. By installing the filter plate, external dust can be prevented from falling on the circuit board and causing short circuits of electronic components.

[0024] 2. In the present utility model, by setting a heat dissipation film on the outer periphery of the board body, the heat conduction performance can be improved, so as to more effectively transfer heat from the electronic components to the heat dissipation structure. By setting a hot dip coating on the outer periphery of the heat dissipation film, not only can the PCBA circuit board be protected from the environment, but also the heat dissipation performance can be improved, thereby extending the equipment life and improving the performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a three-dimensional schematic diagram of a PCBA circuit board with a heat dissipation structure proposed by the present utility model;

[0026] Figure 2 is a structural schematic diagram of the housing of a PCBA circuit board with a heat dissipation structure proposed by the present utility model;

[0027] Figure 3 is a structural schematic diagram of the filter plate of a PCBA circuit board with a heat dissipation structure proposed by the present utility model;

[0028] Figure 4 is a structural schematic diagram of the second limiting block of a PCBA circuit board with a heat dissipation structure proposed by the present utility model;

[0029] Figure 5 is a structural schematic diagram of the push rod of a PCBA circuit board with a heat dissipation structure proposed by the present utility model;

[0030] Figure 6 is a structural schematic diagram of the board body of a PCBA circuit board with a heat dissipation structure proposed by the present utility model.

[0031] LEGEND DESCRIPTION:

[0032] 1. Housing; 2. First connector; 3. Second connector; 4. Board body; 5. Fan; 6. Ventilation opening; 7. Filter plate; 8. Handle; 9. Push rod; 10. First fixing rod; 11. First limiting block; 12. Second limiting block; 13. Second fixing rod; 14. First spring; 15. Heat dissipation film; 16. Hot dip coating; 17. First limiting plate; 18. Second limiting plate; 19. Second spring. Detailed implementation manners

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0034] Refer to Figure 1 - Figure 3 An embodiment provided by the present utility model: A PCBA circuit board with a heat dissipation structure includes a housing 1. There are two connectors one 2 provided on the front side of the housing 1, and two connectors two 3 provided on the front side of the housing 1. A board body 4 is fixedly connected inside the housing 1. A fan 5 is fixedly connected to one side of the board body 4. A plurality of uniformly distributed ventilation openings 6 are opened inside the housing 1. Filter plates 7 are slidably connected to both the left and right sides inside the housing 1. A handle 8 is fixedly connected to the front side of the filter plate 7. Push rods 9 are slidably connected to both the left and right sides at the rear of the housing 1. A fixing rod one 10 is slidably connected to the front side of the push rod 9. A limiting block one 11 is fixedly connected to the front side of the fixing rod one 10. Two fixing rods two 13 are fixedly connected to the rear side inside the filter plate 7. The end of the fixing rod two 13 away from the filter plate 7 is slidably connected to a limiting block two 12. A spring one 14 is fixedly connected to the side of the limiting block two 12 away from the fixing rod one 10. The end of the spring one 14 away from the limiting block two 12 is fixedly connected inside the filter plate 7. The spring one 14 is sleeved on the outer periphery of the fixing rod two 13. The housing 1 is used to protect the circuit board. The connector one 2 is used to connect the board body 4. The connector two 3 is used to connect the board body 4. The board body 4 is used to realize the functions of electronic control and processing. The fan 5 is used to dissipate heat from the board body 4. The ventilation openings 6 are used for air circulation. The filter plate 7 functions to prevent external dust from falling on the circuit board. The handle 8 is used to pull the filter plate 7 to move. The push rod 9 is used to fix the fixing rod one 10. The fixing rod one 10 is used to fix the limiting block one 11. The limiting block one 11 is used to fix the filter plate 7. The limiting block two 12 is used to fix the filter plate 7. The fixing rod two 13 is used to fix the limiting block two 12. The spring one 14 can drive the limiting block two 12 to reset by its elastic force.

[0035] Refer to Figure 1 、 Figure 2 and Figure 5, a heat dissipation component is provided on the outer periphery of the board body 4. The heat dissipation component is used to extend the service life of the device and improve its performance. The heat dissipation component includes a heat dissipation film 15, which is provided on the outer periphery of the board body 4, and a heat dipping coating 16 is provided on the outer periphery of the heat dissipation film 15. The heat dissipation film 15 can improve the heat conduction performance to more effectively transfer heat from the electronic components to the heat dissipation structure. The heat dipping coating 16 can not only protect the PCBA circuit board from the environment, but also improve the heat dissipation performance, thereby extending the service life of the device and improving its performance.

[0036] Refer to Figure 3 - Figure 5 , the material of the heat dissipation film 15 is aluminum oxide, and the material of the heat dipping coating 16 is epoxy resin. The front side of the push rod 9 is slidably connected inside the filter plate 7. The front side of the second limiting block 12 abuts against the rear side of the first limiting block 11. One end of the second fixing rod 13 is fixedly connected to the first limiting plate 17. The outer periphery of the first limiting plate 17 is slidably connected inside the second limiting block 12. The outer periphery of the first fixing rod 10 is fixedly connected to the second limiting plate 18. The outer periphery of the second limiting plate 18 is slidably connected inside the push rod 9. One side of the second limiting plate 18 away from the first limiting block 11 is fixedly connected to the second spring 19. One end of the second spring 19 away from the second limiting plate 18 is fixedly connected inside the push rod 9. The second spring 19 is sleeved on the outer periphery of the first fixing rod 10. The material of the housing 1 is aluminum alloy. Using aluminum oxide material for the heat dissipation film 15 can form a good heat conduction path between the PCB components and the radiator. Using epoxy resin material for the heat dipping coating 16 can provide strong mechanical protection and chemical resistance. The first limiting plate 17 serves to prevent the second fixing rod 13 from falling off inside the second limiting block 12. The second limiting plate 18 serves to prevent the first fixing rod 10 from falling off inside the push rod 9. The second spring 19 can drive the push rod 9 to reset through its elastic force. Using aluminum alloy material for the housing 1 can provide high mechanical strength and seismic resistance.

[0037] Working principle: The transmission line can be connected to the board body 4 through connector 1 2 and connector 2 3. The circuit board can be cooled by the fan 5. The air flow can be promoted by opening symmetrical ventilation openings 6 inside the housing 1. By pushing the push rod 9, the second limiting block 12 can be driven to move. The second limiting block 12 can release the fixation of the filter plate 7 by moving. After releasing the fixation of the filter plate 7, the filter plate 7 can be pulled out by pulling the handle 8. After the filter plate 7 is pulled out, it can be cleaned to prevent blockage from affecting its ventilation and heat dissipation effect. After the push rod 9 is released, the push rod 9 can be driven to reset by the elastic force of the second spring 19. After the push rod 9 is reset, the second limiting block 12 can be driven to reset by the elastic force of the first spring 14. After the second limiting block 12 is reset, the filter plate 7 can be fixed by cooperating with the first limiting block 11. By installing the filter plate 7, external dust can be prevented from falling on the circuit board and causing short circuits of electronic components. By setting a heat dissipation film 15 on the outer periphery of the board body 4, the heat conduction performance can be improved, so as to more effectively transfer heat from the electronic components to the heat dissipation structure. By setting a hot dip coating 16 on the outer periphery of the heat dissipation film 15, not only can the PCBA circuit board be protected from environmental influences, but also the heat dissipation performance can be improved, thereby extending the equipment life and improving the performance.

[0038] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PCBA circuit board with a heat dissipation structure, comprising a housing (1), characterized in that: On the front side of the housing (1), there are two first connectors (2). On the front side of the housing (1), there are two second connectors (3). Inside the housing (1), there is a plate body (4) fixedly connected. A heat dissipation component is arranged on the outer periphery of the plate body (4). The heat dissipation component is used to extend the service life of the device and improve the performance. On one side of the plate body (4), a fan (5) is fixedly connected. Inside the housing (1), there are a plurality of uniformly distributed ventilation openings (6). On the left and right sides inside the housing (1), there are filter plates (7) slidably connected. On the front side of the filter plate (7), there is a handle (8) fixedly connected. On the left and right sides of the rear part of the housing (1), there are push rods (9) slidably connected. On the front side of the push rod (9), there is a first fixing rod (10) slidably connected. On the front side of the first fixing rod (10), there is a first limiting block (11) fixedly connected. On the rear side inside the filter plate (7), there are two second fixing rods (13) fixedly connected. One end of the second fixing rod (13) away from the filter plate (7) is slidably connected with a second limiting block (12). On the side of the second limiting block (12) away from the first fixing rod (10), there is a first spring (14) fixedly connected. One end of the first spring (14) away from the second limiting block (12) is fixedly connected inside the filter plate (7). The first spring (14) is sleeved on the outer periphery of the second fixing rod (13).

2. The PCBA circuit board with a heat dissipation structure according to claim 1, wherein: The heat dissipation component includes a heat dissipation film (15). The heat dissipation film (15) is arranged on the outer periphery of the plate body (4). On the outer periphery of the heat dissipation film (15), there is a heat dipping coating (16).

3. The PCBA circuit board with a heat dissipation structure according to claim 2, characterized in that: The material of the heat dissipation film (15) is aluminum oxide. The material of the heat dipping coating (16) is epoxy resin.

4. A PCBA circuit board with a heat dissipation structure according to claim 1, characterized in that: The front side of the push rod (9) is slidably connected inside the filter plate (7). The front side of the second limiting block (12) abuts against the rear side of the first limiting block (11).

5. A PCBA circuit board with a heat dissipation structure according to claim 1, characterized in that: One end of the second fixing rod (13) is fixedly connected with a first limiting plate (17). The outer periphery of the first limiting plate (17) is slidably connected inside the second limiting block (12).

6. The PCBA circuit board with a heat dissipation structure according to claim 1, wherein: The outer periphery of the first fixing rod (10) is fixedly connected with a second limiting plate (18). The outer periphery of the second limiting plate (18) is slidably connected inside the push rod (9).

7. The PCBA circuit board with a heat dissipation structure according to claim 6, wherein: On the side of the second limiting plate (18) away from the first limiting block (11), there is a second spring (19) fixedly connected. One end of the second spring (19) away from the second limiting plate (18) is fixedly connected inside the push rod (9). The second spring (19) is sleeved on the outer periphery of the first fixing rod (10).

8. A PCBA circuit board with a heat dissipation structure according to claim 1, characterized in that: The material of the housing (1) is aluminum alloy.

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