Heat dissipation structure of heating device and electrical equipment

Abstract

The utility model discloses a heat dissipation structure of a heating device and electrical equipment, and relates to the technical field of equipment heat dissipation, the heat dissipation structure of the heating device comprises a heat-conducting medium arranged on the peripheral side of the heating device, one side of the heat-conducting medium is in surface contact with the heating device, and the other side of the heat-conducting medium extends in the direction away from the heating device and is in contact with a heat dissipation shell. The heat dissipation area of the heat dissipation shell is larger than the contact area of the heat-conducting medium and the heating device, and a heat transfer medium is arranged between the two contact faces of the heat-conducting medium and the heat dissipation shell. The heat dissipation structure can directly carry out targeted cooling on the high heating device, so that the temperature of the heating source in the cabinet body is reduced, and the overall heat dissipation effect of the cabinet body is obviously improved.

Description

Technical Field

[0001] This application relates to the technical field of equipment heat dissipation, and particularly relates to a heat dissipation structure for heat-generating devices and an electrical equipment. Background Art

[0002] There are often multiple devices with relatively high heat generation inside electrical boxes, electrical cabinets, etc. Due to their large self-power consumption or poor heat dissipation solutions, heat-generating devices have a great impact on the overall temperature rise of the box body. Existing conventional heat dissipation methods usually include natural cooling, air cooling, and liquid cooling; natural cooling relies on the box body itself to open holes for heat exchange with the ambient air; air cooling is to add an air-conditioning device to exchange air with the box body with holes for heat dissipation and temperature reduction; liquid cooling is to make a liquid cooling plate at the bottom of the conventional box body, and transfer heat through the circulation of the coolant to achieve heat dissipation and temperature reduction.

[0003] For the above three heat dissipation methods, although they have a certain heat dissipation effect on the entire box body, the heat dissipation effect on individual high-power devices is not obvious, resulting in the inability of the heat-generating device itself to dissipate heat and reduce temperature in a timely manner.

[0004] Therefore, in view of the above technical problems, how to perform heat transfer and heat dissipation treatment for high-heat-generating devices is a technical problem that needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this application is to provide a heat dissipation structure for heat-generating devices and an electrical equipment, which can directly perform targeted temperature reduction on high-heat-generating devices, reduce the temperature of the heat source in the box cabinet, and significantly improve the overall heat dissipation effect of the box cabinet.

[0006] To achieve the above purpose, this application provides a heat dissipation structure for heat-generating devices, including a heat-conducting medium arranged on the periphery of the heat-generating device. One side of the heat-conducting medium is in surface contact with the heat-generating device, and the other side extends away from the heat-generating device and is in contact with a heat dissipation housing. The heat dissipation area of the heat dissipation housing is larger than the contact area between the heat-conducting medium and the heat-generating device. A heat transfer medium is provided between the two contact surfaces of the heat-conducting medium and the heat dissipation housing.

[0007] Preferably, the heat-conducting medium is arranged on the outer wall of the side where the heat source of the heat-generating device is located and close to the heat-generating device.

[0008] Preferably, the heat-conducting medium is potting glue, and the potting glue is arranged between the heat-generating device and the heat dissipation housing.

[0009] Preferably, the heat transfer medium includes a coating surface, the coating surface is located between the heat-conducting medium and the heat dissipation housing, and the coating surface of the heat transfer medium at least covers the contact surface between the heat-conducting medium and the heat dissipation housing.

[0010] Preferably, the heat dissipation housing is made of a metal material with heat conduction performance, and the surface of the heat dissipation housing is in contact with the cooling component or the cooling environment generated by the cooling component.

[0011] Preferably, one side of the heat conduction medium in contact with the heat generating device includes:

[0012] A covering part that at least covers the side wall surface on the side where the heat source of the heat generating device is located and is in surface contact with the side wall surface;

[0013] A wrapping part that extends along the outer circumference of the covering part in the direction of wrapping the heat generating device to wrap or semi-wrap the outer wall of the heat generating device, and the wrapping part is in surface contact with the heat generating device.

[0014] Preferably, the heat generating device is fixedly arranged on the heat dissipation housing and is insulated from the heat dissipation housing.

[0015] Preferably, the wrapping parts are distributed circumferentially around the heat generating device.

[0016] An electrical device includes a heat dissipation housing and / or a box body provided with the heat dissipation housing. The box wall of the box body serves as the heat dissipation housing or the heat dissipation housing is arranged inside the box body. A heat dissipation structure connecting the two is provided at the corresponding position between the heat dissipation housing and the heat generating device, and the heat dissipation structure is the heat generating device heat dissipation structure described above.

[0017] Compared with the above background technology, in this application, the heat generated by the heat generating device itself is transferred to the heat dissipation housing through the heat conduction medium and the heat transfer medium. At the same time, the heat dissipation area of the heat dissipation housing is larger than the contact area between the heat conduction medium and the heat generating device. The heat dissipation housing spreads the heat of the heat generating device, and the large heat dissipation area of the heat dissipation housing can contact and exchange heat with the environment more fully, thereby improving the heat dissipation efficiency of the heat generating device, and further significantly improving the overall heat dissipation effect of the box cabinet. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.

[0019] Figure 1 It is a front view schematic diagram of the heat generating device heat dissipation structure provided by the embodiment of the present application;

[0020] Figure 2 It is a three-dimensional schematic diagram of the heat generating device heat dissipation structure provided by the embodiment of the present application;

[0021] Figure 3 is Figure 1 the sectional view taken along the A-A direction in

[0022] Figure 4 the schematic structural diagram of the heat-conducting medium provided by the embodiment of the present application.

[0023] In the figure: 1 - heating device; 2 - heat-conducting medium; 3 - heat dissipation housing; 4 - heat transfer medium; 21 - covering part; 22 - wrapping part. Specific Embodiments

[0024] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present application.

[0025] It should be noted that in this embodiment, the orientation or positional relationship indicated by "upper", "lower", "front", "rear", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, "first", "second", "third", "fourth" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0026] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0027] In the related art, the conventional heat dissipation methods of the cabinet body include:

[0028] Natural cooling, relying on the opening of the cabinet body itself to exchange heat with the ambient air for heat dissipation, is applicable to cabinets and cabinet bodies with low heat generation. For such cabinet bodies, the selection of the performance of their own devices is relatively limited, the applicable range is small, which does not conform to the existing mainstream energy storage solutions. If there are high-power devices, the temperature rise has a great impact;

[0029] Air cooling, adding an air-conditioning device to exchange air with the opened cabinet body for heat dissipation and temperature reduction. Attention needs to be paid to the air duct design. For the high-power heating device 1, due to structural limitations, the air circulation may be blocked, resulting in a situation where the local heat source is still in a high-temperature state. Moreover, when the temperature difference between the air-cooled air conditioner and the outside is large, condensation beads are likely to appear when opening and closing the door, and there is a risk of opening holes in the cabinet and cabinet body;

[0030] Liquid cooling solution: a liquid cooling plate is placed at the bottom of a conventional cabinet to transfer heat through the circulation of coolant to achieve heat dissipation and cooling. Compared with air cooling, this improves the problem of condensation beads entering the cabinet, but the cost is increased and the heat dissipation effect is not obvious for some high-power consumption devices.

[0031] Based on the above situation, this application proposes a heat dissipation structure of a heating device. For details, please refer to Figure 1 and Figure 2 The heat dissipation structure includes a heat-conducting medium 2 arranged on the peripheral side of the heating device 1, wherein the peripheral side refers to the periphery or side of the heating device 1, one side of the heat-conducting medium 2 contacts the peripheral side of the heating device 1, and the other side extends in a direction away from the heating device 1 until it contacts the heat dissipation housing 3. It should be pointed out that the contact between the heat-conducting medium 2 and the heat dissipation housing 3 is achieved through the heat transfer medium 4, that is, the heat transfer medium 4 is arranged between the two relative contact surfaces of the heat-conducting medium 2 and the heat dissipation housing 3, thereby the heat on the heating device 1 can be transferred through the heat-conducting medium 2, and the heat can be transferred to the heat dissipation housing 3 through the heat transfer medium 4.

[0032] On the one hand, the heat dissipation shell 3 can be in contact with the external environment, thereby achieving heat exchange with the external environment. For example, the heat dissipation shell 3 can be in contact with the cold air of the air conditioner or the heat dissipation shell 3 can be in contact with the liquid cooling plate, etc., so as to exchange the heat on the heat dissipation shell 3 with the external environment to achieve heat dissipation; on the other hand, the heat dissipation area of ​​the heat dissipation shell 3 is larger than the contact area between the heat-conducting medium 2 and the heating device 1, thereby increasing the heat dissipation area of ​​the heating device 1 relative to the external environment in disguised form. It can be seen from this that the heat dissipation shell 3 can be used as the main heat dissipation component of the heating device 1, and the heat exchange efficiency with the external environment is better. At the same time, the heat transfer can be distributed through the heat dissipation shell 3, thereby further improving the heat dissipation efficiency; the temperature of the heating device 1 in the corresponding cabinet body is reduced, and the corresponding internal temperature of the cabinet body will also be significantly improved, thereby ensuring the overall heat dissipation effect of the cabinet body.

[0033] In summary of the above embodiments, the present application transfers the heat generated by the heating device 1 itself to the heat dissipation shell 3 through the heat conductive medium 2 and the heat transfer medium 4. At the same time, the heat dissipation area of ​​the heat dissipation shell 3 is larger than the contact area between the heat conductive medium 2 and the heating device 1. The heat dissipation shell 3 is used to distribute the heat of the heating device 1. The large heat dissipation area of ​​the heat dissipation shell 3 can more fully contact and exchange heat with the environment, thereby improving the heat dissipation efficiency of the heating device 1, and further significantly improving the overall heat dissipation effect of the cabinet.

[0034] In order to transfer heat from the heat-generating device 1 to the heat-conducting medium 2 as much as possible, the heat-conducting medium 2 can be disposed on the outer wall of the side where the heat source of the heat-generating device 1 is located, or in other words, the heat-conducting medium 2 can be disposed on the outer wall of the side with the highest heat of the heat-generating device 1, so that most of the heat of the heat source can be transferred to the heat-conducting medium 2. Of course, if the heat source is located at the central position of the heat-generating device 1 and the heat of each outer wall of the heat-generating device 1 is roughly the same, then the heat-conducting medium 2 can be disposed on any one or more outer walls, and there is no further limitation here.

[0035] The heat-conducting medium 2 is a potting compound. The potting compound uses a heat-conducting material with a small thermal resistance. The potting compound has the advantages of insulation, cleanliness, isolation, and heat transfer. The liquid potting compound is loaded into a specific mold, and the potting compound is placed between the heat-generating device 1 and the heat-dissipating housing 3, and cured at normal temperature or under heating conditions, so as to form a solid potting compound in surface contact with the heat-generating device 1. It should be noted that during the curing process of the potting compound, it should be ensured as much as possible that there are no defects such as air bubbles on the contact surface between the potting compound and the heat-generating device 1, so as to improve the fitting degree between the potting compound and the heat-generating device 1, and further ensure the heat conduction efficiency between the heat-generating device 1 and the potting compound.

[0036] In addition, a certain gap is left between the heat-conducting medium 2 and the heat-dissipating housing 3 to facilitate the application of the heat-transfer medium 4. The heat-transfer medium 4 can be other heat-conducting materials such as thermal grease. The heat-transfer medium is applied in a uniform thin layer between the cured heat-conducting medium 2 and the heat-dissipating housing 3, so that the heat on the heat-conducting medium 2 can be evenly transferred to the heat-dissipating housing 3 through the heat-transfer medium 4. And the application surface of the heat-transfer medium 4 can at least cover the contact surface between the heat-conducting medium 2 and the heat-dissipating housing 3, so that the heat of the heat-conducting medium 2 can be completely transferred to the heat-dissipating housing 3, and there is no situation where local heat cannot be transferred to the heat-dissipating housing 3, providing a good heat dissipation foundation for the heat-generating device 1.

[0037] The heat-dissipating housing 3 is made of a metal material with good heat-conducting performance, such as the commonly used aluminum material, etc. At the same time, the surface of the heat-dissipating housing 3 can be in contact with the cooling component or the cooling environment generated by the cooling component, that is, the heat-dissipating housing 3 is in contact with the cold air of the air conditioner or the heat-dissipating housing 3 is in direct contact with the liquid cooling plate, etc.

[0038] Please refer to Figure 3 and Figure 4 , one side of the heat-conducting medium 2 in surface contact with the heat-generating device 1 includes a covering portion 21 and a wrapping portion 22. The covering portion 21 can at least cover the side wall surface of the side where the heat source of the heat-generating device 1 is located and is in surface contact with the side wall surface to ensure that the heat at this wall surface can be completely transferred to the heat-conducting medium 2. At the same time, considering that the heat generated by the heat-generating device 1 not only acts on the side wall surface close to the heat source, but also acts on other side wall surfaces, the wrapping portion 22 of the heat-conducting medium 2 can also be in contact with other side wall surfaces, so that the heat on the heat-generating device 1 can be fully transferred to the heat-conducting medium 2.

[0039] In some embodiments, the wrapping portion 22 can be circumferentially arranged along the outer edge of the covering portion 21 and can extend in the direction of wrapping the heating device 1, so as to wrap or semi-wrap the side wall of the heating device 1, and the wrapping portion 22 can also be in surface contact with the heating device 1.

[0040] In the related art, the heating device 1 can be a device with a heat source such as a fuse switch in a high-voltage box, and the heat dissipation mechanism can perform separate cooling treatment on the fuse switch; the heating device 1 can be fixedly arranged on the heat dissipation housing 3 and is insulated from the heat dissipation housing 3. A certain interval is left between the heating device 1 and the heat dissipation housing 3, and the heat conduction medium 2 and the heat transfer medium 4 can be arranged in this interval, so as to achieve the separate heat dissipation of the heating device 1.

[0041] The application scenarios of this heat dissipation structure include but are not limited to the heat dissipation methods of air cooling or liquid cooling for the cabinet body, and can perform targeted cooling and heat dissipation on the heat source. On the basis of the original heat dissipation scheme of the cabinet body, the heat dissipation effect can be significantly improved; and according to the different thermal resistance coefficients of the heat conduction medium 2 and the heat dissipation housing 3, the internal temperature of the cabinet body can be controlled within a reasonable temperature range.

[0042] This application also provides an electrical device. For example, the electrical device is an electrical box or an electrical cabinet. The electrical device includes the heat dissipation housing 3 and / or a box body provided with the heat dissipation housing 3, that is, the box wall of the cabinet body serves as the heat dissipation housing 3, or the heat dissipation housing 3 is arranged inside the box body. A heat dissipation structure connecting the two is provided at the corresponding position between the heat dissipation housing 3 and the heating device 1, and the heat dissipation structure is the above-mentioned heat dissipation structure for the heating device.

[0043] It should be noted that in this specification, relational terms such as first and second are only used to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0044] Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation structure for a heating device, characterized in that, It includes a heat-conducting medium (2) provided on the peripheral side of a heating device (1). One side of the heat-conducting medium (2) is in surface contact with the heating device (1), and the other side extends in a direction away from the heating device (1) and contacts a heat-dissipating housing (3). The heat-dissipating area of the heat-dissipating housing (3) is larger than the contact area between the heat-conducting medium (2) and the heating device (1). A heat-transfer medium (4) is provided between the two contact surfaces of the heat-conducting medium (2) and the heat-dissipating housing (3).

2. The heat dissipation structure of the heating device according to claim 1, wherein, The heat-conducting medium (2) is provided on the outer wall at the side where the heat source of the heating device (1) is located, close to the heating device (1).

3. The heat dissipation structure of the heating device according to claim 2, wherein The heat-conducting medium (2) is a potting adhesive, and the potting adhesive is provided between the heating device (1) and the heat-dissipating housing (3).

4. The heat dissipation structure of the heating device according to claim 3, wherein The heat-transfer medium (4) includes a coating surface, the coating surface is located between the heat-conducting medium (2) and the heat-dissipating housing (3), and the coating surface of the heat-transfer medium (4) at least covers the contact surface between the heat-conducting medium (2) and the heat-dissipating housing (3).

5. The heat dissipation structure of the heating device according to claim 2, wherein, The heat-dissipating housing (3) is made of a metal material with heat-conducting performance, and the surface of the heat-dissipating housing (3) is in contact with a cooling component or the cooling environment generated by the cooling component.

6. The heat dissipation structure of the heating device according to any one of claims 2-5, characterized in that, One side of the heat-conducting medium (2) in surface contact with the heating device (1) includes: A covering part (21) that at least covers the side wall surface on the side where the heat source of the heating device is located and is in surface contact with the side wall surface; A wrapping part (22) that extends along the outer periphery of the covering part (21) in a direction of wrapping the heating device (1) to wrap or semi-wrap the outer wall of the heating device (1), and the wrapping part (22) is in surface contact with the heating device (1).

7. The heat dissipation structure of the heating device according to claim 6, characterized in that, The heating device (1) is fixedly provided on the heat-dissipating housing (3) and is insulated from the heat-dissipating housing (3).

8. The heat dissipation structure of the heating device according to claim 6, characterized in that, The wrapping part (22) is distributed circumferentially along the heating device (1).

9. An electrical device, characterized in that, It includes a heat-dissipating housing (3) and / or a box body provided with the heat-dissipating housing (3). The box wall of the box body serves as the heat-dissipating housing (3) or the heat-dissipating housing (3) is provided inside the box body. A heat-dissipating structure connecting the two is provided at the corresponding position between the heat-dissipating housing (3) and the heating device (1), and the heat-dissipating structure is the heating device heat-dissipating structure according to any one of claims 1-8.

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