Electronic device

Abstract

The utility model relates to an electronic device. The electronic device includes: a display panel in which a central region and an edge region adjacent to the central region are defined; a functional layer disposed on a rear surface of the display panel and overlapping the central region; and a bank disposed on the rear surface of the display panel and overlapping the edge region. The functional layer includes a shock-absorbing material and a light-shielding material, and the bank includes a light-shielding material. A side surface of the functional layer is in contact with the bank.

Description

Technical Field

[0001] The present disclosure relates herein to an electronic device and a method for manufacturing an electronic device, the electronic device including a functional layer and a bank having a light-shielding property on a rear surface of a display panel. Background Art

[0002] Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles may include a display device for displaying images and electronic components for performing various functions. As electronic devices have higher performance and smaller thicknesses, the electronic components installed in the electronic devices have a larger capacity and become more highly integrated. Accordingly, the electronic components generate a large amount of heat inside the electronic device. The heat generated inside the electronic device may shorten the service life of the product or cause damage or malfunction of the electronic components and the display device. Summary of the Utility Model

[0003] The present disclosure provides an electronic device having improved reliability and a method for manufacturing the electronic device.

[0004] An embodiment of the present utility model provides an electronic device including a display panel defining a central region and an edge region adjacent to the central region in the display panel, including a functional layer having a shock-absorbing and light-shielding function disposed on a rear surface of the display panel and overlapping with the central region, and including a bank having a light-shielding function disposed on the rear surface of the display panel and overlapping with the edge region. And a side surface of the functional layer is in contact with the bank.

[0005] In an embodiment, a thickness of the functional layer may be uniform along a rear surface of the display panel.

[0006] In an embodiment, a thickness of the functional layer may be equal to or less than a height of the bank.

[0007] In an embodiment, the bank may include a plurality of sub-banks sequentially stacked with each other, and the plurality of sub-banks may include the same material as each other.

[0008] In an embodiment, the functional layer may include: a first functional layer disposed on a rear surface of the display panel; and a second functional layer disposed on the first functional layer.

[0009] In an embodiment, the first functional layer and the second functional layer may include the same material as each other.

[0010] In an embodiment, the edge region may include: a first edge region surrounding the central region; and a second edge region surrounded by the central region, and the bank may include: a first bank overlapping with the first edge region; and a second bank overlapping with the second edge region.

[0011] In an embodiment, the side surface of the functional layer may include: a first side surface in contact with the first dam; and a second side surface in contact with the second dam.

[0012] In an embodiment, the functional layer may be provided with a functional hole overlapping with the second edge region, wherein the functional hole may be defined by the second side surface.

[0013] In an embodiment, a plurality of functional holes are provided as the plurality of functional holes, and the display panel is provided with panel holes defined in the display panel to overlap with at least one functional hole selected from the plurality of functional holes.

[0014] In an embodiment, the size of the panel hole may be smaller than the size of at least one functional hole overlapping with the panel hole.

[0015] In an embodiment, the electronic device may further include: an electro-optical module overlapping with at least one functional hole overlapping with the panel hole.

[0016] In an embodiment, the electronic device may further include: a heat dissipation layer spaced apart from the rear surface of the display panel, and the heat dissipation layer is disposed below the functional layer and the dam.

[0017] In an embodiment, the heat dissipation layer may include a heat dissipation material and an electromagnetic shielding material.

[0018] In an embodiment of the present utility model, a method for manufacturing an electronic device includes: providing a display panel, defining a central region and an edge region adjacent to the central region in the display panel; forming a dam overlapping with the edge region on the rear surface of the display panel; and forming a functional layer overlapping with the central region on the rear surface of the display panel, wherein the dam is in contact with the side surface of the functional layer.

[0019] In an embodiment, the dam may include a plurality of sub-dams sequentially stacked on each other, and forming the dam may include: forming a first sub-dam among the plurality of sub-dams on the rear surface of the display panel; and forming a second sub-dam among the plurality of sub-dams on the first sub-dam.

[0020] In an embodiment, forming the functional layer may include: applying a first preliminary functional layer overlapping with the central region on the rear surface of the display panel; performing a first curing on the first preliminary functional layer to provide a first functional layer; applying a second preliminary functional layer on the first functional layer; and performing a second curing on the second preliminary functional layer to provide a second functional layer.

[0021] In an embodiment, the edge region may include: a first edge region surrounding the central region; and a second edge region surrounded by the central region. Forming the dam may include: forming a first dam overlapping with the first edge region; and forming a second dam overlapping with the second edge region.

[0022] In an embodiment, the display panel may be provided with a panel hole defined in the display panel to overlap with the electronic module, and the second bank may surround the panel hole.

[0023] In an embodiment, the method for manufacturing an electronic device may further include: forming an adhesive layer on the functional layer and the bank; and forming a heat dissipation layer on the adhesive layer. Description of the Drawings

[0024] The above and other features of the present utility model will become more apparent by describing embodiments of the present utility model in more detail with reference to the accompanying drawings, in which:

[0025] Figure 1 is a perspective view of an electronic device according to an embodiment of the present utility model;

[0026] Figure 2 is an exploded perspective view of an electronic device according to an embodiment of the present utility model;

[0027] Figure 3 is a block diagram of an electronic device according to an embodiment of the present utility model;

[0028] Figure 4A is a plan view of a display panel according to an embodiment of the present utility model;

[0029] Figure 4B is a cross-sectional view of a display panel and a functional layer according to an embodiment of the present utility model;

[0030] Figure 5 is a plan view of an electronic device according to an embodiment of the present utility model;

[0031] Figure 6A is along Figure 5 a cross-sectional view of a part of the electronic device taken along line I-I';

[0032] Figure 6B is along Figure 5 a cross-sectional view of a part of the electronic device taken along line II-II';

[0033] Figure 7A is a plan view of an electronic device according to an embodiment of the present utility model;

[0034] Figure 7B is along Figure 7A a cross-sectional view of a part of the electronic device taken along line Ⅲ-Ⅲ';

[0035] Figure 8 is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present utility model;

[0036] Figures 9A to 9Eis a cross-sectional view of some operations of a method for manufacturing an electronic device according to an embodiment of the present utility model; and

[0037] Figures 10A to 10C is a cross-sectional view of some operations of a method for manufacturing an electronic device according to an embodiment of the present utility model. Detailed implementation mode

[0038] The present utility model will now be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. However, the present utility model can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present utility model to those skilled in the art

[0039] In this specification, it will be understood that when an element (or region, layer, or part, etc.) is referred to as "on" another element, "connected to" or "coupled to" another element, the element can be directly disposed on the another element, directly connected to or directly coupled to the another element, or an intervening element can be disposed between the element and the another element.

[0040] Like reference numerals or symbols always denote like elements. In addition, in the drawings, the thickness, ratio, and dimensions of the elements are exaggerated for effective description of the technical content.

[0041] The terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, "a", "one (kind / er)", "the (said / this)", and "at least one (kind / er)" do not indicate a limitation on quantity and are intended to include both the singular and the plural. The reference to "a" element after the reference to "the" element in the claims includes one element and a plurality of elements. For example, "element" has the same meaning as "at least one element" unless the context clearly indicates otherwise. "At least one (kind / er)" should not be construed as limited to "one" or "one (kind / er)". "Or" means "and / or". As used herein, the term "and / or" includes any combination and all combinations of one or more of the related listed items. In addition, when the terms "comprises and / or comprising" or "includes and / or including" and their variants are used in this specification, it is stated that there are the stated features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their groups.

[0042] Although the terms first, second, etc. may be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element. Unless the context clearly indicates otherwise, the singular form also includes the plural form.

[0043] In addition, terms such as "below", "on the lower side", "above", or "on the upper side", etc. may be used to describe the relationship of elements shown in the drawings. These terms have relative concepts and are described based on the directions indicated in the drawings.

[0044] Taking into account the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), as used herein, "about" or "approximate" includes the stated value and means within an acceptable deviation range of the particular value determined by a person of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0045] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which this disclosure pertains. In addition, unless explicitly defined herein, terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their meaning in the context of the relevant field and should not be interpreted in an idealized or overly formal sense.

[0046] In this document, embodiments are described with reference to cross-sectional views that are schematic diagrams of idealized embodiments. As such, variations in the shape of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of the regions shown herein, but will include, for example, deviations in shape caused by manufacturing. For example, regions shown or described as flat will generally have rough and / or non-linear features. In addition, the sharp corners shown may be rounded. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the exact shape of the regions and are not intended to limit the scope of the claims.

[0047] Hereinafter, embodiments of the present utility model will be described with reference to the drawings.

[0048] Figure 1 is a perspective view of an electronic device ED according to an embodiment of the present utility model.

[0049] Refer to Figure 1, embodiments of the electronic device ED can be activated in response to an electrical signal and can display an image. In an embodiment, for example, the electronic device ED can be a small or medium-sized electronic device such as a monitor, a mobile phone, a tablet personal computer (PC), a car navigation system, or a gaming console, and a large device such as a television or an external billboard. However, the embodiments of the electronic device ED are examples and are not limited to any one embodiment without departing from the spirit of the present utility model. In an embodiment, as Figure 1 shown, the electronic device ED can be a mobile phone, but is not limited thereto.

[0050] In an embodiment, the electronic device ED can have a rectangular shape on a plane, the rectangular shape having a short side extending in a first direction DR1 and a long side extending in a second direction DR2 intersecting the first direction DR1. However, the embodiments of the present utility model are not limited thereto, and the electronic device ED can have various shapes (such as a circular shape or other polygonal shapes, etc.) on a plane.

[0051] In an embodiment, a third direction DR3 can be defined as a direction perpendicular to the plane defined by the first direction DR1 and the second direction DR2. The front surface (or top surface) and the rear surface (or bottom surface) of each component constituting the electronic device ED can face each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface can be substantially parallel to the third direction DR3. The distance defined along the third direction DR3 between the front surface and the rear surface can correspond to the thickness of the component.

[0052] In this specification, "on a plane" can be defined as "viewed in the third direction DR3". In this specification, "in a cross-section" can be defined as "viewed in the first direction DR1 or the second direction DR2". It will be understood that the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can have relative concepts and can thus be changed to other directions.

[0053] In an embodiment, the electronic device ED can be rigid or flexible. The term "flexible" can mean "bendable" and can include all structures, for example, structures bendable to the nanometer level and fully foldable structures. In an embodiment, for example, the flexible electronic device ED can include a bending device or a foldable device.

[0054] The electronic device ED can display an image through a display surface IS. The display surface IS can correspond to the front surface of the electronic device ED. In an embodiment, the display surface IS can include a flat surface defined by a first direction DR1 and a second direction DR2, and can display an image in a third direction DR3 perpendicular to the first direction DR1 and the second direction DR2. The display surface IS can also include curved surfaces that are bent from at least two sides of the flat surface respectively. However, the shape of the display surface is not limited thereto. In an embodiment, for example, the display surface can include only the flat surface, or can also include at least two curved surfaces, for example, four curved surfaces bent from four sides of the flat surface respectively.

[0055] A partial area of the display surface IS can be defined as a sensing area SA. Figure 1 An embodiment in which a single sensing area SA is defined is shown as an example, but the number of sensing areas SA is not limited thereto. The sensing area SA can be an area with a higher light transmittance compared to other areas in the display surface IS. The sensing area SA can transmit an optical signal while displaying an image.

[0056] The electronic device ED according to an embodiment can sense an external input applied from the outside. The external input can include various forms of input. In an embodiment, for example, the external input can include physical forces (e.g., pressure), heat, light, etc. The external input can include an input applied close to the electronic device ED (e.g., hovering) and an input in contact with the electronic device ED (e.g., contact of a user's hand or pen).

[0057] The electronic device ED can sense a user's input through the display surface IS defined in the front surface and respond to the sensed input signal. However, the area for the electronic device ED to sense an external input is not limited to the front surface of the electronic device ED and can be changed according to the design of the electronic device ED. In an embodiment, for example, the electronic device ED can sense a user's input applied to the side surface or the rear surface of the electronic device ED.

[0058] Figure 2 is an exploded perspective view of the electronic device ED according to an embodiment of the present utility model. Figure 3 is a block diagram of the electronic device ED according to an embodiment of the present utility model.

[0059] Referring to Figure 2 and Figure 3 , an embodiment of the electronic device ED can include a display device DD, an electronic module EM, an electro-optical module EOM, a power supply module PSM, and a housing HAU.

[0060] The display device DD can generate images and sense external inputs. The display device DD can include a window WM and a display module DM. The display module DM can include a display panel DP and can also include at least one component disposed on the display panel DP. Figure 2 Only the display panel DP among the stacked structures of the display module DM is schematically shown, but embodiments of the display module DM are not limited thereto.

[0061] The window WM can be disposed on the display module DM. The window WM can cover the front surface of the display module DM and protect the display module DM from external impacts and scratches. The window WM can be coupled to the display module DM through an adhesive layer.

[0062] The window WM can include an optically transparent insulating material. In an embodiment, for example, the window WM can include a glass film or a synthetic resin film as a base film. The window WM can have a single-layer or multi-layer structure. In an embodiment, for example, the window WM can include a plurality of synthetic resin films joined by an adhesive, or a glass film and a synthetic resin film joined by an adhesive. The window WM can also include functional layers (such as an anti-fingerprint layer, a phase control layer, and a hard coat) disposed on the base film.

[0063] The front surface of the window WM can correspond to the front surface of the electronic device ED. The front surface of the window WM can include a transmissive area TA and a border area BZA.

[0064] The transmissive area TA can be optically transparent. The transmissive area TA can transmit the images provided by the display panel DP, and a user can observe the images through the transmissive area TA. In an embodiment, as Figure 2 shown, the transmissive area TA can have a quadrilateral shape, but the transmissive area TA can have various shapes, and embodiments of the present utility model are not limited thereto.

[0065] The border area BZA can be adjacent to the transmissive area TA. The shape of the transmissive area TA can be substantially defined by the border area BZA. In an embodiment, for example, the border area BZA can be disposed outside the transmissive area TA and can surround the transmissive area TA. However, this is shown as an example, and in an alternative embodiment, the border area BZA can be adjacent to one side of the transmissive area TA or can be omitted. In addition, the border area BZA can be disposed not in the front surface of the electronic device ED but in the side surface of the electronic device ED.

[0066] The border area BZA can be an area having a lower light transmittance than the transmissive area TA. The border area BZA can correspond to an area where a material having a predetermined color is printed. The border area BZA can block light transmission and can thus effectively prevent components of the display module DM disposed to overlap with the border area BZA from being visible from the outside.

[0067] The display panel DP can be disposed between the window WM and the housing HAU. The display panel DP can display an image in response to an electrical signal. The display panel DP according to an embodiment can be an emissive display panel, but is not particularly limited thereto. In an embodiment, for example, the display panel DP can be an organic light-emitting display panel, an inorganic light-emitting display panel, or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel can include an organic light-emitting material, and the light-emitting layer of the inorganic light-emitting display panel can include an inorganic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel can include quantum dots, quantum rods, etc. Hereinafter, for ease of description, an embodiment in which the display panel DP is an organic light-emitting display panel will be described in detail.

[0068] The display panel DP can include a display area DA and a non-display area NDA. The display area DA can be an area where light-emitting elements are disposed. The light-emitting elements can generate light in response to an electrical signal and can output an image through the display area DA. In an embodiment, for example, the light-emitting elements can be light-emitting diodes, but the embodiments of the present invention are not necessarily limited thereto. The display area DA can overlap at least a part of the transmissive area TA.

[0069] The display panel DP can include a sensing area DP-SA, and the sensing area DP-SA of the display panel DP can correspond to the sensing area SA of the above-described electronic device ED (see Figure 1 ). That is, in the display area DA, the sensing area DP-SA can be an area having a relatively high light transmittance. The sensing area DP-SA can be defined inside the display area DA. However, the embodiments of the present invention are not limited thereto, and a part of the sensing area DP-SA can be defined inside the non-display area NDA.

[0070] The light-emitting elements can be disposed in the sensing area SA. The density of the light-emitting elements disposed in the sensing area SA can be less than the density of the light-emitting elements disposed in another area spaced apart from the sensing area SA in the display area DA. That is, the sensing area SA can be an area having a lower resolution than other areas of the display area DA.

[0071] The non-display area NDA can be adjacent to the display area DA. In an embodiment, for example, the non-display area NDA can surround the display area DA. However, the embodiments of the present invention are not limited thereto, and the non-display area NDA can be defined in various shapes. The non-display area NDA can be an area where a driving circuit for driving light-emitting elements provided in the display area DA and signal lines and pads for supplying electrical signals to the light-emitting elements are provided. The non-display area NDA can overlap at least a part of the border area BZA, and the border area BZA can effectively prevent the components provided in the non-display area NDA from being visible to the outside.

[0072] The electronic device ED can include a flexible printed circuit board FCB electrically connected to the display panel DP. The flexible printed circuit board FCB can be disposed on the non-display area NDA of the display panel DP and coupled to the display panel DP. The flexible printed circuit board FCB can be connected to the main circuit board. The main circuit board can be an electronic component constituting the electronic module EM.

[0073] A partial area of the display panel DP can be provided as a bending area BA. In an embodiment, the bending area BA can be included in the non-display area NDA. The bending area BA can be bent about a bending axis parallel to the first direction DR1. Due to the bending of the bending area BA, the flexible printed circuit board FCB can overlap a part of the display panel DP on a plane. The display panel can also include a data driver DDV. The data driver DDV can include a data driving circuit for driving pixels located inside the display area DA. In an embodiment, the data driver DDV can be provided in the form of an integrated circuit chip mounted inside the non-display area NDA of the display panel DP. However, the embodiments of the present invention are not limited thereto, and the data driver DDV can be mounted on the flexible printed circuit board FCB.

[0074] The window WM and the housing HAU can be coupled to each other and constitute the appearance of the electronic device ED. The display module DM, the electronic module EM, and the power supply module PSM can be accommodated in the internal space formed by coupling the window WM and the housing HAU.

[0075] The housing HAU can include a material having relatively high hardness. In an embodiment, for example, the housing HAU can include a plurality of frames and / or plates including or composed of glass, plastic, or metal or a combination thereof. The housing HAU can absorb an impact applied from the outside or prevent foreign substances / moisture, etc. from entering from the outside, thereby protecting the components of the electronic device ED accommodated in the housing HAU.

[0076] Refer to Figure 3, embodiments of the display device DD may include a display panel DP and a sensor SS. The sensor SS may include at least any one of an input sensor, an antenna sensor, and a fingerprint sensor.

[0077] The electronic module EM may include a control module E-10, a wireless communication module E-20, an image input module E-30, an audio input module E-40, an audio output module E-50, a memory E-60, an external interface module E-70, etc. The electronic module EM may include a main circuit board, and the modules included in the electronic module EM may be mounted on the main circuit board or electrically connected to the main circuit board through a flexible printed circuit board FCB (see Figure 2 ). The electronic module EM may be electrically connected to the power supply module PSM.

[0078] The control module E-10 may control the overall operation of the electronic device ED. In an embodiment, for example, the control module E-10 may activate or deactivate the display device DD in response to a user input. The control module E-10 may control the image input module E-30, the audio input module E-40, or the audio output module E-50, etc. in response to a user input. The control module E-10 may include at least one microprocessor.

[0079] The wireless communication module E-20 may send / receive wireless signals to / from another terminal using Bluetooth or Wi-Fi lines. The wireless communication module E-20 may send / receive audio signals using a public communication line. The wireless communication module E-20 may include a plurality of antenna modules.

[0080] The image input module E-30 may process an image signal and convert the image signal into image data that can be displayed in the display device DD. The audio input module E-40 may receive an external audio signal input by a microphone in a recording mode or a voice recognition mode, etc., and may convert the external audio signal into electronic audio data. The audio output module E-50 may convert and output the audio data received from the wireless communication module E-20 or stored in the memory E-60.

[0081] The external interface module E-70 may be used as an interface for connecting to an external charger, a wired / wireless data port, a card (e.g., a memory card or a SIM / UIM card) socket, etc.

[0082] The power supply module PSM may supply the power required for the overall operation of the electronic device ED. In an embodiment, for example, the power supply module PSM may include a typical battery device.

[0083] Refer to Figure 2 and Figure 3, the electro-optical module EOM may overlap with the sensing area DP-SA and may be disposed under the display panel DP. The electro-optical module EOM may be an electronic component that receives an optical signal provided from the outside through the sensing area DP-SA or outputs an optical signal to the outside. In an embodiment, for example, the electro-optical module EOM may include a camera module and / or a proximity sensor. The camera module may capture an external image through the sensing area DP-SA. The proximity sensor may be a sensor that measures the distance between an object and the electronic device ED using information received through the sensing area DP-SA. However, embodiments of the electro-optical module EOM are not limited thereto, and the electro-optical module EOM may further include a sensor for identifying a part of a user's body (e.g., fingerprint, iris, or face), or a small lamp for emitting light.

[0084] Return reference Figure 2 , the electronic device ED may include a dam DAM disposed on the rear surface of the display panel DP. Although Figure 2 not shown, the electronic device ED may include a functional layer FL disposed on the rear surface of the display panel DP (see Figure 4B ). The functional layer FL may be directly formed on the rear surface DP-B of the display panel DP (see Figure 4B ). That is, the functional layer FL may be coupled to a component defining the rear surface DP-B of the display panel DP without a separate adhesive layer. The functional layer FL may be a single layer or have a structure in which multiple layers are sequentially stacked. In addition, the functional layer FL may include a material having impact resistance or light-shielding properties. That is, the functional layer FL has impact resistance, and thus may protect the display panel DP from external impact or interference transmitted to the rear surface of the display panel DP. The functional layer FL has a light-shielding function, and thus may effectively prevent light from being emitted to the rear surface of the display panel DP. The functional layer FL may prevent electronic components disposed under the display panel DP from being visible or seen through from the outside due to light being emitted to the rear surface DP-B of the display panel DP.

[0085] Figure 4A is a plan view of the display panel DP according to an embodiment of the present utility model. Figure 4B is a cross-sectional view of a part of the electronic device ED (see Figure 1 ) according to an embodiment of the present utility model.

[0086] Refer to Figure 4A , in an embodiment, the display panel DP may include a substrate SUB, pixels PX, signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, PL, and CNL electrically connected to the pixels PX, a scan driver SDV, a data driver DDV, and a light emission driver EDV.

[0087] The substrate base SUB can provide a substrate surface on which elements and wirings for the display panel DP are disposed in a plane parallel to each of the first direction DR1 and the second direction DR2. The substrate base SUB can include a display area DA and a non-display area NDA corresponding to the display area DA and the non-display area NDA of the display panel DP, respectively.

[0088] The display area DA can have pixels PX disposed therein and thus display an image. The non-display area NDA can be adjacent to the display area DA and thus can be an area where no image is displayed. A scan driver SDV, a data driver DDV, a light emission driver EDV, etc. for driving the pixels PX can be disposed in the non-display area NDA. However, at least one selected from the scan driver SDV, the data driver DDV, and the light emission driver EDV can be disposed in the display area DA to reduce the area (or reduce the size) of the non-display area NDA.

[0089] Each of the pixels PX can include a light-emitting element and a pixel driving circuit composed of transistors (e.g., a switching transistor, a driving transistor, etc.) connected to the light-emitting element and at least one capacitor. Each of the pixels PX can emit light in response to an electric signal applied to the pixel PX and display an image within the display area DA. Some of the pixels PX can include transistors disposed in the non-display area NDA, but embodiments of the present invention are not limited thereto.

[0090] The signal lines SL1 to SLm, DL1 to DLn, EL1 to ELm, CSL1, CSL2, PL, and CNL can include scan lines SL1 to SLm, data lines DL1 to DLn, light emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power supply line PL, and a connection line CNL. Herein, m and n represent natural numbers of 1 or greater.

[0091] The data lines DL1 to DLn can cross the scan lines SL1 to SLm and the light emission lines EL1 to ELm while being insulated therefrom. In an embodiment, for example, the scan lines SL1 to SLm can extend in the first direction DR1 to be connected to the scan driver SDV. The data lines DL1 to DLn can extend in the second direction DR2 to be connected to the data driver DDV. The light emission lines EL1 to ELm can extend in the first direction DR1 to be connected to the light emission driver EDV.

[0092] The power supply line PL can extend in the second direction DR2 and is provided in the non-display area NDA. In an embodiment, the power supply line PL can be provided between the display area DA and the light emission driver EDV. However, the position where the power supply line PL is provided is not limited thereto.

[0093] The connection line CNL can extend in the first direction DR1 and can be arranged along the second direction DR2 to connect to the power supply line PL and the pixel PX. Each of the connection lines CNL can be provided on a layer different from the layer on which the power supply line PL is provided and can thus be electrically connected to the power supply line PL through a contact hole. However, the embodiments of the present utility model are not limited thereto, and the connection line CNL can be integrally formed with the power supply line PL as a single integral and indivisible part in the same layer (or directly on the same layer). The power supply voltage applied to the power supply line PL can be applied to the pixel PX through the connection line CNL.

[0094] The first control line CSL1 can be connected to the scan driver SDV. The second control line CSL2 can be connected to the light emission driver EDV.

[0095] The pad PD can be provided adjacent to the lower end of the non-display area NDA. The pad PD can be provided closer to the lower end of the display panel DP than the data driver DDV. The pads PD can be provided spaced apart from each other along the first direction DR1. The pads PD can be respectively connected to the corresponding signal lines among the plurality of signal lines. In an embodiment, for example, the power supply line PL, the first control line CSL1, and the second control line CSL2 can be electrically connected to the pad PD, and the data lines DL1 to DLn can be respectively electrically connected to the corresponding pads PD through the data driver DDV. The pad PD can be the part to which the aforementioned flexible printed circuit board FCB (see Figure 2 ) is electrically connected. Therefore, the electrical signals provided from the flexible printed circuit board FCB (see Figure 2 ) can be transmitted to the display panel DP through the pad PD.

[0096] The scan driver SDV can generate a scan signal in response to a scan control signal. The scan signal can be applied to the pixel PX through the scan lines SL1 to SLm. The data driver DDV can generate a data voltage corresponding to an image signal in response to a data control signal. The data voltage can be applied to the pixel PX through the data lines DL1 to DLn. The light emission driver EDV can generate a light emission signal in response to a light emission control signal. The light emission signal can be applied to the pixel PX through the light emission lines EL1 to ELm.

[0097] The pixel PX can receive a data voltage in response to a scan signal. The pixel PX can emit an image by generating light having a luminance corresponding to the data voltage in response to a light emission signal. The emission time of the pixel PX can be controlled by the light emission signal.

[0098] Referring Figure 4B , in an embodiment, the display panel DP may include a substrate base SUB, a circuit layer CL, a display element layer OL, and a packaging layer TFE. In such an embodiment, the functional layer FL and the dam DAM may be provided on the rear surface DP-B of the display panel DP. The display panel DP may include a rear surface DP-B facing the functional layer FL. The rear surface DP-B of the display panel DP may substantially correspond to the rear surface of the substrate base SUB, and hereinafter, the same reference numerals or symbols as the rear surface DP-B of the display panel DP are used for the rear surface of the substrate base SUB.

[0099] The substrate base SUB may provide a substrate surface on which the circuit layer CL is provided. The substrate base SUB may be a rigid substrate or a flexible substrate that can be bent, folded, curled, etc. The substrate base SUB may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments of the present invention are not limited thereto, and the substrate base SUB may include an inorganic layer, a synthetic resin layer, or a composite material layer.

[0100] The substrate base SUB may have a multilayer structure. In an embodiment, for example, the substrate base SUB may include a synthetic resin layer and a single layer or multiple layers of inorganic layers provided between the synthetic resin layers. The synthetic resin layers may each include an acrylate resin, a methacrylate resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a silicone resin, a polyamide resin, or a perylene resin, etc., but the materials of the synthetic resin layers are not limited thereto.

[0101] The circuit layer CL may be provided on the substrate base SUB. The circuit layer CL may include at least one insulating layer, a semiconductor pattern, and a conductive pattern. The insulating layer, the semiconductor pattern, and the conductive pattern included in the circuit layer CL may form or define driving elements, signal lines, and pads in the circuit layer CL.

[0102] The display element layer OL may be provided on the circuit layer CL. The display element layer OL may include light emitting elements provided in the display area DA. The light emitting elements may include organic light emitting elements, inorganic light emitting elements, micro light emitting diodes (LEDs), or nano LEDs, but are not particularly limited. The light emitting elements of the display element layer OL may be electrically connected to the driving elements of the circuit layer CL, and may generate light in the display area DA in response to signals provided by the driving elements.

[0103] The encapsulation layer TFE can be disposed on the display element layer OL and can seal the light-emitting element. The encapsulation layer TFE can include at least one thin film to protect the display element layer OL and improve the optical efficiency of the display element layer OL. The encapsulation layer TFE can include at least one of an inorganic film and an organic film. In an embodiment, the encapsulation layer TFE can include a stacked structure of an inorganic film and an organic film disposed between the inorganic films, but the embodiments of the present utility model are not particularly limited thereto. The inorganic film of the encapsulation layer TFE can protect the light-emitting element from moisture / oxygen. The organic film of the encapsulation layer TFE can protect the light-emitting element from foreign substances such as dust particles.

[0104] In an embodiment, a sensor layer (not shown) can be disposed on the display panel DP. In an embodiment, the sensor layer can be formed on the display panel DP by a continuous process. In such an embodiment, the sensor layer can be directly disposed on the display panel DP without a separate adhesive layer. However, the embodiment is not necessarily limited thereto, and optionally, the sensor layer can be coupled to the display panel DP through an adhesive layer.

[0105] The sensor layer can include at least one of an input sensor, an antenna sensor, and a fingerprint sensor. In an embodiment, for example, the sensor layer can include an input sensor, and the input sensor can sense an external input and provide an input signal having information about the external input, such that the display panel DP can generate an image corresponding to the external input. The input sensor can be driven by various methods such as a capacitance method, a resistive film method, an infrared method, an acoustic wave method, or a pressure method, but the embodiments of the present utility model are not limited thereto. An anti-reflection layer or the like can be further disposed on the sensor layer.

[0106] The functional layer FL can be disposed on the rear surface DP-B of the display panel DP. In an embodiment, for example, the functional layer FL can be directly formed on the rear surface DP-B of the display panel DP. In such an embodiment, the functional layer FL can be coupled to the substrate SUB without a separate adhesive layer. The functional layer FL can be provided as a single layer (or defined by a single layer) rather than a plurality of functional layers stacked in the third direction DR3. The functional layer FL can include a light-shielding material and a shock-absorbing material. In an embodiment, for example, the light-shielding material can include a black pigment or a black dye as a carbon-based heat-dissipating material, thereby exhibiting a light-shielding function. In an embodiment, for example, the shock-absorbing material can include an acrylate-based polymer resin or a urethane-based polymer resin. The functional layer FL can absorb an impact applied from the outside, thereby protecting the display panel DP from an external impact.

[0107] The dam DAM can be provided on the rear surface DP-B of the display panel DP. The dam DAM can be directly formed on the rear surface DP-B of the display panel DP. According to an embodiment of the present invention, the dam DAM can be formed to be in direct contact with the opposite side surfaces of the functional layer FL that face each other in the first direction DR1. The dam DAM can be formed to overlap with the edge of the display panel DP so that the functional layer FL does not overflow to the outside of the display panel DP. The dam DAM can include a light-shielding material. In an embodiment, for example, the dam DAM can include a black pigment or a black dye as a carbon-based heat-dissipating material.

[0108] Figure 5 is a plan view of an electronic device ED according to an embodiment of the present invention. Specifically, this plan view shows the functional layer FL and the dam DAM provided on the rear surface DP-B (see Figure 4B ) of the display panel DP (see Figure 4B ). Figure 6A is a cross-sectional view of a part of the electronic device ED taken along the line I-I' of Figure 5 . Figure 6B is a cross-sectional view of a part of the electronic device ED taken along the line II-II' of Figure 5 .

[0109] Referring to Figures 5 to 6B , a central region CA and an edge region EA adjacent to the central region CA can be defined in the display panel DP. The edge region EA can be a region defined along the edge of the display panel DP. The edge region EA can include a first edge region EA1 surrounding the central region CA and a second edge region EA2 surrounded by the central region CA. The first edge region EA1 is a region defined along the edge of the display panel DP, and the second edge region EA2 is a region defined along the sensing region SA. The central region CA can correspond to the display region DA shown in Figure 2 , and the first edge region EA1 can correspond to the non-display region NDA. The functional layer FL can be provided to overlap with the central region CA. However, the embodiments of the present invention are not limited to those shown, and the functional layer FL can be provided to overlap with a part of the first edge region EA1 or a part of the second edge region EA2.

[0110] The DAM can include a first DAM1 overlapping with a first edge area EA1 and a second DAM2 overlapping with a second edge area EA2. The first DAM1 can be arranged to surround the functional layer FL. The second DAM2 can be arranged to be surrounded by the functional layer FL. According to an embodiment of the present utility model, the side surface of the functional layer FL can be in direct contact with the DAM. In such an embodiment, the first side surface SS1 of the functional layer FL can be in contact with the first DAM1, and the second side surface SS2 of the functional layer FL can be in contact with the second DAM2.

[0111] The first DAM1 and the second DAM2 can each include a plurality of sub-DAMs stacked sequentially with each other. In an embodiment, for example, the first DAM1 can include a first sub-DAM SDAM1, a second sub-DAM SDAM2, and a third sub-DAM SDAM3, and the second DAM2 can include a fourth sub-DAM SDAM4, a fifth sub-DAM SDAM5, and a sixth sub-DAM SDAM6.

[0112] The first sub-DAM SDAM1 can be directly disposed on the rear surface DP-B of the display panel DP, the second sub-DAM SDAM2 can be directly disposed on the first sub-DAM SDAM1, and the third sub-DAM SDAM3 can be directly disposed on the second sub-DAM SDAM2. The first sub-DAM SDAM1, the second sub-DAM SDAM2, and the third sub-DAM SDAM3 can include the same material as each other. In an embodiment, for example, the first sub-DAM SDAM1, the second sub-DAM SDAM2, and the third sub-DAM SDAM3 can each include a black pigment or a black dye as a carbon-based heat dissipation material. The number of sub-DAMs included in the first DAM1 is not limited to Figure 6A the number shown, and the first DAM1 can include four or more sub-DAMs.

[0113] The fourth sub-DAM SDAM4 can be directly disposed on the rear surface DP-B of the display panel DP, the fifth sub-DAM SDAM5 can be directly disposed on the fourth sub-DAM SDAM4, and the sixth sub-DAM SDAM6 can be directly disposed on the fifth sub-DAM SDAM5. The fourth sub-DAM SDAM4, the fifth sub-DAM SDAM5, and the sixth sub-DAM SDAM6 can include the same material as each other. In an embodiment, for example, the fourth sub-DAM SDAM4, the fifth sub-DAM SDAM5, and the sixth sub-DAM SDAM6 can each include a black pigment or a black dye as a carbon-based heat dissipation material. The number of sub-DAMs included in the second DAM2 is not limited to Figure 6B the number shown, and the second DAM2 can include four or more sub-DAMs.

[0114] Referring to Figure 6A and Figure 6B, the functional layer FL may include multiple layers. In an embodiment, for example, the functional layer FL may include a first functional layer FL1 and a second functional layer FL2. The first functional layer FL1 may be disposed on the rear surface DP-B of the display panel DP. The second functional layer FL2 may be disposed on the first functional layer FL1. The first functional layer FL1 and the second functional layer FL2 may include the same material as each other. The first functional layer FL1 and the second functional layer FL2 may be connected to each other and integrally formed into a single, integral, and inseparable part.

[0115] Referring to Figure 6B , the display panel DP may be provided with a panel hole DPH defined therethrough to correspond to the electro-optical module EOM (see Figure 2 ). The electro-optical module EOM may receive an external input (e.g., light) through the panel hole DPH or may provide an output to the outside. The functional layer FL may be provided with a functional hole FLH defined therethrough to correspond to the electro-optical module EOM. The functional hole FLH may be defined by the second side surface SS2 of the functional layer FL. The panel hole DPH and the functional hole FLH may overlap with the sensing area SA. According to an embodiment of the present invention, the size of the panel hole DPH may be smaller than the size of the functional hole FLH. The panel hole DPH is surrounded by a second edge area EA2, and the functional hole FLH is surrounded by a central area CA. Since the second dam DAM2 is provided to overlap with the second edge area EA2, the panel hole DPH and the dam hole DH defined by the second dam DAM2 may be arranged in the third direction DR3, and the size of the panel hole DPH may be smaller than the size of the functional hole FLH.

[0116] Referring to Figure 6A and Figure 6B , the second functional layer FL2 may provide a flat surface. The second functional layer FL2 may provide a flat surface facing the rear surface DP-B of the display panel DP. Thus, the functional layer FL may have a uniform thickness Th1 along the rear surface DP-B of the display panel DP. According to an embodiment of the present invention, the thickness Th1 of the functional layer FL may be equal to or less than the thickness Th2a of the first dam DAM1 or the thickness Th2b of the second dam DAM2. In an embodiment, for example, the thickness Th1 of the functional layer FL may be in the range of about 50 micrometers (μm) to about 250 μm. In an embodiment, for example, the thickness Th1 of the functional layer FL may be in the range of about 100 μm to about 150 μm. The thickness Th2a of the first dam DAM1 and the thickness Th2b of the second dam DAM2 may be the same as each other. Each of the thickness Th2a of the first dam DAM1 and the thickness Th2b of the second dam DAM2 may be about 250 μm or greater.

[0117] Referring to Figures 5 to 6B, according to an embodiment of the present invention, an electronic device ED may include a functional layer FL and dams DAM on the rear surface DP-B of a display panel DP. Since the side surfaces SS1 and SS2 of the functional layer FL are in direct contact with the dams DAM, the functional layer FL may have a uniform thickness Th1 along the rear surface DP-B of the display panel DP. Since the functional layer FL including a light-shielding material has a uniform thickness Th1 up to the region adjacent to the edge region EA of the display panel DP, and the dams DAM including the light-shielding material are provided in the edge region EA, light emitted to the rear surface of the display panel DP can be blocked throughout the display panel DP. As a result, the functional layer FL and the dams DAM can effectively prevent the electronic components provided below the display panel DP from being visible or seen through from the outside due to light being emitted to the rear surface DP-B of the display panel DP throughout the display panel DP.

[0118] Referring to Figure 6A and Figure 6B , in an embodiment, a heat dissipation layer HDL may be provided below the functional layer FL and the dams DAM1 and DAM2. In such an embodiment, the heat dissipation layer HDL may be provided on the functional layer FL and the dams DAM1 and DAM2 so as to be spaced apart from the rear surface DP-B of the display panel DP in a direction opposite to the third direction DR3. The heat dissipation layer HDL may perform a heat dissipation function to release heat generated from components of the electronic device ED (see Figure 1 ) having the display panel DP to the outside. In an embodiment, for example, the heat dissipation layer HDL may include copper (Cu). The heat dissipation layer HDL may include an electromagnetic shielding material. Since the heat dissipation layer HDL includes an electromagnetic shielding material, the heat dissipation layer HDL can prevent the electric and magnetic fields generated from electronic components and the like provided below the heat dissipation layer HDL from being transmitted to the display panel DP provided above the heat dissipation layer HDL.

[0119] In an embodiment, an adhesive layer ADL may be provided between the heat dissipation layer HDL and the functional layer FL and between the heat dissipation layer HDL and the dams DAM1 and DAM2. The heat dissipation layer HDL may be adhered to the functional layer FL and the dams DAM1 and DAM2 through the adhesive layer ADL. The adhesive layer ADL may be a pressure-sensitive adhesive (PSA) layer or an adhesive resin layer.

[0120] Figure 7A is a plan view of an electronic device EDa according to an embodiment of the present invention. Figure 7B is a cross-sectional view of a part of the electronic device EDa taken along the line III-III' of Figure 7A . For ease of description, any repeated detailed description of elements identical or similar to the above elements will be omitted.

[0121] Referring to Figure 7A and Figure 7B, in an embodiment of the electronic device DAa, the edge region EAa may include a first edge region EA1 surrounding the central region CA and second edge regions EA2a and EA2b surrounded by the central region CA. The functional layer FLa may overlap with the central region CA. The first dam DAM1 may overlap with the first edge region EA1, and the second dams DAM2a and DAM2b may overlap with the second edge regions EA2a and EA2b.

[0122] According to an embodiment of the present invention, the second edge regions EA2a and EA2b may be provided in plurality. Accordingly, the second dams DAM2a and DAM2b provided in the second edge regions EA2a and EA2b may also be provided in plurality. In the embodiment shown in Figure 7A , the functional layer FLa may include a plurality of functional holes FLHa. The functional holes FLHa may include a first functional hole FLH1 overlapping with the first sensing region SA1 and a second functional hole FLH2 overlapping with the second sensing region SA2. The first functional hole FLH1 overlapping with the first sensing region SA1 may be the same as Figure 5 the functional hole FLH overlapping with the sensing region SA shown in.

[0123] Referring to Figure 7B , the functional layer FLa may include a first functional layer FL1a and a second functional layer FL2a. The first functional layer FL1a and the second functional layer FL2a may be connected to each other and integrally formed as a single, integral, and inseparable part. The second functional hole FLH2 formed in the functional layer FLa may overlap with the display panel DP. In such an embodiment, the second functional hole FLH2 may overlap with the second sensing region SA2 of the display panel DP (see Figure 7A ). Electronic components and the like may be provided corresponding to the second functional hole FLH2 overlapping with the second sensing region SA2. In an embodiment, for example, the electronic components may include a camera module and / or a proximity sensor.

[0124] In such an embodiment, the first functional hole FLH1 may overlap with the panel hole DPH as shown in Figure 6B . The second functional hole FLH2 may not overlap with Figure 6B the panel hole DPH shown in. The plurality of functional holes FLHa may include the first functional hole FLH1 overlapping with the panel hole DPH and the second functional hole FLH2 not overlapping with the panel hole DPH. That is, the second functional hole FLH2 may be formed in the functional layer FLa while overlapping with a region in which no defined hole of the display panel DP passes through. According to an embodiment of the present invention, as shown in Figure 7AAs shown, two functional holes FLHa can be provided, but the embodiments of the present invention are not limited thereto, and three or more functional holes for setting electronic components or the like can be formed in the functional layer FLa.

[0125] Figure 8 FIG. is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention. Figures 9A to 9E FIG. is a cross-sectional view of some operations of a method for manufacturing an electronic device according to an embodiment of the present invention. Figures 10A to 10C FIG. is a cross-sectional view of some operations of a method for manufacturing an electronic device according to an embodiment of the present invention. Hereinafter, reference will be made to Figures 8 to 10C to describe an embodiment of a method for manufacturing an electronic device ED (see Figure 1 ).

[0126] Reference is made to Figures 8 to 9E , and an embodiment of a method for manufacturing an electronic device ED according to the present invention may include: providing a display panel DP (S100) in which a central region CA and an edge region EA adjacent to the central region CA are defined; forming a first dam DAM1 overlapping the edge region EA on the rear surface DP-B of the display panel DP (S200); and forming a functional layer FL overlapping the central region CA on the rear surface DP-B of the display panel DP (S300).

[0127] Reference is made to Figure 9A and Figure 9B , and it is possible to perform providing a display panel DP (S100) in which a central region CA and an edge region EA adjacent to the central region CA are defined and performing forming a first dam DAM1 overlapping the edge region EA on the rear surface DP-B of the display panel DP (S200). The edge region EA may be a region defined along the edge of the display panel DP. The central region CA may be a region surrounded by the edge region EA.

[0128] The first dam DAM1 may be formed on the rear surface DP-B of the display panel DP to overlap the edge region EA. The first dam DAM1 may be formed of a plurality of sub-dams SDAM1, SDAM2, and SDAM3 stacked in sequence with each other. Although not shown, it is possible to perform forming a first sub-dam SDAM1 on the rear surface DP-B of the display panel DP, forming a second sub-dam SDAM2 on the first sub-dam SDAM1, and forming a third sub-dam SDAM3 on the second sub-dam SDAM2. The method for manufacturing an electronic device according to an embodiment of the present invention is not limited thereto, and may include forming four or more sub-dams.

[0129] Each of the first sub-dam SDAM1, the second sub-dam SDAM2, and the third sub-dam SDAM3 can be formed by applying and photocuring a preliminary sub-dam. In an embodiment, the first sub-dam SDAM1 can be formed by applying a first preliminary sub-dam and then photocuring the first preliminary sub-dam by UV irradiation. The second sub-dam SDAM2 and the third sub-dam SDAM3 can be formed in the same manner as the first sub-dam SDAM1 is formed, and then the first dam DAM1 can be disposed on the rear surface DP-B of the display panel DP. The method of applying the first preliminary sub-dam may include a dispensing method. However, the embodiments of the present invention are not limited thereto, and the method of applying the first preliminary sub-dam may include an inkjet method, a slit method, a transfer method, or the like.

[0130] The first dam DAM1 including the first sub-dam SDAM1, the second sub-dam SDAM2, and the third sub-dam SDAM3 may include a light-shielding material. In an embodiment, for example, the first dam DAM1 may include a black pigment or a black dye as a carbon-based heat-dissipating material.

[0131] Referring to Figure 9C and Figure 9D , a functional layer FL overlapping with the central region CA can be formed on the rear surface DP-B of the display panel DP (S300).

[0132] Referring to Figure 9C , a first preliminary functional layer FFL1 can be formed on the rear surface DP-B of the display panel DP using an application device IJ. That is, the first preliminary functional layer FFL1 can be formed by an inkjet method or a dispensing method using the application device IJ. One side surface of the first preliminary functional layer FFL1 can be in contact with the side surface of the first dam DAM1. The first preliminary functional layer FFL1 may include a light-shielding material and a shock-absorbing material. In an embodiment, for example, the light-shielding material may include a black pigment or a black dye as a carbon-based heat-dissipating material, thereby exhibiting a light-shielding function. In an embodiment, for example, the shock-absorbing material may include an acrylate polymer resin or a urethane polymer resin.

[0133] Although not shown, the first photocuring can be performed after the first preliminary functional layer FFL1 is formed. The first photocuring can be performed by irradiating the first preliminary functional layer FFL1 with ultraviolet light to form the first functional layer FL1.

[0134] Referring to Figure 9D , forming the functional layer FL (see Figure 9E ) by forming a second functional layer FL2 on the first functional layer FL1 can be performed (see Figure 9E)。Although not shown, the formation of the second functional layer FL2 can be performed in the same manner as the formation of the first functional layer FL1. In such an embodiment, an application device IJ (see Figure 9C ) can be used to form a second preliminary functional layer FFL2 on the first functional layer FL1. The second preliminary functional layer FFL2 can be formed by an inkjet method using the application device IJ. Hereinafter, as Figure 9D shown, a second photocuring can be performed on the second preliminary functional layer FFL2. The second photocuring can be performed on the second preliminary functional layer FFL2 by irradiating with ultraviolet (UV) light to form the second functional layer FL2.

[0135] The second functional layer FL2 can provide a flat surface. The second functional layer FL2 can provide a flat surface facing the back surface DP-B of the display panel DP. Since the second functional layer FL2 includes a flat surface, the functional layer FL can have a uniform thickness along the back surface DP-B of the display panel DP.

[0136] Since the functional layer FL including the light-shielding material has a uniform thickness up to the region adjacent to the edge region EA of the display panel DP, and the first dam DAM1 including the light-shielding material is provided in the edge region EA, it is possible to block the light emitted to the back surface of the display panel DP throughout the display panel DP. As a result, the functional layer FL and the first dam DAM1 can effectively prevent the electronic components provided below the display panel DP from being visible or seen through from the outside due to the light emission to the back surface DP-B of the display panel DP throughout the display panel DP.

[0137] Referring to Figure 9E , an embodiment of the method for manufacturing an electronic device according to the present utility model may further include: providing an adhesive layer ADL on the functional layer FL and the first dam DAM1; and providing a heat dissipation layer HDL on the adhesive layer ADL. The adhesive layer ADL can be a pressure-sensitive adhesive (PSA) layer or an adhesive resin layer. The heat dissipation layer HDL can include copper (Cu). The heat dissipation layer HDL can include an electromagnetic shielding material. Since the heat dissipation layer HDL includes an electromagnetic shielding material, the heat dissipation layer HDL can prevent the electric field and magnetic field generated from the electronic components provided below the heat dissipation layer HDL from being transmitted to the display panel DP provided above the heat dissipation layer HDL.

[0138] Figures 10A to 10C is a cross-sectional view showing the formation of the second dam DAM2 and the functional layer FL in a region adjacent to the sensing region SA shown in Figure 5 and Figure 6B .

[0139] Referring to Figure 5 and Figure 10A, a display panel DP providing a central region CA and a second edge region EA2 adjacent to the central region CA can be implemented, and a second dam DAM2 overlapping with the second edge region EA2 can be formed on a rear surface DP-B of the display panel DP. The second edge region EA2 is a region defined along an edge of the sensing region SA.

[0140] Forming the second dam DAM2 can be the same as Figure 9A and Figure 9B shown in forming the first dam DAM1. That is, the second dam DAM2 can be formed by sequentially stacking a plurality of sub-dams SDAM4, SDAM5, and SDAM6 on each other. The second dam DAM2 including the plurality of sub-dams SDAM4, SDAM5, and SDAM6 can include a light-shielding material. In an embodiment, for example, the second dam DAM2 can include a black pigment or a black dye as a carbon-based heat dissipation material.

[0141] Referring to Figure 5 and Figure 10B , a functional layer FL overlapping with the central region CA can be formed on the rear surface DP-B of the display panel DP. The functional layer FL can include a first functional layer FL1 and a second functional layer FL2. Forming the functional layer FL can be the same as Figure 9C and Figure 9D shown in forming the functional layer FL.

[0142] The second functional layer FL2 can provide a flat surface. The second functional layer FL2 can provide a flat surface facing the rear surface DP-B of the display panel DP. Accordingly, the functional layer FL can have a uniform thickness along the rear surface DP-B of the display panel DP.

[0143] The functional layer FL including a light-shielding material can have a uniform thickness up to a region adjacent to the second edge region EA2 of the display panel DP, and the second dam DAM2 including a light-shielding material can be disposed in the second edge region EA2. Accordingly, it is possible to block light emitted to the rear surface DP-B of the display panel DP in the second edge region EA2 and the central region CA adjacent to the second edge region EA2.

[0144] Referring to Figure 10C, an embodiment of the method for manufacturing an electronic device according to the present utility model may further include: disposing an adhesive layer ADL on the functional layer FL and the second dam DAM2; and disposing a heat dissipation layer HDL on the adhesive layer ADL. The adhesive layer ADL may be a pressure-sensitive adhesive (PSA) layer or an adhesive resin layer. The heat dissipation layer HDL may include copper (Cu). The heat dissipation layer HDL may include an electromagnetic shielding material. Since the heat dissipation layer HDL includes an electromagnetic shielding material, the heat dissipation layer HDL can prevent the electric field and magnetic field generated from the electronic components disposed below the heat dissipation layer HDL from being transmitted to the display panel DP disposed above the heat dissipation layer HDL.

[0145] An electronic device according to an embodiment of the present utility model may include a functional layer on the rear surface of a display panel, and may include a dam in contact with a side surface of the functional layer. Since the functional layer including a light-shielding material has a uniform thickness up to a region adjacent to an edge region of the display panel, and a dam including a light-shielding material is disposed in the edge region, it is possible to block the light emitted to the rear surface of the display panel over the entire region of the display panel (i.e., throughout the display panel). As a result, the functional layer and the dam can effectively prevent the electronic components disposed below the display panel from being visible or seen through from the outside due to light being emitted to the rear surface of the display panel throughout the display panel.

[0146] The present utility model should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present utility model to those skilled in the art.

[0147] Although the present utility model has been specifically shown and described with reference to embodiments of the present utility model, those of ordinary skill in the art will understand that various changes in form and detail may be made herein without departing from the spirit or scope of the present utility model as defined by the appended claims.

Claims

1. An electronic device, characterized in that, The electronic device includes: A display panel, in which a central region and an edge region adjacent to the central region are defined; A functional layer having shock absorption and light shielding functions, disposed on the rear surface of the display panel and overlapping with the central region; and A bank having a light shielding function, disposed on the rear surface of the display panel and overlapping with the edge region, wherein a side surface of the functional layer is in contact with the bank.

2. The electronic device according to claim 1, wherein The thickness of the functional layer is uniform along the rear surface of the display panel.

3. The electronic device according to claim 2, wherein The thickness of the functional layer is equal to or less than the height of the bank.

4. The electronic device according to claim 1, wherein The functional layer includes: A first functional layer, disposed on the rear surface of the display panel; and A second functional layer, disposed on the first functional layer.

5. The electronic device according to claim 1, wherein The edge region includes: A first edge region, surrounding the central region; and A second edge region, surrounded by the central region, and The bank includes: A first bank, overlapping with the first edge region; and A second bank, overlapping with the second edge region.

6. The electronic device according to claim 5, wherein The side surface of the functional layer includes: A first side surface, in contact with the first bank; and A second side surface, in contact with the second bank.

7. The electronic device according to claim 6, wherein The functional layer is provided with functional holes overlapping with the second edge region, wherein the functional holes are defined by the second side surface.

8. The electronic device according to claim 7, wherein The functional holes are provided as a plurality of functional holes, and The display panel is provided with panel holes defined in the display panel to overlap with at least one of the functional holes selected from the plurality of functional holes.

9. The electronic device according to claim 8, wherein The size of the panel holes is smaller than the size of the at least one functional hole overlapping with the panel holes.

10. The electronic device according to claim 8, wherein, The electronic device further includes: An electro-optical module, overlapping with the at least one functional hole overlapping with the panel holes.

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