Cutting fluid filtering device and silicon wafer cutting machine

Abstract

The utility model relates to the field of cutting fluid filtering, particularly provides a cutting fluid filtering device and a silicon wafer cutting machine, and aims to solve the problems that a filtering device of an existing silicon wafer cutting machine is easy to block and poor in filtering effect. In order to achieve the purpose, the filtering device for the cutting fluid comprises a filtering net, a filter element, a filter element and a filter element, wherein the filtering net is used for being placed at a cutting fluid outlet; the baffle surrounds the outer side of the filter screen in the circumferential direction, a filter space is formed between the baffle and the filter screen, the baffle is used for blocking sediment in the cutting fluid out of the filter space, and the filter screen is used for filtering the cutting fluid entering the filter space from the position above the baffle. According to the filtering device, impurities such as silicon wafer silicon sludge can be blocked outside the filtering space, so that the filtering device is not easily blocked by the silicon wafer silicon sludge, the cutting fluid can be effectively filtered, the cleanliness of the cutting fluid is improved, and the cutting yield of silicon wafers is improved.

Description

Technical Field

[0001] The utility model relates to the field of cutting fluid filtration, and particularly provides a cutting fluid filtration device and a silicon wafer cutting machine. Background Art

[0002] When a wire saw cuts a silicon wafer, a spraying device is required to spray a large amount of cutting fluid onto the surface of the silicon wafer. The cutting fluid has the functions of cooling, lubricating and cleaning, and can reduce friction and heat accumulation during the cutting process, improving the cutting quality and the service life of the equipment. A water pump is responsible for pumping the cutting fluid out of the storage tank and spraying it onto the surface of the silicon wafer through the spraying device. A cutting fluid outlet is provided on the cutting machine, and a filtration device is provided at the cutting fluid outlet for filtering out impurities and particulate matters in the cutting fluid. After passing through the filtration device and the cutting fluid outlet, the cutting fluid flows into the cutting fluid circulation system, and the cutting fluid circulation system is responsible for recycling the used cutting fluid back into the storage tank and then pumping it out by the water pump and spraying it onto the surface of the silicon wafer. This can reduce the waste of cutting fluid and the cost of silicon wafer processing.

[0003] During the silicon wafer cutting process, the silicon wafer material will be cut into thin slices, and at the same time, a large amount of debris and fine particles will be generated. Under the action of the cutting fluid, these debris and particles will gradually deposit at the bottom of the cutting fluid or suspend in the cutting fluid, forming silicon mud; during the cutting process, some silicon wafers will be damaged, fragmented, etc., and these silicon wafers will also mix into the cutting fluid. The steel wire is responsible for driving the mortar to cut the silicon wafer. However, due to various reasons (such as the quality problem of the steel wire itself, abnormal tension during the cutting process, insufficient cutting ability of the mortar, surface defects of the silicon wafer, etc.), the steel wire may break during the cutting process. The broken steel wire segments remain in the cutting fluid and become impurities.

[0004] The current filtration device is a single-layer filter screen. Silicon mud and silicon wafers in the cutting fluid will accumulate on the filter screen, resulting in blockage of the filter screen, poor filtration effect, and inability to effectively filter out broken steel wires. When the cutting fluid is reused, if the filtration is not thorough, the impurities in the cutting fluid may scratch the surface of the silicon wafer during the cutting process, resulting in defects such as scratches and wire marks on the surface of the silicon wafer. These defects will not only affect the appearance quality of the silicon wafer, but may also affect its electrical and mechanical properties, resulting in a reduction in the yield of the silicon wafer. The impurities in the cutting fluid may also cause wear and corrosion to the steel wire, accelerating the aging and fracture of the steel wire. The impurities may also cause problems such as wire jumping and wire jamming of the steel wire during the cutting process. When the broken steel wire is recycled with the cutting fluid, the cutting fluid is doped with steel wires. If the broken steel wire hits the wire mesh, it will further increase the risk of wire breakage.

[0005] Correspondingly, the field needs a new technical solution to solve the above problems. Summary of the Utility Model

[0006] The present utility model aims to solve the above technical problems, that is, to solve the problems that the filtering device of the existing silicon wafer cutting machine is prone to blockage and has poor filtering effect. For this purpose, the present utility model provides a filtering device for cutting fluid, including: a filter screen, which is used to be placed at the cutting fluid outlet; a baffle, which surrounds the outside of the filter screen in the circumferential direction, a filtering space is formed between the baffle and the filter screen, the baffle is used to block the sediment in the cutting fluid outside the filtering space, and the filter screen is used to filter the cutting fluid entering the filtering space from above the baffle.

[0007] In the specific embodiment of the above-mentioned filtering device with cutting fluid, the filtering device further includes: a mounting plate, which is arranged at the bottom of the baffle, and the filter screen is detachably fixed on the mounting plate through a first connecting piece.

[0008] In the specific embodiment of the above-mentioned filtering device with cutting fluid, the filtering device further includes: a magnetic member, which is arranged outside the baffle and is used to adsorb metal impurities in the cutting fluid.

[0009] In the specific embodiment of the above-mentioned filtering device with cutting fluid, a groove is arranged outside the baffle, the magnetic member is arranged in the groove, and the top surface of the magnetic member does not protrude from the top surface of the groove.

[0010] In the specific embodiment of the above-mentioned filtering device with cutting fluid, a plurality of annular protrusions are arranged outside the baffle, and the groove is formed between two adjacent annular protrusions.

[0011] In the specific embodiment of the above-mentioned filtering device with cutting fluid, there are three annular protrusions, forming two grooves.

[0012] In the specific embodiment of the above-mentioned filtering device with cutting fluid, a first mounting hole is arranged at the bottom of the groove, a second mounting hole is arranged on the magnetic member, and the magnetic member is mounted on the baffle through the first mounting hole and the second mounting hole by a second connecting piece.

[0013] In the specific embodiment of the above-mentioned filtering device with cutting fluid, a plurality of magnetic members are arranged along the circumferential direction of the baffle.

[0014] In the specific embodiment of the above-mentioned filtering device with cutting fluid, the height of the baffle is 95 mm; and / or the filter screen is a 20-mesh filter screen.

[0015] A silicon wafer cutting machine includes a frame, a loading device, a spraying device, and a cutting fluid circulation device; a cutting fluid outlet is provided on the frame, and the cutting fluid circulation device is connected to the cutting fluid outlet; the loading device is arranged on the frame and is used for placing silicon wafers to be cut; the spraying device is located on one side of the loading device and is used for spraying cutting fluid onto the surface of the silicon wafer; it further includes a filtering device for the cutting fluid as described in any one of the above, and the filtering device for the cutting fluid is placed at the cutting fluid outlet and is used for filtering the cutting fluid flowing into the cutting fluid circulation device.

[0016] In the case of adopting the above technical solution, the present utility model can block impurities such as silicon wafer silicon mud outside the filtering space, and only the relatively clean cutting fluid in the upper layer of the cutting fluid will enter the filtering space and be filtered by the filter net. Since the silicon wafer silicon mud is blocked outside by the baffle, the filtering device in the present utility model is not easily blocked by the silicon wafer silicon mud, can effectively filter the cutting fluid, improve the cleanliness of the cutting fluid, and improve the cutting yield of the silicon wafer. In addition, when the cutting fluid flows through the magnetic part, the broken steel wire is adsorbed on the baffle by the strong magnetic part and separated from the cutting fluid, and no longer enters the circulation of the cutting fluid, improving the cleanliness of the cutting fluid, avoiding re-breaking caused by the broken steel wire, as well as the wear and aging of the steel wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following describes the preferred embodiments of the present utility model with reference to the drawings, in which:

[0018] Figure 1 is the overall structural schematic diagram of the filtering device for the cutting fluid in the present utility model;

[0019] Figure 2 is the structural schematic diagram of a certain perspective of the filtering device for the cutting fluid in the present utility model;

[0020] Figure 3 is Figure 2 the enlarged view of part A in

[0021] In the figure: 1, filter net; 2, baffle; 3, filtering space; 4, mounting plate; 5, first connecting piece; 6, magnetic part; 7, groove; 8, annular protrusion; 9, first mounting hole; 10, second mounting hole; 11, second connecting piece. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The following describes the preferred embodiments of the present utility model with reference to the drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present utility model and are not used to limit the protection scope of the present utility model. Those skilled in the art can make adjustments according to needs to adapt to specific application scenarios.

[0023] It should be noted that in the description of the present utility model, the terms indicating directions or positional relationships such as "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the relevant devices or components must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, ordinal numbers such as "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0024] In addition, it should also be noted that in the description of the present utility model, unless otherwise clearly specified and defined, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0025] Furthermore, in order to more clearly show the core technical solution of the present utility model, the description of the well-known structure of the wafer cutting machine is omitted in the following description. However, this omission is only for the convenience of description and does not mean that the wafer cutting machine can be without these structures.

[0026] As Figures 1 - 3 shown, the present utility model provides a filtering device for cutting fluid, including: a filter screen 1, which is used to be placed at the cutting fluid outlet; a baffle 2, which surrounds the outside of the filter screen 1 in the circumferential direction. A filtering space 3 is formed between the baffle 2 and the filter screen 1. The baffle 2 is used to block the sediment in the cutting fluid outside the filtering space 3, and the filter screen 1 is used to filter the cutting fluid entering the filtering space 3 from above the baffle 2.

[0027] In this embodiment, in order to solve the problems that the existing filtering device is easy to be blocked and the filtering effect is not good, a baffle 2 is surrounded outside the filter screen 1. When the filtering device is placed at the cutting fluid outlet, impurities such as silicon wafers and silicon mud will sink to the bottom of the cutting fluid due to gravity and are just blocked outside the filtering space 3 by the baffle 2. Only the relatively clean cutting fluid on the upper layer of the cutting fluid will enter the filtering space 3 and be filtered by the filter screen 1. Since the silicon wafers and silicon mud are blocked outside by the baffle 2, the filtering device in the present utility model is not easy to be blocked by silicon wafers and silicon mud, can effectively filter the cutting fluid, improve the cleanliness of the cutting fluid, and improve the cutting yield of the silicon wafers.

[0028] With the continuous progress of filtering, more and more silicon wafers and silicon mud are deposited outside the baffle 2, and the height is also getting higher and higher. There will also be more and more impurities in the upper cutting fluid. In order to improve the filtering effect, it is necessary to regularly clean the silicon mud and silicon wafers outside the baffle 2, and regularly clean or replace the filter screen 1.

[0029] Further, as Figures 1 - 3 shown, the filtering device further includes: a mounting plate 4, the mounting plate 4 is arranged at the bottom of the baffle 2, and the filter net 1 is detachably fixed on the mounting plate 4 through a first connecting member 5. The first connecting member 5 can be a bolt or a screw, etc. When the filter net 1 is damaged, the first connecting member 5 can be removed and the filter net 1 can be quickly replaced.

[0030] In this embodiment, Figure 1 the filter net 1 shown is circular, the baffle 2 is annular, then the mounting plate 4 is also annular, Figure 1 the mounting plate 4 shown is two-layer, the edge of the filter net 1 is clamped between the two-layer mounting plates, mounting holes are arranged on the edge of the filter net 1 and the two-layer mounting plates, the mounting holes can be threaded holes, and the first connecting member 5 sequentially passes through the upper mounting plate 4, the filter net 1 and the lower mounting plate 4 to fix the filter net 1 on the mounting plate 4.

[0031] It should be noted that although Figure 1 the filter net 1 shown is circular, this is not a limitation to the present utility model. Without departing from the basic principle of the present utility model, those skilled in the art can adopt other shaped filter nets 1 and baffles 2, as long as the filtering of the cutting fluid is not affected. For example, rectangles or polygons, etc., these do not depart from the principle of the present utility model, and thus will all fall within the protection scope of the present utility model.

[0032] Although the connection between the filter net 1 and the baffle 2 is described in combination with the first connecting member 5 in the specification, however, the present utility model can obviously adopt other fastening methods, such as snap connection, etc., as long as this method can install the filter net 1 onto the baffle 2.

[0033] Further, as Figures 1 - 3 shown, in order to adsorb the broken steel wires in the cutting fluid in this embodiment, the filtering device further includes a magnetic member 6, the magnetic member 6 is arranged outside the baffle 2 and is used for adsorbing metal impurities in the cutting fluid; the magnetic member 6 can be a magnet.

[0034] In this embodiment, when the cutting fluid flows through the magnetic member 6, the broken steel wires are strongly adsorbed on the baffle 2 by the magnetic member 6, separated from the cutting fluid, and no longer enter the circulation of the cutting fluid, improving the cleanliness of the cutting fluid, avoiding re-breaking caused by the broken steel wires, as well as the wear and aging of the steel wires, and improving the cutting yield of the silicon wafers. As the filtering continues, more and more broken steel wires are adsorbed on the baffle 2, and the broken steel wires on the baffle 2 need to be cleaned regularly.

[0035] Further, as Figures 1 - 3 shown, a groove 7 is arranged outside the baffle 2, the magnetic member 6 is arranged in the groove 7, and the top surface of the magnetic member 6 does not protrude from the top surface of the groove 7.

[0036] In this embodiment, in order to prevent the magnetic member 6 from being knocked and to increase the service life of the magnetic member 6, a groove 7 is provided on the outer side of the baffle 2. The magnetic member 6 is placed in the groove 7, and the top of the groove 7 is higher than the top surface of the magnetic member 6 or is flush with the magnetic member 6, so as to prevent the magnetic member 6 from being knocked after protruding from the top surface of the groove.

[0037] Furthermore, as Figure 2 shown, a plurality of annular protrusions 8 are provided on the outer side of the baffle 2, and a groove 7 is formed between two adjacent annular protrusions 8. In this embodiment, in order to reduce the thickness and weight of the baffle 2, the groove 7 is formed by providing the annular protrusions 8 on the outer side of the baffle 2. A groove 7 is formed between two adjacent annular protrusions 8. In order to improve the adsorption effect on the broken steel wire, a plurality of annular protrusions 8 can be provided to form a plurality of grooves 7.

[0038] Furthermore, as Figures 1 - 3 shown, in this embodiment, three annular protrusions 8 are provided on the outer side of the baffle 2 to form two grooves 7. The magnetic members 6 are arranged in upper and lower layers around the baffle 2. When the cutting fluid passes through the double-layer strong magnets, the broken steel wire can be adsorbed to the maximum extent, improving the cleanliness and cutting yield of the cutting fluid.

[0039] Furthermore, as Figure 3 shown, in this embodiment, in order to install the magnetic member, a first mounting hole 9 is provided at the bottom of the groove 7, a second mounting hole 10 is provided on the magnetic member 6, and the second connecting member 11 mounts the magnetic member 6 on the baffle 2 through the first mounting hole 9 and the second mounting hole 10. The second connecting member 11 can be a bolt or a screw, etc. If the magnetism of a certain magnetic member 6 decreases or disappears, the second connecting member 11 can be removed and the magnetic member 6 can be quickly replaced without affecting the normal use of other magnetic members.

[0040] It should be noted that although the connection between the magnetic member 6 and the baffle 2 is described in combination with the second connecting member 11 in the specification, obviously, the present utility model can adopt other installation methods, such as snap connection, etc., as long as the magnetic member 6 can be installed on the baffle 2.

[0041] Furthermore, as Figure 1 shown, in this embodiment, a plurality of magnetic members 6 are arranged along the circumferential direction of the baffle 2. In order to facilitate the replacement of the damaged magnetic members and to maximize the adsorption effect, the size of each magnetic member 6 is set to be relatively small, and a plurality of them are arranged at intervals along the circumferential direction of the baffle 2. In this way, even if a certain magnetic member 6 is damaged, the adsorption force on the broken steel wire will not decrease too much, and arranging a plurality along the circumferential direction can make the entire circumferential direction of the baffle 2 be covered with the adsorption force of the magnetic members 6 on the broken steel wire.

[0042] It should be noted that although Figure 1The magnetic member 6 shown is square, but this is not a limitation of the present utility model. Without departing from the basic principle of the present utility model, those skilled in the art can adopt magnetic members 6 of other shapes, as long as the adsorption effect of the magnetic member 6 on the broken steel wire is not affected. For example, circular shapes, etc., none of these deviate from the principle of the present utility model, and therefore all will fall within the protection scope of the present utility model.

[0043] Furthermore, in this embodiment, the height of the baffle 2 is 95 mm. During actual application, the height of the baffle 2 can be adjusted according to actual conditions. Further, in this embodiment, the filter screen 1 is a 20-mesh filter screen; during actual application, the size of the filter screen 1 can be adjusted according to actual conditions.

[0044] A silicon wafer cutting machine includes a frame, a loading device, a spraying device, and a cutting fluid circulation device; a cutting fluid outlet and a cutting fluid circulation device connected to the cutting fluid outlet are provided on the frame; the loading device is arranged on the frame and is used for placing the silicon wafer to be cut; the spraying device is located on one side of the loading device and is used for spraying cutting fluid onto the surface of the silicon wafer; it further includes the filtering device for the cutting fluid according to any one of the above, and the filtering device for the cutting fluid is placed at the cutting fluid outlet and is used for filtering the cutting fluid flowing into the cutting fluid circulation device.

[0045] Those skilled in the art can understand that although some of the embodiments described herein include certain features included in other embodiments rather than other features, the combination of the features of different embodiments means that it is within the scope of this application and forms different embodiments. For example, in the claims of this application, any one of the claimed embodiments can be used in any combination.

[0046] So far, the technical solution of the present utility model has been described in conjunction with the preferred embodiments shown in the drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present utility model is obviously not limited to these specific embodiments. Without departing from the principle of the present utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present utility model.

Claims

1. A filtering device for cutting fluid, characterized in that, Comprising: A filter screen (1), which is used to be placed at the cutting fluid outlet; A baffle (2), which circumferentially surrounds the outside of the filter screen (1). A filtering space (3) is formed between the baffle (2) and the filter screen (1). The baffle (2) is used to block the sediment in the cutting fluid outside the filtering space (3), and the filter screen (1) is used to filter the cutting fluid entering the filtering space (3) from above the baffle (2).

2. The filtering device for cutting fluid according to claim 1, characterized in that, The filtering device further comprises: A mounting plate (4), which is arranged at the bottom of the baffle (2). The filter screen (1) is detachably fixed to the mounting plate (4) through a first connecting piece (5).

3. The filtering device for cutting fluid according to claim 1, characterized in that The filtering device further comprises: A magnetic member (6), which is arranged outside the baffle (2) and is used to adsorb metal impurities in the cutting fluid.

4. The filtering device for cutting fluid according to claim 3, wherein: A groove (7) is arranged on the outside of the baffle (2), the magnetic member (6) is arranged in the groove (7), and the top surface of the magnetic member (6) does not protrude from the top surface of the groove (7).

5. The filtering device for cutting fluid according to claim 4, wherein: A plurality of annular protrusions (8) are arranged on the outside of the baffle (2), and the groove (7) is formed between two adjacent annular protrusions (8).

6. The filtering device for cutting fluid according to claim 5, wherein: There are three annular protrusions (8), forming two grooves (7).

7. The filtering device for cutting fluid according to claim 4, wherein: A first mounting hole (9) is arranged at the bottom of the groove (7), a second mounting hole (10) is arranged on the magnetic member (6), and the magnetic member (6) is mounted on the baffle (2) through the first mounting hole (9) and the second mounting hole (10) by a second connecting piece (11).

8. The filtering device for cutting fluid according to claim 3, wherein: A plurality of magnetic members (6) are arranged along the circumference of the baffle (2).

9. The filtering device for cutting fluid according to claim 1, wherein: The height of the baffle (2) is 95 mm; and / or The filter screen (1) is a 20-mesh filter screen.

10. A silicon wafer cutting machine, comprising a frame, a loading device, a spraying device and a cutting fluid circulation device; a cutting fluid outlet is provided on the frame, and the cutting fluid circulation device is connected to the cutting fluid outlet; the loading device is arranged on the frame and is used for placing the silicon wafer to be cut; the spraying device is located on one side of the loading device and is used for spraying cutting fluid on the surface of the silicon wafer; characterized in that, It further comprises the filtering device for cutting fluid according to any one of claims 1-9. The filtering device for cutting fluid is placed at the cutting fluid outlet and is used to filter the cutting fluid flowing into the cutting fluid circulation device.

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