BGA welding heating tuyere

Abstract

The utility model discloses a BGA welding heating tuyere which comprises a shell and a stand column, an air inlet is formed in the top of the shell, a plurality of air guide blades are installed on the outer side of the stand column at equal intervals, and one end of each air guide blade is fixed to the air inlet of the shell. According to the utility model, the six air guide blades are designed on the inner wall of the shell, and the angles between the six air guide blades and the inner wall are 45 degrees, so that high-temperature gas is fully mixed, uniform hot air is generated, and the BGA is effectively heated.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA soldering, in particular to a BGA soldering heating air nozzle. Background Technique

[0002] During the process of repairing the main board, it is necessary to replace the BGA chip on the main board. When replacing the BGA, it is necessary to apply solder paste to the pad position of the PCB, then place the BGA chip on the PCB, and then use the BGA replacement equipment to heat the BGA to melt the solder paste and solder the BGA to the PCB. During the heating process of the BGA, it is necessary to ensure that the temperature of the entire BGA area is uniform, otherwise phenomena such as dry soldering or cold soldering will occur, resulting in rework or scrapping, increasing the repair cost.

[0003] The BGA replacement equipment generates high-temperature gas, which reaches the surface of the BGA through the air nozzle for heating. Currently, most of the air nozzles used are straight-through type, with a higher temperature in the center of the air nozzle and a lower temperature around it. After actual measurement, the temperature difference between the center and the surrounding can reach 6 degrees Celsius, and the welding temperature is uneven, resulting in poor BGA soldering. Therefore, we propose a BGA soldering heating air nozzle. Content of the Utility Model

[0004] The purpose of the utility model is to provide a BGA soldering heating air nozzle to solve the problems in the prior art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A BGA soldering heating air nozzle, including a housing and a column. An air inlet is opened at the top of the housing, and a plurality of air guiding vanes are equidistantly installed on the outer side of the column, and one end of the air guiding vane is fixed at the air inlet of the housing.

[0006] Preferably, a total of six air guiding vanes are provided, and the included angle between the air guiding vane and the top of the housing is 45°.

[0007] Preferably, the top of the housing is connected to a clamping plate through an annular column.

[0008] Preferably, a bottom plate is installed at the bottom end of the column, and the column is an annular column.

[0009] Preferably, the length and width of the housing are both 47 mm, and the height of the housing is 35 mm; the diameter of the annular column is 24 mm.

[0010] Compared with the prior art, the beneficial effect of the utility model is that: 6 air guiding vanes are designed on the inner wall of the housing, with an angle of 45 degrees with the inner wall, so that the high-temperature gas is fully mixed to generate uniform hot air, effectively heating the BGA. Description of the Drawings

[0011] The accompanying drawings are used to provide a further understanding of the present utility model and form a part of the description. Together with the embodiments of the present utility model, they are used to explain the present utility model and do not constitute a limitation to the present utility model. In the accompanying drawings:

[0012] Figure 1 is a schematic structural view of the present utility model;

[0013] Figure 2 is a schematic structural view of the bottom perspective of the present utility model;

[0014] Figure 3 is an exploded view of the present utility model;

[0015] Figure 4 is a schematic structural view of the interior of the present utility model;

[0016] Figure 5 is a schematic structural view of the air guiding vane, bottom plate and column of the present utility model.

[0017] In the figure: 1, outer shell; 2, clamping plate; 3, annular column; 4, air guiding vane; 5, bottom plate; 6, column; 11, air inlet. Detailed implementation manners

[0018] To make the purpose, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model.

[0019] Please refer to Figures 1-5 , in an embodiment of the present utility model, a BGA soldering heating nozzle includes an outer shell 1 and a column 6. An air inlet 11 is opened at the top of the outer shell 1. A plurality of air guiding vanes 4 are equidistantly installed on the outer side of the column 6. One end of the air guiding vane 4 is fixed at the air inlet 11 of the outer shell 1; there are six air guiding vanes 4 in total, and the included angle between the air guiding vane 4 and the top of the outer shell 1 is 45°. When high-temperature gas passes through the nozzle, the air guiding vane changes the direction of the high-temperature gas, and the high-temperature gas changes from a direct discharge mode to a spiral mode and is ejected from the nozzle; the high-temperature gas is fully mixed, effectively reducing the temperature difference between the center and the periphery, achieving the purpose of uniformly heating the BGA.

[0020] The length and width of the outer shell 1 are both 47 mm, and the height of the outer shell 1 is 35 mm; the diameter of the annular column is 24 mm; according to the common BGA sizes on current computers, a nozzle with a 47 mm x 47 mm square size is designed, which can cover the entire BGA area; the top of the outer shell 1 is connected to the clamping plate 2 through the annular column 3; the bottom end of the upright column 6 is provided with a bottom plate 5, and the upright column 6 is an annular upright column.

[0021] The material for making the nozzle is selected as SUS304 stainless steel. The outer shell 1 has an outer dimension of 47 mm x 47 mm and a height of 35 mm. The internal structure is a cylindrical structure with a diameter of 24 mm. Six air guiding vanes are designed on the inner wall, and the angle with the inner wall is 45 degrees, so that the high-temperature gas can be fully mixed to generate uniform hot air, effectively heating the BGA.

[0022] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A BGA soldering heating air nozzle, comprising a housing (1) and a column (6), characterized in that: An air inlet (11) is provided at the top of the outer shell (1). A plurality of air guiding vanes (4) are equidistantly installed on the outer side of the upright column (6), and one end of the air guiding vane (4) is fixed at the air inlet (11) of the outer shell (1).

2. The BGA soldering heating nozzle according to claim 1, characterized in that: Six air guiding vanes (4) are provided in total, and the included angle between the air guiding vane (4) and the top of the outer shell (1) is 45°.

3. The BGA soldering heating nozzle according to claim 1, characterized in that: The top of the outer shell (1) is connected to the clamping plate (2) through an annular column (3).

4. The BGA soldering heating air nozzle according to claim 1, wherein: A bottom plate (5) is installed at the bottom end of the upright column (6), and the upright column (6) is an annular upright column.

5. A BGA soldering heating air nozzle according to claim 3, characterized in that: The length and width of the outer shell (1) are both 47 mm, and the height of the outer shell (1) is 35 mm; the diameter of the annular column (3) is 24 mm.

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