Vehicle-mounted information entertainment system and vehicle
A modular SoC and MCU system in car infotainment systems allows quick adaptation to diverse market needs with high domestic chip utilization, addressing the challenge of cost-effective multifunctionality.
Patent Information
- Application Number
- CN202422091828.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-27
AI Technical Summary
Existing in-vehicle infotainment systems are difficult to quickly adapt to the functional needs of different markets and are costly.
It adopts system-on-chip modules and microcontroller modules, combining multiple interfaces and modules, supports mainstream peripherals in the industry, reserves interfaces to adjust the bill of materials, maximizes support for domestic chips, realizes signal reception, processing and transmission, and sets a shield in the installation box to reduce noise interference.
It has achieved rapid adaptation to the functional needs of different markets and reduced costs. The overall domestic production rate of chip components reaches more than 70%, ensuring the stability and versatility of signal transmission.
Smart Images
Figure CN223100607U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an in-vehicle infotainment system and a vehicle. Background Art
[0002] An in-vehicle infotainment system (IVI) is an integrated information processing system in a vehicle. At present, with the development of the vehicle industry, there is a need for an in-vehicle infotainment system that can quickly adapt to different market function requirements, is multi-functional and low-cost. Summary of the Utility Model
[0003] The purpose of the utility model is to provide an in-vehicle infotainment system and a vehicle, which can quickly adapt to different market function requirements and reduce costs while being multi-functional.
[0004] The utility model discloses an in-vehicle infotainment system, which includes a system-on-chip module and a microcontroller module connected to each other;
[0005] The system-on-chip module is also connected to a video decoder module, a deserialization module and a serialization module. The video decoder module is used to connect to a rearview image system, the deserialization module is used to connect to a panoramic image system, and the serialization module is used to connect to an in-vehicle display system;
[0006] The microcontroller module is also connected to a LIN bus module and a CAN bus module.
[0007] Optionally, the system-on-chip module is also connected to a wireless transceiver module, a wireless communication module, an Ethernet communication module and an in-vehicle communication system. The wireless transceiver module is used to connect to an antenna, the wireless communication module is used to connect to Bluetooth and WiFi, and the Ethernet communication module is used to connect to Ethernet.
[0008] Optionally, the system-on-chip module is also connected to a navigation and positioning module and a sensor module. The navigation and positioning module is used to connect to a GPS navigation and positioning system and a Beidou navigation and positioning system, and the sensor module is used to connect to an accelerometer and a gyroscope.
[0009] Optionally, the system-on-chip module is also connected to a speaker, a microphone, an embedded multimedia card module, a memory card module, an authentication module and a power management module. The power management module is used to connect to a power supply and supply power outward.
[0010] Optionally, the microcontroller module is also connected to the speaker, a memory module and a power supply.
[0011] Optionally, the microcontroller module also receives a body signal and a vehicle driving signal.
[0012] Optionally, the system - on - chip module and the micro - controller module are arranged in an installation box defined by an upper cover and a lower cover. An external shielding cover is arranged outside the installation box, and an internal shielding cover is arranged inside the installation box.
[0013] Optionally, the antenna and the heat sink are arranged on the upper cover.
[0014] Optionally, brackets are arranged on both sides of the installation box.
[0015] The present utility model also discloses a vehicle, including the in - vehicle infotainment system described above.
[0016] Compared with the prior art, the main differences and effects of the present utility model are as follows:
[0017] The in - vehicle infotainment system of the present utility model uses a system - on - chip module and a micro - controller module to receive, process, and transmit in - vehicle signals. Multiple interfaces are reserved, which can support various mainstream peripherals in the industry. The surface - mount bill of materials can be adjusted according to the requirements of the whole vehicle, quickly adapting to different market function requirements. At the same time, it maximally supports domestic chips, and the localization rate of overall chip - type components can reach more than 70%. While having multiple functions, it reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a connection schematic diagram of functional elements in the in - vehicle infotainment system according to the present utility model;
[0019] Figure 2 is an exploded schematic diagram of the in - vehicle infotainment system according to the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0020] To make the objectives and technical solutions of the embodiments of the present utility model clearer, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the drawings of the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. Based on the described embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0021] The first embodiment of the present utility model relates to an in - vehicle infotainment system.
[0022] Figure 1 is a connection schematic diagram of functional elements in the in - vehicle infotainment system according to the present utility model.
[0023] As Figure 1As shown, the in-vehicle infotainment system includes a System on Chip (SoC) module 101 and a Micro Controller Unit (MCU) module 102. The SoC module 101 and the MCU module 102 are connected to each other. More specifically, the SoC module 101 and the MCU module 102 are connected to each other via a GPIO interface, a UART1 interface, and an SPI0 interface. As an example, the SoC module 101 can be an AC8015 chip, and the MCU module 102 can be an AC78406 chip, etc.
[0024] The in-vehicle infotainment system of the present utility model uses the SoC module 101 and the MCU module 102 to receive, process, and send in-vehicle signals, and reserves multiple interfaces, which can support various mainstream peripherals in the industry. The surface mount bill of materials can be adjusted according to the requirements of the whole vehicle to quickly adapt to different market function requirements. At the same time, it maximally supports domestic chips, and the localization rate of overall chip components can reach more than 70%. While having multiple functions, it reduces costs.
[0025] In one embodiment, the SoC module 101 is also connected to a video decoder module 103. More specifically, the SoC module 101 and the video decoder module 103 are connected via a BT656 interface. The video decoder module 103 is used to connect to a rear-view imaging system 104. Among them, the rear-view imaging system 104 includes, for example, a standard-definition rear-view camera (RVC). More specifically, the video decoder module 103 and the rear-view imaging system 104 are connected via a CVBS interface. As an example, the video decoder module 103 can be an ARK7116 chip, etc.
[0026] In one embodiment, the system-on-chip module 101 is further connected to deserialization modules 105a and 105b. More specifically, the system-on-chip module 101 and the deserialization module 105a are connected via a MIPI-CSI0 4-LINE interface, and the system-on-chip module 101 and the deserialization module 105b are connected via a MIPI-CSI1 4-LINE interface. The deserialization modules 105a and 105b are used to connect to panoramic imaging systems 106a and 106b. Among them, the panoramic imaging system 106a includes, for example, an Around View Monitor (AVM) box, and the panoramic imaging system 106b includes, for example, multiple analog high-definition AVMs. More specifically, the deserialization module 105a and the panoramic imaging system 106a are connected via a GMSL interface, and the deserialization module 105b and the panoramic imaging system 106b are connected via a TVI interface. As an example, the deserialization module 105a can be a DS90UB936 chip, and the deserialization module 105b can be a TP2855 chip, etc.
[0027] In one embodiment, the system-on-chip module 101 is further connected to serialization modules 107a and 107b. More specifically, the system-on-chip module 101 and the serialization module 107a are connected via an LVDS0 2+8Line interface and an I2C interface, and the system-on-chip module 101 and the serialization module 107b are connected via an LVDS1 1+4Line interface and an I2C interface. The serialization modules 107a and 107b are used to connect to in-vehicle display systems 108a and 108b. Among them, the in-vehicle display system 108a includes, for example, an in-vehicle entertainment display screen with a resolution of 1920*1080 and a refresh rate of 60fps, and the in-vehicle display system 108b includes, for example, an instrument panel and a driving image display screen with a resolution of 1920*1080 and a refresh rate of 60fps. More specifically, the serialization module 107a and the in-vehicle display system 108a are connected via two FPD-LINK interfaces, and the serialization module 107b and the in-vehicle display system 108b are connected via one FPD-LINK interface. As an example, the serialization module 107a can be a DS90UB947 chip, and the serialization module 107b can be a DS90UB927 chip, etc.
[0028] The in-vehicle infotainment system of the present utility model can be adapted to different vehicle models, support the rear-view imaging function and the panoramic imaging function, and display relevant images on the driving image display screen.
[0029] In one embodiment, the system-on-chip module 101 is also connected to wireless transceiver modules 108a and 108b. More specifically, the system-on-chip module 101 and the wireless transceiver module 108a are connected via an I2C interface and an I2S interface, and the system-on-chip module 101 and the wireless transceiver module 108b are connected via an I2S interface and an SPI1 interface. The wireless transceiver modules 108a and 108b are used to connect to antennas 109a and 109b. As an example, the wireless transceiver module 108a can be a TEF6686 chip, and the wireless transceiver module 108b can be a SAF3602 chip, etc.
[0030] In one embodiment, the system-on-chip module 101 is also connected to a wireless communication module 110. More specifically, the system-on-chip module 101 and the wireless communication module 110 are connected via a PCIE interface, a UART2 interface, and a PCM interface. The wireless communication module 110 is used to connect to Bluetooth 111a, WiFi 111b, etc. As an example, the wireless communication module 110 can be an I1433-sp chip or an I1495-sp chip, etc.
[0031] In one embodiment, the system-on-chip module 101 is also connected to an Ethernet communication module 112. More specifically, the system-on-chip module 101 and the Ethernet communication module 112 are connected via an RMII interface. The Ethernet communication module 112 is used to connect to an Ethernet. As an example, the Ethernet communication module 112 can be a YT8010A chip, etc.
[0032] In one embodiment, the system-on-chip module 101 is also connected to an in-vehicle communication system 113. More specifically, the system-on-chip module 101 and the in-vehicle communication system 113 are connected via a USB_3.1_PORT2 interface, where the in-vehicle communication system 113 includes, for example, a Telematics Box (TBOX).
[0033] The in-vehicle infotainment system of the present utility model can provide multiple communication functions and communicate with a vehicle head unit.
[0034] In one embodiment, the system-on-chip module 101 is also connected to a navigation and positioning module 114. More specifically, the system-on-chip module 101 and the navigation and positioning module 114 are connected via a UART3 interface. The navigation and positioning module 114 is used to connect to a GPS navigation and positioning system 115a, a Beidou navigation and positioning system 115b, etc. As an example, the navigation and positioning module 114 can be a UM220-IVNV chip, etc.
[0035] In one embodiment, the system-on-chip module 101 is also connected to the sensor module 116. More specifically, the system-on-chip module 101 and the sensor module 116 are connected via an I2C interface. The sensor module 116 is used to connect to an accelerometer, a gyroscope, etc. As an example, the sensor module 116 can be an ICM40607 chip, etc.
[0036] The in-vehicle infotainment system of the present utility model can support multiple navigation and positioning systems and can accurately identify the current state of the vehicle.
[0037] In one embodiment, the system-on-chip module 101 is also connected to the speaker 117. More specifically, the system-on-chip module 101 and the speaker 117 are connected via an I2S_MC interface. Optionally, a power amplifier module 118 is also provided between the system-on-chip module 101 and the speaker 117. As an example, the power amplifier module 118 can be a TDA7803 chip, etc.
[0038] In one embodiment, the system-on-chip module 101 is also connected to the microphone 119. More specifically, the system-on-chip module 101 and the microphone 119 are connected via a MIC interface.
[0039] In one embodiment, the system-on-chip module 101 is also connected to the embedded multimedia card module 120. More specifically, the system-on-chip module 101 and the embedded multimedia card module 120 are connected via an eMMC5.1 interface. As an example, the embedded multimedia card module 120 can be an FEMDMW032G chip, etc.
[0040] In one embodiment, the system-on-chip module 101 is also connected to the memory card module 121. More specifically, the system-on-chip module 101 and the memory card module 121 are connected via a 32-bit interface. As an example, the memory card module 121 can be an H54G46BYYQX053 chip or a K4FHE3D4HA chip, etc.
[0041] In one embodiment, the system-on-chip module 101 is also connected to the authentication module 122. More specifically, the system-on-chip module 101 and the authentication module 122 are connected via an I2C interface. As an example, the authentication module 122 can be an MFI343S00177 chip, etc.
[0042] The in-vehicle infotainment system of the present utility model can achieve the writing, storage, and reading of in-vehicle signals and supports authentication and signal communication encoding and decoding functions such as the IOS system.
[0043] In one embodiment, the system-on-chip module 101 is also connected to the power management modules 123a and 123b. More specifically, the system-on-chip module 101 and the power management module 123a are connected via the USB_OTG_PORT0 interface, and the system-on-chip module 101 and the power management module 123b are connected via the USB_2.0_PORT1 interface. The power management modules 123a and 123b are used to connect to a power source (such as a battery) and supply power outward (such as providing a 5V USB voltage for charging electronic products). As an example, the power management modules 123a and 123b can both be MPS4228 chips or the like.
[0044] In one embodiment, the microcontroller module 102 is also connected to the LIN bus module 124. More specifically, the microcontroller module 102 and the LIN bus module 124 are connected via the UART interface. As an example, the LIN bus module 124 can be a SIT1021 chip.
[0045] In one embodiment, the microcontroller module 102 is also connected to the CAN bus modules 125a and 125b. More specifically, the microcontroller module 102 and the CAN bus modules 125a and 125b are both connected via the CAN interface. As an example, the CAN bus module 125a can be a SIT1043 chip or the like, and the CAN bus module 125b can be a SIT1042 chip or the like.
[0046] The in-vehicle infotainment system of the present utility model can support LIN data transceiver and CAN data transceiver.
[0047] In one embodiment, the microcontroller module 102 is also connected to the speaker 117. More specifically, the microcontroller module 102 and the speaker 117 are connected via the I2C interface. Optionally, a power amplifier module 118 is also provided between the microcontroller module 102 and the speaker 117. As an example, the power amplifier module 118 can be a TDA7803 chip or the like.
[0048] In one embodiment, the microcontroller module 102 is also connected to the memory module 126. More specifically, the microcontroller module 102 and the memory module 126 are connected via the I2C interface. As an example, the memory module 126 can be an EEPROM chip (such as an EEPROM chip of the GT24C series) or the like.
[0049] In one embodiment, the microcontroller module 102 is also connected to a power supply 127. More specifically, the microcontroller module 102 and the power supply 127 are connected via a BATT interface. As an example, the power supply 127 can be an LDO power chip (such as a JWQ7821 power chip) or a DC / DC power chip (such as an SA24403 power chip, an SA24406 power chip, or an SA23003 power chip), etc.
[0050] In one embodiment, the microcontroller module 102 also receives a body signal 128 and a vehicle driving signal 129. More specifically, the microcontroller module 102 receives the vehicle driving signal 129 via a STRG_SW interface. Among them, the body signal 128 includes a vehicle identification code, etc., and the vehicle driving signal 129 includes a trip mileage signal, etc.
[0051] Figure 2 It is an exploded view of the in-vehicle infotainment system according to the present utility model.
[0052] As Figure 2 shown, the in-vehicle infotainment system of the present utility model adopts a vehicle standard single DIN design. The system-on-chip module 101 and the microcontroller module 102 are arranged in an installation box defined by an upper cover 201 and a lower cover 202.
[0053] In one embodiment, an external shielding cover 203 is provided outside the installation box, and an internal shielding cover 204 is provided inside the installation box. Among them, the external shielding cover 203 can shield external noise signals, and the internal shielding cover 204 can shield internal noise signals (such as power signals, etc.), so as to avoid affecting the transmission of in-vehicle signals.
[0054] In one embodiment, antennas 109a, 109b and a heat sink 205 are provided on the upper cover 201. Among them, the heat sink 205 can dissipate the heat inside the installation box to the external environment, ensuring that the temperature of internal components such as the system-on-chip module 101 and the microcontroller module 102 will not be too high during normal operation, thereby extending the service life.
[0055] In one embodiment, brackets 206a, 206b are provided on both sides of the installation box. Among them, through the mounting holes on the brackets 206a, 206b, the installation box and its internal components can be fixed to a specified position of the vehicle.
[0056] The second embodiment of the present utility model relates to a vehicle, which includes the in-vehicle infotainment system described above.
[0057] The first embodiment is a device embodiment corresponding to this embodiment, and this embodiment can be implemented in cooperation with the first embodiment. The relevant technical details mentioned in the first embodiment are still valid in this embodiment. To avoid repetition, they will not be elaborated here. Correspondingly, the relevant technical details mentioned in this embodiment can also be applied to the first embodiment.
[0058] It should be noted that in the claims and the specification of this patent, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one" does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.
[0059] In the drawings, some structural or method features may be shown in a particular arrangement and / or order. However, it should be understood that such a particular arrangement and / or ordering may not be required. Instead, in some embodiments, these features may be arranged in a manner and / or order different from that shown in the illustrative drawings. Additionally, the inclusion of a structural or method feature in a particular figure does not imply that such a feature is required in all embodiments, and in some embodiments, these features may not be included or may be modified or combined with other features.
[0060] Although the present utility model has been illustrated and described by referring to certain preferred embodiments thereof, those of ordinary skill in the art should understand that various changes may be made in form and detail without departing from the spirit and scope of the present utility model.
Claims
1. An in-vehicle infotainment system, characterized in that, The in-vehicle infotainment system includes a system-on-chip module and a microcontroller module that are interconnected; The system-on-chip module is further connected to a video decoder module, a deserialization module, and a serialization module. The video decoder module is used to connect to a rear-view imaging system, the deserialization module is used to connect to a panoramic imaging system, and the serialization module is used to connect to an in-vehicle display system; The microcontroller module is further connected to a LIN bus module and a CAN bus module.
2. The in-vehicle infotainment system according to claim 1, wherein The system-on-chip module is further connected to a wireless transceiver module, a wireless communication module, an Ethernet communication module, and an in-vehicle communication system. The wireless transceiver module is used to connect to an antenna, the wireless communication module is used to connect to Bluetooth and WiFi, and the Ethernet communication module is used to connect to an Ethernet.
3. The in-vehicle infotainment system according to claim 2, wherein The system-on-chip module is further connected to a navigation and positioning module and a sensor module. The navigation and positioning module is used to connect to a GPS navigation and positioning system and a Beidou navigation and positioning system, and the sensor module is used to connect to an accelerometer and a gyroscope.
4. The in-vehicle infotainment system according to claim 3, characterized in that, The system-on-chip module is further connected to a speaker, a microphone, an embedded multimedia card module, a memory card module, an authentication module, and a power management module. The power management module is used to connect to a power source and supply power externally.
5. The in-vehicle infotainment system according to claim 4, wherein The microcontroller module is further connected to the speaker, a memory module, and a power source.
6. The in-vehicle infotainment system according to claim 5, wherein, The microcontroller module further receives a body signal and a vehicle driving signal.
7. The in-vehicle infotainment system according to claim 6, wherein, The system-on-chip module and the microcontroller module are disposed in an installation box defined by an upper cover and a lower cover. An external shielding cover is provided outside the installation box, and an internal shielding cover is provided inside the installation box.
8. The in-vehicle infotainment system according to claim 7, characterized in that, The antenna and a heat sink are provided on the upper cover.
9. The in-vehicle infotainment system according to claim 8, wherein, Brackets are provided on both sides of the installation box.
10. A vehicle, characterized in that, An in-vehicle infotainment system according to any one of claims 1 to 9 is included.