Printed circuit board (PCB) electroplating device

Abstract

The utility model discloses a PCB (Printed Circuit Board) electroplating device, which relates to the technical field of electroplating devices, and comprises an electroplating pool and supporting columns symmetrically arranged at the top of the electroplating pool, a threaded rod and a limiting sliding rod are arranged between the supporting columns, the limiting sliding rod is rotationally arranged, a transverse seat is arranged on the outer side of the threaded rod and the outer side of the limiting sliding rod in a matched manner, and the transverse seat is provided with a clamping groove. A servo motor drives a heating pipe to conduct reciprocating motion type heating in an electroplating solution, the electroplating solution in all areas in an electroplating pool can be evenly heated, when the heating pipe moves, the electroplating solution flows through the interior of a flow channel pipe and can drive a propeller to rotate, and therefore the electroplating solution can be evenly heated. And the propeller drives the stirring shaft and the stirring blades to synchronously rotate through the second bevel gear and the first bevel gear, so that ions precipitated in the bottom area of the electroplating tank can be stirred while heating is carried out, the ions can be more uniformly distributed in an electroplating solution, the electroplating effect is further improved, the deposition speed is further increased, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating devices, in particular to a PCB board electroplating device. Background Art

[0002] PCB board generally refers to printed circuit board. The design of printed circuit board is mainly layout design. Circuit board makes the circuit miniaturized and intuitive. It plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. PCB board needs to be electroplated during the production process.

[0003] The Chinese patent authorization announcement number is CN219430159U, and the name is a PCB board electroplating device, including an electroplating cylinder, a top plate is arranged at the upper end of the electroplating cylinder, a first vertical plate and a second vertical plate are slidably installed on the left and right sides of the lower end of the top plate, a fixed inner shell is installed at the lower end of the first vertical plate, a pull rod is installed inside the fixed inner shell, a reset spring and an inner disk are installed from left to right on the side of the outside of the pull rod located inside the fixed inner shell, a dynamic clamp shell is installed on the side of the right end of the outside of the pull rod located outside the fixed inner shell, a fixed clamp shell is installed on the left side of the lower end of the second vertical plate, and a clamping cavity is arranged inside the dynamic clamp shell and the fixed clamp shell, and the PCB board is fixed by clamping the two ends to match the edge of the shell to wrap, so as to improve the stability of the PCB board fixation and prevent it from falling off during electroplating;

[0004] The disadvantages of the above-mentioned prior art solutions are that: although the above-mentioned solutions can form a stable fixation for the PCB board to prevent it from falling off during electroplating, during electroplating, the device is carried out at room temperature, and the temperature of the electroplating solution is easily too low, resulting in a slower diffusion rate of ions in the electroplating solution and a lower deposition rate, which affects production efficiency and may cause the surface quality of the coating to deteriorate. Utility Model Content

[0005] The purpose of the utility model is to provide a PCB board electroplating device to solve the technical problems mentioned in the above background technology.

[0006] The technical problem to be solved by the utility model can be achieved through the following technical solutions:

[0007] A PCB electroplating device comprises an electroplating tank and a support column symmetrically arranged on the top of the electroplating tank;

[0008] A threaded rod and a limiting slide rod are arranged between the support columns, and the limiting slide rod is rotatably arranged. A transverse seat is arranged on the outer sides of the threaded rod and the limiting slide rod. A suspension rod is arranged at the bottom of the limiting slide rod. A mounting frame is arranged at the bottom end of the suspension rod, and the mounting frame is vertically distributed. A heating pipe is mounted inside the mounting frame. A servo motor for driving the threaded rod is arranged on one side of a group of the support columns. Flow channels are symmetrically arranged at the bottom of the mounting frame, and the flow channels are horizontally distributed. A stirring shaft is rotatably arranged inside the flow channels. The bottom end of the stirring shaft penetrates through the flow channels and is provided with stirring blades. A first bevel gear is arranged on the outer side of the stirring shaft. A rotating shaft is mounted inside the flow channels. A propeller is arranged at one end of the rotating shaft. A second bevel gear meshing with the first bevel gear is arranged at the other end of the rotating shaft.

[0009] As a further scheme of the utility model: Temperature sensors are arranged on the inner walls on both sides of the electroplating bath. The first bevel gear is located inside the flow channels, and the rotating shaft is located on one side of the first bevel gear.

[0010] As a further scheme of the utility model: A cross beam is arranged on the side where the support columns are close to each other, and a limiting groove is formed at the top of the cross beam.

[0011] As a further scheme of the utility model: A cathode hanging rod is sleeved outside a group of the limiting grooves. A limiting frame is arranged at the bottom end of the cathode hanging rod. A guide rod is slidably sleeved at the bottom end of the limiting frame. A clamping plate is arranged at the bottom of the guide rod.

[0012] As a further scheme of the utility model: A clamping spring is sleeved on the outer side of the guide rod. A plurality of groups of plate body clamping grooves are formed on the sides where the limiting frame and the clamping plate are close to each other.

[0013] As a further scheme of the utility model: An anode hanging rod is sleeved outside the other group of the limiting grooves. A fixed shaft is arranged at the bottom end of the anode hanging rod. A waste liquid pipe is arranged on one side of the electroplating bath.

[0014] The beneficial effects of the utility model:

[0015] When the utility model electroplates a PCB board, the servo motor drives the heating pipe to reciprocally move and heat in the electroplating solution, so as to uniformly heat the electroplating solution in each area of the electroplating bath. When the heating pipe moves, the electroplating solution flowing through the inside of the flow channels can drive the propeller to rotate. The propeller drives the stirring shaft and the stirring blades to rotate synchronously through the second bevel gear and the first bevel gear. Thus, when heating, the ions precipitated in the bottom area of the electroplating bath can be stirred, so that the ions can be more uniformly distributed in the electroplating solution, further improving the electroplating effect and deposition speed, and improving the production efficiency. Description of the drawings

[0016] The present utility model will be further described below in conjunction with the accompanying drawings.

[0017] Figure 1 It is a three-dimensional schematic diagram of the overall device in the present utility model;

[0018] Figure 2 It is a schematic diagram of the structure of the cathode hanging rod in the present utility model;

[0019] Figure 3 It is a schematic diagram of the structure of the anode hanging rod in the present utility model;

[0020] Figure 4 It is a schematic diagram of the overall structure of the device in the present utility model;

[0021] Figure 5 It is the present utility model Figure 4 An enlarged schematic diagram at position A.

[0022] In the figure: 1, electroplating bath; 2, support column; 3, cross beam; 4, limit groove; 5, cathode hanging rod; 6, limit frame; 7, guide rod; 8, clamping plate; 9, clamping tension spring; 10, plate body card slot; 11, anode hanging rod; 12, fixed shaft; 13, waste liquid pipe; 14, threaded rod; 15, limit slide bar; 16, transverse seat; 17, suspension rod; 18, erection frame; 19, heating pipe; 20, servo motor; 21, flow channel pipe; 22, stirring shaft; 23, stirring blade; 24, first bevel gear; 25, rotating shaft; 26, propeller; 27, second bevel gear. Specific embodiments

[0023] The technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0024] Such as Figures 1-5As shown in the figure, a PCB board electroplating device includes an electroplating bath 1 and support columns 2 symmetrically arranged on the top of the electroplating bath 1. A cross beam 3 is arranged on the side of the support columns 2 close to each other. A limiting groove 4 is opened on the top of the cross beam 3. A cathode hanging rod 5 is sleeved on the outside of a group of limiting grooves 4. A limiting frame 6 is arranged at the bottom end of the cathode hanging rod 5. A guide rod 7 is slidably sleeved at the bottom end of the limiting frame 6. A clamping plate 8 is arranged at the bottom of the guide rod 7. A clamping spring 9 is sleeved on the outside of the guide rod 7. A number of board body clamping grooves 10 are opened on the sides of the limiting frame 6 and the clamping plate 8 close to each other. An anode hanging rod 11 is sleeved on the outside of the other group of limiting grooves 4. A fixed shaft 12 is arranged at the bottom end of the anode hanging rod 11. A waste liquid pipe 13 is arranged on one side of the electroplating bath 1. When the device electroplates the PCB board, the fixed shaft 12 arranged on the anode hanging rod 11 can be used to install the coating metal block to provide metal ions for electroplating. The staff pulls the clamping plate 8, and after the upper and lower ends of the PCB board to be electroplated are clamped into the board body clamping grooves 10 and then let go, the clamping plate 8 is retracted by the pulling force of the clamping spring 9 to form extrusion on the PCB board, thus forming stable fixation and ensuring the stability of the PCB board during electroplating;

[0025] A threaded rod 14 and a limiting slide rod 15 are arranged between the support columns 2, and the limiting slide rod 15 is rotatably arranged. A transverse seat 16 is arranged on the outer sides of the threaded rod 14 and the limiting slide rod 15. A suspension rod 17 is arranged at the bottom of the limiting slide rod 15. A mounting frame 18 is arranged at the bottom end of the suspension rod 17, and the mounting frame 18 is vertically distributed. A heating pipe 19 is mounted inside the mounting frame 18. A servo motor 20 for driving the threaded rod 14 is arranged on one side of a group of support columns 2. Flow channel pipes 21 are symmetrically arranged at the bottom of the mounting frame 18, and the flow channel pipes 21 are horizontally distributed. A stirring shaft 22 is rotatably arranged inside the flow channel pipes 21. A stirring blade 23 is arranged at the bottom end of the stirring shaft 22 through the flow channel pipes 21. A first bevel gear 24 is arranged on the outer side of the stirring shaft 22, and the first bevel gear 24 is located inside the flow channel pipes 21. A rotating shaft 25 is mounted inside the flow channel pipes 21, and the rotating shaft 25 is located on one side of the first bevel gear 24. A propeller 26 is arranged at one end of the rotating shaft 25. A second bevel gear 27 meshing with the first bevel gear 24 is arranged at the other end of the rotating shaft 25. Temperature sensors are arranged on the inner walls on both sides of the electroplating bath 1. When the device is in use, the staff can start the servo motor 20 to drive the threaded rod 14 to rotate through the servo motor 20, thereby driving the transverse seat 16 to move reciprocally, so that the heating pipe 19 can move and heat in the electroplating solution, so as to uniformly heat the electroplating solution in each area of the electroplating bath 1. The temperature of the electroplating solution can be monitored in real time through the arranged temperature sensors. When the heating pipe 19 moves, the flow channel pipes 21 also move together. The electroplating solution flowing through the inside of the flow channel pipes 21 can drive the propeller 26 to rotate. The propeller 26 drives the second bevel gear 27 to rotate. The second bevel gear 27 meshes with the first bevel gear 24, so that the stirring shaft 22 and the stirring blade 23 rotate synchronously, and the ions precipitated in the bottom area of the electroplating bath 1 can be stirred, so that the ions can be more uniformly distributed in the electroplating solution, improving the electroplating effect.

[0026] The above has described an embodiment of the present invention in detail, but the described content is only the preferred embodiment of the present invention and cannot be considered as used to limit the scope of implementation of the present invention. All equal changes and improvements made according to the scope of application of the present invention shall still fall within the scope covered by the patent of the present invention.

Claims

1. A PCB board electroplating device, comprising an electroplating bath (1) and support columns (2) symmetrically arranged on the top of the electroplating bath (1); characterized in that: A threaded rod (14) and a limit slide rod (15) are arranged between the support columns (2), and the limit slide rod (15) is rotatably arranged. A transverse seat (16) is arranged on the outer sides of the threaded rod (14) and the limit slide rod (15). A suspension rod (17) is arranged at the bottom of the limit slide rod (15). The bottom end of the suspension rod (17) is provided with an erection frame (18), and the erection frame (18) is vertically distributed. A heating pipe (19) is erected inside the erection frame (18). A servo motor (20) for driving the threaded rod (14) is arranged on one side of a group of the support columns (2). Flow channel pipes (21) are symmetrically arranged at the bottom of the erection frame (18), and the flow channel pipes (21) are horizontally distributed. A stirring shaft (22) is rotatably arranged inside the flow channel pipes (21). The bottom end of the stirring shaft (22) penetrates through the flow channel pipes (21) and is provided with stirring blades (23). A first bevel gear (24) is arranged on the outer side of the stirring shaft (22). A rotating shaft (25) is erected inside the flow channel pipes (21). A propeller (26) is arranged at one end of the rotating shaft (25). A second bevel gear (27) meshing with the first bevel gear (24) is arranged at the other end of the rotating shaft (25).

2. The PCB plating device according to claim 1, characterized in that, Temperature sensors are arranged on the inner walls of both sides of the electroplating bath (1). The first bevel gear (24) is located inside the flow channel pipes (21), and the rotating shaft (25) is located on one side of the first bevel gear (24).

3. The electroplating device for PCB boards according to claim 1, characterized in that, A cross beam (3) is arranged on the side of the support columns (2) close to each other. A limit groove (4) is opened at the top of the cross beam (3).

4. A PCB plating device according to claim 3, characterized in that, A cathode hanging rod (5) is sleeved outside a group of the limit grooves (4). A limit frame (6) is arranged at the bottom end of the cathode hanging rod (5). A guide rod (7) is slidably sleeved at the bottom end of the limit frame (6). A clamping plate (8) is arranged at the bottom of the guide rod (7).

5. A PCB plating device according to claim 4, wherein, A clamping spring (9) is sleeved on the outer side of the guide rod (7). A number of plate body clamping grooves (10) are opened on the sides of the limit frame (6) and the clamping plate (8) close to each other.

6. The electroplating device for a PCB board according to claim 3, characterized in that, An anode hanging rod (11) is sleeved outside the other group of the limit grooves (4). A fixed shaft (12) is arranged at the bottom end of the anode hanging rod (11). A waste liquid pipe (13) is arranged on one side of the electroplating bath (1).

Images