Starting-up circuit, device and system based on single-chip microcomputer
The boot-up circuit for MCU systems addresses boot failures by enabling alternative power-on via a long press and static protection, ensuring reliable operation even in MCU errors, thus improving system flexibility and reliability.
Patent Information
- Application Number
- CN202422154221.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-02
AI Technical Summary
The existing MCU program error causes the problem of failure to boot, especially in the case of MCU abnormality, the power-down save and power-down alarm functions cannot be realized.
Design a startup circuit based on a microcontroller. By setting a delay circuit and a startup control circuit, when the MCU is abnormal, press and hold the power button to skip the MCU, use the delay circuit to realize the startup function, and protect the microcontroller from electrostatic interference through an electrostatic protector.
The startup of the circuit system is improved in abnormal situations, ensuring the storage and safe shutdown of important data, and reducing the impact of static electricity on the microcontroller.
Smart Images

Figure CN223108292U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of single-chip microcomputers, and specifically, to a power-on circuit, device, and system based on a single-chip microcomputer. Background Art
[0002] Currently, an MCU is often used to control the power-on signal. If an MCU program error occurs, the device cannot be powered on. For example, in the case of a startup failure caused by slow power-on, for products that require power-down preservation or power-down alarm functions, the characteristic of slow discharge of a large-capacity capacitor is used to implement this function so that when the external power supply is powered down, the system can rely on the energy storage of the capacitor to maintain the time required for the system to save important data and safely shut down. Therefore, it is necessary to propose a circuit system that skips the MCU and realizes power-on in the case of MCU abnormalities. Summary of the Utility Model
[0003] The purpose of this application is to provide a power-on circuit, device, and system based on a single-chip microcomputer to solve the problem that the existing MCU program error cannot power on.
[0004] To solve the above problems, this application adopts the following technical solutions to be implemented:
[0005] The first aspect of this application provides a power-on circuit based on a single-chip microcomputer. The power-on circuit based on a single-chip microcomputer includes: a power supply module, a power-on control circuit, a single-chip microcomputer, a field effect transistor unit, a delay circuit, and a HEADER module. The power supply module is respectively connected to the power-on control circuit, the single-chip microcomputer, the field effect transistor unit, the delay circuit, and the HEADER module. The single-chip microcomputer is respectively connected to the field effect transistor unit, the power-on control circuit, the delay circuit, and the HEADER module. Among them, when the MCU is in a normal state, pressing the power button briefly, the MCU receives the button signal and executes the power-on operation; when the MCU is abnormal, pressing the power button briefly, the MCU receives the button signal but cannot normally send out the power-on signal. Pressing the power button long, the delay circuit is in an operating state, and the button signal is sent to the subsequent circuit skipping the MCU to achieve power-on.
[0006] By setting a preset time, the judgment of the pressing duration of the power button is realized, thereby realizing different operation modes, skipping the MCU to realize the power-on function in the case of MCU abnormality, and further solving the problem of inability to power on due to MCU program error, improving the flexibility and reliability of the circuit system.
[0007] Furthermore, the power-on circuit based on a single-chip microcomputer includes an electrostatic protector, and the electrostatic protector is respectively connected to the single-chip microcomputer and the HEADER module.
[0008] By adding an electrostatic protector, the single-chip microcomputer is protected from static electricity, improving the reliability and stability of the circuit. Since the key part of the power-on circuit connected to external devices is vulnerable to static interference, the electrostatic protector also helps protect the HEADER module.
[0009] Furthermore, the field effect transistor unit includes a plurality of field effect transistors. One ends of the plurality of field effect transistors are all connected to the power supply terminal, and the other ends of the plurality of field effect transistors are all connected to different pins of the single-chip microcomputer.
[0010] The plurality of field effect transistors allow different management strategies to be implemented for different parts of the single-chip microcomputer. By controlling each field effect transistor separately, fine control of the pins of the single-chip microcomputer can be achieved, which helps improve the performance and reliability of the entire system.
[0011] Furthermore, the single-chip microcomputer includes a control chip and a first impedance circuit. One end of the first impedance circuit is connected to the control chip, and the other end of the first impedance circuit is connected to the power supply terminal. The control chip is respectively connected to the field effect transistor unit, the power-on control circuit, the delay circuit, and the HEADER module.
[0012] Due to the setting of the first impedance circuit, the power supply can be precisely controlled by the control chip, reducing energy consumption, improving the stability and reliability of the system. At the same time, the first impedance circuit can prevent overcurrent and overvoltage, protecting the control chip and the entire circuit system from damage.
[0013] Furthermore, the single-chip microcomputer includes a first capacitive reactance circuit. One end of the first capacitive reactance circuit is connected to the control chip, and the other end of the first capacitive reactance circuit is grounded.
[0014] The introduction of the first capacitive reactance circuit can reduce signal interference and electromagnetic interference, improve the signal integrity of the circuit, improve the response characteristics of the system, reduce signal noise, enabling the control chip to process signals more accurately, thereby ensuring the stability and reliability of the signals received by the control chip.
[0015] Furthermore, the single-chip microcomputer includes a second capacitive reactance circuit. One end of the second capacitive reactance circuit, the first impedance circuit, and the control chip are connected in sequence, and the other end of the second capacitive reactance circuit is grounded.
[0016] By placing the second capacitive reactance circuit between the control chip and the first impedance circuit, noise and interference in the power supply and the circuit are filtered out, improving the purity of the signal and ensuring that the signal received by the control chip is more stable.
[0017] Furthermore, the delay circuit includes a plurality of LED lamp assemblies. The plurality of LED lamp assemblies are connected in sequence, and one end of each LED lamp assembly is connected to the power supply terminal.
[0018] By connecting multiple LED lamp components in sequence, an intuitive visual indication can be provided when the delay circuit is activated, enabling the user to clearly see the status of the delay process.
[0019] Furthermore, the delay circuit includes a third capacitive reactance circuit. One end of the third capacitive reactance circuit is grounded, and the other end is connected to the LED lamp component.
[0020] The introduction of the third capacitive reactance circuit can improve the stability of the circuit. Through its filtering effect, it reduces the noise and interference in the power supply and the circuit, improving the reliability and stability of the circuit.
[0021] The second aspect of the present application provides a power-on device based on a single-chip microcomputer, including a housing with a receiving cavity formed inside, and the power-on circuit based on a single-chip microcomputer described in any one of the above, which is disposed inside the housing.
[0022] The third aspect of the present application provides a power-on system based on a single-chip microcomputer, and the power-on system based on a single-chip microcomputer includes the power-on device described above.
[0023] Compared with the prior art, the beneficial effects of the present application are as follows: When the MCU malfunctions, if the power button of the power module 100 is pressed briefly, and the MCU receives the button signal but cannot normally send out the power-on signal and cannot power on through the MCU. At this time, when the duration of pressing the power button exceeds the preset time (long press), the delay circuit and the power-on control circuit operate to enable power-on, thus skipping the MCU to achieve the power-on function in the case of MCU abnormality, thereby solving the problem of inability to power on caused by MCU program errors and improving the flexibility and reliability of the circuit system. Description of the Drawings
[0024] Figure 1 It is a system diagram of a power-on circuit based on a single-chip microcomputer provided by an embodiment of the present application;
[0025] Figure 2 It is a schematic diagram of a single-chip microcomputer provided by an embodiment of the present application;
[0026] Figure 3 It is a schematic diagram of a field effect transistor unit provided by an embodiment of the present application; and
[0027] Figure 4 It is a schematic diagram of a power-on control circuit and a delay circuit provided by an embodiment of the present application.
[0028] Description of the Reference Numerals:
[0029] 100. Power supply module; 200. Power-on control circuit; 300. Microcontroller; 310. Control chip; 320. First impedance circuit; 330. First capacitive reactance circuit; 340. Second capacitive reactance circuit; 400. Field effect transistor unit; 410. Field effect transistor; 500. Delay circuit; 510. LED lamp assembly; 520. Third capacitive reactance circuit; 600. HEADER module; 700. Electrostatic protector. Detailed implementation manners
[0030] The following will describe in detail the detailed implementation manners of the present application with reference to the accompanying drawings.
[0031] It should be noted that, without conflict, the embodiments in the present application and the technical features in the embodiments may be combined with each other. The detailed description in the detailed implementation manners should be understood as an explanatory illustration of the purpose of the present application and should not be regarded as an improper limitation to the present application.
[0032] It should be understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings. These orientation terms are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0033] Figure 1 It is a system diagram of a power-on circuit based on a microcontroller provided by an embodiment of the present application. Figure 2 It is a schematic diagram of a microcontroller provided by an embodiment of the present application. Figure 3 It is a schematic diagram of a field effect transistor unit provided by an embodiment of the present application. 4 is a schematic diagram of a power-on control circuit and a delay circuit provided by an embodiment of the present application. As Figures 1 to 4As shown in the figure, an embodiment of the present application provides a power-on circuit based on a single-chip microcomputer, including: a power supply module 100, a power-on control circuit 200, a single-chip microcomputer 300, a field effect transistor unit 400, a delay circuit 500, and a HEADER module 600. The power supply module 100 is respectively connected to the power-on control circuit 200, the single-chip microcomputer 300, the field effect transistor unit 400, the delay circuit 500, and the HEADER module 600. The single-chip microcomputer 300 is respectively connected to the field effect transistor unit 400, the power-on control circuit 200, the delay circuit 500, and the HEADER module 600. Among them, when the MCU is in a normal state, short-pressing the power button of the power supply module 100, the MCU receives the button signal, and the circuit powers on normally; when the MCU is abnormal, short-pressing the power button of the power supply module 100, the MCU receives the button signal but cannot normally send out the power-on signal and cannot power on through the MCU. At this time, long-pressing the power button, when the duration of pressing the power button is greater than the preset time, the delay circuit 500 is in an operating state, and the button signal is sent to the subsequent circuit to skip the MCU to achieve the power-on function, thus solving the problem of inability to power on caused by an MCU program error.
[0034] Specifically, the power supply module 100 is respectively connected to the power-on control circuit 200, the single-chip microcomputer 300, the field effect transistor unit 400, the delay circuit 500, and the HEADER module 600. The power supply module 100 provides power for the entire circuit system. The single-chip microcomputer 300 is respectively connected to the field effect transistor unit 400, the power-on control circuit 200, the delay circuit 500, and the HEADER module 600. Among them, the single-chip microcomputer 300 is used to control the operation of the entire circuit system. The power-on control circuit 200 is connected to the BIOS. The power-on control circuit 200 is used to control the power switch. The delay circuit 500 is connected to the power-on control circuit 200. The delay circuit 500 is used to implement the power-on function when the duration of pressing the power button exceeds the preset time. The field effect transistor unit 400 is connected to the single-chip microcomputer 300 and the power-on control circuit 200. The HEADER module 600 is connected to the single-chip microcomputer 300. The HEADER module 600 is used for data communication with other circuit modules. When the MCU is in a normal state, short-pressing the power button of the power supply module 100. Short-pressing means that the duration of pressing the power button is less than the preset time. The MCU receives the button signal, and the circuit powers on normally; when the MCU is abnormal, short-pressing the power button of the power supply module 100, the MCU receives the button signal but cannot normally send out the power-on signal and cannot power on through the MCU. At this time, long-pressing the power button, which means that the duration of pressing the power button is greater than the preset time, the delay circuit 500 is in an operating state, and the button signal is sent to the subsequent circuit to skip the MCU to achieve the power-on function, thus solving the problem of inability to power on caused by an MCU program error.
[0035] When the user presses the power button, the power module 100 supplies power to the entire circuit system, detects the pressing duration of the power button. If the pressing duration of the power button exceeds the preset time (long press), the delay circuit 500 starts to operate and transmits a signal to the power-on control circuit 200. After receiving the signal from the delay circuit 500, the power-on control circuit 200 controls the field effect transistor unit 400 to conduct, thereby supplying power to the microcontroller 300. The microcontroller 300 starts and executes the program, and conducts data communication with other circuit modules through the HEADER module 600. The microcontroller 300 controls the power switch through the field effect transistor unit 400 to make the circuit system operate normally. If the pressing duration of the power button is less than the preset time, the delay circuit 500 is in a non-operating state, and the power-on control circuit 200 does not control the field effect transistor unit 400 to conduct, so the circuit system does not start.
[0036] By setting the preset time, the judgment of the pressing duration of the power button is realized, thereby realizing different operation modes, skipping the MCU to achieve the power-on function in the case of MCU abnormality, and further solving the problem of inability to power on due to MCU program errors, improving the flexibility and reliability of the circuit system.
[0037] In some embodiments, the power-on circuit based on the microcontroller includes an electrostatic protector 700, and the electrostatic protector 700 is respectively connected to the microcontroller 300 and the HEADER module 600.
[0038] Specifically, the electrostatic protector 700 is connected to the microcontroller 300 and the HEADER module 600 to ensure the safety of the circuit system. The function of the electrostatic protector 700 is to prevent static electricity from damaging the microcontroller 300 and the HEADER module 600. During the operation of the circuit system, the electrostatic protector 700 is always in a working state, monitoring and eliminating potential static electricity threats in real time. For example, the electrostatic protector 700 can be implemented by components such as zinc oxide diodes (Zener diodes) or silicon controlled rectifier diodes (SCRs), which have a high breakdown voltage and stable conduction characteristics, and can effectively absorb and disperse static electricity energy. To further improve the anti-static ability of the circuit system, anti-static materials can be used in the circuit board (PCB) design and the circuit system can be grounded.
[0039] By adding the electrostatic protector 700, the microcontroller 300 is protected from the influence of static electricity, improving the reliability and stability of the circuit. Since the key part of the power-on circuit connected to external devices is vulnerable to static electricity interference, the electrostatic protector 700 also helps to protect the HEADER module 600.
[0040] In some embodiments, the field - effect transistor unit 400 includes a plurality of field - effect transistors 410. One ends of the plurality of field - effect transistors 410 are all connected to the power supply terminal, and the other ends of the plurality of field - effect transistors 410 are all connected to different pins of the microcontroller 300.
[0041] Specifically, the field - effect transistor unit 400 is used to control the power supply output to each pin of the microcontroller 300. The field - effect transistor unit 400 includes a plurality of field - effect transistors 410. One end of each field - effect transistor 410 is connected to the power supply terminal, and the other end is connected to a different pin of the microcontroller 300. For example, one ends of the plurality of field - effect transistors 410 are connected to the power supply terminal, and the other ends are connected to different pins of the microcontroller 300. The field - effect transistor unit 400 can control the power supply situation of each pin of the microcontroller 300. Among them, the field - effect transistor unit 400 can independently control the conduction and cutoff of each field - effect transistor 410 according to the program requirements of the microcontroller 300, so as to realize the independent control of each pin of the microcontroller 300. By controlling the power supply output to each pin of the microcontroller 300 through the field - effect transistor unit 400, the power consumption of the circuit system can be effectively reduced, and the utilization efficiency of the power supply can be improved.
[0042] The plurality of field - effect transistors 410 allow different management strategies to be implemented for different parts of the microcontroller 300. By controlling each field - effect transistor 410 separately, fine control of the microcontroller pins can be achieved, which helps to improve the performance and reliability of the entire system.
[0043] In some embodiments, the microcontroller 300 includes a control chip 310 and a first impedance circuit 320. One end of the first impedance circuit 320 is connected to the control chip 310, and the other end of the first impedance circuit 320 is connected to the power supply terminal. The control chip 310 is respectively connected to the field - effect transistor unit 400, the power - on control circuit 200, the delay circuit 500, and the HEADER module 600.
[0044] Specifically, the selection of the control chip 310 needs to meet the control requirements for the field - effect transistor unit 400, the power - on control circuit 200, the delay circuit 500, and the HEADER module 600, ensuring that it has sufficient processing power and response speed. The control chip 310 can be a microcontroller with an ARM architecture or an 8 - bit / 16 - bit microcontroller. The field - effect transistor unit 400 is controlled by the control chip 310 and is used to switch the power - supply state of the circuit or control the operation of high - power devices. The power - on control circuit 200 is responsible for providing the reset signal and start signal of the microcontroller 300. The delay circuit 500 is used to implement the signal delay function. The design of the delay circuit needs to determine the delay time according to the specific application scenario. The HEADER module 600 is used to connect to other circuits or devices. For example, the control chip 310 needs to be able to identify and process signals from the HEADER module 600, such as data communication, input / output control, etc.
[0045] Due to the setting of the first impedance circuit 320, the power supply can be precisely controlled by the control chip 310, reducing energy consumption and improving the stability and reliability of the system. At the same time, the first impedance circuit 320 can prevent overcurrent and overvoltage, protecting the control chip 310 and the entire circuit system from damage.
[0046] In some embodiments, the microcontroller 300 includes a first capacitive reactance circuit 330. One end of the first capacitive reactance circuit 330 is connected to the control chip 310, and the other end of the first capacitive reactance circuit 330 is grounded.
[0047] Specifically, the function of the first capacitive reactance circuit 330 is to introduce capacitive reactance into the circuit to achieve specific circuit effects. For example, it can be used for filtering, coupling, decoupling, etc. During implementation, the first capacitive reactance circuit 330 needs to be designed according to specific application scenarios and requirements. After design, the other end of the first capacitive reactance circuit 330 is grounded. Grounding can improve the safety of the circuit, reduce the risk of faults, and at the same time improve the stability and anti-interference ability of the circuit.
[0048] The introduction of the first capacitive reactance circuit 330 can reduce signal interference and electromagnetic interference, improve the signal integrity of the circuit, improve the response characteristics of the system, reduce signal noise, enabling the control chip 310 to process signals more accurately, thereby ensuring the stability and reliability of the signals received by the control chip.
[0049] In some embodiments, the microcontroller 300 includes a second capacitive reactance circuit 340. One end of the second capacitive reactance circuit 340, the first impedance circuit 320, and the control chip 310 are connected in sequence, and the other end of the second capacitive reactance circuit 340 is grounded.
[0050] Specifically, the first impedance circuit 320, its function is to introduce impedance into the circuit to achieve specific circuit effects. For example, it can be used for filtering, coupling, decoupling, etc. The first impedance circuit 320 is connected to the control chip 310, the second capacitive reactance circuit 340 is connected to the control chip 310, and one end of the second capacitive reactance circuit 340 is connected to the first impedance circuit 320, and the other end of the second capacitive reactance circuit 340 is grounded. Grounding can improve the safety of the circuit, reduce the risk of faults, and at the same time improve the stability and anti-interference ability of the circuit.
[0051] By placing the second capacitive reactance circuit 340 between the control chip 310 and the first impedance circuit 320, the noise and interference in the power supply and the circuit are filtered out, improving the purity of the signal and ensuring that the signal received by the control chip 310 is more stable.
[0052] In some embodiments, the delay circuit 500 includes a plurality of LED lamp assemblies 510, which are connected in sequence. One end of each LED lamp assembly 510 is connected to the power supply terminal.
[0053] Specifically, first, a plurality of LED lamp assemblies 510 need to be prepared. These LED lamp assemblies 510 should be selected with appropriate models and specifications according to actual requirements to ensure that they can meet the brightness and power requirements of the circuit. Connect the plurality of LED lamp assemblies 510 in sequence. When connecting, it is necessary to ensure that one end of each LED lamp assembly 510 is connected to the power supply terminal. For example, appropriate protection components such as fuses and overvoltage protectors can be added between the LED lamp assemblies 510. These protection components can play a protective role when abnormal conditions occur in the circuit and prevent the circuit from being damaged. In particular, a control module can also be added to the delay circuit 500 to achieve the adjustment of the brightness and time of the LED lamp assemblies 510. For example, a microcontroller or an electronic switch can be used to achieve the brightness adjustment and timing control of the LED lamp assemblies 510.
[0054] By using a plurality of LED lamp assemblies 510 connected in sequence, an intuitive visual indication can be provided when the delay circuit 500 is activated, enabling the user to clearly see the status of the delay process.
[0055] In some embodiments, the delay circuit 500 includes a third capacitive reactance circuit 520. One end of the third capacitive reactance circuit 520 is grounded, and the other end of the third capacitive reactance circuit 520 is connected to the LED lamp assembly 510.
[0056] Specifically, one end of the third capacitive reactance circuit 520 is grounded, and the other end of the third capacitive reactance circuit 520 is connected to the LED lamp assembly 510. When connecting, in order to achieve the control of the LED lamp assembly 510, a control module can be added to the delay circuit 500. For example, a microcontroller or an electronic switch can be used to achieve the timing control and brightness adjustment of the LED lamp assembly 510.
[0057] The introduction of the third capacitive reactance circuit 520 can improve the stability of the circuit. Through its filtering effect, the noise and interference in the power supply and the circuit are reduced, and the reliability and stability of the circuit are improved.
[0058] The second aspect of the present application provides a power-on device based on a single-chip microcomputer, including a housing with a receiving cavity formed therein, and the power-on circuit based on a single-chip microcomputer according to any one of the above, which is disposed in the housing.
[0059] The third aspect of the present application provides a power-on system based on a single-chip microcomputer. The power-on system based on a single-chip microcomputer includes the power-on device.
[0060] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions required to be protected by the present application.
Claims
1. A power-on circuit based on a single-chip microcontroller, characterized in that The microcontroller-based power-on circuit includes: a power supply module, a power-on control circuit, a microcontroller, a field effect transistor unit, a delay circuit, and a HEADER module. The power supply module is respectively connected to the power-on control circuit, the microcontroller, the field effect transistor unit, the delay circuit, and the HEADER module. The microcontroller is respectively connected to the field effect transistor unit, the power-on control circuit, the delay circuit, and the HEADER module. Among them, when the MCU is in a normal state, pressing the power button briefly, the MCU receives the button signal and executes the power-on action; when the MCU is abnormal, pressing the power button briefly, the MCU receives the button signal but cannot normally send out the power-on signal. Long pressing the power button, the delay circuit is in an operating state, and the button signal is sent to the subsequent circuit skipping the MCU to achieve power-on.
2. The power-on circuit based on a single-chip microcomputer according to claim 1, wherein The microcontroller-based power-on circuit includes an electrostatic protector, and the electrostatic protector is respectively connected to the microcontroller and the HEADER module.
3. The power-on circuit based on a single-chip microcomputer according to claim 1, wherein, The field effect transistor unit includes a plurality of field effect transistors. One ends of the plurality of field effect transistors are all connected to the power supply terminal, and the other ends of the plurality of field effect transistors are respectively connected to different pins of the microcontroller.
4. A power-on circuit based on a single-chip microcomputer according to claim 1, characterized in that, The microcontroller includes a control chip and a first impedance circuit. One end of the first impedance circuit is connected to the control chip, and the other end of the first impedance circuit is connected to the power supply terminal. The control chip is respectively connected to the field effect transistor unit, the power-on control circuit, the delay circuit, and the HEADER module.
5. The power-on circuit based on a single-chip microcomputer according to claim 4, characterized in that The microcontroller includes a first capacitive reactance circuit. One end of the first capacitive reactance circuit is connected to the control chip, and the other end of the first capacitive reactance circuit is grounded.
6. The power-on circuit based on a single-chip microcomputer according to claim 4, wherein The microcontroller includes a second capacitive reactance circuit. One end of the second capacitive reactance circuit, the first impedance circuit, and the control chip are connected in sequence, and the other end of the second capacitive reactance circuit is grounded.
7. The power-on circuit based on a single-chip microcomputer according to claim 1, characterized in that, The delay circuit includes a plurality of LED lamp assemblies, and the plurality of LED lamp assemblies are connected in sequence. One end of each LED lamp assembly is connected to the power supply terminal.
8. A power-on circuit based on a single-chip microcomputer according to claim 7, characterized in that, The delay circuit includes a third capacitive reactance circuit. One end of the third capacitive reactance circuit is grounded, and the other end of the third capacitive reactance circuit is connected to the LED lamp assembly.
9. A power-on device based on a single-chip microcomputer, characterized in that, A housing with a receiving cavity formed inside, and the microcontroller-based power-on circuit according to any one of claims 1-8 is disposed inside the housing.
10. A power-on system based on a single-chip microcomputer, characterized in that, The microcontroller-based power-on system includes the power-on device according to claim 9.