Cooling fin of pressure-proof component

Abstract

The utility model relates to the technical field of integrated circuit radiating fin fixation, and discloses a radiating fin of an anti-pressing component, which comprises a circuit board substrate, a radiating device, a buckle mechanism and an elastic piece, the circuit board substrate is provided with a chip body, the radiating device covers the chip body, and the elastic piece is arranged on the chip body. The buckling mechanism penetrates through the circuit board substrate and the heat dissipation device to form a through hole for installation, the circuit board substrate and the heat dissipation device are fixedly connected through the buckling mechanism, the elastic piece is connected to the buckling mechanism in a sleeving mode and used for applying downward pressure to the heat dissipation device, the heat dissipation device comprises a heat dissipation fin body, and a heat dissipation fin boss is fixedly connected to the bottom of the heat dissipation fin body. The bottom of the cooling fin body is fixedly connected with the cooling fin boss, and when the cooling fin body is installed, the cooling fin boss is in contact with the surface of the circuit board substrate to form support, so that when the buckle mechanism is installed, pressure is shared by the cooling fin boss, and the effect of preventing the cooling fin body from crushing the chip body is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of fixing integrated circuit heat sinks, and particularly relates to a heat sink for preventing components from being pressed. Background Technique

[0002] An integrated circuit contains several chips or electrical components, and billions of micro-transistors are integrated inside the chips. These transistors generate a large amount of heat during operation, and the heat will increase with the increase in the working intensity of the transistors. High temperature will cause the performance of the chips to decline, so heat dissipation for the chips is required.

[0003] The heat sink increases the surface area of the chip and improves the heat dissipation efficiency. The heat sink made of metal or alloy materials has good heat conduction performance, which can quickly conduct and dissipate the heat generated by the chip to the surrounding environment, thereby reducing the temperature of the chip during operation and improving the stability of the chip during operation.

[0004] When installing the heat sink, in order to improve stability, spring clips are generally used for fixation. Since the heat sink is in direct contact with the chip, when manually pressing the spring clip, the corresponding corners of the heat sink are stressed, causing the heat sink to press on the components on the integrated circuit. The components will be damaged due to the stress, resulting in abnormal operation of the product. Moreover, after installing the heat sink, the end of the clip will extend to the back of the circuit board, affecting the installation of the circuit board. For example, in the utility model patent with the publication number CN 205987676 U and the name "A Heat Sink", the clip extends to the back of the circuit board and forms a protrusion, and support columns are required to cooperate for installation when installing the circuit board.

[0005] Therefore, a heat sink for preventing components from being pressed is proposed to protect the chip and improve the convenience of installing the circuit board. Content of the Utility Model

[0006] The purpose of the utility model is to provide a heat sink for preventing components from being pressed to solve the problems raised in the above background technique.

[0007] To solve the above technical problems, the utility model provides the following technical solution: A heat sink for preventing components from being pressed, including a circuit board substrate, a heat dissipation device, a clip mechanism, and an elastic member. The circuit board substrate is provided with a chip body, the heat dissipation device covers the chip body, the clip mechanism penetrates through the circuit board substrate and the heat dissipation device to form a through hole for installation, the circuit board substrate and the heat dissipation device are fixedly connected through the clip mechanism, and the elastic member is sleeved on the clip mechanism and is used to apply a downward pressure to the heat dissipation device;

[0008] The heat dissipation device includes a heat sink body, and a heat sink boss is fixedly connected to the bottom of the heat sink body. The bottom of the heat sink boss is lapped with the top of the circuit board substrate;

[0009] The buckle mechanism includes an upper buckle. A locking threaded cavity is formed at the center of the bottom of the upper buckle. A deformation groove is formed on the outer surface of the upper buckle. The deformation groove penetrates the outer surface of the upper buckle and extends into the interior of the locking threaded cavity. The bottom of the upper buckle is a flat surface;

[0010] The interior of the locking threaded cavity is connected with a filler to keep the shape of the upper buckle.

[0011] Preferably, the number of the heat sink bosses is multiple, and most of the heat sink bosses are arranged in the blank area on the top of the circuit board substrate.

[0012] Preferably, the height of the heat sink boss is greater than or equal to the height of the chip body, and the heat sink boss is formed by stacking multiple silicon wafers.

[0013] Preferably, a limiting piece is fixedly connected to the bottom of the upper buckle. The top of the limiting piece is lapped with the bottom of the circuit board substrate. The diameter of the limiting piece is greater than the diameter of the through hole of the circuit board substrate; when the upper buckle is pressed and deformed inward, the diameter of the limiting piece is smaller than the diameter of the through hole on the circuit board substrate.

[0014] Preferably, the filler is a locking bolt, and the length of the locking bolt does not exceed the length of the upper buckle.

[0015] Preferably, a screw fixing hole is formed at the center of the bottom of the locking bolt. The locking bolt cooperates with a screw and the screw fixing hole to fix the circuit board substrate to the plane where the circuit board substrate needs to be installed.

[0016] Preferably, the depth of the locking bolt installed inside the locking threaded cavity is adjustable.

[0017] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows:

[0018] First, by fixedly connecting a heat sink boss to the bottom of the heat sink body, when installing the heat sink body, the heat sink boss contacts the surface of the circuit board substrate to form a support. Thus, when installing the buckle mechanism, the pressure is shared by the heat sink boss, achieving the effect of preventing the heat sink body from damaging the chip body.

[0019] Second, the utility model achieves the effect of improving the installation convenience by setting an upper buckle, opening a locking threaded cavity at the axis of the bottom of the upper buckle, and opening a deformation groove on the outer surface of the locking threaded cavity to communicate with the locking threaded cavity, so that the outer surface of the upper buckle can be deformed and inserted into the through hole of the circuit board substrate, and the shape of the upper buckle is maintained by a filler, and the bottom of the upper buckle is flat to avoid uneven contact surfaces.

[0020] Third, the utility model internally threads a locking bolt in the locking threaded cavity and opens a screw fixing hole at the axis of the locking bolt. When installing the circuit board substrate, the bolt can be fixed to the support surface by cooperating with the screw fixing hole, and at the same time, the locking bolt can adjust the installation height inside the locking threaded cavity, so as to replace the support column for use, achieving the effect of further improving the installation convenience. Description of the Drawings

[0021] Figure 1 Schematic diagram of the structure of the utility model installed on a circuit board substrate;

[0022] Figure 2 Assembly schematic diagram of the structure of the utility model;

[0023] Figure 3 Bottom view of the structure of the utility model;

[0024] Figure 4 Schematic diagram of the heat dissipation device structure of the utility model;

[0025] Figure 5 Schematic diagram of the connection between the upper buckle and the locking bolt of the utility model;

[0026] Figure 6 Assembly schematic diagram of the upper buckle and the locking bolt of the utility model;

[0027] Figure 7 Schematic diagram of the locking bolt used as a leg of the utility model.

[0028] Wherein: 1. Circuit board substrate; 2. Chip body; 3. Heat dissipation device; 301. Heat sink body; 302. Heat sink boss; 4. Buckle mechanism; 401. Upper buckle; 402. Locking threaded cavity; 403. Deformation groove; 404. Locking bolt; 405. Limiting piece; 406. Screw fixing hole; 5. Elastic member. Detailed Embodiment

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] Please refer to Figure 1-7 , a heat sink for a pressure-proof component, including a circuit board substrate 1, a heat dissipation device 3, a buckle mechanism 4, and an elastic member 5. A chip body 2 is installed on the circuit board substrate 1. The heat dissipation device 3 covers the chip body 2. The buckle mechanism 4 penetrates through the circuit board substrate 1 and the heat dissipation device 3 to form a through hole for installation. The circuit board substrate 1 and the heat dissipation device 3 are fixedly connected through the buckle mechanism 4. The elastic member 5 is sleeved on the buckle mechanism 4 and is used to apply a downward pressure to the heat dissipation device 3;

[0031] The heat dissipation device 3 includes a heat sink body 301. A heat sink boss 302 is fixedly connected to the bottom of the heat sink body 301. The bottom of the heat sink boss 302 abuts against the top of the circuit board substrate 1;

[0032] The buckle mechanism 4 includes an upper buckle 401. A locking thread cavity 402 is provided at the axis of the bottom of the upper buckle 401. A deformation groove 403 is provided on the outer surface of the upper buckle 401. The deformation groove 403 penetrates through the outer surface of the upper buckle 401 and extends into the interior of the locking thread cavity 402. The bottom of the upper buckle 401 is a plane;

[0033] The interior of the locking thread cavity 402 is connected with a filler to keep the shape of the upper buckle 401.

[0034] Through the above technical solution, a heat sink boss 302 is fixedly connected to the bottom of the heat sink body 301. When the heat sink body 301 is installed, the heat sink boss 302 contacts the surface of the circuit board substrate 1 to form a support. Thus, when the buckle mechanism 4 is installed, the pressure is shared by the heat sink boss 302, achieving the effect of preventing the heat sink body 301 from pressing and damaging the chip body 2;

[0035] The upper buckle 401 is provided, and a locking thread cavity 402 is provided at the axis of the bottom of the upper buckle 401. A deformation groove 403 is provided on the outer surface of the locking thread cavity 402 and is in communication with the locking thread cavity 402. Thus, the outer surface of the upper buckle 401 can be deformed and inserted into the through hole of the circuit board substrate 1, and the shape of the upper buckle 401 is maintained by the filler. Moreover, the bottom of the upper buckle 401 is flat and slightly exceeds the bottom of the circuit board substrate 1 to avoid uneven contact surfaces, achieving the effect of improving the installation convenience;

[0036] During installation, the upper buckle 401 is first squeezed and then the elastic member 5 is sleeved on. Then, they respectively pass through the through holes on the heat sink body 301 and the circuit board substrate 1, and then are fixed in the through holes by the rebound of the upper buckle 401, and the filler is used to prevent the upper buckle 401 from detaching.

[0037] Specifically, the number of the heat sink bosses 302 is multiple, and most of the heat sink bosses 302 are arranged in the blank area on the top of the circuit board substrate 1.

[0038] Through the above technical solution, multiple heat sink bosses 302 are provided to increase the support points for the heat sink body 301, thereby preventing damage to the chip body 2 after the heat sink body 301 is deformed under pressure. When the heat sink body 301 is under pressure, multiple heat sink bosses 302 share the pressure together and form a support, which can reduce the deformation amplitude of the heat sink body 301.

[0039] Specifically, the height of the heat sink boss 302 is greater than or equal to the height of the chip body 2, and the heat sink boss 302 is composed of multiple silicon wafers stacked together.

[0040] Through the above technical solution, setting the height of the heat sink boss 302 can effectively prevent the chip body 2 from being overly pressured by the heat sink body 301. When the height of the heat sink boss 302 is less than that of the chip body 2, the acting force of the heat sink body 301 will still directly act on the surface of the chip body 2, and the protective effect cannot be achieved.

[0041] The heat sink boss 302 is formed by stacking and adhering multiple silicon wafers, so that the height of the heat sink boss 302 can be adjusted according to the height of the chip body 2 to improve the adaptability. At the same time, the silicon wafer has good thermal conductivity, which is beneficial to heat dissipation.

[0042] Specifically, a limiting piece 405 is fixedly connected to the bottom of the upper buckle 401. The top of the limiting piece 405 is lapped with the bottom of the circuit board substrate 1, and the diameter of the limiting piece 405 is larger than the diameter of the through hole of the circuit board substrate 1; when the upper buckle 401 is deformed inward under pressure, the diameter of the limiting piece 405 is smaller than the diameter of the through hole on the circuit board substrate 1.

[0043] Through the above technical solution, the function of setting the limiting piece 405 is to improve the connection stability of the upper buckle 401. Thus, when the upper buckle 401 is elastically pressured by the elastic member 5, the limiting piece 405 cooperates with the bottom of the circuit board substrate 1 to prevent the upper buckle 401 from being extruded, and further improve the fixing stability of the upper buckle 401.

[0044] Specifically, the filler is a locking bolt 404, and the length of the locking bolt 404 does not exceed the length of the upper buckle 401.

[0045] By the above technical solution, the locking bolt 404 is set, so that it can be fixed inside the locking thread cavity 402 through threaded connection, so as to improve the installation stability of the locking bolt 404, and thus stably support the structure of the upper snap 401;

[0046] Set the length of the locking bolt 404 so that when the locking bolt 404 is completely screwed into the locking thread cavity 402, the head of the locking bolt 404 can overlap with the limiting piece 405 to reduce the length exceeding the bottom of the circuit board substrate 1.

[0047] Specifically, a screw fixing hole 406 is opened at the axis of the bottom of the locking bolt 404, and the locking bolt 404 uses a screw to cooperate with the screw fixing hole 406 to fix the circuit board substrate 1 to the plane where the circuit board substrate 1 needs to be installed.

[0048] By the above technical solution, a screw fixing hole 406 is opened at the axis of the bottom of the locking bolt 404, and its function is to be able to fix bolts or screws through the screw fixing hole 406. When the chassis or the device for placing the circuit board substrate 1 can penetrate the screw, the screw can directly penetrate into the screw fixing hole 406 to install the circuit board substrate 1. And after installing the circuit board substrate 1, there will be a gap between the bottom of the circuit board substrate 1 and the installation surface, and the ventilation can also be improved through the gap to accelerate heat dissipation.

[0049] Specifically, the installation depth of the locking bolt 404 inside the locking thread cavity 402 is adjustable.

[0050] By the above technical solution, the installation depth of the locking thread cavity 402 is controlled by the number of turns of the locking bolt 404 tightened. When the locking bolt 404 is used as an installation foot, the distance between the end of the locking bolt 404 and the bottom of the circuit board substrate 1 can be adjusted according to actual needs, so that the circuit board substrate 1 can obtain different installation heights and adapt to different installation environments.

[0051] During use, by fixedly connecting the heat sink boss 302 to the bottom of the heat sink body 301, when the heat sink body 301 is installed, the heat sink boss 302 contacts the surface of the circuit board substrate 1 to form a support. Thus, when the snap mechanism 4 is installed, the pressure is shared by the heat sink boss 302, achieving the effect of preventing the heat sink body 301 from crushing the chip body 2;

[0052] By setting the upper buckle 401, a locking thread cavity 402 is opened at the axis of the bottom of the upper buckle 401, and a deformation groove 403 is opened on the outer surface of the locking thread cavity 402 and communicates with the locking thread cavity 402, so that the outer surface of the upper buckle 401 can be deformed and inserted into the through hole of the circuit board substrate 1, and the shape of the upper buckle 401 is maintained by the filler, and the bottom of the upper buckle 401 is flat to avoid uneven contact surfaces, achieving the effect of improving the installation convenience;

[0053] By threadedly connecting a locking bolt 404 inside the locking thread cavity 402 and opening a screw fixing hole 406 at the axis of the locking bolt 404, when installing the circuit board substrate 1, the bolt can be fixed to the support surface by cooperating with the screw fixing hole 406, and at the same time, the locking bolt 404 can adjust the installation height inside the locking thread cavity 402, so as to be used instead of the support column, achieving the effect of further improving the installation convenience.

[0054] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat sink for a pressure - resistant component, comprising a circuit board substrate (1), a heat dissipation device (3), a buckle mechanism (4), and an elastic member (5). The circuit board substrate (1) is mounted with a chip body (2), the heat dissipation device (3) covers the chip body (2), the buckle mechanism (4) penetrates through the circuit board substrate (1) and the heat dissipation device (3) to form a through - hole for installation, the circuit board substrate (1) and the heat dissipation device (3) are fixedly connected through the buckle mechanism (4), and the elastic member (5) is sleeved on the buckle mechanism (4) and is used to apply a downward pressure to the heat dissipation device (3). It is characterized in that: The heat dissipation device (3) includes a heat sink body (301), and a heat sink boss (302) is fixedly connected to the bottom of the heat sink body (301), and the bottom of the heat sink boss (302) abuts against the top of the circuit board substrate (1). The buckle mechanism (4) includes an upper buckle (401). A locking thread cavity (402) is formed at the axis of the bottom of the upper buckle (401). A deformation groove (403) is formed on the outer surface of the upper buckle (401), and the deformation groove (403) penetrates through the outer surface of the upper buckle (401) and extends into the interior of the locking thread cavity (402). The bottom of the upper buckle (401) is a flat surface. The interior of the locking thread cavity (402) is connected with a filler to keep the shape of the upper buckle (401).

2. The heat sink for a pressure-proof component according to claim 1, characterized in that: The number of the heat sink bosses (302) is multiple, and most of the heat sink bosses (302) are arranged in the blank area on the top of the circuit board substrate (1).

3. The heat sink of a pressure-proof component according to claim 2, characterized in that, The height of the heat sink boss (302) is greater than or equal to the height of the chip body (2), and the heat sink boss (302) is formed by stacking multiple silicon wafers.

4. The heat sink for a pressure-resistant component according to claim 1, characterized in that: A limiting piece (405) is fixedly connected to the bottom of the upper buckle (401). The top of the limiting piece (405) abuts against the bottom of the circuit board substrate (1), and the diameter of the limiting piece (405) is greater than the diameter of the through - hole of the circuit board substrate (1); when the upper buckle (401) is pressed and deformed inward, the diameter of the limiting piece (405) is less than the diameter of the through - hole on the circuit board substrate (1).

5. The heat sink of a pressure-proof component according to claim 4, characterized in that: The filler is a locking bolt (404), and the length of the locking bolt (404) does not exceed the length of the upper buckle (401).

6. The heat sink of a pressure-proof component according to claim 5, characterized in that: A screw fixing hole (406) is formed at the axis of the bottom of the locking bolt (404), and the locking bolt (404) uses a screw to cooperate with the screw fixing hole (406) to fix the circuit board substrate (1) to the plane where the circuit board substrate (1) needs to be installed.

7. The heat sink for a pressure-resistant component according to claim 6, characterized in that: The installation depth of the locking bolt (404) inside the locking thread cavity (402) is adjustable.

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