Hot matching packaged ultrafast recovery diode

Abstract

The utility model discloses a thermal matching packaging ultrafast recovery diode comprising a packaging housing, the lower end of the packaging housing is provided with lead frames at the left side and the right side, the packaging housing passes through a clamping groove at the rear end, and a cooling fin is arranged at the rear end of the packaging housing. According to the device, the clamping groove is formed in the rear end of the packaging shell, the sliding grooves are formed in the left end and the right end of the clamping groove, the two expansion rubber plugs are arranged at the bottom of the clamping groove, the cooling fin is inserted into the clamping groove, and meanwhile the rollers located at the left end and the right end of the cooling fin are attached to the inner walls of the sliding grooves to rotate; when the roller rotates, the rotating shaft serves as a circle center shaft, the cooling fins are inserted into the clamping grooves till the expansion rubber plugs are inserted into the inner positions of the insertion holes, then the cooling fins can be installed, the installation steps of the cooling fins can be simplified through the connecting mode, and the cooling fins can be rapidly taken down when needing to be replaced.

Description

Technical Field

[0001] The utility model belongs to the technical field related to ultra-fast recovery diodes with thermal matching packaging, and particularly relates to an ultra-fast recovery diode with thermal matching packaging. Background Art

[0002] An ultra-fast recovery diode with thermal matching packaging is a semiconductor device with excellent recovery characteristics and is commonly used in the fields of power electronics and switching power supplies. Compared with traditional diodes, the ultra-fast recovery diode has a faster recovery time when turning off, which can reduce switching losses, reduce electromagnetic interference, and improve system efficiency. Thermal matching packaging means that this diode is designed and packaged to have good thermal performance to ensure effective heat dissipation in high-power and high-frequency applications and prevent the device from overheating. Thermal matching packaging usually helps to improve the reliability and service life of the device.

[0003] In traditional ultra-fast recovery diodes, the heat sink is fixed to the diode. When it is necessary to disassemble and replace the heat sink, the operation complexity will increase. Therefore, the market needs a new device to solve the problems currently faced. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an ultra-fast recovery diode with thermal matching packaging to solve the problem that in traditional ultra-fast recovery diodes, the heat sink is fixed to the diode, which will increase the operation complexity when it is necessary to disassemble and replace the heat sink. Therefore, the market needs a new device to solve the problems currently faced.

[0005] To achieve the above purpose, the utility model provides the following technical solution: An ultra-fast recovery diode with thermal matching packaging, including a packaging shell. At the lower end of the packaging shell, lead frames are arranged at the left and right positions. Through a card slot at the rear end, a heat sink is installed at the rear end of the packaging shell. At the left and right ends of the card slot, chutes are arranged. Inside the card slot, expansion rubber plugs are arranged. When installing the heat sink and the card slot, rollers fixed at the left and right ends of the heat sink are clamped inside the chutes. The rollers are installed on the heat sink through a rotating shaft fixed inside. Insertion holes at the left and right sides at the lower end of the heat sink are in insertion connection with the expansion rubber plugs.

[0006] Preferably, a through hole is arranged at the upper position at the front end of the heat sink.

[0007] Preferably, the packaging shell is connected to an external circuit through the lead frame.

[0008] Preferably, when the heat sink is inserted into the inner position of the card slot, it fits tightly with the encapsulation housing.

[0009] Preferably, when the heat sink is inserted into the inner position of the card slot, the roller is in contact with the inner wall of the chute and rotates.

[0010] Preferably, the rotation of the roller is centered on the rotation axis.

[0011] Preferably, when the heat sink moves along the card slot, the expansion rubber plug can be inserted into the inner position of the insertion hole.

[0012] Preferably, when the expansion rubber plug is inserted into the inner part of the insertion hole, the installation of the heat sink with the encapsulation housing is completed.

[0013] Compared with the prior art, the present utility model provides an ultra-fast recovery diode with thermal matching encapsulation, having the following beneficial effects:

[0014] A card slot is provided at the rear end position of the encapsulation housing of the device, chutes are provided at the left and right end positions of the card slot, two expansion rubber plugs are provided at the bottom position of the card slot, the heat sink is inserted into the card slot, and at the same time, the rollers at the left and right end positions of the heat sink are in contact with the inner walls of the chutes and rotate. When the rollers rotate, they are centered on the rotation axis. The heat sink is inserted into the card slot until the expansion rubber plug is inserted into the inner position of the insertion hole, and thus the installation of the heat sink can be completed. This connection method can simplify the installation steps of the heat sink, and the heat sink can be quickly removed when it needs to be replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of an ultra-fast recovery diode with thermal matching encapsulation of the present utility model.

[0016] Figure 2 It is a schematic rear view structural diagram of an ultra-fast recovery diode with thermal matching encapsulation of the present utility model.

[0017] Figure 3 It is a schematic exploded structural diagram of an ultra-fast recovery diode with thermal matching encapsulation of the present utility model.

[0018] Figure 4 It is a schematic bottom structural diagram of the heat sink of an ultra-fast recovery diode with thermal matching encapsulation of the present utility model.

[0019] Figure 5 It is a schematic sectional structural diagram of the heat sink of an ultra-fast recovery diode with thermal matching encapsulation of the present utility model.

[0020] In the figure: 1. Encapsulation housing; 2. Heat sink; 3. Through-hole; 4. Lead frame; 5. Roller; 6. Slide groove; 7. Card slot; 8. Expansion rubber plug; 9. Insertion hole; 10. Rotating shaft. Detailed implementation manner

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] The utility model provides an ultrafast recovery diode with thermal matching encapsulation as Figures 1-5 shown, which includes an encapsulation housing 1. Lead frames 4 are arranged at the lower end of the encapsulation housing 1 at the left and right positions. The encapsulation housing 1 is provided with a heat sink 2 installed at the rear end position through a card slot 7 at the rear end position. Slide grooves 6 are arranged at the left and right ends of the card slot 7, and an expansion rubber plug 8 is arranged at the inner position of the card slot 7. When the heat sink 2 and the card slot 7 are installed, rollers 5 fixed at the left and right ends of the heat sink 2 are clamped in the inner position of the slide groove 6. The rollers 5 are installed with the heat sink 2 through a rotating shaft 10 fixed at the inner side position. Insertion holes 9 at the left and right sides of the lower end of the heat sink 2 are in plug-in connection with the expansion rubber plug 8.

[0023] When a reverse voltage is applied to the diode, a depletion region is formed in the diode to block the current flow. In the case of reverse bias, when the forward current is suddenly cut off, a part of the stored charge will still be retained inside the diode. The ultrafast recovery diode can quickly consume these stored charges, thereby quickly stopping the reverse current, reducing the reverse recovery time, and improving the overall switching efficiency.

[0024] As Figure 2 and Figure 3 shown, a through-hole 3 is arranged at the upper position at the front end of the heat sink 2. The encapsulation housing 1 is connected to an external circuit through the lead frame 4. When the heat sink 2 is inserted into the inner position of the card slot 7, it fits tightly with the encapsulation housing 1. When the heat sink 2 is inserted into the inner position of the card slot 7, the rollers 5 fit and rotate along the inner wall of the slide groove 6. The rotation of the rollers 5 takes the rotating shaft 10 as the center axis. When the heat sink 2 moves along the card slot 7, the expansion rubber plug 8 can be inserted into the inner position of the insertion hole 9. When the expansion rubber plug 8 is inserted into the inner position of the insertion hole 9, the installation of the heat sink 2 with the encapsulation housing 1 is completed.

[0025] Insert the heat sink 2 into the card slot 7. At the same time, the rollers 5 located at the left and right ends of the heat sink 2 are in contact with the inner walls of the sliding grooves 6 and rotate. When the rollers 5 rotate, they take the rotating shaft 10 as the center axis. Insert the heat sink 2 into the card slot 7 until the expansion rubber plug 8 is inserted into the inner part of the insertion hole 9, and the installation of the heat sink 2 can be completed.

[0026] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An ultra-fast recovery diode with thermal matching packaging, characterized in that, It includes a packaging housing (1). At the lower end of the packaging housing (1), lead frames (4) are provided at the left and right positions. The packaging housing (1) is provided with a heat sink (2) at the rear end position through a card slot (7) at the rear end. At the left and right ends of the card slot (7), chutes (6) are provided. An expansion rubber plug (8) is provided at the inner position of the card slot (7). When the heat sink (2) is installed with the card slot (7), rollers (5) fixed at the left and right ends of the heat sink (2) are clamped at the inner position of the chute (6). The rollers (5) are installed with the heat sink (2) through a rotating shaft (10) fixed at the inner side. Insertion holes (9) at the left and right sides at the lower end of the heat sink (2) are in plug-in connection with the expansion rubber plug (8).

2. The ultrafast recovery diode with thermal matching packaging according to claim 1, wherein: At the upper position at the front end of the heat sink (2), a through hole (3) is provided.

3. The fast recovery diode with thermal matching package according to claim 1, wherein: The packaging housing (1) is connected to an external circuit through the lead frame (4).

4. The ultrafast recovery diode with thermal matching packaging according to claim 1, wherein: When the heat sink (2) is inserted into the inner position of the card slot (7), it fits tightly with the packaging housing (1).

5. The fast recovery diode with thermal matching package according to claim 1, wherein: When the heat sink (2) is inserted into the inner position of the card slot (7), the rollers (5) rotate while fitting against the inner wall of the chute (6).

6. The ultrafast recovery diode with thermal matching package according to claim 5, characterized in that: The rotation of the rollers (5) is centered on the rotating shaft (10).

7. An ultrafast recovery diode with thermal matching packaging according to claim 5, characterized in that: When the heat sink (2) moves along the card slot (7), the expansion rubber plug (8) can be inserted into the inner position of the insertion hole (9).

8. An ultrafast recovery diode with thermal matching packaging according to claim 7, characterized in that: When the expansion rubber plug (8) is inserted into the inner part of the insertion hole (9), the installation of the heat sink (2) with the packaging housing (1) is completed.

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