Integrated double-conveying direct cooling plate

Abstract

The utility model discloses an integrated double-conveying direct cooling plate, and relates to the field of new energy, the direct cooling plate comprises a plate body and a heat exchange flow channel arranged in the plate body, and the inner wall surface of the heat exchange flow channel is provided with a plurality of capillary conveying grooves spirally arranged along the trend of the heat exchange flow channel; the depth of the capillary conveying groove is 0.1-0.5 mm, and the width of the capillary conveying groove is 0.1-0.3 mm. According to the direct cooling plate, the capillary channels are formed in the wall faces of the flow channels, the contact area of cooling liquid and the wall faces can be increased, the function of conveying the cooling liquid inside and outside the flow channels at the same time can be achieved, and the heat dissipation efficiency is further improved. The design of the double-conveying direct-cooling plate is particularly suitable for temperature control of a battery pack with high energy density, can effectively avoid formation of a heat dissipation dead point, and ensures safe operation of the battery under a high-load condition.

Description

Technical Field

[0001] The present application relates to the field of new energy, and in particular to an integrated double-transport direct cooling plate. Background Art

[0002] Existing direct cooling plate technology has been widely used in the temperature control systems of energy storage batteries and power batteries. It designs multiple parallel or series flow channels inside the plate body to allow the coolant to flow through the flow channels, thereby achieving heat conduction and dissipation. The coolant flows through the flow channels to carry away the heat generated by the battery to control the battery temperature. These flow channels are usually straight or curved, and the smooth structural design allows the coolant to pass with low resistance. However, with the continuous development of battery technology, the energy density of battery packs has gradually increased, and the heat generated has increased significantly. The traditional direct cooling plate design has shown shortcomings in the temperature control of high-energy-density battery packs, and it is difficult to cope with the increasing heat dissipation needs.

[0003] A key problem facing traditional direct cooling plates is the limitation of heat dissipation efficiency. Since the design of the flow channel is relatively simple, the flow pattern of the coolant inside the flow channel is relatively simple, and it mainly relies on the flow rate and flow rate of the coolant to improve the heat dissipation efficiency. However, when faced with high-power batteries, this design can easily lead to uneven distribution of the coolant in the flow channel, resulting in problems of insufficient local cooling. As the heat generated in the battery pack increases, the design of the traditional direct cooling plate cannot dissipate the heat in a timely and effective manner, which in turn affects the overall performance of the battery and may even cause safety problems. In addition, the smooth structure of the traditional flow channel design makes it easy for the coolant to form a laminar flow, resulting in a small contact area between the liquid and the flow channel wall, limited heat transfer efficiency, and unable to fully take away the large amount of heat generated by the battery.

[0004] What is more serious is that when the direct cooling plate uses refrigerant as the working fluid, it is easy to cause gas plugs due to the phenomenon of heat vaporization. The formation of gas plugs will block the normal flow of the refrigerant, resulting in the inability of the coolant in the flow channel to circulate effectively, thus forming "heat dissipation dead spots" in some areas. These heat dissipation dead spots cannot dissipate the heat of the battery in time, causing the local temperature to rise sharply, which may eventually cause thermal runaway of the battery, seriously threatening the safety of the battery. This problem is particularly prominent in high-energy density battery packs. The rapidly accumulated heat and delayed heat dissipation effect will greatly increase the risk of battery failure.

[0005] The main reasons for these deficiencies lie in the limitations of the traditional direct-cooling plate flow channel design. Firstly, although the smooth design of the flow channel wall reduces the flow resistance, it simultaneously limits the contact area between the coolant and the wall, resulting in low heat transfer efficiency. Secondly, the flow channel design is too single, failing to make full use of the space inside the flow channel and unable to effectively improve the cooling effect. In addition, the air plug problem highlights the deficiencies of the existing direct-cooling plate in dealing with refrigerant gasification and fails to effectively prevent and alleviate the impact of refrigerant gasification on the coolant circulation in the flow channel. Therefore, in the face of high-power and high-energy-density battery packs, the design of traditional direct-cooling plates gradually becomes difficult to meet higher heat dissipation requirements. Summary of the Invention

[0006] The purpose of this application aims to overcome at least one deficiency existing in the prior art and provides an integrated dual-delivery direct-cooling plate. By setting capillary channels on the inner wall surface of the flow channel, this direct-cooling plate can not only enhance the contact area between the coolant and the wall, but also realize the function of simultaneously delivering coolant inside and outside the flow channel, further improving the heat dissipation efficiency. The design of this dual-delivery direct-cooling plate is particularly suitable for controlling the temperature of high-energy-density battery packs, which can effectively avoid the formation of heat dissipation dead spots and ensure the safe operation of the battery under high-load conditions.

[0007] To achieve the above purpose, this application discloses an integrated dual-delivery direct-cooling plate, which includes a plate body and a heat exchange flow channel arranged inside the plate body. Among them, a number of capillary delivery channels are spirally arranged along the direction of the heat exchange flow channel on the inner wall surface of the heat exchange flow channel; the depth of the capillary delivery channel is 0.1 - 0.5 mm, and the width is 0.1 - 0.3 mm.

[0008] In some embodiments, the plate body is an integrated structure, and the flow channel is constituted by the plate body itself. An insulating layer is attached to the non-thermally conductive side of the plate body.

[0009] In some embodiments, the plate body is a split structure, including a heat-conducting layer, an insulating layer, and heat exchange tubes sandwiched between the heat-conducting layer and the insulating layer. Opposite grooves are provided on the heat-conducting layer and the insulating layer. After the heat-conducting layer and the insulating layer are combined, an installation channel that is insulated on one side and heat-conductive on the other side is formed; the heat exchange tubes used to form the flow channel are located in the installation channel, and at least the outer surface of the heat exchange tube is closely fitted with the heat-conducting layer.

[0010] In some embodiments, the cross-section of the flow channel is one of a circle, an ellipse, a square, and a trapezoid.

[0011] In some embodiments, some of the capillary delivery channels in the flow channel are spirally arranged forward and some are spirally arranged backward, so that the capillary delivery channels are staggered with each other to improve the wall surface delivery efficiency.

[0012] In some embodiments, the cross-section of the heat exchange flow channel is one or a combination of an inverted V shape, an inverted Ω shape, an inverted trapezoid, and a rectangle.

[0013] Compared with the prior art, the present invention has at least one of the following beneficial effects:

[0014] 1. Realize one-sided heat conduction: By using the design of heat conduction layer and heat insulation layer in the flow channel, one-sided heat conduction is realized to further improve the heat exchange efficiency.

[0015] 2. Improve heat dissipation efficiency: The design of the capillary delivery groove significantly increases the contact area between the coolant and the flow channel wall, enhances the heat conduction effect, and improves the heat dissipation efficiency.

[0016] 3. Prevent heat dissipation dead spots: The dual delivery design ensures that coolant is delivered inside and outside the flow channel at the same time, avoiding local insufficient heat dissipation and reducing the formation of heat dissipation dead spots.

[0017] 4. Reduce gas plugging problems: The optimized flow channel design effectively solves the gas plugging problem caused by refrigerant gasification, ensures the normal circulation of coolant, and improves the safety of the system.

[0018] The above-listed beneficial effects are not exhaustive of all advantages. Other potential beneficial effects and detailed technical implementations will be further disclosed in the examples or other description parts of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] After reading the following detailed description in conjunction with the accompanying drawings, you will better understand the various aspects of the present disclosure. The positions, sizes, and ranges of various structures shown in the accompanying drawings sometimes do not represent the actual positions, sizes, and ranges. In the accompanying drawings:

[0020] Figure 1 This is a schematic structural diagram of an embodiment disclosed in the present application, in which the heat insulation layer is omitted.

[0021] Figure 2 This is a structural perspective view of an embodiment disclosed in the present application, in which the heat insulation layer is omitted.

[0022] Figure 3 It is a schematic diagram of the partial structure of a heat dissipation channel after being cut open in an embodiment disclosed in the present application.

[0023] Figure 4 It is a structural schematic diagram of another embodiment disclosed in the present application.

[0024] Figure 5 It is a structural decomposition diagram of another embodiment disclosed in the present application. DETAILED DESCRIPTION

[0025] The present disclosure will be described below with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown. However, it should be understood that the present disclosure can be presented in many different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the disclosure of the present disclosure more complete and fully explain the protection scope of the present disclosure to those skilled in the art. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide more additional embodiments.

[0026] It should be understood that in all the drawings, the same reference numerals denote the same elements. In the drawings, for the sake of clarity, the dimensions of some features may be deformed.

[0027] It should be understood that the terms used in the specification are only for describing specific embodiments and are not intended to limit the present disclosure. All terms used in the specification (including technical terms and scientific terms) have the meanings commonly understood by those skilled in the art unless otherwise defined. For the sake of brevity and / or clarity, technologies, methods, and devices known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorized specification.

[0028] The singular forms "a", "the", and "said" used in the specification include the plural forms unless clearly specified. The terms "comprising", "including", and "containing" used in the specification indicate the presence of the claimed features, but do not exclude the presence of one or more other features. The term "and / or" used in the specification includes any and all combinations of one or more of the related listed items. Embodiment 1:

[0029] Referring to Figures 1-3 , this embodiment discloses an exemplary structure of an integrated double-conveying direct cooling plate, which is designed to improve the heat dissipation efficiency of the battery pack and ensure the stable operation of high-energy-density batteries.

[0030] In this embodiment, the direct cooling plate is composed of a plate body 1, and a flow channel 2 for heat exchange for conveying the coolant is arranged inside the plate body 1. By optimizing the flow channel design and adding capillary channels 3, the double conveyance of the coolant is realized, and the contact area between the coolant and the wall surface is enhanced, thereby improving the heat dissipation effect.

[0031] In terms of the specific structure, the plate body 1 of the direct cooling plate adopts an integral structure. The plate body 1 is made of materials with high thermal conductivity, such as aluminum alloy or copper materials, to ensure that heat can be quickly conducted from the battery pack to the coolant. One side of the plate body 1 is closely provided with a heat insulation layer 4, and the heat insulation layer 4 can adopt ceramics or other low thermal conductivity materials to avoid heat loss from this side and ensure that heat is concentrated and transferred to the flow channel through the heat conduction side. This design significantly improves the heat exchange efficiency through the way of single-side heat conduction and is suitable for the temperature control of battery packs under high-load working conditions.

[0032] As Figure 3 shown, the flow channel 2 is directly constructed inside the plate body 1, and its inner wall is provided with several spiral capillary conveying grooves 3. The depth of the capillary conveying grooves 3 is between 0.1 - 0.5 mm, and the width is 0.1 - 0.3 mm. These capillary conveying grooves 3 are arranged along the direction of the flow channel 2 to form a spiral structure with forward and reverse intersections.

[0033] The cross-section of the flow channel 2 is designed in various shapes to meet the cooling requirements in different application scenarios. Specifically, the cross-section of the flow channel 2 can be circular (in this embodiment), elliptical, square or trapezoidal structure, and each shape can optimize the flow path of the coolant to ensure a stable cooling effect under different flow rates and pressures. Especially in high-power battery packs, the flow channel 2 structure with an inverted V-shaped or inverted Ω-shaped cross-section design can further increase the flow velocity of the coolant and avoid the air plug problem caused by flow channel blockage or refrigerant gasification.

[0034] It should be understood that in this embodiment, the principle of the direct cooling plate to prevent air plug mainly relies on the design of capillary transportation. The capillary conveying grooves 3 are arranged on the inner wall of the flow channel 2 not to create turbulence, but to utilize the capillary effect to enable the wall surface itself to have the ability to continuously convey the coolant. Even when air plugs are formed in the flow channel due to refrigerant gasification, the capillary conveying grooves 3 can still convey the coolant along the wall surface to ensure the cooling effect of the local area.

[0035] To facilitate a further understanding of this embodiment, it should also be noted that the capillary effect is generated by the interfacial tension difference between the liquid and the solid surface. When the coolant flows in the capillary conveying grooves 3, due to the small size of the grooves (depth 0.1 - 0.5 mm, width 0.1 - 0.3 mm), the liquid will flow along these tiny grooves. Even when bubbles block the main flow channel, the capillary conveying grooves 3 can still guide the coolant to flow beside or around the bubbles.

[0036] The advantage of this design is that once an air plug is formed in a traditional cooling system, the circulation of the coolant will be completely blocked, resulting in local heat accumulation, which may cause overheating and failure of the battery. In this embodiment, the capillary delivery groove 3 can maintain the coolant delivery on the wall surface. Even if the coolant in the flow channel 2 is blocked, the liquid in the capillary groove can still pass smoothly, thereby continuing to dissipate heat around the bubbles. This can avoid the heat dissipation "dead corner" caused by air plugs and ensure that the heat can be transferred out in time.

[0037] In addition, the design of this capillary transport structure does not significantly increase the difficulty of production. Instead, it can achieve multi-level transport of the flow channel through a simple manufacturing process. Especially in large-sized direct cooling plates, this design can not only maintain efficient heat dissipation performance, but also effectively reduce the gas plugging problem caused by vaporization. Combined with this design principle, the cooling system can still maintain stable thermal management performance even under extreme working conditions.

[0038] Implementation:2:

[0039] like Figure 4 and 5 As shown, the main difference between this embodiment and embodiment 1 is that the plate body adopts a split structure. The plate body includes a heat-conducting layer 7, a heat-insulating layer 5, and a heat exchange tube 6 sandwiched between the two layers. The heat-conducting layer 7 and the heat-insulating layer 5 are respectively provided with opposite grooves, and when the two layers are matched, an installation channel with one side for heat conduction and the other side for heat insulation is formed. The heat exchange tube 6 is located in the installation channel, and its outer surface is tightly attached to the heat-conducting layer 7 to ensure that heat can be quickly transferred to the coolant in the heat exchange tube 6 through the heat-conducting layer 7.

[0040] The heat exchange tube 6 plays a core role in this embodiment, and its production is extremely convenient, and the process is simple and mature.

[0041] During implementation, materials with high thermal conductivity, such as copper or aluminum alloy, are generally used, and the pipe wall is relatively thin, which can ensure that the coolant can quickly take away the heat generated by the battery when flowing through the pipe.

[0042] Similar to the first embodiment, the inner wall surface of the heat exchange tube 6 , that is, the inner wall surface of the flow channel 2 formed by the heat exchange tube 6 , also has a capillary conveying groove 3 .

[0043] At the same time, the cross-section design of the heat exchange tube 6 is flexible and can be designed into circular, elliptical or rectangular shapes according to the application scenario. These shapes can adapt to different flow channel designs and further optimize the flow path of the coolant. For large-sized direct cooling plates, multiple heat exchange tubes 6 can be arranged in parallel to ensure uniform distribution of the coolant throughout the plate body, avoiding problems such as excessive local temperature or insufficient heat dissipation.

[0044] The advantages of this split structure not only lie in improving the heat dissipation efficiency, but also in effectively controlling the production cost. By adopting a standardized manufacturing process for heat exchange tubes, the heat exchange tube 6 can achieve cost optimization in mass production while reducing the production difficulty. This modular design makes the heat exchange tubes easy to replace and maintain. When a problem occurs in the pipeline, it is not necessary to replace the entire direct cooling plate, but only the damaged part of the pipeline, thus reducing the maintenance cost and downtime.

[0045] In addition, the heat insulation layer 5 is made of low thermal conductivity materials (such as ceramics or polyurethane), which avoids the diffusion of heat to the outside of the device, thus ensuring that the heat is concentrated and conducted to the heat exchange tube 6 through the heat conduction layer 7, effectively improving the heat exchange efficiency.

[0046] Through this split design, the direct cooling plate can maintain good heat dissipation performance in large-size applications while reducing the production and maintenance costs, making it suitable for wide applications in the temperature control systems of high-power energy storage battery packs and power battery packs to ensure the safe and stable operation of the battery packs.

[0047] Although the exemplary embodiments of the present disclosure have been described, those skilled in the art should understand that various changes and modifications can be made to the exemplary embodiments of the present disclosure without departing from the spirit and scope of the present disclosure in essence. Therefore, all changes and modifications are included in the protection scope of the present disclosure defined by the claims. The present disclosure is defined by the appended claims, and equivalents of these claims are also included.

Claims

1. Integrated dual-conveyor direct cooling plate, characterized in that, The direct cooling plate includes: a plate body and a heat exchange flow channel arranged in the plate body. Among them, a number of capillary transport grooves are arranged on the inner wall surface of the heat exchange flow channel in a spiral shape along the direction of the heat exchange flow channel; the capillary transport grooves are 0.1-0.5 mm deep and 0.1-0.3 mm wide.

2. The integrated dual-conveying direct cooling plate according to claim 1, wherein: The plate body is of an integral structure, and the flow channel is formed by the plate body itself. An insulating layer is attached to the non-thermally conductive side of the plate body.

3. The integrated double-conveying direct cooling plate as described in claim 1, wherein: The plate body is of a split structure, including a heat conductive layer, an insulating layer and a heat exchange tube sandwiched between the heat conductive layer and the insulating layer. Opposite grooves are provided on the heat conductive layer and the insulating layer. After the heat conductive layer and the insulating layer are combined, an installation channel that is thermally insulated on one side and thermally conductive on the other side is formed; the heat exchange tube for forming the flow channel is located in the installation channel, and the outer surface of the heat exchange tube is at least in close contact with the heat conductive layer.

4. The integrated double-conveying direct cooling plate according to claim 1 or 3, characterized in that: The cross section of the flow channel is one of a circle, an ellipse, a square, and a trapezoid.

5. The integrated double-conveying direct cooling plate as described in claim 1 or 3, characterized in that: The capillary transport grooves in the flow channel are partially spiraled forward and partially spiraled backward, so that the capillary transport grooves are staggered with each other to improve the wall surface transport efficiency.

6. The integrated dual-conveying direct cooling plate as described in claim 1 or 3, characterized in that: The cross section of the heat exchange flow channel is one or a combination of an inverted V shape, an inverted Ω shape, an inverted trapezoid, and a rectangle.

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