Ultrathin matrix type Schottky rectifier module

Abstract

The utility model provides an ultrathin matrix type Schottky rectifier module, which aims to solve the problem that Schottky chips of the existing Schottky rectifier module are arranged disorderly, and comprises the Schottky chips. The base plate, the connecting plate and the connecting strip are all capable of conducting electricity integrally or partially; wherein two rows of connecting plates are arranged on the bottom plate, and each row of connecting plates comprises at least one connecting plate; each row of connecting plates is also correspondingly connected with one connecting strip, and the two connecting strips are respectively arranged on the two rows of connecting plates; the Schottky chips are arranged on the bottom plate on the two sides of the connecting plate in rows, and the row direction of the Schottky chips is consistent with the row direction of the connecting plate; the Schottky chip is also electrically connected with the connecting plate; each Schottky chip can bear the same current, uniform heat dissipation is achieved, and stable work of the Schottky chip is guaranteed.

Description

Technical Field

[0001] The utility model relates to the field of rectifier modules, in particular to an ultra-thin matrix Schottky rectifier module. Background Art

[0002] The common solution for the inverter rectifier circuit of high-power equipment is to connect multiple Schottky rectifier modules in parallel to obtain high voltage and high power, such as the content shown in the patents with the authorized publication numbers CN107452723B and CN217849258U. However, since the currently arranged Schottky chips are usually arranged irregularly or in two rows, the circuit current density corresponding to the copper bottom plate per unit area is low, and the overall surge current resistance of the Schottky rectifier module is not high. In order to improve the surge current resistance of the Schottky rectifier module and increase the power density, a technical solution for an ultra-thin matrix Schottky rectifier module is proposed. Summary of the Invention

[0003] The purpose of the utility model is to solve the deficiencies of the prior art and provide an ultra-thin matrix Schottky rectifier module.

[0004] To solve the above problems, the utility model adopts the following scheme:

[0005] An ultra-thin matrix Schottky rectifier module includes Schottky chips; it also includes a bottom plate, a connecting plate and a connecting bar, and the bottom plate, the connecting plate and the connecting bar can all conduct electricity integrally or partially conduct electricity integrally; wherein there are two rows of connecting plates arranged on the bottom plate, and each row of connecting plates includes at least one connecting plate; each row of connecting plates is also correspondingly connected to a connecting bar, and the two connecting bars are respectively arranged on the two rows of connecting plates; the Schottky chips are arranged in rows on the bottom plate on both sides of the connecting plates, and the row direction of the Schottky chips is the same as the row direction of the connecting plates; the Schottky chips are also electrically connected to the connecting plates.

[0006] Further, the bottom plate is made of red copper, the length of the bottom plate is 90 mm to 110 mm, and the width of the bottom plate is 50 mm to 70 mm.

[0007] Further, the connecting plate is a ceramic copper clad plate; wherein the ceramic base is insulating and the copper plate thereon is conductive.

[0008] Further, the connecting bar is made of red copper and the surface of the connecting bar is silver-plated.

[0009] Further, the thickness of the connecting bar is at least 1 mm.

[0010] Further, the connecting bar is also provided with connecting holes for connecting external circuits.

[0011] Furthermore, it also includes a shell, which includes an outer shell and a drawer cover shell; the cross-section of the connecting strip perpendicular to its length direction is "U" or "匚" shaped, the sides of the opening in the connecting strip are opposite, and the upper surface of the connecting strip is provided with a connecting hole; the drawer cover shell is in the shape of a square plate, and the drawer cover shell is slidably arranged between the two connecting strips; the drawer cover shell is also provided with mounting holes corresponding to the connecting holes on the connecting strip, and nuts are arranged in the mounting holes; the outer shell is arranged on the bottom plate, and the outer shell covers the Schottky chip on the bottom plate; the upper surface of the outer shell is also provided with a hollow hole for exposing the upper surface of the connecting strip, and the upper surface of the connecting strip is exposed to the outside of the outer shell from the hollow hole on the outer shell.

[0012] Furthermore, the upper surface of the Schottky chip is connected to the connection board through a thick aluminum wire.

[0013] Furthermore, the wire diameter of the thick aluminum wire is 15 mil to 20 mil.

[0014] Furthermore, each row of connecting boards includes two connecting boards, five Schottky chips are respectively arranged on both sides of each connecting board, and each connecting board is connected to ten Schottky chips; the interval between the Schottky chips located on the same side of the same connecting board is at least 0.8 mm.

[0015] The beneficial effects of the utility model are:

[0016] By setting up fully symmetrically arranged Schottky chips, it is ensured that each Schottky chip can withstand the same current, achieve uniform heat dissipation, and ensure its stable operation;

[0017] By setting the connecting strips in a "U" or "匚" shape and setting a drawer cover between the connecting strips to achieve connection with the external circuit, compared with the traditional connection method of setting sheet electrodes or block electrodes, the overall height of the module is greatly reduced, making the overall volume of the module smaller and having a higher power density;

[0018] Silver plating on the surface of the connecting strip is more conducive to current transmission than traditional electrodes, improving the overall surge current resistance of the module;

[0019] By additionally covering the nickel-plated layer of the base plate with a layer of solder resist, the soldered Schottky chip is guaranteed to work stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of Example 1;

[0021] Figure 2 It is an exploded view of the overall structure of Example 1;

[0022] Figure 3 This is a schematic diagram of the overall structure of Example 1 without the outer shell.

[0023] Description of the drawing reference numerals: Schottky chip 1, thick aluminum wire 11, bottom plate 2, connecting plate 3, connecting bar 4, connecting hole 41, outer shell 5, hollow hole 51, screw 52, extraction cover shell 6, mounting hole 61, strip structure 62, nut 63. Specific implementation mode

[0024] The following describes the implementation mode of the present utility model through specific examples. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through different specific implementation modes. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0025] It should be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present utility model in a schematic manner. Therefore, only the components related to the present utility model are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0026] Embodiment 1:

[0027] An ultra-thin matrix Schottky rectifier module includes a Schottky chip 1; it also includes a bottom plate 2, a connecting plate 3, and a connecting bar 4. The bottom plate 2, the connecting plate 3, and the connecting bar 4 can all conduct electricity as a whole or partially conduct electricity as a whole. Conducting electricity as a whole means that the whole is made of conductive materials, and partially conducting electricity as a whole means that a part of the whole is made of conductive materials; two rows of connecting plates 3 are arranged on the bottom plate 2, and each row of connecting plates 3 includes at least one connecting plate 3, forming a 2*n matrix. In this example, each row of connecting plates 3 includes two connecting plates 3; each row of connecting plates 3 is also correspondingly connected to a connecting bar 4, and the two connecting bars 4 are respectively arranged above the two rows of connecting plates 3; the Schottky chips 1 are arranged in rows on the bottom plates 2 on both sides of the connecting plates 3, and the row direction of the Schottky chips 1 is the same as the row direction of the connecting plates 3; the Schottky chips 1 are also electrically connected to the connecting plates 3.

[0028] The bottom plate 2 is made of copper, the length of the bottom plate 2 is 90mm~110mm, and the width of the bottom plate 2 is 50mm~70mm. In this example, the length and width of the bottom plate 2 are 103.8mm long*58.8mm. The thickness of the bottom plate 2 is 3mm~5mm, and the area on the bottom plate 2 for setting the Schottky chip 1 is also provided with a nickel-plated layer, and an additional layer of solder resist is covered on the nickel-plated layer to prevent the solder of the Schottky chip 1 from melting and causing solder interference and interconnection to the adjacent Schottky chips 1, thereby ensuring the thickness of the tin layer of the Schottky chip 1 soldered, thereby ensuring that the horizontal height of the Schottky chip 1 after soldering is the same, and ensuring that each Schottky chip 1 can evenly pass current and dissipate heat during operation.

[0029] The upper surface of the Schottky chip 1 is connected to the connecting plate 3 through a thick aluminum wire 11. The wire diameter of the thick aluminum wire 11 is 15mil~20mil; in this example, five Schottky chips 1 are respectively arranged on both sides of each connecting plate 3, and each connecting plate 3 is connected to ten Schottky chips 1; the interval between the Schottky chips 1 located on the same side of the same connecting plate 3 is at least 0.8mm; forty Schottky chips 1 are correspondingly arranged on four connecting plates 3, wherein each Schottky chip 1 is a 100A chip, and forty parallel Schottky chips 1 mean that they can withstand a current of 4000A. Combined with the length and width of the bottom plate 2 of 103.8mm*58.8mm, the current density of the bottom plate 2 is calculated to be about 0.66A / mm 2 .

[0030] The connecting plate 3 is a ceramic copper-clad plate; wherein the ceramic base is insulated and the copper plate thereon is conductive; one side of the ceramic in the connecting plate 3 is in contact with the bottom plate 2 at the bottom, and one side of the copper plate faces upward.

[0031] The connecting strip 4 is made of copper, and the surface of the connecting strip 4 is silver-plated; in some other embodiments, nickel plating, tin plating or gold plating can also be selected; the plating layer remains smooth, and the roughness range of the plating layer surface is Ra0.2~0.3; the large area of silver-plated copper strip is welded with the ceramic copper-clad plate to reduce the contact thermal resistance, and the ultrasonic bonding process of 20mil thick aluminum wire is used to reduce the tube voltage drop of the module from 0.9V to 0.7V, which is reduced by 0.2V. Under high-power operating conditions, the heat loss caused by the reduction of 0.2V can reduce P=U*I=0.2V*4000A=800W, which has good economic and energy-saving benefits. The thickness of the connecting strip 4 is at least 1mm, and in this case it is 1.2mm. The connecting strip 4 is also provided with a connection hole 41 for connecting an external circuit; in this case, the cross section of the connecting strip 4 perpendicular to its length direction is "U" or "匚" shaped, and the opening side of the connecting strip 4 is opposite, and the upper surface of the connecting strip 4 is provided with a connection hole 41.

[0032] The housing also includes a shell 5 and a drawer cover shell 6; the drawer cover shell 6 is in the shape of a square plate, and the drawer cover shell 6 is slidably arranged between the two connecting strips 4; the drawer cover shell 6 is also provided with a mounting hole 61 corresponding to the connecting hole 41 on the connecting strip 4, and a nut 63 is arranged in the mounting hole 61, so that the connection structure of the external circuit passes through the connecting hole 41 on the connecting strip 4 and is connected with the thread in the mounting hole to realize the connection between the external circuit and the connecting strip 4; the shell 5 is arranged on the bottom plate 2, and the shell 5 covers the Schottky chip 1 on the bottom plate 2; the upper surface of the shell 5 is also provided with a hollow hole 51 for exposing the upper surface of the connecting strip 4, and the upper surface of the connecting strip 4 is exposed to the outside of the shell 5 from the hollow hole 51 on the shell 5. In this example, the two sides of the shell 5 are connected and fixed to the drawer cover shell 6 by screws 52. In this example, the upper surface of the drawer cover shell 6 is also provided with a raised strip structure 62, and the strip structure 62 is sandwiched between the upper surfaces of the two connecting strips 4 to separate the two connecting strips 4.

[0033] During the implementation process, by setting up a fully symmetrical arrangement of Schottky chips 1, it is ensured that each Schottky chip 1 can withstand the same current, achieve uniform heat dissipation, and ensure its stable operation; by setting the connecting bar 4 to be a "U" or "匚" shape, and setting a drawer shell 6 between the connecting bars 4, it is possible to achieve connection with an external circuit. Compared with the traditional connection method of setting sheet electrodes or block electrodes, the overall height of the module is greatly reduced, making the overall volume of the module smaller and having a higher power density; by silver-plating the surface of the connecting bar 4, it is more conducive to current transmission than traditional electrodes, and the overall surge current resistance of the module is improved; by additionally covering the nickel-plated layer of the base plate 2 with a layer of solder resist film, it is ensured that the welded Schottky chip 1 can work stably.

[0034] The above description is only a specific example of the utility model and does not constitute any limitation to the utility model. Obviously, for professionals in this field, after understanding the content and principle of the utility model, it is possible to make various modifications and changes in form and details without departing from the principle and structure of the utility model, but these modifications and changes based on the idea of the utility model are still within the scope of protection of the claims of the utility model.

Claims

1. An ultra-thin matrix Schottky rectifier module, comprising a Schottky chip (1); characterized in that, The invention also comprises a bottom plate (2), a connecting plate (3) and a connecting strip (4), wherein the bottom plate (2), the connecting plate (3) and the connecting strip (4) are all electrically conductive as a whole or partially electrically conductive as a whole; wherein two rows of connecting plates (3) are arranged on the bottom plate (2), and each row of connecting plates (3) comprises at least one connecting plate (3); each row of connecting plates (3) is also connected to a corresponding connecting strip (4), and the two connecting strips (4) are respectively arranged on the two rows of connecting plates (3); the Schottky chips (1) are arranged in a row on the bottom plate (2) on both sides of the connecting plates (3), and the arrangement direction of the Schottky chips (1) is consistent with the arrangement direction of the connecting plates (3); and the Schottky chips (1) are also electrically connected to the connecting plates (3).

2. The ultra-thin matrix Schottky rectifier module according to claim 1, characterized in that The bottom plate (2) is made of red copper, the length of the bottom plate (2) is 90 mm to 110 mm, and the width of the bottom plate (2) is 50 mm to 70 mm.

3. The ultra-thin matrix Schottky rectifier module according to claim 1, wherein The connecting plate (3) is a ceramic copper-clad plate; the ceramic base is insulating and the copper plate thereon is conductive.

4. A kind of ultra-thin matrix Schottky rectifier module according to claim 1, characterized in that, The connecting strip (4) is made of red copper, and the surface of the connecting strip (4) is silver-plated.

5. A kind of ultra-thin matrix Schottky rectifier module according to claim 4, characterized in that, The thickness of the connecting strip (4) is at least 1 mm.

6. An ultra-thin matrix Schottky rectifier module according to any one of claims 1 to 5, characterized in that The connecting bar (4) is also provided with a connecting hole (41) for connecting to an external circuit.

7. The ultra-thin matrix Schottky rectifier module according to claim 6, characterized in that, The housing also comprises an outer shell (5) and a drawer cover shell (6); the cross section of the connecting strip (4) perpendicular to its length direction is in a "U" or "匚" shape, the two sides of the opening in the connecting strip (4) are opposite, and the upper surface of the connecting strip (4) is provided with a connecting hole (41); the drawer cover shell (6) is in a square plate shape, and the drawer cover shell (6) is slidably arranged between the two connecting strips (4); the drawer cover shell (6) is also provided with a mounting hole (61) corresponding to the connecting hole (41) on the connecting strip (4), and a nut (63) is arranged in the mounting hole (61); the outer shell (5) is arranged on the bottom plate (2), and the outer shell (5) covers the Schottky chip (1) on the bottom plate (2); the upper surface of the outer shell (5) is also provided with a hollow hole (51) for exposing the upper surface of the connecting strip (4), and the upper surface of the connecting strip (4) is exposed to the outside of the outer shell (5) from the hollow hole (51) on the outer shell (5).

8. The ultra-thin matrix Schottky rectifier module according to claim 1, characterized in that, The upper surface of the Schottky chip (1) is connected to the connection board (3) via a thick aluminum wire (11).

9. The ultra-thin matrix Schottky rectifier module according to claim 8, wherein, The wire diameter of the thick aluminum wire (11) is 15 mil to 20 mil.

10. A kind of ultra-thin matrix Schottky rectifier module according to claim 1, characterized in that, Each row of connection boards (3) comprises two connection boards (3), five Schottky chips (1) are respectively arranged on both sides of each connection board (3), and each connection board (3) is connected to ten Schottky chips (1); the interval between the Schottky chips (1) located on the same side of the same connection board (3) is at least 0.8 mm.

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