Circuit board multi-section heat dissipation structure and clothes dryer

Abstract

The utility model discloses a circuit board multi-section type heat dissipation structure and a clothes dryer, the heat dissipation structure comprises a machine body, a roller, an air duct piece, a support, a circuit board, a heat dissipation piece, a first cooling pipeline and a second cooling pipeline, the roller is rotatably installed in the machine body, the air duct piece forms an air supply channel, and the air supply channel communicates with the roller and is used for conveying hot air into the roller; the support is locked on the outer wall face of the air duct piece through a fastener, an installation cavity for embedding installation of the circuit board is formed in the support, the heat dissipation piece is attached to the back face of the circuit board, at least part of the first cooling pipeline is arranged in the heat dissipation piece, the first cooling pipeline comprises a first inlet end, and the first inlet end is connected to the condenser through a pipeline. The second cooling pipeline is at least partially arranged in the heat dissipation piece and comprises a second inlet end, and the second inlet end is connected to the cooling water tank through a pipeline. According to the invention, the circuit board is subjected to multi-section cooling, so that the heat dissipation effect of the circuit board is remarkably improved.

Description

Technical Field

[0001] This application relates to the technical field of dryers, and particularly to a multi-stage heat dissipation structure for a circuit board and a dryer. Background Art

[0002] A dryer is a type of household cleaning appliance that uses electric heating to instantly evaporate and dry the moisture in washed clothes. Inside the dryer, since it is necessary to continuously maintain a relatively high drying temperature, the temperature inside the machine body remains at a relatively high level for a long time. And the circuit board also generates heat continuously during operation, which easily causes the circuit board to overheat and damages the circuit board. Summary of the Utility Model

[0003] The purpose of the embodiments of this application is to provide a multi-stage heat dissipation structure for a circuit board and a dryer. By performing multi-stage cooling on the circuit board, the heat dissipation effect of the circuit board is significantly improved.

[0004] To achieve the above object, this application adopts the following technical solutions:

[0005] On the one hand, a multi-stage heat dissipation structure for a circuit board is provided, including: a machine body, a drum, an air duct member, a bracket, a circuit board, a heat dissipation member, a first cooling pipeline, and a second cooling pipeline. The drum is rotatably installed inside the machine body. The air duct member forms an air supply channel, and the air supply channel is communicated with the drum for delivering hot air into the drum. A limiting frame is convexly provided on the outer wall surface of the air duct member, and a limiting hole is formed between the limiting frame and the inner wall surface of the air duct member. A limiting portion that cooperates with the limiting hole for limiting is provided on the bracket, and the bracket is locked to the outer wall surface of the air duct member through a fastening member. An installation cavity for the circuit board to be fitted and installed is formed on the bracket. The heat dissipation member is attached to the back surface of the circuit board. At least part of the first cooling pipeline is arranged inside the heat dissipation member. The first cooling pipeline includes a first inlet end, and the first inlet end is connected to a condenser through a pipeline. At least part of the second cooling pipeline is arranged inside the heat dissipation member. The second cooling pipeline includes a second inlet end, and the second inlet end is connected to a cooling water tank through a pipeline.

[0006] Further, a throttling member and a third cooling pipeline are further included. At least part of the third cooling pipeline is arranged inside the heat dissipation member. The first cooling pipeline includes a first outlet end, the third cooling pipeline includes a third inlet end, the throttling member includes a throttling outlet end and a throttling inlet end, the first outlet end is connected to the throttling inlet end, and the throttling outlet end is connected to the third inlet end.

[0007] Further, a control valve is further included. The control valve is connected between the throttling outlet end and the third inlet end, and the control valve is used to control the on-off of the pipeline between the throttling outlet end and the third inlet end.

[0008] Furthermore, the heat sink includes a first heat sink and a second heat sink that are staggered and connected, the first cooling pipeline is at least partially disposed in the first heat sink, and the second cooling pipeline is at least partially disposed in the second heat sink.

[0009] Furthermore, the heat sink also includes a third heat sink that is staggeredly connected to the first heat sink, and the third cooling pipeline is at least partially disposed in the third heat sink.

[0010] Further, the third cooling pipeline includes a third outlet end, and the third outlet end is connected to the evaporator.

[0011] Furthermore, a one-way valve is provided between the third outlet port and the evaporator, and the one-way valve is configured to limit the refrigerant to flow only from the third outlet port to the evaporator.

[0012] Furthermore, a temperature sensor is provided on the circuit board, and the temperature sensor is electrically connected to the control valve.

[0013] Furthermore, it also includes a return pipe, the second cooling pipeline includes a second outlet end, one end of the return pipe is connected to the second outlet end, and the other end is connected to the cooling water tank.

[0014] On the other hand, a clothes dryer is provided, comprising the multi-stage heat dissipation structure of the circuit board as described in any one of the above items, and a driving assembly, wherein the power end of the driving assembly is connected to the drum.

[0015] The beneficial effects of the present application are as follows: This structure is based on two different cooling methods: one is liquid cooling, and the other is air cooling. Air cooling dissipates heat through the air supply channel formed by the air duct member. The hot air is conveyed into the drum to dry the clothes. At the same time, this hot air also flows through the outer wall surface of the air duct member, performing preliminary heat exchange and heat dissipation on the circuit board installed thereon. The reason why air cooling can be adopted here is that the temperature of the conveyed hot air is generally lower than the temperature value reached after the circuit board operates. Liquid cooling includes a first cooling pipeline and a second cooling pipeline. The first cooling pipeline is at least partially disposed inside the heat dissipation member and is connected to the condenser through the first inlet end. When the cooling liquid, such as refrigerant, flows into the first cooling pipeline from the condenser, it absorbs the heat dissipated by the circuit board and then flows back to the evaporator for heat dissipation, forming a cycle. The second cooling pipeline is also at least partially disposed inside the heat dissipation member and is connected to the cooling water tank through the second inlet end. The cooling water or other cooling liquid in the cooling water tank flows into the second cooling pipeline through the pipeline, further absorbing the heat of the circuit board, and then flowing back to the cooling water tank for circulating cooling. By combining the two heat dissipation methods of air cooling and liquid cooling, the circuit board can be more efficiently and evenly cooled, significantly reducing the possibility of overheating of the circuit board, thereby extending the service life of the circuit board. Due to the adoption of the two heat dissipation methods, the operating temperature of the circuit board can be more stably controlled within a certain range, which helps to improve the operating efficiency and stability of the dryer. Brief Description of the Drawings

[0016] The following further elaborates on the present application in detail with reference to the drawings and embodiments.

[0017] Figure 1 It is a schematic diagram of the internal structure of the dryer according to the embodiment of the present application;

[0018] Figure 2 It is an assembly diagram of the air duct member, the first cooling pipeline, and the second cooling pipeline according to the embodiment of the present application;

[0019] Figure 3 It is a perspective view of the air duct member according to the embodiment of the present application;

[0020] Figure 4 It is an assembly diagram of the bracket and the circuit board according to the embodiment of the present application;

[0021] Figure 5 It is a schematic diagram of the connection between the heat dissipation member and the pipeline according to the embodiment of the present application.

[0022] In the figure: 1, body; 2, drum; 3, air duct member; 301, limit frame; 302, limit hole; 4, bracket; 401, limit portion; 5, circuit board; 6, heat dissipation member; 601, first heat dissipation plate; 602, second heat dissipation plate; 603, third heat dissipation plate; 7, first cooling pipeline; 8, second cooling pipeline; 9, inside the cooling water tank; 10, third cooling pipeline; 11, throttle member; 12, return water pipe. Detailed implementation manner

[0023] To make the technical problems solved by this application, the technical solutions adopted, and the achieved technical effects clearer, the technical solutions of the embodiments of this application will be further described in detail below. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of this application.

[0024] In the description of this application, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0025] In this application, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but are in contact through other features therebetween. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is at a higher horizontal height than the second feature. The first feature being "below", "below", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is at a lower horizontal height than the second feature.

[0026] As Figures 1 - 5As shown in the figure, this embodiment provides a multi-section heat dissipation structure for a circuit board, including: a body 1, a drum 2, an air duct member 3, a bracket 4, a circuit board 5, a heat dissipation member 6, a first cooling pipeline 7, and a second cooling pipeline 8. The drum 2 is rotatably installed inside the body 1. The air duct member 3 forms an air supply channel, and the air supply channel is communicated with the drum 2 for delivering hot air into the drum 2. A limiting frame 301 is convexly provided on the outer wall surface of the air duct member 3, and a limiting hole 302 is formed between the limiting frame 301 and the inner wall surface of the air duct member 3. A limiting portion 401 that cooperates with the limiting hole 302 for limiting is provided on the bracket 4, and the bracket 4 is locked to the outer wall surface of the air duct member 3 through a fastener. An installation cavity for the circuit board 5 to be fitted and installed is formed on the bracket 4. The heat dissipation member 6 is attached to the back surface of the circuit board 5. At least part of the first cooling pipeline 7 is arranged inside the heat dissipation member 6. The first cooling pipeline 7 includes a first inlet end, and the first inlet end is connected to a condenser through a pipeline. At least part of the second cooling pipeline 8 is arranged inside the heat dissipation member 6. The second cooling pipeline 8 includes a second inlet end, and the second inlet end is connected to a cooling water tank through a pipeline.

[0027] Based on the above solution, there are two different cooling methods: one is liquid cooling, and the other is air cooling. Air cooling is through the air supply channel formed by the air duct member 3, and the hot air is delivered into the drum 2 to dry clothes. At the same time, this hot air will also flow through the outer wall surface of the air duct member 3 to conduct preliminary heat exchange and heat dissipation for the circuit board 5 installed on it. The reason why air cooling can be adopted here is that the temperature of the delivered hot air is generally lower than the temperature value reached after the circuit board 5 works. Liquid cooling includes the first cooling pipeline 7 and the second cooling pipeline 8. At least part of the first cooling pipeline 7 is arranged inside the heat dissipation member 6 and is connected to the condenser through the first inlet end. When the cooling liquid such as refrigerant flows into the first cooling pipeline 7 from the condenser, it will absorb the heat dissipated by the circuit board 5, and then flow back to the evaporator for heat dissipation, forming a cycle. At least part of the second cooling pipeline 8 is also arranged inside the heat dissipation member 6 and is connected to the cooling water tank through the second inlet end. The cooling water or other coolant in the cooling water tank 9 flows into the second cooling pipeline 8 through a pipeline to further absorb the heat of the circuit board 5, and then flows back to the cooling water tank for circulating cooling. By combining the two heat dissipation methods of air cooling and liquid cooling, the circuit board 5 can obtain more efficient and uniform heat dissipation, significantly reducing the possibility of overheating of the circuit board 5, thereby extending the service life of the circuit board 5. Due to the adoption of two heat dissipation methods, the working temperature of the circuit board 5 can be more stably controlled within a certain range, which helps to improve the working efficiency and stability of the clothes dryer.

[0028] It is worth mentioning that the air-cooled heat dissipation of the air supply channel belongs to the cooling and heat dissipation in the first stage. Since the existing air resources are used for heat dissipation in this stage, the heat dissipation effect is poor. For this reason, subsequent liquid cooling is added. By cooling and dissipating heat from the circuit board 5 separately or simultaneously through two cooling pipelines, the heat dissipation effect can be effectively improved, so that the circuit board 5 never overheats and operates stably.

[0029] Furthermore, it also includes a throttling member 11 and a third cooling pipeline 10. At least part of the third cooling pipeline 10 is arranged inside the heat dissipation member 6. The first cooling pipeline 7 includes a first outlet end, the third cooling pipeline 10 includes a third inlet end, the throttling member 11 includes a throttling outlet end and a throttling inlet end. The first outlet end is connected to the throttling inlet end, and the throttling outlet end is connected to the third inlet end. When the cooling liquid such as refrigerant flows into the first cooling pipeline 7 from the condenser, it will absorb the heat dissipated by the circuit board 5. When the cooling liquid flows through the first cooling pipeline 7 and then flows out from the first outlet end. At this time, the cooling liquid flowing out from the first cooling pipeline 7 passes through the throttling member 11. The function of the throttling member 11 is to increase the flow velocity and pressure loss of the fluid by reducing the flow channel area, thereby reducing the temperature and pressure of the fluid. Specifically, the throttling inlet end receives the cooling liquid flowing out from the first outlet end and flows out from the throttling outlet end after throttling. The throttled cooling liquid enters the third cooling pipeline 10. At least part of the third cooling pipeline 10 is also arranged inside the heat dissipation member 6. The third cooling pipeline 10 receives the cooling liquid flowing out from the throttling outlet end through the third inlet end. Since the temperature and pressure of the cooling liquid are reduced after throttling, it can absorb the heat of the circuit board 5 more effectively, thereby realizing further heat dissipation. By adding the throttling member 11 and the third cooling pipeline 10, the heat dissipation efficiency of the heat dissipation structure is further improved. The throttling member 11 can reduce the temperature and pressure of the cooling liquid, so that the cooling liquid in the third cooling pipeline 10 can absorb heat more effectively.

[0030] Even further, it also includes a control valve. The control valve is connected between the throttling outlet end and the third inlet end. The control valve is used to control the on-off of the pipeline between the throttling outlet end and the third inlet end. The control valve can control the on-off of the pipeline between the throttling outlet end and the third inlet end according to the working temperature of the circuit board 5 or the preset heat dissipation requirement. When the control valve is opened, the throttled cooling liquid can enter the third cooling pipeline 10 to further absorb the heat of the circuit board 5. When the control valve is closed, the cooling liquid in the third cooling pipeline 10 stops flowing. At this time, only the first cooling pipeline 7 and the second cooling pipeline 8 are used for heat dissipation. Simply put, the third cooling pipeline 10 is used when the temperature of the circuit board 5 is too high. Generally, the heat dissipation effect of the circuit board 5 can be ensured through the first cooling pipeline 7 and the second cooling pipeline 8. However, for the sake of insurance, the third cooling pipeline 10 is added.

[0031] In some embodiments, the heat sink 6 includes a first heat sink 601 and a second heat sink 602 that are staggered, the first cooling pipeline 7 is at least partially disposed in the first heat sink 601, and the second cooling pipeline 8 is at least partially disposed in the second heat sink 602; in addition, the heat sink 6 also includes a third heat sink 603 that is staggered with the first heat sink 601, and the third cooling pipeline 10 is at least partially disposed in the third heat sink 603. The first heat sink 601 in the heat sink 6 is closely attached to the circuit board 5, and is used to receive and conduct the heat generated by the circuit board 5. The first cooling pipeline 7 is at least partially disposed in the first heat sink 601. When the cooling liquid flows from the condenser into the first cooling pipeline 7, it absorbs the heat of the circuit board 5 conducted on the first heat sink 601 to achieve heat transfer. The second heat sink 602 that is staggered with the first heat sink 601 has a second cooling pipeline 8 at least partially disposed therein. The second cooling pipeline 8 is connected to the cooling water tank through a pipeline, and uses cooling water or other cooling liquid to further absorb the heat conducted from the first heat sink 601 or the circuit board 5. The newly added third heat sink 603 is staggeredly connected with the first heat sink 601, and a third cooling pipeline 10 is at least partially arranged inside it. The third cooling pipeline 10 is connected to the first cooling pipeline 7 through a throttling member 11. When the control valve is opened, the throttled cooling liquid flows into the third cooling pipeline 10 to provide additional heat dissipation support for the circuit board 5. Through the staggered connection of the first heat sink 601, the second heat sink 602 and the third heat sink 603, a multi-level heat dissipation structure is formed. This design makes the heat dissipation area larger and the heat conduction more uniform, thereby improving the heat dissipation efficiency.

[0032] At the same time, the third cooling pipeline 10 includes a third outlet end, the third outlet end is connected to the evaporator, and a one-way valve is arranged between the third outlet end and the evaporator, and the one-way valve is configured to limit the refrigerant to flow only from the third outlet end to the evaporator. The evaporator is an important component in the dryer, and its function is to evaporate the liquid refrigerant into a gaseous state, while absorbing heat, thereby reducing the surrounding temperature. In this system, the evaporator is used to absorb the heat released by the cooling liquid in the third cooling pipeline 10, so that the cooling liquid returns to a lower temperature and state, and prepares for the next cycle. The one-way valve is installed between the third outlet end and the evaporator, and its function is to limit the flow direction of the refrigerant, ensure that the refrigerant can only flow from the third outlet end to the evaporator, prevent the refrigerant from flowing back and leaking, and ensure the normal operation of the system.

[0033] Preferably, a temperature sensor is provided on the circuit board 5, and the temperature sensor is electrically connected to the control valve. The temperature sensor can accurately sense the temperature change of the circuit board 5 and convert the temperature data into an electrical signal. The temperature sensor transmits the monitored temperature data to the control valve through an electrical connection. This electrical connection can be a direct wired connection or achieved through wireless communication. After receiving the temperature data from the temperature sensor, the control valve will judge whether it is necessary to adjust the heat dissipation capacity of the heat dissipation system according to a preset algorithm or logic. If the temperature of the circuit board 5 exceeds the preset safety threshold, the control valve will open, allowing the throttled cooling liquid to flow into the third cooling pipeline 10 to enhance the heat dissipation effect; if the temperature of the circuit board 5 is within the safe range or lower, the control valve will close to reduce unnecessary heat dissipation consumption.

[0034] Further, a return pipe 12 is further included. The second cooling pipeline 8 includes a second outlet end. One end of the return pipe 12 is connected to the second outlet end, and the other end is connected to the cooling water tank. The cooling liquid flowing out from the second outlet end flows back to the cooling water tank through the return pipe 12. The introduction of the return pipe 12 ensures that the cooling liquid can form a complete cycle during the heat dissipation process, improving the cooling efficiency. At the same time, the return pipe 12 can also help maintain the stability of the coolant volume in the cooling water tank, ensuring the continuous and stable operation of the heat dissipation system.

[0035] On the other hand, a dryer is also provided, including the circuit board multi-stage heat dissipation structure as described in any one of the above, and a driving assembly. The power end of the driving assembly is connected to the drum 2.

[0036] In the description of this article, it should be understood that the orientation or positional relationships such as "upper", "lower", "left", "right", etc. are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to this application. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0037] In the description of this specification, the description referring to terms such as "one embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0038] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0039] The technical principles of the present application have been described above in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present application and should not be construed in any way as limiting the scope of protection of the present application. Based on the explanations herein, those skilled in the art can readily conceive of other specific embodiments of the present application without creative effort, and these embodiments will fall within the scope of protection of the present application.

Claims

1. A multi-segment heat dissipation structure for a circuit board, characterized in that, Including: A body (1), a drum (2), an air duct member (3), a bracket (4), a circuit board (5), a heat sink (6), a first cooling pipeline (7) and a second cooling pipeline (8). The drum (2) is rotatably installed inside the body (1). The air duct member (3) forms an air supply channel, and the air supply channel is communicated with the drum (2) for delivering hot air into the drum (2). A limiting frame (301) protrudes from the outer wall surface of the air duct member (3), and a limiting hole (302) is formed between the limiting frame (301) and the inner wall surface of the air duct member (3). A limiting portion (401) which is matched with the limiting hole (302) for limiting is arranged on the bracket (4), and the bracket (4) is locked to the outer wall surface of the air duct member (3) through a fastener. An installation cavity for the circuit board (5) to be fitted and installed is formed on the bracket (4). The heat sink (6) is attached to the back surface of the circuit board (5). At least part of the first cooling pipeline (7) is arranged inside the heat sink (6). The first cooling pipeline (7) includes a first inlet end, and the first inlet end is connected to a condenser through a pipeline. At least part of the second cooling pipeline (8) is arranged inside the heat sink (6). The second cooling pipeline (8) includes a second inlet end, and the second inlet end is connected to a cooling water tank through a pipeline.

2. The multi-segment heat dissipation structure of the circuit board according to claim 1, wherein It further includes a throttling member (11) and a third cooling pipeline (10). At least part of the third cooling pipeline (10) is arranged inside the heat sink (6). The first cooling pipeline (7) includes a first outlet end, the third cooling pipeline (10) includes a third inlet end. The throttling member (11) includes a throttling outlet end and a throttling inlet end. The first outlet end is connected to the throttling inlet end, and the throttling outlet end is connected to the third inlet end.

3. The multi-segment heat dissipation structure of the circuit board according to claim 2, characterized in that, It further includes a control valve. The control valve is connected between the throttling outlet end and the third inlet end, and the control valve is used to control the on-off of the pipeline between the throttling outlet end and the third inlet end.

4. The multi-segment heat dissipation structure of the circuit board according to claim 2, wherein, The heat sink (6) includes a first heat dissipation plate (601) and a second heat dissipation plate (602) which are connected in an alternating manner. At least part of the first cooling pipeline (7) is arranged inside the first heat dissipation plate (601), and at least part of the second cooling pipeline (8) is arranged inside the second heat dissipation plate (602).

5. The multi-segment heat dissipation structure of the circuit board according to claim 4, wherein The heat sink (6) further includes a third heat dissipation plate (603) which is connected in an alternating manner with the first heat dissipation plate (601). At least part of the third cooling pipeline (10) is arranged inside the third heat dissipation plate (603).

6. The multi-stage heat dissipation structure of the circuit board according to claim 2, characterized in that, The third cooling pipeline (10) includes a third outlet end, and the third outlet end is connected to an evaporator.

7. The multi-segment heat dissipation structure of the circuit board according to claim 6, wherein, A check valve is arranged between the third outlet end and the evaporator, and the check valve is configured to limit the refrigerant to flow only from the third outlet end to the evaporator.

8. The multi-segment heat dissipation structure of a circuit board according to claim 3, characterized in that, A temperature sensor is arranged on the circuit board (5), and the temperature sensor is electrically connected to the control valve.

9. The multi-segment heat dissipation structure of the circuit board according to claim 8, wherein, It further includes a return water pipe (12). The second cooling pipeline (8) includes a second outlet end. One end of the return water pipe (12) is connected to the second outlet end, and the other end is connected to the cooling water tank.

10. A dryer, characterized in that, It includes the multi-segment heat dissipation structure of the circuit board according to any one of claims 1-9, and a driving component. The power end of the driving component is connected to the roller (2).

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