Protective structure for circuit module

Abstract

The utility model relates to the technical field of circuit modules, in particular to a protection structure for a circuit module, which comprises a circuit module main body, a circuit board is arranged on the circuit module main body, a lower shell is connected below the circuit board, and a wiring harness end is welded on the circuit board. An internal low-pressure injection molding protection structure and an external low-pressure injection molding protection structure are arranged on the inner side and the outer side of the circuit module body respectively, a boss is integrally arranged on the side face of the internal low-pressure injection molding protection structure and is in close fit with the lower shell, and a fixing hole is formed in the circuit board. The protection structure for the circuit module solves the dustproof and waterproof problems of the circuit board in a low-pressure injection molding manner, ensures the state stability and the parallelism of structural parts while accurately positioning the circuit board, is easy to cure glue, and improves the yield of a potting process.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit modules, and particularly relates to a protection structure for a circuit module. Background Technique

[0002] A circuit module refers to a device that integrates electronic circuits with specific functions within a small range, usually including some basic electronic components (such as resistors, capacitors, diodes, transistors, etc.) and possibly integrated circuits (ICs). Circuit modules are an important part of modern electronic technology. Therefore, protecting circuit modules can improve the quality of circuit modules. By designing a protection structure, circuit modules have the advantages of moisture-proof, waterproof, dust-proof, corrosion-proof, shock-proof, insulation isolation, and improved heat dissipation.

[0003] The existing circuit modules are made into a protection structure by the potting method. At present, the potting process mainly fills glue into the structural parts containing electronic components and circuits manually or by equipment, and then achieves complete curing under normal temperature or heating conditions to become a thermosetting polymer insulating material with excellent performance, so as to achieve the purposes of bonding, sealing, and coating.

[0004] However, the current potting process has the following disadvantages: 1. It is difficult for the glue selection to meet all requirements. If the selection is inappropriate, it is difficult to repair and maintain the components when they are affected by moisture and aging and malfunction, which will affect the yield rate during mass production, and even cause the scrapping of finished products or the generation of after-sales parts; 2. It is easy to have the situation of glue poisoning (non-curing), and it is impossible to achieve the completeness and stability of the curing state; 3. The potting operation process will also have a certain impact on the environment and is not environmentally friendly enough. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a protection structure for a circuit module, so as to solve the problems of glue quality, easy generation of defective products, incomplete curing, and lack of environmental friendliness in the current market when the circuit module protection structure is processed by potting as mentioned in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A protection structure for a circuit module, including a circuit module main body, a circuit board is provided on the circuit module main body, a lower housing is connected below the circuit board, and a wire harness end is welded on the circuit board. An internal low-pressure injection molding protection structure and an external low-pressure injection molding protection structure are respectively arranged inside and outside the circuit module main body. A boss is integrally arranged on the side of the internal low-pressure injection molding protection structure, and the boss is closely matched with the lower housing. Fixing holes are opened on the circuit board.

[0007] Preferably, the internal low-pressure injection molding protection structure and the external low-pressure injection molding protection structure are integrally formed.

[0008] Preferably, the internal low-pressure injection molding protection structure and the external low-pressure injection molding protection structure completely cover the circuit board and the connection part between the wire harness end and the circuit board.

[0009] Preferably, there are six bosses, and the bosses are in interference fit with the lower shell.

[0010] Preferably, three fixing holes are provided, and the fixing holes are evenly distributed on the circumference.

[0011] Preferably, the circuit board is fixedly connected to the lower shell through the fixing holes after being wrapped by low-pressure injection molding.

[0012] Compared with the prior art, the beneficial effects of the present utility model are:

[0013] 1. The protection structure for the circuit module solves the problems of dust and water protection for the circuit board by means of low-pressure injection molding. While accurately positioning the circuit board, it ensures the state stability and the parallelism of the structural parts, is conducive to the curing of glue, and improves the yield of the potting process.

[0014] 2. The protection structure for the circuit module meets a higher dust and water protection level by completely wrapping the circuit module and the wire harness end.

[0015] 3. The protection structure for the circuit module ensures the compression and parallelism between the lower shell and the internal low-pressure injection molding protection structure through the design of the boss structure.

[0016] 4. The protection structure for the circuit module ensures the stability of the state of the circuit module and the consistency of the position of the circuit module by adding 3 fixing holes on the circuit module. Description of the Drawings

[0017] Figure 1 It is the bottom view of a protection structure for a circuit module of the present utility model;

[0018] Figure 2 It is the top view of the relative position structure of the internal low-pressure injection molding protection structure of a protection structure for a circuit module of the present utility model with respect to the circuit board;

[0019] Figure 3 It is the side view of a protection structure for a circuit module of the present utility model;

[0020] Figure 4 It is the side view of the boss position of a protection structure for a circuit module of the present utility model.

[0021] In the figure: 1. Main body of the circuit module; 2. Internal low-pressure injection molding protection structure; 3. External low-pressure injection molding protection structure; 4. Lower housing; 5. Wiring harness end; 6. Boss; 7. Fixing hole; 8. Circuit board. Specific implementation manner

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0023] Please refer to Figures 1-4, the present utility model provides a technical solution: a protection structure for a circuit module, including a circuit module body 1, a circuit board 8 is provided on the circuit module body 1, and a lower housing 4 is connected below the circuit board 8, and a wire harness end 5 is welded on the circuit board 8. An internal low-pressure injection molding protection structure 2 and an external low-pressure injection molding protection structure 3 are respectively provided on the inner and outer sides of the circuit module body 1. The internal low-pressure injection molding protection structure 2 and the external low-pressure injection molding protection structure 3 are integrally formed. This structure enables the internal low-pressure injection molding protection structure 2 and the external low-pressure injection molding protection structure 3 to be formed on the inner and outer sides of the lower housing 4 respectively when the circuit module body 1 is filled with glue by low-pressure injection molding. The internal low-pressure injection molding protection structure 2 and the external low-pressure injection molding protection structure 3 completely cover the circuit board 8 and the connection part between the wire harness end 5 and the circuit board 8. This structure can ensure that all parts of the circuit module body 1 are covered in the glue, so that the formed protection structure can perform all-round dust and waterproof protection treatment on the circuit module body 1, and at the same time avoid the exposure of the wiring part of the wire harness end 5. A boss 6 is integrally provided on the side of the internal low-pressure injection molding protection structure 2, and the boss 6 is tightly fitted with the lower housing 4. There are six bosses 6, and the boss 6 is interference-fitted with the lower housing 4. This structure of the boss 6 can press the inner internal low-pressure injection molding protection structure 2 into the lower housing 4 by interference, ensuring the parallelism between the lower housing 4 and the internal low-pressure injection molding protection structure 2, and ensuring the parallelism between the lower housing 4 and the structure for installing the circuit module body 1, ensuring the uniformity of glue filling, and enabling the glue to solidify smoothly. Three fixing holes 7 are provided on the circuit board 8, and the fixing holes 7 are evenly distributed on the circumference. This structure enables the circuit board 8 to be evenly stressed through the arrangement of the fixing holes 7, ensuring the stability of the circuit board 8 positioning. After the circuit board 8 is wrapped by low-pressure injection molding, it is fixedly connected to the lower housing 4 through the fixing holes 7. The fixing holes 7 are threaded holes. This structure enables the circuit board 8 to be connected and positioned with the lower housing 4 by screwing the screws into the fixing holes 7 after being wrapped by low-pressure injection molding, ensuring the structural stability of the circuit board 8 in the X and Y directions, and avoiding the problem of the circuit module body 1 shifting during the low-pressure injection molding process of the internal low-pressure injection molding protection structure 2.

[0024] Working principle: When using the protection structure for the circuit module, first, when the circuit module body 1 is potted, the glue is injected into the circuit module body 1 through low-pressure injection molding technology, forming an external low-pressure injection molding protection structure 3 on the side of the lower housing 4 and an internal low-pressure injection molding protection structure 2 inside the lower housing 4. The boss 6 presses the internal low-pressure injection molding protection structure 2 into the lower housing 4 by interference, ensuring the parallelism between the internal low-pressure injection molding protection structure 2 and the lower housing 4. At the same time, the fixing holes 7 position the circuit board 8 in the X and Y directions, avoiding the position shift of the circuit board 8. At the same time, the welding part between the wire harness end 5 and the circuit board 8 is also completely covered, improving the protection performance of the circuit module body 1, and thus completing a series of work.

[0025] Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A protective structure for a circuit module, comprising a circuit module body (1), characterized in that: A circuit board (8) is provided on the main body (1) of the circuit module, and a lower housing (4) is connected below the circuit board (8). A wire harness end (5) is soldered on the circuit board (8). An internal low-pressure injection molding protection structure (2) and an external low-pressure injection molding protection structure (3) are respectively provided on the inner and outer sides of the main body (1) of the circuit module. A boss (6) is integrally provided on the side of the internal low-pressure injection molding protection structure (2), and the boss (6) is tightly fitted with the lower housing (4). A fixing hole (7) is provided on the circuit board (8).

2. The protective structure for a circuit module according to claim 1, wherein: The internal low-pressure injection molding protection structure (2) and the external low-pressure injection molding protection structure (3) are integrally formed between them.

3. The protective structure for a circuit module according to claim 1, characterized in that: The internal low-pressure injection molding protection structure (2) and the external low-pressure injection molding protection structure (3) completely cover the circuit board (8) and the connection part of the wire harness end (5) and the circuit board (8).

4. A protection structure for a circuit module according to claim 1, characterized in that: Six bosses (6) are provided, and the bosses (6) are interference-fitted with the lower housing (4).

5. A protection structure for a circuit module according to claim 1, characterized in that: Three fixing holes (7) are provided, and the fixing holes (7) are evenly distributed on the circumference.

6. The protective structure for a circuit module according to claim 5, characterized in that: After being wrapped by low-pressure injection molding, the circuit board (8) is fixedly connected to the lower housing (4) through the fixing holes (7).

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