Active temperature control heat dissipation structure and driver
The proactive cooling system in inverters and drives uses semiconductor coolers and heat pipes to manage heat transfer and distribution, achieving efficient temperature reduction and component longevity without increasing size or cost.
Patent Information
- Application Number
- CN202422162871.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-03
AI Technical Summary
In the process of reducing the volume, existing drivers face the problems of plate-level heat dissipation difficulties, and conventional heat dissipation solutions are high cost, large in size and insufficient heat dissipation effect.
The active temperature-controlled heat dissipation structure is adopted, including an installation substrate, a semiconductor refrigeration sheet, an inner radiator, an inner circulating fan and heat pipe. The heat from the inner radiator is transferred to the installation substrate through the semiconductor refrigeration sheet, and the internal circulating fan is used to blow the cooling gas to the circuit board. The outer radiator transfers heat to the outside through the heat pipe to achieve active cooling.
While maintaining low cost and small volume, it significantly improves heat dissipation effect, reduces circuit board temperature, extends the life of capacitors and other devices, and improves protection level.
Smart Images
Figure CN223110382U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat dissipation technology, and in particular to an active temperature control heat dissipation structure and a driver. Background Art
[0002] As the size of inverters and drivers becomes smaller and smaller, the power density becomes higher and higher, and the protection level of the casing becomes higher and higher, the heat sources such as the driver board, power board, control board, and filter board in the driver cavity are coupled with each other, and the multi-layer boards are stacked and blocked, making the board-level heat dissipation of the driver more and more difficult.
[0003] The conventional ways to solve the board-level heat dissipation of the driver include increasing the opening of the shell, increasing the heat sink or heat dissipation sheet metal, setting up an internal circulation fan, increasing the size of the whole machine, and using a metal shell for the shell. However, the opening of the shell only dissipates heat naturally, and the heat dissipation improvement effect is limited, which will affect the protection of the single board or increase the cost of single board protection. Adding a heat sink or heat dissipation sheet metal is significantly helpful in solving the heat dissipation of bottleneck heating devices. Since there are many discrete devices on the driver board and other boards, the height difference is obvious, and the requirements for the single board layout are high. In addition, the actual improvement effect of the heat dissipation sheet metal or heat sink in the sealed cavity is small. The maximum operating temperature of a conventional fan is about 70°C. When used as an internal circulation fan, a fan with a higher temperature resistance specification needs to be selected, which increases the cost. Increasing the size of the whole machine is contrary to miniaturization, and is contrary to the method of reducing the volume by stacking multi-layer boards of the driver, and the cost of using a metal shell will increase significantly. Therefore, there is currently a lack of effective heat dissipation structure for the difficulty of board-level heat dissipation caused by the reduction of the driver volume, so as to achieve low cost and small volume while improving the heat dissipation effect. Utility Model Content
[0004] The embodiment of the present application provides an active temperature control heat dissipation structure, which can solve the current lack of an effective heat dissipation structure for reducing the size of the driver, resulting in difficulty in board-level heat dissipation, and achieve the technical problem of improving the heat dissipation effect while maintaining low cost and small size.
[0005] The present application provides an active temperature control and heat dissipation structure, which is applied to a driver. The active temperature control and heat dissipation structure includes:
[0006] A mounting base plate fixed in the inner cavity of the drive side of the driver;
[0007] A semiconductor cooling sheet is arranged on one side of the mounting substrate, the semiconductor cooling sheet is provided with a cold end and a hot end, and the hot end is attached to the mounting substrate;
[0008] An inner radiator is arranged on the other side of the semiconductor cooling plate away from the mounting substrate, and the cold end is attached to the inner radiator;
[0009] An internal circulation fan is arranged in the driving-side inner cavity of the driver, and the air outlet of the internal circulation fan faces the inner radiator directly, and is used to blow cold air into the driving-side inner cavity of the driver;
[0010] An outer radiator is arranged outside the driving-side inner cavity of the driver;
[0011] A heat-conducting connecting piece thermally connects the outer radiator and the mounting substrate.
[0012] The semiconductor refrigeration chip transfers the heat of the inner radiator to the mounting substrate to realize the cooling of the gas on the inner radiator side; the heat pipe is used to transfer the heat of the mounting substrate to the outer radiator to realize the transfer of the heat in the driving-side inner cavity to the outside; the internal circulation fan can suck the cooled gas on the side of the semiconductor refrigeration chip and the inner radiator and blow it to the circuit board fixed in the driving-side inner cavity to dissipate heat from the circuit board, and it is possible to break through the bottleneck of the insufficient heat dissipation capacity of the conventional heat dissipation scheme without using a high-power high-temperature-resistant fan, and realize the improvement of the heat dissipation effect while keeping the cost low and the volume small.
[0013] In one embodiment, the heat-conducting connecting piece is a heat pipe, one end of the heat pipe is connected to the outer radiator, and the other end of the heat pipe is connected to the mounting substrate.
[0014] In one embodiment, the number of the heat pipes is at least two, and at least two heat pipes are arranged parallel to each other at intervals.
[0015] In one embodiment, the active temperature control heat dissipation structure further includes:
[0016] A heat-conducting layer is arranged between the semiconductor refrigeration chip and the mounting substrate, and between the semiconductor refrigeration chip and the inner radiator.
[0017] In one embodiment, the outer radiator is arranged in the main heat dissipation air duct of the driver; the main heat dissipation air duct is separated from and adjacent to the driving-side inner cavity.
[0018] In one embodiment, the heat-conducting layer is made of silicone grease.
[0019] In one embodiment, the at least two heat pipes are arranged parallel to each other at intervals, and the gas flow direction in the main heat dissipation air duct is opposite to the gas flow direction in the driving-side inner cavity.
[0020] In one embodiment, the width of the circuit board is equal to the width of the inner cavity on the driving side, the width of the mounting substrate is less than the width of the inner cavity on the driving side, the width of the semiconductor refrigeration sheet is equal to the width of the mounting substrate, the width of the inner radiator is equal to the width of the mounting substrate, the gas in the inner cavity on the driving side is guided by the internal circulation fan to form a circulating air flow, the hot air is cooled after passing through the semiconductor refrigeration sheet to form cold air, and the internal circulation fan blows the cold air towards the circuit board.
[0021] The present application also provides a driver, which includes a housing, a circuit board, and the active temperature control and heat dissipation structure as described above. An adjacent and separated main heat dissipation air duct and an inner cavity on the driving side are provided in the housing. The circuit board is arranged in the inner cavity on the driving side. The mounting substrate, the semiconductor refrigeration sheet, the inner radiator, and the internal circulation fan in the active temperature control and heat dissipation structure are arranged in the inner cavity on the driving side, and the outer radiator in the active temperature control and heat dissipation structure is arranged in the main heat dissipation air duct.
[0022] In one embodiment, the circuit board includes at least one of a filter board, a driving board, a power supply board, and a control board.
[0023] In one embodiment, the driver further includes a main fan, which is arranged in the main heat dissipation air duct and is located on one side of the outer radiator.
[0024] In one embodiment, the main heat dissipation air duct is arranged in parallel with the inner cavity on the driving side. The width of the main heat dissipation air duct is greater than the width of the inner cavity on the driving side. The length of the main heat dissipation air duct is equal to the length of the inner cavity on the driving side. The width of the outer radiator is equal to the width of the main heat dissipation air duct. The width of the inner radiator is less than or equal to the width of the inner cavity on the driving side. The area of the outer radiator is greater than the area of the inner radiator.
[0025] The active temperature control and heat dissipation structure and the driver provided by the embodiments of the present application, by setting that the active temperature control and heat dissipation structure includes a mounting substrate, a semiconductor refrigeration sheet, and an inner radiator which are stacked, use the semiconductor refrigeration sheet to transfer the heat of the inner radiator to the mounting substrate to realize the cooling of the gas on the side of the inner radiator; also set that the active temperature control and heat dissipation structure includes an outer radiator and a heat pipe, and use the heat pipe to transfer the heat of the mounting substrate to the outer radiator to realize the transfer of the heat in the inner cavity on the driving side to the outside; and further set that the active temperature control and heat dissipation structure includes an internal circulation fan, and the internal circulation fan can suck the cooling gas on one side of the semiconductor refrigeration sheet and the inner radiator and blow it towards the circuit board fixed in the inner cavity on the driving side to dissipate heat from the circuit board, and it is possible to break through the bottleneck of the insufficient heat dissipation capacity of the conventional heat dissipation scheme without using a high-power high-temperature-resistant fan, and realize the improvement of the heat dissipation effect while keeping the cost low and the volume small. Brief Description of the Drawings
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the structures shown in these drawings.
[0027] Figure 1 It is a schematic side view structure diagram of the active temperature control and heat dissipation structure provided by the embodiment of the present application in the driver.
[0028] Figure 2 It is a schematic three-dimensional structure diagram of the active temperature control and heat dissipation structure provided by the embodiment of the present application.
[0029] Figure 3 It is a schematic internal structure diagram of the driver provided by the embodiment of the present application.
[0030] Figure 4 It is a schematic structure diagram of the active temperature control and heat dissipation structure installed on the driver provided by the embodiment of the present application.
[0031] Figure 5 It is a schematic structure diagram of the outer radiator and the active power radiator provided by the embodiment of the application.
[0032] Explanation of the Reference Numerals in the Drawings:
[0033]
[0034] The realization of the object, functional features and advantages of the present invention will be further described with reference to the embodiments and the drawings. Detailed Embodiments
[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.
[0036] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0037] Embodiment 1
[0038] Specifically, please refer to Figure 1 、 Figure 2 Figure 3 The active temperature control and heat dissipation structure 10 includes: a mounting substrate 1, a thermoelectric cooler 2, an inner radiator 3, and an internal circulation fan 4.
[0039] Specifically, the mounting substrate 1 is provided on the bottom surface, top surface, and side surface. The bottom surface is fixed in the drive-side inner cavity 21 of the driver. The top surface is arranged parallel to the bottom surface, and the side surface surrounds the mounting substrate 1; the thermoelectric cooler 2 is provided on the top surface of the mounting substrate 1; the inner radiator 3 is provided on the side of the thermoelectric cooler 2 facing away from the mounting substrate 1; the internal circulation fan 4 is arranged in the drive-side inner wall of the driver, fixed to the side surface of the mounting substrate 1, and adjacent to the thermoelectric cooler 2 and the inner radiator 3; the air outlet of the internal circulation fan 4 is facing the inner radiator 3, and is used to blow cold air into the drive-side inner cavity of the driver. The internal circulation fan 4 can suck the gas on one side of the thermoelectric cooler 2 and the inner radiator 3 and blow it onto the circuit board 30 fixed in the drive-side inner cavity 21 to dissipate heat from the circuit board 30.
[0040] It can be understood that in the embodiment of the present application, by setting the active temperature control and heat dissipation structure 10 including the mounting substrate 1, the thermoelectric cooler 2, and the inner radiator 3 arranged in a stacked manner, the thermoelectric cooler 2 is used to actively cool the gas in the drive-side inner cavity 21 of the driver, and further setting the active temperature control and heat dissipation structure 10 including the internal circulation fan 4, the internal circulation fan 4 can suck the cooled gas on one side of the thermoelectric cooler 2 and the inner radiator 3 and blow it onto the circuit board 30 fixed in the drive-side inner cavity 21 to dissipate heat from the circuit board 30, without the need to use a high-power high-temperature-resistant fan, which can break through the bottleneck of the insufficient heat dissipation capacity of the conventional heat dissipation solution, and achieve the improvement of the heat dissipation effect while maintaining a low cost and a small volume.
[0041] Such as Figure 1 、 Figure 3As shown, inside the drive-side inner cavity 21 of the driver, the active temperature-controlled heat dissipation structure 10 is arranged on the upper side of the drive-side inner cavity 21, and the circuit board 30 is arranged on the lower side of the drive-side inner cavity 21. The semiconductor refrigeration chip 2 can actively cool the hot air gas on the upper side of the drive-side inner cavity 21 to form cold air, and the internal circulation fan 4 blows the cold air towards the circuit board 30 in the lower chamber of the drive-side inner cavity 21 for heat dissipation.
[0042] Preferably, the semiconductor refrigeration chip 2 is a TEC refrigeration chip, the internal circulation fan 4 adopts closed-loop control, and multiple temperature monitoring points are arranged inside the drive-side inner cavity 21. The start and stop of the internal circulation fan 4 and the switch of the semiconductor refrigeration chip 2 are controlled according to the temperature and temperature difference at the monitoring points. By controlling the switch of the TEC refrigeration chip and switching the positive and negative of the power supply, the refrigeration power can be adjusted in a timely manner according to the fluctuations of the inner cavity temperature and temperature difference, and the cavity temperature can be controlled within a suitable temperature range. It has been verified that the temperature of the drive-side inner cavity 21 is more than 20 °C lower than that of the conventional heat dissipation scheme, which can significantly improve the life of the capacitors on the circuit board 30.
[0043] In this embodiment, the mounting substrate 1 is a metal substrate; the semiconductor refrigeration chip 2 is provided with a cold end and a hot end, the cold end is attached to the inner side radiator 3, and the hot end is attached to the mounting substrate 1. The material of the metal substrate can be copper or aluminum.
[0044] The semiconductor refrigeration chip 2 transfers the heat of the inner side radiator 3 to the mounting substrate 1, realizing the cooling of the gas on the inner side radiator side 3.
[0045] In this embodiment, the active temperature-controlled heat dissipation structure 10 further includes: a heat conduction layer. The heat conduction layer is arranged between the semiconductor refrigeration chip 2 and the mounting substrate 1; and between the semiconductor refrigeration chip 2 and the inner side radiator 3.
[0046] Among them, the heat conduction layer is formed by applying silicone grease on both sides of the semiconductor refrigeration chip 2.
[0047] The width of the internal circulation fan 4 is greater than the thickness of the inner side radiator 3. In this embodiment, the width of the internal circulation fan 4 is equal to the sum of the thickness of the inner side radiator 3 and the thickness of the semiconductor refrigeration chip 2. In this way, the internal circulation fan 4 can fully suck the cold air from one side of the semiconductor refrigeration chip 2 and the inner side radiator 3.
[0048] As Figures 1 to 4As shown, in this embodiment, the active temperature control and heat dissipation structure 10 further includes: an outer radiator 5 and at least two heat pipes 6. The outer radiator 5 is disposed outside the inner cavity on the driving side of the driver. Specifically, the outer radiator 5 is disposed in the main heat dissipation air duct 22 of the driver. The main heat dissipation air duct 22 is separated from and adjacent to the inner cavity 21 on the driving side. At least two heat pipes 6 connect the outer radiator 5 and the mounting substrate 1.
[0049] Specifically, one end of the heat pipe 6 connected to the inner radiator 3 is the cold end, and one end of the heat pipe 6 connected to the outer radiator 5 is the hot end. The heat of the mounting substrate 1 is transferred to the outer radiator 5 by using the heat pipe 6, so as to transfer the heat in the inner cavity on the driving side to the main heat dissipation air duct 22.
[0050] Wherein the outer radiator 5 is disposed on one side of the radiator of the main power device, shares the air duct with the main radiator, and the heat in the inner cavity is taken away by the fan in the main air duct. The inner radiator 3 is disposed on one side of the inner cavity 21 on the driving side.
[0051] In this embodiment, the main heat dissipation air duct 22 is arranged in parallel with the inner cavity 21 on the driving side. The width of the main heat dissipation air duct 22 is greater than the width of the inner cavity 21 on the driving side. The length of the main heat dissipation air duct 22 is equal to the length of the inner cavity 21 on the driving side. The width of the outer radiator 5 is equal to the width of the main heat dissipation air duct 22. The width of the inner radiator 3 is less than or equal to the width of the inner cavity 21 on the driving side. The area of the outer radiator 5 is greater than the area of the inner radiator 3.
[0052] In this embodiment, the at least two heat pipes 6 are arranged in parallel at intervals. The gas flow direction in the main heat dissipation air duct 22 is opposite to the gas flow direction in the inner cavity 21 on the driving side. In this way, the high temperature in the inner cavity 21 on the driving side can be transferred to the gas in the main heat dissipation air duct 22 by the counter-direction heat transfer method through the housing 20 of the driver.
[0053] Such as Figure 3 、 Figure 4 As shown, in this embodiment, the circuit board 30 includes at least one of a filter board 31, a driving board 32, a power supply board, and a control board. The protection level of the inner cavity on the driving board 32 side can be increased to IP5X or above.
[0054] In this embodiment, the width of the circuit board 30 is equal to the width of the driving-side inner cavity 21, the width of the mounting substrate 1 is less than the width of the driving-side inner cavity 21, the width of the semiconductor refrigeration sheet 2 is equal to the width of the mounting substrate 1, the width of the inner radiator 3 is equal to the width of the mounting substrate 1, the gas in the driving-side inner cavity 21 is guided by the internal circulation fan 4 to form a circulating air flow, the hot air is cooled after being dissipated by the semiconductor refrigeration sheet 2 to form cold air, and the internal circulation fan 4 blows the cold air to the circuit board 30. This realizes volume reduction, improvement of the protection level, extension of the service life of components such as capacitors on the circuit board 30, and a significant improvement in the reliability of the cooling effect.
[0055] The utility model utilizes the thermoelectric refrigeration and heat dissipation technology to break through the limitation of the heat dissipation capacity of the conventional design of the housing, change the passive heat dissipation to active temperature control, and solve the problem of single-board heat dissipation in the inner cavity of the driver. The goals of reducing the volume, improving the protection level, extending the service life of components such as capacitors, and significantly improving the reliability are achieved.
[0056] Embodiment 2
[0057] As Figures 1 to 5 shown, in Embodiment 3 of the present application, a driver is provided, which includes a housing 20, a circuit board 30, and an active temperature control and heat dissipation structure 10. The housing 20 is provided with an adjacent and separated main heat dissipation air duct 22 and a driving-side inner cavity 21. The circuit board 30 is arranged in the driving-side inner cavity 21. The mounting substrate 1, the semiconductor refrigeration sheet 2, the inner radiator 3, and the internal circulation fan 4 in the active temperature control and heat dissipation structure 10 are arranged in the driving-side inner cavity 21, and the outer radiator 5 in the active temperature control and heat dissipation structure 10 is arranged in the main heat dissipation air duct 22.
[0058] Please refer to Figure 1 、 Figure 2 Figure 3 The active temperature control and heat dissipation structure 10 includes: a mounting substrate 1, a semiconductor refrigeration sheet 2, an inner radiator 3, and an internal circulation fan 4.
[0059] Specifically, the mounting substrate 1 is arranged on the bottom surface, the top surface, and the side surface. The bottom surface is fixed on the driving-side inner cavity 21 of the driver. The top surface is arranged parallel to the bottom surface. The side surface surrounds the mounting substrate 1. The semiconductor refrigeration sheet 2 is arranged on the top surface of the mounting substrate 1. The inner radiator 3 is arranged on the side of the semiconductor refrigeration sheet 2 away from the mounting substrate 1. The internal circulation fan 4 is fixed on the side surface of the mounting substrate 1 and is adjacent to the semiconductor refrigeration sheet 2 and the inner radiator 3. The internal circulation fan 4 can suck the gas on one side of the semiconductor refrigeration sheet 2 and the inner radiator 3 and blow it to the circuit board 30 fixed in the driving-side inner cavity 21 to dissipate heat from the circuit board 30.
[0060] It is understandable that in the embodiment of the present application, the active temperature control and heat dissipation structure 10 is provided, which includes an installation substrate 1, a thermoelectric cooler 2, and an inner radiator 3 arranged in layers. The thermoelectric cooler 2 actively cools the gas in the driving side inner cavity 21 of the driver, and further, the active temperature control and heat dissipation structure 10 is provided with an inner circulation fan 4. The inner circulation fan 4 can suck the cooled gas on one side of the thermoelectric cooler 2 and the inner radiator 3 and blow it to the circuit board 30 fixed in the driving side inner cavity 21 to dissipate heat from the circuit board 30. Without using a high-power high-temperature-resistant fan, the bottleneck of insufficient heat dissipation capacity of the conventional heat dissipation scheme can be broken, and the heat dissipation effect can be improved while keeping the cost low and the volume small.
[0061] As Figure 1 、 Figure 3 shown, in the driving side inner cavity 21 of the driver, the active temperature control and heat dissipation structure 10 is arranged on the upper side of the driving side inner cavity 21, and the circuit board 30 is arranged on the lower side of the driving side inner cavity 21. The thermoelectric cooler 2 can actively cool the hot air gas on the upper side of the driving side inner cavity 21 to form cold air, and the inner circulation fan 4 blows the cold air to the circuit board 30 in the lower chamber of the driving side inner cavity 21 for heat dissipation.
[0062] Preferably, the thermoelectric cooler 2 is a TEC cooler, the inner circulation fan 4 adopts closed-loop control, and multiple temperature monitoring points are arranged in the driving side inner cavity 21. The start and stop of the inner circulation fan 4 and the on-off of the thermoelectric cooler 2 are controlled according to the temperature and temperature difference of the monitoring points. By controlling the on-off of the TEC cooler and switching the positive and negative of the power supply, the refrigeration power can be adjusted in time according to the fluctuations of the inner cavity temperature and temperature difference, and the cavity temperature can be controlled within a suitable temperature range. It has been verified that the temperature of the driving side inner cavity 21 is more than 20 °C lower than that of the conventional heat dissipation scheme, which can significantly improve the lifespan of the capacitors on the circuit board 30.
[0063] In this embodiment, the installation substrate 1 is a metal substrate; the thermoelectric cooler 2 is provided with a cold end and a hot end. The cold end is attached to the inner radiator 3, and the hot end is attached to the installation substrate 1. The material of the metal substrate can be copper or aluminum.
[0064] The thermoelectric cooler 2 transfers the heat of the inner radiator 3 to the installation substrate 1 to realize the cooling of the gas on the inner radiator side 3.
[0065] In this embodiment, the active temperature control and heat dissipation structure 10 further includes: a heat conduction layer. The heat conduction layer is arranged between the thermoelectric cooler 2 and the installation substrate 1; and between the thermoelectric cooler 2 and the inner radiator 3.
[0066] Among them, the heat conduction layer is formed by applying silicone grease on both sides of the semiconductor refrigeration sheet 2.
[0067] The width of the internal circulation fan 4 is greater than the thickness of the inner radiator 3. In this embodiment, the width of the internal circulation fan 4 is equal to the sum of the thickness of the inner radiator 3 and the thickness of the semiconductor refrigeration sheet 2. In this way, the internal circulation fan 4 can fully absorb the cold air from one side of the semiconductor refrigeration sheet 2 and the inner radiator 3.
[0068] Such as Figures 1 to 5 As shown, in this embodiment, the active temperature control and heat dissipation structure 10 further includes: an outer radiator 5 and at least two heat pipes 6. The outer radiator 5 is arranged in the main heat dissipation air duct 22 of the driver; the main heat dissipation air duct 22 is arranged adjacent to the driving side inner cavity 21; at least two heat pipes 6 connect the outer radiator 5 and the mounting substrate 1.
[0069] Among them, the outer radiator 5 is arranged on one side of the radiator of the main power device, shares the air duct with the main radiator, and the fan in the main air duct takes away the heat in the inner cavity. The inner radiator 3 is arranged on one side of the driving side inner cavity 21.
[0070] In this embodiment, the main heat dissipation air duct 22 is arranged parallel to the driving side inner cavity 21, the width of the main heat dissipation air duct 22 is greater than the width of the driving side inner cavity 21, the length of the main heat dissipation air duct 22 is equal to the length of the driving side inner cavity 21, the width of the outer radiator 5 is equal to the width of the main heat dissipation air duct 22, the width of the inner radiator 3 is less than or equal to the width of the driving side inner cavity 21, and the area of the outer radiator 5 is greater than the area of the inner radiator 3.
[0071] In this embodiment, the at least two heat pipes 6 are arranged parallel to each other at intervals, and the gas flow direction in the main heat dissipation air duct 22 is opposite to the gas flow direction in the driving side inner cavity 21. In this way, the high temperature in the driving side inner cavity 21 can be transferred to the gas in the main heat dissipation air duct 22 through the counter-direction heat transfer method of the housing 20 of the driver.
[0072] Specifically, one end of the heat pipe 6 connected to the inner radiator 3 is the cold end, and one end of the heat pipe 6 connected to the outer radiator 5 is the hot end, and heat exchange is carried out through the semiconductor refrigeration sheet 2.
[0073] Such as Figure 3 、 Figure 4 As shown, in this embodiment, the circuit board 30 includes at least one of a filter board 31, a drive board 32, a power board, and a control board. The inner cavity protection level on the drive board 32 side can be improved to IP5X or above.
[0074] Please refer to Figure 4 -Figure 5 The driver further includes a main fan 221 disposed in the main heat dissipation duct 22. The main fan 221 is located on one side of the outer radiator 5 and is used to dissipate heat from the main power devices in the main heat dissipation duct 22.
[0075] In this embodiment, the width of the circuit board 30 is equal to the width of the drive-side inner cavity 21, the width of the mounting substrate 1 is less than the width of the drive-side inner cavity 21, the width of the semiconductor refrigeration sheet 2 is equal to the width of the mounting substrate 1, the width of the inner radiator 3 is equal to the width of the mounting substrate 1, the gas in the drive-side inner cavity 21 is guided by the internal circulation fan 4 to form a circulating wind, and the hot wind forms cold wind after being dissipated by the semiconductor refrigeration sheet 2, and the internal circulation fan 4 blows the cold wind onto the circuit board 30. This realizes volume reduction, improvement of the protection level, extension of the service life of components such as capacitors on the circuit board 30, and a significant improvement in the reliability of the cooling effect.
[0076] The present utility model utilizes the thermoelectric refrigeration and heat dissipation technology, breaks through the limitation of the heat dissipation capacity of the conventional design of the outer shell, changes the passive heat dissipation to active temperature control, and solves the problem of heat dissipation of the single board in the driver inner cavity. It realizes the goals of reducing volume, improving the protection level, extending the service life of components such as capacitors, and significantly improving the reliability.
[0077] The active temperature control heat dissipation structure and the driver provided in the embodiment of the present application, by setting the active temperature control heat dissipation structure including a stacked mounting substrate, a semiconductor refrigeration sheet and an inner radiator, the semiconductor refrigeration sheet transfers the heat of the inner radiator to the mounting substrate to realize the cooling of the gas on the inner radiator side; it is also set that the active temperature control heat dissipation structure includes an outer radiator and a heat pipe, and the heat pipe is used to transfer the heat of the mounting substrate to the outer radiator to realize the transfer of the heat in the drive-side inner cavity to the outside; and further set that the active temperature control heat dissipation structure includes an internal circulation fan, and the internal circulation fan can suck the cooled gas on one side of the semiconductor refrigeration sheet and the inner radiator and blow it onto the circuit board fixed in the drive-side inner cavity to dissipate heat from the circuit board, and it is possible to break through the bottleneck of the insufficient heat dissipation capacity of the conventional heat dissipation solution without using a high-power high-temperature-resistant fan, and realize the improvement of the heat dissipation effect while keeping the cost low and the volume small.
[0078] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.
[0079] The above has introduced in detail an active temperature control and heat dissipation structure and a driver provided by an embodiment of the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. An active temperature control and heat dissipation structure is applied to a driver, and is characterized in that, The active temperature control and heat dissipation structure comprises: A mounting base plate fixed in the inner cavity of the drive side of the driver; A semiconductor cooling sheet is arranged on one side of the mounting substrate, the semiconductor cooling sheet is provided with a cold end and a hot end, and the hot end is attached to the mounting substrate; An inner radiator is arranged on the other side of the semiconductor cooling plate away from the mounting substrate, and the cold end is attached to the inner radiator; An internal circulation fan is arranged in the inner cavity of the drive side of the driver, and the air outlet of the internal circulation fan is directly opposite to the inner radiator, and is used to blow cold air to the inner cavity of the drive side of the driver; An outer radiator is arranged outside the inner cavity of the driver side; A heat-conducting connector is used to heat-conduct the outer heat sink and the mounting substrate.
2. The active temperature-controlled heat dissipation structure according to claim 1, wherein The heat-conducting connecting member is a heat pipe, one end of the heat pipe is connected to the outer radiator, and the other end of the heat pipe is connected to the mounting substrate.
3. The active temperature control and heat dissipation structure according to claim 2, characterized in that, The number of the heat pipes is at least two, and at least two of the heat pipes are arranged parallel to each other and spaced apart.
4. The actively temperature-controlled heat dissipation structure according to claim 2, wherein The active temperature control and heat dissipation structure also includes: The heat-conducting layer is arranged between the semiconductor cooling sheet and the mounting substrate, and between the semiconductor cooling sheet and the inner heat sink.
5. The active temperature control and heat dissipation structure according to claim 1, characterized in that, The outer radiator is arranged in the main heat dissipation air duct of the driver; the main heat dissipation air duct is separated from and adjacent to the inner cavity of the driving side.
6. The active temperature control heat dissipation structure according to claim 5, wherein, The gas flow direction in the main heat dissipation air duct is opposite to the gas flow direction in the driving side inner cavity.
7. The active temperature control heat dissipation structure according to claim 4, wherein, The heat conducting layer is made of silicone grease.
8. A driver, characterized in that, The driver includes a shell, a circuit board and an active temperature control and heat dissipation structure as described in any one of claims 1 to 7, wherein the shell is provided with a main heat dissipation duct and a drive side inner cavity which are adjacent and separated, the circuit board is arranged in the drive side inner cavity, the mounting substrate, semiconductor refrigeration plate, inner radiator and inner circulation fan in the active temperature control and heat dissipation structure are arranged in the drive side inner cavity, and the outer radiator in the active temperature control and heat dissipation structure is arranged in the main heat dissipation duct.
9. The driver according to claim 8, characterized in that The circuit board includes at least one of a filter board, a drive board, a power board and a control board.
10. The driver according to claim 8, characterized in that, The driver further comprises a main fan disposed in the main heat dissipation air duct, and the main fan is located at one side of the outer radiator.