Variable range flow chip glue sealing structure

Abstract

The utility model belongs to the technical field of flow chips, and particularly relates to a variable range flow chip glue sealing structure, which comprises a substrate I and a chip body, a substrate II is placed on the surface of the substrate I, a mounting groove for placing the chip body is arranged on the surface of the substrate I, and an auxiliary structure is arranged between the substrate I and the substrate II; according to the utility model, through the arrangement of the auxiliary structure, the glue can flow along the predetermined direction, the uniformity and integrity of glue distribution are ensured, the glue sealing effect is improved, the glue is prevented from overflowing between the chip body and the mounting groove, tight connection and stable fixation after glue sealing are ensured, the stability and reliability of the chip are improved, and the production cost is reduced. The center of the mounting groove can be quickly covered with glue, so that more uniform glue distribution is formed in the whole mounting groove, the glue sealing quality is effectively ensured, and the stability and reliability of the chip are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of flow chips, in particular to a variable-range flow chip encapsulation structure. Background Art

[0002] A variable-range flow chip is a flow sensor chip with a special design, which can realize flow measurement of different ranges and can be used to measure the flow of gases and liquids. In many fields, such as industrial automation, air conditioning, automotive industry, etc., flow sensors are widely used. Through optimized design and manufacturing processes, variable-range flow chips have the advantages of high precision, fast response and strong anti-interference ability;

[0003] At present, considering the protection and stability of variable-range flow chips, the encapsulation structure of variable-range flow chips is particularly important. There are certain defects in the existing encapsulation of variable-range flow chips. During the encapsulation process of variable-range flow chips, the area between the substrate and the chip cannot be fully covered, and at the same time, glue overflow is likely to occur during the encapsulation process, making it difficult to ensure the stability and reliability of the variable-range flow chip after encapsulation;

[0004] In view of the above technical defects, a solution is proposed now. Content of the Utility Model

[0005] The purpose of the utility model is to provide a variable-range flow chip encapsulation structure. By setting an auxiliary structure, it can be fully filled, ensuring the uniformity and integrity of the glue distribution, improving the encapsulation effect, and at the same time preventing glue overflow, effectively ensuring the encapsulation quality and improving the stability and reliability of the chip, so as to solve the problems raised in the background art.

[0006] The purpose of the utility model can be achieved by the following technical solutions: A variable-range flow chip encapsulation structure includes a first substrate. A second substrate is placed on the surface of the first substrate. An installation groove is opened on the surface of the first substrate. An auxiliary structure is arranged between the first substrate and the second substrate; the auxiliary structure includes a communication port opened on the upper surface of the first substrate, the communication port penetrates through the first substrate and communicates with the installation groove. A plurality of first guiding strips are fixedly connected in the installation groove. Discharge ports communicating with the installation groove are opened on both sides of the outer wall of the first substrate. A plurality of horizontal blocking strips are fixedly connected in the first substrate near the discharge ports. A glue injection port communicating with the communication port is opened on the surface of the second substrate away from the first substrate.

[0007] Preferably, four communication ports are provided and are distributed in a matrix. Communication grooves communicating with the communication ports are opened at the four corners of the inner wall of the installation groove.

[0008] Preferably, a plugging pipe corresponding to the four communication ports is fixedly connected to the surface of the second substrate close to the first substrate, a channel communicating with the glue injection port is formed in the second substrate, and one end of the channel far from the glue injection port communicates with the plugging pipe.

[0009] Preferably, an adhesive layer is arranged between the chip body and the installation groove, two symmetrically arranged bearing seats are fixedly connected to the inner wall of the installation groove, and a sealing strip is arranged on the surface of the second substrate close to the first substrate and outside the second substrate.

[0010] Preferably, heat sinks are evenly distributed on the surface of the first substrate far from the second substrate, and two symmetrically arranged heat dissipation openings are formed in one side of the first substrate.

[0011] Preferably, a plurality of spaced guide strips two are fixedly connected to the center of the installation groove, there are multiple groups of guide strips one, and the multiple groups of guide strips one are distributed in the installation groove in a matrix. One end of the guide strip one extends towards the guide strip two, and the other end of the guide strip one extends towards the corresponding communication port.

[0012] The beneficial effects of the present utility model are as follows:

[0013] (1) By setting the auxiliary structure, the guide strip one and the blocking strip can accurately guide the injected glue, ensuring that the glue can flow along the predetermined direction, so as to fully fill the installation groove, guarantee the uniformity and integrity of the glue distribution, improve the glue sealing effect, and the discharge ports communicated with the installation groove are arranged on both sides of the outer wall of the first substrate, which can effectively discharge the excess glue in the installation groove, prevent the glue from overflowing between the chip body and the installation groove, ensure the tight connection and stable fixation between the chip body and the installation groove, and improve the stability and reliability of the variable range flow chip;

[0014] (2) Under the action of the guide strip one and the guide strip two, the center of the installation groove can be quickly covered with glue, preventing the glue from accumulating at the edges of the installation groove and the chip body, enabling the glue to be guided in multiple directions during the flowing process, so as to form a more uniform glue distribution in the entire installation groove, effectively guarantee the glue sealing quality and improve the stability and reliability of the variable range flow chip. Description of the Drawings

[0015] The following further describes the present utility model in conjunction with the drawings;

[0016] Figure 1 is the three-dimensional overall structure of the present utility model Figure 1 ;

[0017] Figure 2 is the three-dimensional overall structure of the present utility model Figure 2 ;

[0018] Figure 3 It is a schematic diagram of the structure inside the installation groove of the present utility model;

[0019] Figure 4 It is a schematic diagram of the channel structure of the present utility model;

[0020] Figure 5 It is a schematic diagram of the first substrate of the present utility model.

[0021] Legend: 1. First substrate; 2. Second substrate; 3. Glue injection port; 4. Communication port; 5. Chip body; 6. Communication groove; 7. First guiding strip; 8. Blocking strip; 9. Discharge port; 10. Installation groove; 11. Channel; 12. Insertion pipe; 13. Heat dissipation opening; 14. Heat sink; 15. Carrier seat; 16. Second guiding strip. Specific implementation mode

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present utility model.

[0023] Embodiment 1:

[0024] This embodiment is used to solve the problems that when sealing glue in the prior art, it is difficult to fully cover between the substrate and the chip, and at the same time, glue overflow is likely to occur during the glue sealing process, making it difficult to ensure the stability and reliability of the chip after glue sealing.

[0025] Please refer to Figure 1 - Figure 5 As shown, this embodiment is a variable-range flow chip glue-sealing structure, including a first substrate 1 and a chip body 5. A second substrate 2 is placed on the surface of the first substrate 1. An installation groove 10 for placing the chip body 5 is provided on the surface of the first substrate 1. An auxiliary structure is provided between the first substrate 1 and the second substrate 2;

[0026] The auxiliary structure includes a communication port 4 opened on the upper surface of the first substrate 1. The communication port 4 penetrates through the first substrate 1 and communicates with the installation groove 10. Glue injection operation is carried out into the installation groove 10 through the communication port 4. A first guiding strip 7 is fixedly connected in the installation groove 10. The first guiding strip 7 guides the injected glue so that it can flow along the direction of the first guiding strip 7, thereby ensuring that the installation groove 10 can be fully injected with glue, so that the chip body 5 can be fully bonded to the installation groove 10, ensuring the stability and reliability of the variable-range flow chip after glue sealing;

[0027] On both sides of the outer wall of the first substrate 1, discharge ports 9 communicating with the installation groove 10 are provided. By providing the discharge ports 9, the excess glue in the installation groove 10 is discharged to prevent the glue in the installation groove 10 from overflowing between the chip body 5 and the installation groove 10. Near the discharge ports 9 in the first substrate 1, a plurality of horizontally arranged blocking strips 8 are fixedly connected. By providing the horizontally arranged blocking strips 8, it can further assist the first guiding strip 7 to guide the glue. On the surface of the second substrate 2 away from the first substrate 1, a glue injection port 3 communicating with the communication port 4 is provided. Glue is injected into the communication port 4 through the glue injection port 3. The second substrate 2 seals the side close to the chip body 5, which can ensure the effect of encapsulating the chip body 5, ensure the tight connection between the encapsulation material and the chip, and avoid defects such as bubbles and voids.

[0028] There are four communication ports 4 and they are arranged in a matrix. At the four corners of the inner wall of the installation groove 10, communication grooves 6 communicating with the communication ports 4 are provided. When injecting into the communication ports 4, the glue can fully cover the bottom of the installation groove 10.

[0029] On the surface of the second substrate 2 close to the first substrate 1, plug-in pipes 12 corresponding to the four communication ports 4 are fixedly connected. A channel 11 communicating with the glue injection port 3 is provided in the second substrate 2. One end of the channel 11 away from the glue injection port 3 communicates with the plug-in pipe 12. When the plug-in pipe 12 is inserted into the communication port 4 and glue is injected into the glue injection port 3, the glue in the glue injection port 3 flows into the plug-in pipe 12 through the four channels 11 corresponding to the communication port 4. Thus, the glue in the plug-in pipe 12 is simultaneously conveyed to the four corners of the installation groove 10 through the communication port 4, which can make the glue fully fill the installation groove 10, so as to ensure the full encapsulation of the chip body 5. The second substrate 2 is composed of two spliced substrates.

[0030] Two symmetrically arranged bearing seats 15 are fixedly connected to the inner wall of the installation groove 10. On the surface of the second substrate 2 close to the first substrate 1 and outside the second substrate 2, a sealing strip is provided. By providing the bearing seats 15, there is enough gap between the chip body 5 and the bottom of the installation groove 10 to fill the glue, and the sealing strip further prevents the glue from overflowing from the gap between the second substrate 2 and the installation groove 10.

[0031] On the surface of the first substrate 1 away from the second substrate 2, heat sinks 14 are evenly distributed. Two symmetrically arranged heat dissipation openings 13 are provided on the side of the first substrate 1. The heat sinks 14 can improve the overall heat dissipation effect of the first substrate 1, and at the same time, the two heat dissipation openings 13 cooperate with the heat sinks 14 to further improve the heat dissipation effect of the first substrate 1.

[0032] Embodiment 2:

[0033] This embodiment is used to further solve the problems of non-uniformity and incompleteness in the encapsulation process.

[0034] Please refer to Figure 1 and Figure 5 As shown, a variable-range flow chip encapsulation structure according to this embodiment includes a plurality of guiding strips two 16 fixedly connected at the center of the installation groove 10 and arranged at intervals. There are multiple groups of guiding strips one 7, and the multiple groups of guiding strips one 7 are distributed in the installation groove 10 in a matrix. Glue flows into the installation groove 10 through the communication ports 4 and the communication grooves 6. One end of the guiding strip one 7 extends towards the guiding strip two 16, and the other end of the guiding strip one 7 extends towards the corresponding communication port 4. Under the action of the guiding strip one 7, the glue flows towards the guiding strip two 16, which can quickly cover the center of the installation groove 10 with glue, prevent the glue from accumulating at the edges of the installation groove 10 and the chip body 5, and enable the glue to be guided in multiple directions during the flowing process, so as to form a more uniform glue distribution in the entire installation groove 10, effectively ensuring the encapsulation quality and improving the stability and reliability of the chip.

[0035] Combining Embodiment 1 and Embodiment 2

[0036] By setting the auxiliary structure, the guiding strip one 7 and the blocking strip 8 can accurately guide the injected glue to ensure that the glue can flow along the predetermined direction, so as to fully fill the installation groove 10, ensure the uniformity and integrity of the glue distribution, improve the encapsulation effect. The discharge ports 9 communicating with the installation groove 10 are opened on both outer sides of the outer wall of the substrate one 1, which can effectively discharge the excess glue in the installation groove 10, prevent the glue from overflowing between the chip body 5 and the installation groove 10, ensure the tight connection and stable fixation between the chip body 5 and the installation groove 10, and improve the stability and reliability of the chip. Under the action of the guiding strip one 7 and the guiding strip two 16, the center of the installation groove 10 can be quickly covered with glue, preventing the glue from accumulating at the edges of the installation groove 10 and the chip body 5, enabling the glue to be guided in multiple directions during the flowing process, so as to form a more uniform glue distribution in the entire installation groove 10, effectively ensuring the encapsulation quality and improving the stability and reliability of the chip.

[0037] As Figure 1 - Figure 5 shown, the working process and principle of the present utility model are as follows:

[0038] Step 1, connect the substrate two 2 with the substrate one 1, and make the insertion pipe 12 on the substrate two 2 be inserted into the communication port 4 on the substrate one 1. Inject glue into the glue injection port 3. The glue in the glue injection port 3 flows into the insertion pipe 12 through the four channels 11 corresponding to the communication port 4, so that the glue in the insertion pipe 12 is simultaneously conveyed to the four corners in the installation groove 10 through the communication port 4, enabling the glue to fully fill the installation groove 10;

[0039] In Step 2, the guiding strip 1 guides the injected glue so that it can flow along the direction of the guiding strip 1 and flow towards the guiding strip 2 under the action of the guiding strip 1, thereby ensuring that the glue injection operation can be fully carried out in the installation groove 10, enabling the chip body 5 to be fully bonded to the installation groove 10. The discharge port 9 discharges the excess glue in the installation groove 10 to prevent the glue in the installation groove 10 from overflowing between the chip body 5 and the installation groove 10.

[0040] The above content is only an example and explanation of the structure of the present invention. Those skilled in the art of the present technology can make various modifications or supplements to the described specific embodiments or use similar methods to replace them. As long as they do not deviate from the structure of the invention or exceed the scope defined by this claim book, they should fall within the protection scope of the present invention.

[0041] In the description of this specification, the description with reference to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0042] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only the specific implementation manners. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments to better explain the principle and practical application of the present invention, so that those skilled in the art of the present technology can understand and utilize the present invention well. The present invention is only limited by the claim book and its full scope and equivalents.

Claims

1. A variable-range flow chip encapsulation structure, comprising a first substrate (1) and a chip body (5), characterized in that A substrate two (2) is placed on the surface of the substrate one (1). An installation groove (10) for placing a chip body (5) is formed on the surface of the substrate one (1). An auxiliary structure is provided between the substrate one (1) and the substrate two (2). The auxiliary structure includes a communication port (4) formed on the upper surface of the substrate one (1). The communication port (4) penetrates through the substrate one (1) and communicates with the installation groove (10). A plurality of groups of guide bars one (7) are fixedly connected in the installation groove (10). Discharge ports (9) communicating with the installation groove (10) are formed on both sides of the outer wall of the substrate one (1). A plurality of horizontal blocking bars (8) are fixedly connected in the substrate one (1) near the discharge ports (9). A glue injection port (3) communicating with the communication port (4) is formed on the surface of the substrate two (2) away from the substrate one (1).

2. The variable-range flow chip encapsulation structure according to claim 1, characterized in that, Four communication ports (4) are provided and are arranged in a matrix. Communication grooves (6) communicating with the communication ports (4) are formed at the four corners of the inner wall of the installation groove (10).

3. A variable-range flow chip encapsulation structure according to claim 1, characterized in that, Insertion pipes (12) corresponding to the four communication ports (4) are fixedly connected to the surface of the substrate two (2) close to the substrate one (1). A channel (11) communicating with the glue injection port (3) is formed in the substrate two (2). One end of the channel (11) away from the glue injection port (3) communicates with the insertion pipe (12).

4. A variable-range flow chip encapsulation structure according to claim 1, characterized in that, An adhesive layer is provided between the chip body (5) and the installation groove (10). Two symmetrically arranged bearing seats (15) are fixedly connected to the inner wall of the installation groove (10). A sealing strip is provided on the surface of the substrate two (2) close to the substrate one (1) and outside the substrate two (2).

5. A variable-range flow chip encapsulation structure according to claim 1, characterized in that, Heat sinks (14) are evenly distributed on the surface of the substrate one (1) away from the substrate two (2). Two symmetrically arranged heat dissipation openings (13) are formed on the side surface of the substrate one (1).

6. The variable-range flow chip encapsulation structure according to claim 1, wherein A plurality of spaced guide bars two (16) are fixedly connected to the center of the installation groove (10). A plurality of groups of guide bars one (7) are provided. The plurality of groups of guide bars one (7) are arranged in a matrix in the installation groove (10). One end of the guide bar one (7) extends towards the guide bar two (16), and the other end of the guide bar one (7) extends towards the corresponding communication port (4).

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