Semiconductor vacuum coating device

Abstract

The utility model discloses a semiconductor vacuum coating device which comprises a feeding mechanism and a cleaning mechanism, the feeding mechanism comprises a coating machine, a supporting frame installed in the coating machine, a tray connected with the top of the supporting frame, a discharging disc attached to the top of the tray, a motor connected between the supporting frame and the discharging disc and a material frame attached to the top of the discharging disc, and the material frame is connected with the inner wall of the coating machine. A plurality of round openings are formed in the discharging disc. According to the semiconductor surface cleaning device, when a semiconductor passes through the bottom of the T-shaped rod, the telescopic rod can extrude the filtering box, the T-shaped rod and the soft bristles to descend, the soft bristles make contact with the surface of the semiconductor, then along with continuous descending of the soft bristles, the bottom ends of the soft bristles can irregularly move and bend, and therefore the surface of the semiconductor can be cleaned easily; and the suction force of the exhaust fan acts on the semiconductor surface through the filter box and the air duct, so that the dust removal operation is realized, and the coating effect is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of coating devices, in particular to a semiconductor vacuum coating device. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors have extensive applications in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors.

[0003] During the material processing before semiconductor coating, processes such as cutting, grinding, and cleaning may generate some dust and debris. These substances, as contaminants, may adhere to the surface of the semiconductor to be coated, resulting in a poor coating effect. Summary of the Utility Model

[0004] The utility model aims to solve one of the technical problems existing in the prior art or related technologies.

[0005] Therefore, the technical solution adopted by the utility model is as follows:

[0006] A semiconductor vacuum coating device includes a feeding mechanism and a cleaning mechanism. The feeding mechanism includes a coating machine, a support frame installed inside the coating machine, a tray connected to the top of the support frame, a loading tray attached to the top of the tray, a motor connected between the support frame and the loading tray, and a material frame attached to the top of the loading tray. The material frame is connected to the inner wall of the coating machine. A plurality of round openings are formed in the loading tray. The cleaning mechanism includes a telescopic rod connected to the inner embedded top of the coating machine, a filter box connected to the movable end of the telescopic rod, a suction fan and a T-shaped rod connected to the bottom of the filter box, and a plurality of soft hairs connected to the bottom of the T-shaped rod. An air duct communicating with the inside of the filter box is formed inside the T-shaped rod.

[0007] By adopting the above technical solution, when the semiconductor passes under the bottom of the T-shaped rod, the telescopic rod will squeeze the filter box, the T-shaped rod, and the soft hairs will descend. The soft hairs will contact the surface of the semiconductor. Then, as the soft hairs continue to descend, the bottom ends of the soft hairs will move and bend irregularly, which helps to clean the surface of the semiconductor. Then, the suction force of the suction fan acts on the surface of the semiconductor through the filter box and the air duct, thereby realizing the dust cleaning operation and ensuring the coating effect.

[0008] The utility model can be further configured in a preferred example as follows: A notch is left on one side of the tray. The notch is located at the bottom of a round opening, and the diameter of the notch is larger than that of the round opening.

[0009] The utility model can be further configured in a preferred example as follows: A plurality of round openings are equidistantly arranged in a ring surrounding the outside of the output shaft of the motor, and the output shaft of the motor is vertically coaxial with the center of the loading tray.

[0010] In a preferred embodiment, the telescopic rod of the present utility model can be further configured as follows: The telescopic rod is composed of a rod sleeve, a rod body, and a spring. The rod body slides through the bottom end of the rod sleeve, and the spring is located inside the rod sleeve and is connected between the rod sleeve and the rod body.

[0011] In a preferred embodiment, the present utility model can be further configured as follows: A plurality of soft bristles are all located inside a circular opening, and the air duct is located among the plurality of soft bristles.

[0012] In a preferred embodiment, the present utility model can be further configured as follows: A discharge plate is provided at the notch. The discharge plate is installed inside the coating machine. The top of the discharge plate is in contact with the bottom of the loading tray, and the bottom of the inner cavity of the discharge plate is set as an inclined surface.

[0013] In a preferred embodiment, the present utility model can be further configured as follows: A sealing ring is attached to the top of the loading tray, and the sealing ring is sleeved outside the T-shaped rod.

[0014] By adopting the above technical solutions, the beneficial effects achieved by the present utility model are as follows:

[0015] 1. In the present utility model, when the semiconductor passes through the bottom of the T-shaped rod, the telescopic rod will squeeze the filter box, the T-shaped rod, and the soft bristles to descend. The soft bristles contact the surface of the semiconductor. Then, as the soft bristles continue to descend, the bottom ends of the soft bristles will move and bend irregularly, which helps to clean the surface of the semiconductor. Then, the suction force of the exhaust fan acts on the surface of the semiconductor through the filter box and the air duct, thereby realizing the dust cleaning operation and ensuring the coating effect.

[0016] 2. In the present utility model, start the motor, and then the loading tray rotates smoothly against the tray. Then, when each circular opening passes through the bottom of the material box, a semiconductor in the material box will fill this circular opening. This step realizes continuous feeding and provides conditions for improving the coating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a three-dimensional view of the overall structure of the present utility model;

[0018] Figure 2 is an assembly schematic diagram of the overall structure of the feeding mechanism of the present utility model;

[0019] Figure 3 is a disassembled schematic diagram of a partial structure of the feeding mechanism of the present utility model;

[0020] Figure 4 is a schematic diagram of the cleaning mechanism of the present utility model;

[0021] Figure 5 is a front cross-sectional view of some parts in the cleaning mechanism of the present utility model.

[0022] Reference numerals:

[0023] 100. Loading mechanism; 110. Coating machine; 120. Bracket; 130. Tray; 140. Loading tray; 150. Motor; 160. Material box;

[0024] 200. Cleaning mechanism; 210. Telescopic rod; 211. Rod sleeve; 212. Rod body; 213. Spring; 220. Filter box; 230. Exhaust fan; 240. T-shaped rod; 250. Soft hair; 260. Air duct;

[0025] 300. Discharge plate. Specific embodiments

[0026] To make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other.

[0027] It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present utility model.

[0028] The following describes a semiconductor vacuum coating device provided by some embodiments of the present utility model with reference to the accompanying drawings.

[0029] Embodiment 1:

[0030] Combined with Figures 1-4 As shown in the figure, a semiconductor vacuum coating device provided by the present utility model includes a loading mechanism 100 and a cleaning mechanism 200. The loading mechanism 100 includes a coating machine 110, a bracket 120 installed inside the coating machine 110, a tray 130 connected to the top of the bracket 120, a loading tray 140 attached to the top of the tray, a motor 150 connected between the bracket 120 and the loading tray 140, and a material box 160 attached to the top of the loading tray 140. The material box 160 is connected to the inner wall of the coating machine 110, and a plurality of round openings are formed in the loading tray 140;

[0031] The cleaning mechanism 200 includes a telescopic rod 210 connected to the inner embedded top of the coating machine 110, a filter box 220 connected to the movable end of the telescopic rod 210, an exhaust fan 230 and a T-shaped rod 240 connected to the bottom of the filter box 220, and a plurality of soft hairs 250 connected to the bottom of the T-shaped rod 240. An air duct 260 communicating with the inside of the filter box 220 is formed inside the T-shaped rod 240.

[0032] Further, a notch is provided on one side of the tray 130. The notch is located at the bottom of a circular opening, and the diameter of the notch is larger than that of the circular opening. By providing the notch, the coated semiconductor can fall off automatically when it moves to the notch position.

[0033] Further, multiple circular openings are equidistantly arranged in a ring around the outer side of the output shaft of the motor 150. The output shaft of the motor 150 is vertically coaxial with the center of the material placing disc 140. With this layout design, the material placing disc 140 can rotate in place to ensure the stability of the feeding operation.

[0034] Further, the telescopic rod 210 is composed of a rod sleeve 211, a rod body 212, and a spring 213. The rod body 212 slides through the bottom end of the rod sleeve 211, and the spring 213 is located inside the rod sleeve 211 and is connected between the rod sleeve 211 and the rod body 212. The structural design of the telescopic rod 210 ensures that the soft bristles 250 can contact and clean the top of the semiconductor.

[0035] Further, multiple soft bristles 250 are all located inside a circular opening, and the air duct 260 is located among the multiple soft bristles 250. With this layout design, the suction force transmitted in the air duct 260 can completely remove the dust on the surface of the semiconductor.

[0036] Embodiment 2:

[0037] Combined with Figure 1 As shown, on the basis of Embodiment 1, a discharge plate 300 is provided at the notch. The discharge plate 300 is installed inside the coating machine 110. The top of the discharge plate 300 is attached to the bottom of the material placing disc 140. The bottom of the inner cavity of the discharge plate 300 is set as an inclined surface. By providing the discharge plate 300, the coated semiconductor can slide outward from the coating machine 110 automatically.

[0038] Embodiment 3:

[0039] Combined with Figure 1 and Figure 4 As shown, in the above embodiment, a sealing ring is attached to the top of the material placing disc 140. The sealing ring is sleeved outside the T-shaped rod 240. By providing the sealing ring, the circular opening can be sealed to prevent the suction force transmitted in the air duct 260 from leaking, ensuring that the surface of the semiconductor can be cleaned thoroughly.

[0040] Working principle and usage process of the utility model: When this device is put into actual use, start the motor 150, and then the feeding tray 140 rotates smoothly against the tray 130. Then, when each round opening passes through the bottom of the material frame 160, a semiconductor in the material frame 160 will fill this round opening. This step realizes continuous feeding, providing conditions for improving the coating efficiency. Then, when the semiconductor passes through the bottom of the T-shaped rod 240, the telescopic rod 210 will squeeze the filter box 220, the T-shaped rod 240, and the soft hair 250 to descend. The soft hair 250 contacts the surface of the semiconductor. Then, as the soft hair 250 continues to descend, the bottom end of the soft hair 250 will move and bend irregularly, which helps to clean the surface of the semiconductor. Then, the suction force of the exhaust fan 230 acts on the surface of the semiconductor through the filter box 220 and the air duct 260, thereby realizing the dust cleaning operation and ensuring the coating effect.

[0041] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the claims and their equivalents.

Claims

1. A semiconductor vacuum coating device, characterized in that, Including: A loading mechanism (100), the loading mechanism (100) includes a coating machine (110), a support frame (120) installed inside the coating machine (110), a tray (130) connected to the top of the support frame (120), a blanking tray (140) attached to the top of the tray (130), a motor (150) connected between the support frame (120) and the blanking tray (140), a material frame (160) attached to the top of the blanking tray (140), the material frame (160) is connected to the inner wall of the coating machine (110), and a plurality of circular openings are provided on the blanking tray (140); A cleaning mechanism (200), the cleaning mechanism (200) includes a telescopic rod (210) connected to the inner embedded top of the coating machine (110), a filter box (220) connected to the movable end of the telescopic rod (210), a suction fan (230) and a T-shaped rod (240) connected to the bottom of the filter box (220), and a plurality of soft hairs (250) connected to the bottom of the T-shaped rod (240). An air duct (260) communicating with the inside of the filter box (220) is provided inside the T-shaped rod (240).

2. The semiconductor vacuum coating device according to claim 1, characterized in that, A notch is provided on one side of the tray (130), the notch is located at the bottom of a circular opening, and the diameter of the notch is larger than the diameter of the circular opening.

3. A semiconductor vacuum coating device according to claim 1, characterized in that, A plurality of circular openings are equally spaced and surround the outside of the output shaft of the motor (150) in a ring shape, and the output shaft of the motor (150) is vertically coaxial with the center of the blanking tray (140).

4. A semiconductor vacuum coating device according to claim 1, characterized in that, The telescopic rod (210) is composed of a rod sleeve (211), a rod body (212), and a spring (213). The rod body (212) slides through the bottom end of the rod sleeve (211), and the spring (213) is located inside the rod sleeve (211) and is connected between the rod sleeve (211) and the rod body (212).

5. A semiconductor vacuum coating device according to claim 1, characterized in that, A plurality of soft hairs (250) are all located inside a circular opening, and the air duct (260) is located between the plurality of soft hairs (250).

6. A semiconductor vacuum coating device according to claim 2, characterized in that, An outlet plate (300) is provided at the notch, the outlet plate (300) is installed inside the coating machine (110), the top of the outlet plate (300) is attached to the bottom of the blanking tray (140), and the bottom of the inner cavity of the outlet plate (300) is set as an inclined surface.

7. A semiconductor vacuum coating device according to claim 1, characterized in that, A sealing ring is attached to the top of the blanking tray (140), and the sealing ring is sleeved outside the T-shaped rod (240).

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