Air detection device and air conditioning system
By setting up a multi-layer insulation barrier and heat insulation rib strips in the air detection device, the problem that the environmental parameter sensor is affected by the heating element is solved, and more accurate air parameter detection is achieved.
Patent Information
- Application Number
- CN202421636712.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-11
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-07-11
AI Technical Summary
In the existing air detection device, the environmental parameter sensor is affected by the heating element on the circuit board, resulting in inaccurate detection results.
By providing a first heat insulation groove and a second heat insulation groove in the air detection device, the distance around the environmental parameter sensor is increased, and a multi-layer heat insulation barrier is formed to reduce thermal interference of the heating element to the sensor.
The detection accuracy of environmental parameter sensors is improved, ensuring that the sensor works under stable temperature conditions, reducing the influence of heat, and improving the reliability of measurement data.
Smart Images
Figure CN223122962U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of environmental detection, and in particular to an air detection device and an air conditioning system. Background Art
[0002] Currently, air detection devices usually are provided with environmental parameter sensors, such as temperature sensors, humidity sensors, etc. The environmental parameter sensors are arranged on a circuit board and can detect the parameters of the surrounding air. There are also some heating elements arranged on the circuit board, such as transformers, rectifier bridges, etc. The heat generated by these heating elements will affect the environmental parameter sensors, resulting in inaccurate detection results of the environmental parameter sensors.
[0003] In the prior art, a heat source is arranged on the circuit board, the temperature and humidity sensor is arranged on the circuit board, and there is also an air gap on the circuit board to achieve the heat insulation effect on the temperature and humidity sensor and avoid the influence of the heat source on the temperature and humidity sensor.
[0004] In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
[0005] The heat insulation effect of the air gap is limited, and the environmental parameter sensor will still be affected by the heating elements on the circuit board, resulting in inaccurate detection results of the environmental parameter sensor.
[0006] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to those of ordinary skill in the art. Utility Model Content
[0007] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. The summary is not a general review, nor is it intended to identify key / important constituent elements or delineate the protection scope of these embodiments, but rather serves as a preface to the subsequent detailed description.
[0008] The embodiments of the present disclosure provide an air detection device and an air conditioning system to improve the detection accuracy of the environmental parameter sensor in the air detection device.
[0009] According to a first aspect of the embodiments of the present invention, an air detection device is provided, including a housing and a circuit board disposed inside the housing. The circuit board includes:
[0010] A first board member;
[0011] A second board member, disposed on a first side of the first board member and provided with heating elements;
[0012] The third plate member is disposed on the second side of the first plate member. The second side is disposed opposite to the first side. An environmental parameter sensor is provided, and a first heat insulation groove and a second heat insulation groove are provided. Among them, the first heat insulation groove is disposed around the environmental parameter sensor, and the second heat insulation groove is disposed between the first heat insulation groove and the first plate member.
[0013] In some embodiments, the first heat insulation groove includes a first through groove. The first through groove forms an opening on the side of the third plate member to communicate with the outer space of the third plate member.
[0014] In some embodiments, the first heat insulation groove further includes a second through groove. The second through groove is bent relative to the first through groove and communicates with the first through groove. The first through groove, the second through groove and the side of the third plate member enclose a detection area, and the environmental parameter sensor is disposed in the detection area.
[0015] In some embodiments, the length of the first through groove is 5.5 mm to 6.5 mm.
[0016] In some embodiments, the second heat insulation groove is disposed adjacent to the second through groove, and the length of the second heat insulation groove is greater than the length of the second through groove.
[0017] In some embodiments, the air detection device further includes:
[0018] A mounting plate is disposed inside the housing and is configured to mount a circuit board;
[0019] Heat insulation ribs are disposed on the mounting plate, and together with the mounting plate and the inner side wall of the housing, they enclose a heat insulation space;
[0020] Among them, the third plate member is disposed in the heat insulation space.
[0021] In some embodiments, the heat insulation ribs include:
[0022] A first strip portion is disposed between the first plate member and the third plate member to separate the first plate member and the third plate member;
[0023] A second strip portion is connected to the first strip portion and extends to the peripheral side plate of the housing.
[0024] In some embodiments, the distance between the second heat insulation groove and the first strip portion is greater than the distance between the second heat insulation groove and the first heat insulation groove.
[0025] In some embodiments, the peripheral side plate of the housing is provided with a hole portion. The hole portion is disposed opposite to the environmental parameter sensor, and the distance between the environmental parameter sensor and the hole portion is greater than or equal to 14 mm.
[0026] In some embodiments, the hole portion includes a through hole area and a blind hole area. The blind hole area is disposed around the outer periphery of the through hole area.
[0027] In some embodiments, the distance between the environmental parameter sensor and the first strip is 19.0 mm to 21.0 mm.
[0028] In some embodiments, the environmental parameter sensor is configured to detect the temperature and / or humidity of the air.
[0029] According to a second aspect of the present invention, there is provided an air conditioning system including the air detection device provided in any one of the foregoing embodiments.
[0030] The air detection device and the air conditioning system provided by the embodiments of the present disclosure can achieve the following technical effects:
[0031] By arranging the heating element on the second plate member and the environmental parameter sensor on the third plate member, and separating the second plate member and the third plate member by the first plate member to increase the distance between the heating element and the environmental parameter sensor, the thermal interference of the heating element on the environmental parameter sensor is reduced; and, a first heat insulation groove and a second heat insulation groove are arranged around the environmental parameter sensor to enhance the heat insulation effect on the environmental parameter sensor, further reducing the heat influence received by the environmental parameter sensor, and making the air parameters detected by the environmental temperature sensor more accurate.
[0032] The above general description and the following description are only exemplary and explanatory and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0033] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and among them:
[0034] Figure 1 is a schematic internal structure diagram of an air detection device provided by an embodiment of the present disclosure;
[0035] Figure 2 is Figure 1 an enlarged view of part A of
[0036] Figure 3 is a side sectional view of another air detection device provided by an embodiment of the present disclosure;
[0037] Figure 4 is a side view of another air detection device provided by an embodiment of the present disclosure;
[0038] Figure 5 is a side view of another air detection device provided by an embodiment of the present disclosure;
[0039] Figure 6 is a schematic external structure diagram of another air detection device provided by an embodiment of the present disclosure;
[0040] Figure 7 It is a structural block diagram of an air conditioning system provided by an embodiment of the present disclosure.
[0041] Reference numerals:
[0042] 10. Housing; 11. Peripheral side plate; 12. Panel;
[0043] 20. Circuit board; 210. First board member; 220. Second board member; 221. Heating element; 230. Third board member; 231. Ambient parameter sensor; 232. First heat insulation groove; 2321. First through groove; 2322. Second through groove; 233. Second heat insulation groove;
[0044] 30. Mounting plate; 31. Heat insulation rib; 310. First strip portion; 320. Second strip portion;
[0045] 40. Hole portion; 410. Through hole area; 420. Blind hole area;
[0046] 50. Air conditioning system. Detailed implementation manners
[0047] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference and illustration purposes only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of explanation, multiple details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices can be shown in a simplified manner to simplify the drawings.
[0048] The terms "first", "second", etc. in the specification, claims and above-mentioned drawings of the embodiments of the present disclosure are used to distinguish similar objects and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to implement the embodiments of the present disclosure described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.
[0049] In the embodiments of the present disclosure, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "middle", "outer", "front", and "back" is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and their examples, and are not used to limit that the indicated devices, elements, or components must have a specific orientation, or be constructed and operated in a specific orientation. Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0050] In addition, the terms "arrangement", "connection", and "fixation" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.
[0051] Unless otherwise specified, the term "plurality" means two or more.
[0052] In the embodiments of the present disclosure, the character " / " indicates that the objects before and after are in an "or" relationship. For example, A / B means: A or B.
[0053] The term "and / or" is an associative relationship describing objects, indicating that there can be three relationships. For example, A and / or B means: A or B, or, A and B these three relationships.
[0054] It should be noted that, without conflict, the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other.
[0055] Combined Figures 1 to 2 As shown in FIGS. 6, the embodiments of the present disclosure provide an air detection device, including a housing 10 and a circuit board 20 disposed inside the housing 10. The circuit board 20 includes: a first board member 210, a second board member 220, and a third board member 230. Among them, the second board member 220 is disposed on a first side of the first board member 210 and is provided with a heating element 221; the third board member 230 is disposed on a second side of the first board member 210, the second side is disposed opposite to the first side, and is provided with an environmental parameter sensor 231, and is provided with a first heat insulation groove 232 and a second heat insulation groove 233. Among them, the first heat insulation groove 232 is disposed around the environmental parameter sensor 231, and the second heat insulation groove 233 is disposed between the first heat insulation groove 232 and the first board member 210.
[0056] In an embodiment of the present disclosure, a heating element 221 is provided on the second plate member 220, an environmental parameter sensor 231 is provided on the third plate member 230, and a first plate member 210 is provided between the second plate member 220 and the third plate member 230, increasing the distance between the heating element 221 and the environmental parameter sensor 231 and reducing the influence of the heating element 221 on the environmental parameter sensor 231.
[0057] In an embodiment of the present disclosure, a first heat insulation groove 232 is further provided around the environmental parameter sensor 231, and a second heat insulation groove 233 is provided between the first heat insulation groove 232 and the first plate member 210, which can effectively isolate the heat generated by the heating element 221 and prevent thermal interference to the environmental parameter sensor 231, thereby ensuring the accuracy of the sensor measurement. The first heat insulation groove 232 is arranged around the environmental parameter sensor 231, providing direct heat insulation protection, while the second heat insulation groove 233 is arranged between the first heat insulation groove 232 and the first plate member 210, further enhancing the heat insulation effect and ensuring that the environmental parameter sensor 231 works under stable temperature conditions, improving the reliability of the measurement data.
[0058] Optionally, the first plate member 210, the second plate member 220 and the third plate member 230 form an L shape, and the first plate member 210 and the second plate member 220 are perpendicular to each other. The L-shaped layout helps to implement a better thermal management strategy because the heating element 221 and the sensitive element are spatially separated, reducing mutual interference.
[0059] Optionally, the heating element 221 includes: a rectifier bridge, and / or, a transformer, and / or, a microcontroller. These components are prone to generating heat during operation, affecting the detection accuracy of the sensor.
[0060] Optionally, the heating element 221 and the environmental parameter sensor 231 are arranged diagonally. The diagonal layout can provide a greater distance between the heating element 221 and the sensor within a limited space while maintaining the compactness of the circuit board 20.
[0061] Optionally, the first heat insulation groove 232 is L-shaped and the second heat insulation groove 233 is rectangular. The L-shaped first heat insulation groove 232 is specifically arranged around the environmental parameter sensor 231, providing targeted heat insulation protection and reducing thermal interference in a specific direction. The rectangular second heat insulation groove 233 acts as an additional heat insulation layer and works together with the first heat insulation groove 232 to improve the overall heat insulation performance.
[0062] Optionally, the first plate member, the second plate member and the third plate member are integrally formed. The integrally formed design reduces the need for connecting components and provides a more stable and robust structure.
[0063] In some embodiments, the first heat insulation groove 232 includes a first through groove 2321 and a second through groove 2322 that are connected and communicate with each other. The first through groove 2321 forms an opening on the side of the third plate member 230 to communicate with the outer space of the third plate member 230.
[0064] In the embodiments of the present disclosure, the first heat insulation groove 232 is further designed. By forming an opening on the side of the third plate member 230 through the first through groove 2321 and communicating with the outer space of the third plate member 230, a better heat insulation effect is achieved, which helps to quickly discharge the heat generated by the heating element 221 and maintain the stable operating temperature of the environmental parameter sensor 231. The connected first through groove 2321 and second through groove 2322 promote the flow of air around the circuit board 20. Since air itself is a poor heat conductor, when air flows through the first through groove 2321 and the second through groove 2322, a heat insulation barrier can be formed between the heating element 221 and the environmental parameter sensor 231, thereby reducing heat transfer.
[0065] In some embodiments, the second through groove 2322 is bent relative to the first through groove 2321. The first through groove 2321, the second through groove 2322, and the side of the third plate member 230 enclose a detection area, and the environmental parameter sensor 231 is disposed in the detection area.
[0066] In the embodiments of the present disclosure, by disposing the environmental parameter sensor 231 in a specific detection area, it can be ensured that the environmental parameters measured by the sensor come from a specific and controlled space, thereby improving the measurement accuracy. The bent second through groove 2322 cooperates with the first through groove 2321 to help guide the air to flow around the environmental parameter sensor 231, form a heat insulation barrier, and reduce the influence of the heat of the heating element 221 on the environmental parameter sensor 231.
[0067] Optionally, the included angle between the first through groove 2321 and the second through groove 2322 is 90°. The second through groove 2322 is bent relative to the first through groove 2321, which helps to form a heat insulation barrier between the heating element 221 and the environmental parameter sensor 231 and reduce thermal interference. The included angle between the first through groove 2321 and the second through groove 2322 being 90° can achieve a more compact layout in a limited space.
[0068] In some embodiments, the length of the first through groove 2321 is L1, and 5.5 mm ≤ L1 ≤ 6.5 mm. In this embodiment, the length of the first through groove 2321 is set between 5.5 mm and 6.5 mm to achieve the best heat conduction balance. If it is too short, it is not sufficient to provide enough heat insulation effect, and if it is too long, the mechanical strength of the circuit board 20 may be reduced, and the circuit board 20 is prone to breakage.
[0069] Optionally, the first through slot 2321 has a length of 6.0 m and a width of 3.0 m. Optionally, the second through slot 2322 has a length of 4.5 mm and a width of 2.5 mm.
[0070] In this way, the first through slot 2321 has a larger size, which can provide a larger air flow cross-section, helping to improve the air circulation efficiency and enhance the heat insulation effect. The second through slot 2322 has a smaller size, which can more precisely control the air flow direction, and on the basis of ensuring the mechanical strength of the circuit board 20, improve the heat insulation effect as much as possible.
[0071] In some embodiments, the second heat insulation slot 233 is disposed adjacent to the second through slot 2322, and the length of the second heat insulation slot 233 is greater than the length of the second through slot 2322.
[0072] In the embodiments of the present disclosure, the first heat insulation slot 232 mainly achieves heat insulation by surrounding the outer periphery of the environmental parameter sensor 231. The second heat insulation slot 233 adds a heat insulation barrier between the first heat insulation slot 232 and the first plate member 210. The combination of the first heat insulation slot 232 and the second heat insulation slot 233 provides double heat insulation protection, effectively isolating the heat from the heating element 221 and ensuring the accuracy of the measurement of the environmental parameter sensor 231. The length of the second heat insulation slot 233 can be longer than the length of the second through slot 2322. In this way, compared with the second through slot 2322, a larger heat insulation area is provided, so that the second heat insulation slot 233 becomes a heat buffer zone, which helps to more effectively block and disperse the heat from the first plate member 210 and protect the environmental parameter sensor 231 from heat interference.
[0073] Optionally, the length of the second heat insulation slot 233 is L2, and 5.0 mm ≤ L2 ≤ 6.0 mm. The second heat insulation slot 233 can effectively isolate the thermal influence between the environmental parameter sensor 231 and the heating element 221 within this length range, ensuring the measurement accuracy of the sensor.
[0074] In some embodiments, the air detection device further includes a mounting plate 30 and heat insulation ribs 31. The mounting plate 30 is disposed inside the housing 10 and is configured to mount the circuit board 20. The heat insulation ribs 31 are disposed on the mounting plate 30 and enclose a heat insulation space with the mounting plate 30 and the inner side wall of the housing 10. Among them, the third plate member 230 is disposed in the heat insulation space.
[0075] The embodiments of the present disclosure provide a stable mounting platform for the circuit board 20 by setting the mounting plate 30, which helps to reduce the displacement or damage of the circuit board 20 caused by vibration or impact. The heat insulation space enclosed by the heat insulation ribs 31 and the mounting plate 30 and the inner side wall of the housing 10 provides additional heat insulation protection for the third plate member 230, further isolating the influence of external heat on the environmental parameter sensor 231.
[0076] Optionally, an assembly space is defined between the mounting plate 30 and the housing 10, and the circuit board 20 is disposed within the assembly space. In this way, the circuit board 20 can be stably mounted inside the housing 10.
[0077] Optionally, the housing 10 includes a panel 12 and a peripheral side plate 11 surrounding the peripheral side of the panel 12. The heat insulation rib 31 protrudes from the surface of the mounting plate 30 towards the panel 12, and the heat insulation rib 31 abuts against the inner wall of the panel 12.
[0078] In this way, the heat insulation rib 31 is in direct contact with the inner wall of the panel 12, providing a better heat insulation effect and helping to maintain a stable temperature environment inside the device. The heat insulation rib 31 formed by protrusion increases the structural stability of the housing 10 and improves the overall mechanical strength. The integrally formed heat insulation rib 31 reduces the need for additional components and simplifies the manufacturing process.
[0079] In some embodiments, the heat insulation rib 31 includes a first portion 310 and a second portion 320. Among them, the first portion 310 is disposed between the first plate member 210 and the third plate member 230 to separate the first plate member 210 and the third plate member 230; the second portion 320 is connected to the first portion 310 and extends to the peripheral side plate 11 of the housing 10.
[0080] In the embodiments of the present disclosure, the heat insulation rib 31 is further designed such that the first portion 310 is disposed between the first plate member 210 and the third plate member 230, effectively separating the two plate members, reducing the heat exchange between them, and providing a better temperature partition inside the circuit board 20. The connection between the second portion 320 and the first portion 310 forms a continuous heat insulation path, which can more effectively block the transfer of heat from the heating element 221 to the environmental parameter sensor 231. The second portion 320 extends to the peripheral side plate 11 of the housing 10, which helps to utilize the peripheral side plate 11 of the housing 10 for additional heat dissipation and improves the overall thermal management. In addition, the design of the heat insulation rib 31 provides a certain limiting effect on the circuit board 20, enhances the mechanical stability of the overall structure of the circuit board 20, and reduces the damage caused by mechanical vibration or impact.
[0081] Optionally, the length of the first portion 310 is L3, and 6.5 mm ≤ L3 ≤ 7.0 mm. The length range of the first portion 310 ensures that the heat insulation rib 31 provides sufficient heat insulation between two key components, while avoiding excessive occupation of limited space. And, it enables a certain connection strength to remain between the first plate member 210 and the third plate member 230.
[0082] Optionally, the length of the first portion 310 is 6.7 mm. In this way, the best heat isolation effect can be achieved between the first plate member 210 and the third plate member 230.
[0083] In some embodiments, the distance between the second heat insulation groove 233 and the first strip portion 310 is greater than the distance between the second heat insulation groove 233 and the first heat insulation groove 232.
[0084] In the embodiments of the present disclosure, the distance relationship between the second heat insulation groove 233 and the first strip portion 310, and between the second heat insulation groove 233 and the first heat insulation groove 232 is set such that the distance between the second heat insulation groove 233 and the first strip portion 310 is larger, thereby providing a more sufficient heat insulation space, enhancing the heat insulation effect of the local area, and providing a more stable working environment for the environmental parameter sensor 231.
[0085] Optionally, the distance between the second heat insulation groove 233 and the first heat insulation groove 232 is L4, and 2.2 mm ≤ L4 ≤ 2.7 mm. Optionally, the distance between the second heat insulation groove 233 and the first heat insulation groove 232 is 2.5 mm. By setting the distance between the first heat insulation groove 232 and the second heat insulation groove 233 within this range, the environmental parameter sensor 231 can be more effectively protected from thermal interference, improving the measurement accuracy.
[0086] In some embodiments, the circumferential side plate 11 of the housing 10 is provided with a hole portion 40, the hole portion 40 is disposed opposite to the environmental parameter sensor 231, and the distance between the environmental parameter sensor 231 and the hole portion 40 is greater than or equal to 14 mm.
[0087] Here, making the distance between the environmental parameter sensor 231 and the hole portion 40 greater than or equal to 14 mm helps to form a natural air gap as an effective barrier to avoid the influence of external static electricity on the environmental parameter sensor 231. And this distance enables air to flow between the environmental parameter sensor 231 and the outside of the housing 10, providing a passive cooling mechanism that helps to dissipate the heat near the environmental parameter sensor 231 and keep it at an appropriate working temperature.
[0088] In some embodiments, a hole portion 40 is provided on the circumferential side plate 11 of the housing 10 at a position opposite to the environmental parameter sensor 231, and the hole portion 40 includes a through hole area 410 and a blind hole area 420, and the blind hole area 420 is disposed around the outer periphery of the through hole area 410.
[0089] Combined Figures 3 to 5 As shown, in the embodiments of the present disclosure, the through hole area 410 allows air to directly flow from the outside of the housing 10 to the inside. Since the hole portion 40 is disposed opposite to the environmental parameter sensor 231, it helps the environmental parameter sensor 231 to provide accurate environmental parameter measurements. The blind hole area 420 is disposed around the through hole area 410, which can prevent larger particles or dust from entering the device interior through the hole portion 40. Also, the design of the hole portion 40 can be part of the housing 10, providing an aesthetic appearance without affecting its functionality.
[0090] Optionally, the through-hole region 410 includes a plurality of first holes that penetrate the housing 10, and the plurality of first holes are arranged in an array. The plurality of first holes arranged in an array can provide good ventilation effects without sacrificing structural strength, improve air exchange efficiency, and reduce the noise generated by air flow.
[0091] Optionally, the blind-hole region 420 includes a plurality of second holes that only penetrate a part of the depth of the housing 10, and the plurality of second holes surround the outer periphery of the through-hole region 410. The presence of the second holes can increase the local strength of the housing 10, especially in areas subjected to mechanical stress, and prevent larger foreign objects or dust from entering the device interior through the holes.
[0092] Optionally, the through-hole region 410 includes a plurality of first holes that penetrate the housing 10, and the plurality of first holes are arranged in an array; the blind-hole region 420 includes a plurality of second holes that only penetrate a part of the depth of the housing 10, and the plurality of second holes surround the outer periphery of the through-hole region 410.
[0093] Here, the setting of the through-hole region 410 allows the environmental parameter sensor 231 to directly contact the external air, providing more accurate measurement of environmental parameters. The array arrangement of the through-hole region 410 helps to evenly distribute air flow, ensuring that the air samples detected by the sensor are representative. The blind-hole region 420 surrounding the through-hole region 410 provides a certain degree of physical protection for the environmental parameter sensor 231, preventing dust and larger particles from directly contacting the environmental parameter sensor 231, and can reduce the risk of the housing 10 cracking when subjected to impact, improving overall durability. And the combined setting of the blind-hole region 420 and the through-hole region 410 enables the hole portion 40 to be part of the housing 10, providing an aesthetic appearance without affecting its functionality.
[0094] Optionally, the hole portion 40 is provided on the peripheral side plate 11. In this way, external air can flow into the interior of the housing 10 from one side of the air detection device.
[0095] In some embodiments, the distance between the environmental parameter sensor 231 and the first strip portion 310 is L5, where 19.0 mm ≤ L5 ≤ 21.0 mm.
[0096] Here, maintaining this distance between the environmental parameter sensor 231 and the first strip portion 310 can effectively reduce the influence of the heat of the heating element 221 on the performance of the environmental parameter sensor 231, ensuring the accuracy of the environmental parameters measured by the environmental parameter sensor 231 and avoiding interference of the heat generated by the heating element 221 on the measurement results.
[0097] In some embodiments, the environmental parameter sensor 231 is configured to detect the temperature and / or humidity of the air. In the embodiments of the present disclosure, the environmental parameter sensor 231 can be a temperature sensor, a humidity sensor, or a temperature and humidity sensor. When the above sensors are disposed on the circuit board 20, through the setting manner of any one of the foregoing embodiments, a good heat insulation effect on the environmental parameter sensor 231 can be achieved, and the accuracy of its detection result can be improved.
[0098] Combined with Figure 7 As shown, the embodiments of the present disclosure further provide an air conditioning system 50, including the air detection device provided in any one of the foregoing embodiments.
[0099] The air conditioning system 50 provided by the embodiments of the present disclosure can accurately detect the temperature and / or humidity of the air by setting the air detection device, provide accurate environmental parameters for the air conditioning system 50, and thus achieve more precise control. Based on the accurate detection of environmental parameters, the response time of the air conditioning system 50 can be reduced, the set environmental conditions can be quickly reached, and the overall efficiency can be improved. The reasonable layout and heat insulation design of the heating element 221 and the environmental parameter sensor 231 can reduce thermal stress and extend the service life of the air conditioning system 50 and its components.
[0100] Optionally, the air conditioning system 50 further includes a control device and an adjustment device. The control device is configured to control the operation of the adjustment device according to the detection data of the air detection device, and the adjustment device is configured to adjust the parameters of the indoor air. In this way, the air conditioning system 50 can adjust the indoor air quality to an appropriate level.
[0101] The above description and the drawings fully illustrate the embodiments of the present disclosure, so that those skilled in the art can practice them. Other embodiments may include structural and other changes. The embodiments only represent possible variations. Unless explicitly required, the individual components and functions are optional, and the order of operations can vary. Some parts and features of some embodiments may be included in or replace parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims.
Claims
1. An air detection device, comprising a housing and a circuit board disposed inside the housing, characterized in that, The circuit board includes: A first board member; A second board member, disposed on the first side of the first board member, and provided with a heating element; A third board member, disposed on the second side of the first board member, the second side being opposite to the first side, provided with an environmental parameter sensor, and provided with a first heat insulation groove and a second heat insulation groove, wherein the first heat insulation groove is disposed around the environmental parameter sensor, and the second heat insulation groove is disposed between the first heat insulation groove and the first board member.
2. The air detection device according to claim 1, characterized in that, The first heat insulation groove includes a first through groove, and the first through groove forms an opening on the side of the third board member to communicate with the outer space of the third board member.
3. The air detection device according to claim 2, wherein The first heat insulation groove further includes a second through groove, the second through groove is bent relative to the first through groove and communicates with the first through groove; the first through groove, the second through groove and the side of the third board member enclose a detection area, and the environmental parameter sensor is disposed in the detection area.
4. The air detection device according to claim 3, characterized in that, The length of the first through groove is L1, and 5.5 mm ≤ L1 ≤ 6.5 mm.
5. The air detection device according to claim 2, wherein The second heat insulation groove is disposed adjacent to the second through groove, and the length of the second heat insulation groove is greater than the length of the second through groove.
6. The air detection device according to any one of claims 2 to 5, characterized in that, It further includes: A mounting plate, disposed inside the housing and configured to mount the circuit board; Heat insulation ribs, disposed on the mounting plate, and enclosing a heat insulation space with the mounting plate and the inner side wall of the housing; Wherein, the third board member is disposed in the heat insulation space.
7. The air detection device according to claim 6, wherein The heat insulation ribs include: A first strip portion, disposed between the first board member and the third board member to separate the first board member and the third board member; A second strip portion, connected to the first strip portion and extending to the peripheral side plate of the housing.
8. The air detection device according to claim 7, wherein, The distance between the second heat insulation groove and the first strip portion is greater than the distance between the second heat insulation groove and the first heat insulation groove.
9. The air detection device according to claim 7, characterized in that, The peripheral side plate of the housing is provided with a hole portion, the hole portion is disposed opposite to the environmental parameter sensor, and the distance between the environmental parameter sensor and the hole portion is greater than or equal to 14 mm.
10. The air detection device according to claim 9, characterized in that, The hole portion includes a through hole area and a blind hole area, and the blind hole area is disposed around the outer periphery of the through hole area.
11. The air detection device according to claim 7, characterized in that, The distance between the environmental parameter sensor and the first strip portion is L5, and 19.0 mm ≤ L5 ≤ 21.0 mm.
12. The air detection device according to any one of claims 1 to 5, characterized in that, The environmental parameter sensor is configured to detect the temperature and / or humidity of the air.
13. An air conditioning system, characterized in that, It includes the air detection device according to any one of claims 1 to 12.