Structure of optical fiber module interface radiator and indium heat-conducting sheet
By forming a tightly bonded indium heat conduction sheet structure on the interface heat sink of the optical fiber module, the problems of poor heat dissipation and easy damage in the prior art are solved, and efficient heat dissipation and enhanced durability are achieved.
Patent Information
- Application Number
- CN202422237631.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-12
AI Technical Summary
In the heat dissipation method of existing fiber optic modules, adhesive tape sticking metal heat conduction flakes lead to air infiltration and thermal resistance of adhesives, poor heat dissipation effect, and metal heat conduction flakes are easily damaged, affecting the module life.
Indium heat conducting sheets are used to form a closely bonded structure on the surface of the interface radiator. By forming a rough surface on the nickel-plating layer and forming a roll, the bonding surface has no gaps or air, the top surface is flat, and an antioxidant coating is applied, with a thickness of 0.02mm to 0.1mm.
It improves heat dissipation efficiency, reduces thermal resistance, enhances pull-out and friction resistance, extends the module life, solves the problem of easy oxidation of indium thermally conductive materials, and improves the heat dissipation effect.
Smart Images
Figure CN223123272U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a structure of an indium heat-conducting sheet for closely fitting an interface radiator of an optical fiber module, in particular to a structure for enabling the indium heat-conducting sheet to be closely combined with the surface of the interface radiator and having long-term antioxidant property. Background Art
[0002] With the continuous expansion of the transmission capacity and the continuous improvement of the speed of the network communication system, as well as the wide application of AI application models such as ChatGPT, the demand for computing power support of these applications is continuously increasing. At the same time, higher requirements are put forward for high-speed interconnection inside the data center, and the demand for bandwidth and rate is also increasing continuously. To meet these requirements, the Octal Small Form factor eXtra Dense Pluggable module (abbreviated as OSFP-XD), as a new optical fiber module packaging form, has emerged. It mainly integrates and packages the optical receiver (Receiver) and the optical transmitter (Transmitter) in the optical fiber communication process in the same module, and has the function of receiving and sending messages simultaneously. It supports the upgrade of the global communication network architecture to 1.6T and provides an ideal solution for the construction of the next-generation data center. This optical fiber module (or optical module) has the characteristics of high density and miniaturization. However, with the increase in the density of optoelectronic components inside the optical fiber module, the corresponding component power consumption will also increase. These factors will lead to an increase in heat generation inside the optical fiber module, resulting in a very high temperature when the optical fiber module is working. The electro-optic / photoelectric conversion components and chip performance that are sensitive to temperature in the optical fiber module will be greatly reduced, and even the entire optical fiber module cannot work properly or fails.
[0003] As Figure 1 shown, it is a schematic external view of an existing optical fiber module 10, and an interface radiator 11 is provided on its surface. When the existing optical fiber module 10 components are in use, they continuously receive and transmit signals, and a large amount of heat will be generated during internal operation, causing high-temperature damage to surrounding electronic components. Therefore, it is necessary to dissipate heat through this interface radiator 11.
[0004] As Figure 2A and Figure 2BAs shown in the figure, it is a schematic diagram of an interface heat sink 11. The inner side of the interface heat sink 11 is heat dissipation fins 111, and the upper surface 112 is a flat surface to facilitate plugging and unplugging into the connection port. The commonly used heat dissipation method at present is to paste a metal heat conduction sheet 13 on the upper surface 112 with a tape 12. When using the tape 12 to paste the metal heat conduction sheet 13, the surface cannot be closely attached, air will penetrate, and the adhesive will bring thermal resistance effects, resulting in the inability to improve the heat dissipation effect. Moreover, the tape 12 plus the metal heat conduction sheet 13 will cause a relatively convex thickness (t1). In this way, after the optical fiber module 10 is plugged and unplugged multiple times, the metal heat conduction sheet 13 is easily affected by friction and extrusion forces and is extremely easy to damage, thus reducing the service life of the optical fiber module 10.
[0005] In view of the above problems, the present invention actively researches and improves to solve the above-mentioned deficiencies as the main topic. Summary of the Invention
[0006] The main purpose of the present invention is to provide a structure for closely fitting an indium heat conduction sheet on an interface heat sink of an optical fiber module, which can closely fit the indium heat conduction sheet on the surface of the interface heat sink without an adhesive, has excellent tensile and friction resistance properties, is not easily damaged, can increase the service life of the optical fiber module, reduce the thermal resistance effects brought by air and adhesives, and can also solve the problem of easy oxidation of indium heat conduction materials, with an improvement in heat dissipation efficiency.
[0007] To achieve the above object, the present invention provides a structure for closely fitting an indium heat conduction sheet on an interface heat sink of an optical fiber module, which is characterized in that it comprises:
[0008] An interface heat sink, the surface of which has a nickel plating layer, and a rough surface is formed on the nickel plating layer;
[0009] An indium heat conduction sheet, which forms a thin sheet on the rough surface. The indium heat conduction sheet is pressed by a roller so that the bottom is riveted into the rough surface. The indium heat conduction sheet is closely combined with the upper surface of the interface heat sink, and there is no gap and air at the bonding surface. Moreover, the top surface of the indium heat conduction sheet is a flat and smooth surface and adheres to the upper surface of the interface heat sink, and is closely formed into an indium heat conduction thin layer. The thickness of the indium heat conduction thin layer protruding from the surface of the interface heat sink is 0.02 mm to 0.1 mm; and
[0010] An antioxidant coating with a thickness of 1 to 5 μm is coated on the surface of the indium heat conduction thin layer.
[0011] In the structure for closely fitting an indium heat conduction sheet on an interface heat sink of an optical fiber module, the inner side of the interface heat sink is heat dissipation fins, and the upper surface of the heat dissipation fins is a plane.
[0012] By means of the above technical means, the present invention has the following beneficial effects:
[0013] 1. The present utility model uses indium heat-conducting material to be bonded to the surface of the fiber optic interface heat sink. Its heat dissipation performance can replace the heat dissipation performance of the traditional heat-conducting materials currently used in interface heat sinks. Moreover, the indium heat-conducting sheet has excellent tensile and friction resistance properties and is not easily damaged, which can increase the service life of the fiber optic module.
[0014] 2. The present utility model uses a special method to rivet and bond the indium heat-conducting sheet to the interface heat sink without using an adhesive to fix the heat-conducting sheet. The indium heat-conducting sheet has certain ductility and caulking ability, and can minimize the surface thermal resistance, thereby improving the heat dissipation ability. After passing through the pressure roller, it is closely attached to the surface of the interface heat sink, reducing the thermal resistance impact brought by air and adhesives, and having an improvement in enhancing the heat dissipation effect.
[0015] 3. The present utility model brushes / immerses an antioxidant coating on the surface of the indium heat-conducting material, which can solve the problem of indium metal oxidation. The coating thickness is 1 - 5 μm. This film thickness can reduce the thermal resistance of the metal sheet (the thermal resistance before and after coating construction is 0.121 °C / W and 0.069 °C / W). It can exceed 30 days in an 85 °C / 85% RH aging environment, which is equivalent to extending the storage period from 6 months before treatment to more than 10 years under storage conditions (30 °C / 60% RH), having an improvement in extending the service life of the indium heat-conducting sheet. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 FIG. is a schematic diagram of the appearance of a fiber optic module in the prior art.
[0017] Figure 2A FIG. is an exploded view of a metal heat-conducting sheet attached to the interface heat sink of a fiber optic module in the prior art.
[0018] Figure 2B FIG. is an external view of a metal heat-conducting sheet attached to a fiber optic module in the prior art.
[0019] Figure 2C is Figure 2B an enlarged cross-sectional view of the part indicated by 2C in FIG.
[0020] Figure 3 FIG. is a flowchart of the method of the present utility model.
[0021] Figure 4A FIG. is an exploded perspective view of a preferred embodiment of the present utility model, showing that the indium heat-conducting sheet is a sheet-like body.
[0022] Figure 4B FIG. is a combined perspective view of a preferred embodiment of the present utility model.
[0023] Figure 4C is to show Figure 4B an enlarged cross-sectional view of the 4C-4C section in FIG.
[0024] Figure 5A To show the exploded view of the interface radiator and the jig platform of the present utility model.
[0025] Figure 5B To show the schematic diagram of placing the interface radiator of the present utility model into the jig platform.
[0026] Figure 6A To show the schematic diagram of the mirror roller pressing the indium heat-conducting sheet of the present utility model.
[0027] Figure 6B To show the schematic diagram of the indium heat-conducting sheet being extended and riveted on the rough surface of the interface radiator of the present utility model.
[0028] Figure 7 To show the three-dimensional external view of the indium heat-conducting thin layer of the present utility model coated with a fluorination liquid protective coating.
[0029] Figure 8 To show Figure 7 The enlarged cross-sectional view of the part indicated by 8 in
[0030] Explanation of reference numerals in the drawings: 10 - optical fiber module; 11 - interface radiator; 111 - heat dissipation fins; 112 - nickel plating layer; 113 - rough surface; 20 - indium heat-conducting sheet; 20a - indium heat-conducting thin layer; 21 - PET sheet; 30 - jig platform; 40 - mirror roller; 50 - antioxidant coating. Detailed implementation manners
[0031] The following is to illustrate the implementation manners of the present utility model through specific specific embodiments. Those of ordinary skill in the art can easily understand the other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific embodiments, and various details in the specification of the present utility model can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present utility model.
[0032] First, Figure 3 The flowchart of Figures 4A to 8 As shown, the present utility model provides a structure for closely fitting an indium heat-conducting sheet to an interface radiator of an optical fiber module, and its implementation steps include:
[0033] a). Step S11: "Provide an interface radiator 11 of an optical fiber module", as Figures 4A to 4B shown; in this embodiment, the interface radiator 11 includes inner heat dissipation fins 111, the surface of which has a nickel plating layer 112, and its upper surface is flat for easy insertion and extraction into / from the connection port.
[0034] b). Step S12: "Grind the surface of the nickel plating layer 112 of the interface heat sink 11 to form a rough surface 113". This step is to use sandpaper or a grinding machine to grind the heat-conducting material attachment area on the nickel plating layer 112 of the interface heat sink 11, aiming to increase the roughness in the area. The fine indentations can increase the adhesion when the heat-conducting material is attached.
[0035] c). Step S13: "Provide an indium heat-conducting sheet 20". As Figures 4A to 4C shown, in this embodiment, the indium heat-conducting sheet 20 includes a sheet body that is die-cut into a predetermined shape and degreased. This step is to soak the indium heat-conducting sheet 20 in a degreasing solvent for about 10 minutes, use a lint-free cloth to remove the excess solvent on the surface, and then put it into an oven to dry. In this embodiment, the degreasing solvent used may include ethyl acetate, petroleum ether, etc., but is not limited thereto.
[0036] d). Step S14: "Initially form the indium heat-conducting sheet 20 on the rough surface 113". Since the thermal conductivity of indium metal is 86 W / mK and it is 4 times softer than lead. Therefore, the ductility, gap-filling property, and thermal conductivity of the indium heat-conducting sheet 20 make it an ideal compressible thermal interface material and can minimize the surface thermal resistance, thereby improving the thermal conductivity. However, the important issue is how to firmly attach the indium heat-conducting sheet 20 to the nickel plating layer 112 of the interface heat sink 11 without affecting the access and insertion of the fiber optic module. Therefore, the main technical feature of this utility model lies in overcoming this technical problem.
[0037] e). Step S15: "Place the interface heat sink 11 on a jig platform 30, and a mirror roller 40 is provided on the jig platform 30". As Figures 5A to 5B shown, this step is to die-cut the indium heat-conducting sheet 20 into a shape and size that matches the rough surface 113. In this embodiment, the indium heat-conducting sheet 20, matching the shape of the interface heat sink 11, has a shape that is slightly narrower at the front and rear ends, but is not limited thereto.
[0038] f). Step S16: "Provide a PET sheet 21 and place it between the surface of the indium heat-conducting sheet 20 and the mirror roller 40". In this embodiment, the material property of the PET sheet 21 is that there is no adhesive on the surface, so it will not stick to the surface of the indium heat-conducting sheet 20. Its function is to assist in the pressing process of the mirror roller 40 and improve the surface flatness of the indium heat-conducting sheet 20.
[0039] g). Step S17: "Reciprocally press with the mirror roller 40". As Figure 6A and Figure 6BAs shown, this step is to mirror-polish the surface of the mirror roller 40, and use the PET sheet 21 as the contact medium between it and the indium heat-conducting sheet 20. Then, the indium heat-conducting sheet 20 is roll-pressed with a roller pressure of 40-110 kgf to improve its surface flatness. The roller pressure will vary with the change in the shape of the optical fiber module 10.
[0040] h). Step S18: "Extend the indium heat-conducting sheet 20 and closely bond it to the rough surface 113 of the interface heat sink 11 to form a closely bonded indium heat-conducting thin layer 20a", as Figure 6A and Figure 6B shown, use the mirror roller 40 to reciprocally press and bond the indium heat-conducting sheet 20, so that the bottom of the indium heat-conducting sheet 20 is riveted (bitten) into the rough surface 113, closely bonded to the upper surface of the interface heat sink 11, making its bonding surface have no gaps and air, having a lower thermal resistance, and the top surface of the indium heat-conducting sheet 20 is a flat and smooth surface attached to the upper surface of the interface heat sink 11, forming a closely bonded indium heat-conducting thin layer 20a by close bonding. The thickness (t2) of the indium heat-conducting thin layer 20a protruding from the surface of the interface heat sink 11 is 0.02 mm - 0.1 mm. In this way, the heat dissipation surface closely bonded with the indium heat-conducting sheet 20 has a much higher heat conduction performance than the traditional TIM glue (the thermal conductivity of the commonly used TIM glue is less than 10 W / mK). Through comparative tests, the high thermal conductivity of the indium heat-conducting sheet 20 and the thermal interface material design enable it to transfer the heat generated by the heat source more quickly and evenly, thereby improving the heat dissipation efficiency of the entire system. Compared with the traditional heat dissipation glue, the indium heat-conducting sheet has a lower thermal resistance during the heat conduction process, enabling the heat to flow more smoothly, reducing local heat accumulation, and thus achieving a lower junction temperature and a more uniform temperature distribution.
[0041] i). Step S19: "Tear off the PET sheet to expose the surface of the indium heat-conducting thin layer 20c". This step is to use the mirror roller 40 to reciprocally press and bond the indium heat-conducting sheet 20, so that the bottom of the indium heat-conducting sheet 20 is riveted (bitten) into the rough surface 113, closely bonded to the upper surface of the interface heat sink 11, its bonding surface has no gaps and air, having a lower thermal resistance, and the top surface of the indium heat-conducting sheet 20 is a flat and smooth surface attached to the upper surface of the interface heat sink 11. When the pressing process is completed, the PET sheet needs to be torn off. Since the PET sheet has no adhesive, it will not stick to the surface of the indium heat-conducting sheet 20, so it is very easy to remove, and sometimes it will even be adsorbed on the surface of the mirror roller 40, which is very convenient to remove from the surface of the indium heat-conducting thin layer 20a.
[0042] j). Step S20: "Coat an antioxidant coating 50 with a thickness of 1 - 5 μm on the surface of the indium heat-conducting thin layer 20c", as Figure 8As shown, this step is to prevent the indium heat-conducting layer 20a from oxidation; and the film thickness can reduce the thermal resistance of the indium heat-conducting sheet 20 (the thermal resistances before and after coating construction are 0.121 °C / W and 0.069 °C / W respectively). It can exceed 30 days in an aging environment of 85 °C / 85% RH, which is equivalent to extending the storage period from 6 months before treatment to more than 10 years under storage conditions (30 °C / 60% RH). In this embodiment, the antioxidant coating 50 may include a fluorinated liquid coating, but is not limited thereto.
[0043] k). Step S21: "Stick on the protective film". This step is to prevent the surface of the interface heat sink 11 from being damaged during the process from the factory to the hands of consumers. The protective film (not shown in the figure) can be composed of a commercially available material that can be torn off by hand, and will not be elaborated here.
[0044] l). Step S19: "Complete". As Figure 7 and Figure 8 shown, at this time, the indium heat-conducting thin layer 20a is flatly and closely attached to the upper surface of the interface heat sink 11, and has an antioxidant coating 50, and the thickness (t2) protruding from the surface of the interface heat sink 11 is only about 0.02 - 0.1 mm. Compared with the thickness (t1) of more than 0.15 mm of the traditional metal heat sink pasted with tape, it is much reduced. Therefore, it will not affect the plugging and unplugging of the optical fiber module 10, and it penetrates into the nickel-plated layer 112 surface of the interface heat sink 11 and is almost integrated, so it is more stable as a whole.
[0045] As described above, the interface heat sink structure made according to the above method includes:
[0046] An interface heat sink 11, the surface of which has a nickel-plated layer 112, and a rough surface 113 is formed on the nickel-plated layer 112;
[0047] An indium heat-conducting material 20, cooperating with the rough surface 113, forms a thin sheet on the rough surface 113, so that the indium heat-conducting material 29 is pressed by a roller, and the bottom is riveted (bitten) into the rough surface, and is closely combined on the upper surface of the interface heat sink 11, so that there is no gap and air at the joint surface, and it has a lower thermal resistance. And the top surface of the indium heat-conducting sheet 20 is flat and smooth and attached to the upper surface of the interface heat sink 11, and is closely formed into an indium heat-conducting thin layer 20a, and the thickness (t2) of the indium heat-conducting thin layer 20a protruding from the upper surface of the interface heat sink 11 is 0.02 mm - 0.1 mm; and
[0048] An antioxidant coating 50 with a thickness of 1 - 5 μm is coated on the surface of the indium heat-conducting thin layer 20a.
[0049] By means of the above technical means, the utility model has the following beneficial effects:
[0050] 1. In the present utility model, an indium heat-conducting sheet 20 is closely attached to the surface of the interface heat sink 11 of the optical fiber module 10. Its heat dissipation performance can replace the current solution of using traditional heat-conducting materials for the interface heat sink, and the indium heat-conducting sheet 20 has excellent tensile and friction resistance properties, is not easily damaged, and can extend the service life of the optical fiber module 10.
[0051] 2. In the present utility model, the indium heat-conducting sheet 20 is riveted and closely attached to the interface heat sink 11 by a special method, without using an adhesive to fix the indium heat-conducting sheet 20. Moreover, the indium heat-conducting sheet 20 has a certain ductility and can minimize the surface thermal resistance to improve the heat dissipation capacity. After passing through a pressure roller, it is closely attached to the surface of the interface heat sink 11, reducing the thermal resistance influence brought by air and the adhesive, and enhancing the heat dissipation effect.
[0052] 3. In the present utility model, an antioxidant coating 50 is brushed / soaked on the surface of the indium heat-conducting sheet 20, which can solve the problem of indium oxidation. The coating thickness is 1 - 5 μm. This film thickness can reduce the thermal resistance of the indium heat-conducting sheet 20 and has the effect of extending the service life of the indium heat-conducting sheet 20.
[0053] The above-disclosed drawings and descriptions are only the preferred embodiments of the present utility model. Any modification or equivalent change made by those of ordinary skill in the art within the spirit scope of the present utility model should still be included within the patent scope of the present utility model.
Claims
1. The structure of an indium heat-conducting sheet closely attached to a heat sink at the interface of an optical fiber module, characterized in that, Comprising: An interface heat sink having a nickel plating layer on its surface, and a rough surface is formed on the nickel plating layer; An indium heat conducting sheet, which forms a thin sheet on the rough surface. The indium heat conducting sheet is riveted to the rough surface at the bottom through a pressure roller. The indium heat conducting sheet is tightly combined with the upper surface of the interface heat sink, and there is no gap or air at the bonding surface. Moreover, the top surface of the indium heat conducting sheet is a smooth flat surface and is attached to the upper surface of the interface heat sink, and is integrally formed into an indium heat conducting thin layer. The thickness of the indium heat conducting thin layer protruding from the surface of the interface heat sink is 0.02 mm to 0.1 mm; and An antioxidant coating with a thickness of 1 to 5 μm is coated on the surface of the indium heat conducting thin layer.
2. The structure of the indium heat-conducting sheet closely fitted to the interface radiator of the optical fiber module according to claim 1, characterized in that The inner side of the interface heat sink is a heat dissipating fin, and the upper surface of the heat dissipating fin is a flat surface.