Aerospace oversized memory cache board
Through the design of the Aerospace super-large memory cache board, the existing 3U single-board structure is used to expand the memory capacity, the problem of insufficient memory capacity of micro satellites is solved, efficient space utilization and heat dissipation requirements are achieved, and R&D and launch costs are reduced.
Patent Information
- Application Number
- CN202422309257.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-20
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-20
AI Technical Summary
The data storage hardware of traditional microsatellite integrated electronics MSATA disk has a small memory capacity. Increasing the number of cache boards to achieve super large memory will occupy a large amount of space resources, reduce resource utilization and increase launch costs.
The aerospace super-large memory cache board design includes cold board, circuit board, cover, memory device and thermal conduction device. The memory device is connected to the circuit board through U-shaped parts. The thermal conduction device transmits the heat from the memory stick to the cold board, and uses the existing 3U single board structure to expand the memory capacity and improve space utilization.
Without increasing the number of cache boards, the memory capacity will be greatly improved, the space utilization will be improved, the heat dissipation and weight requirements will be met, and the R&D and launch costs will be saved.
Smart Images
Figure CN223123419U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of data storage, in particular to an aerospace ultra-large memory buffer board. Background Art
[0002] The buffer board of the integrated electronics of a microsatellite undertakes the task of storing the on-board data of the whole satellite. It is an important data storage platform for microsatellites and an indispensable part of the whole satellite. According to different satellite tasks, the memory size of the buffer board is also different. Especially for some DRO satellites or SAR satellites, the data volume is extremely large and complex. The traditional data storage of the integrated electronics of microsatellites is to design one or two MSATA disks in the buffer board to store the data of the whole on-board module.
[0003] With the rapid development of commercial aerospace, the demand for the memory capacity of microsatellites is gradually increasing. The main hardware for the traditional data storage of the integrated electronics of microsatellites is the MSATA disk. The MSATA disk generates low heat, but has a small memory capacity. If ultra-large memory is to be achieved, the number of buffer boards must be increased significantly, resulting in a large occupation of the space resources of the microsatellite, reducing the utilization rate of scarce resources such as volume and mass, and also increasing the launch cost. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an aerospace ultra-large memory buffer board with a large memory capacity and high space utilization rate.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] An aerospace ultra-large memory buffer board includes a cold plate, a circuit board, a cover body, a memory device and a heat conduction device. The circuit board is clamped between the cold plate and the cover body, and both sides of the cover body in the length direction are connected to the cold plate. The memory device includes a U-shaped part and a memory module. The U-shaped part penetrates through the cover body and is connected to the circuit board. The U-shaped part is arranged on one side of the cover body in the length direction, and the memory module is clamped at both ends of the U-shaped part in the length direction. The heat conduction device is installed on the cover body and is attached to the memory module to conduct the heat generated by the memory module to the cold plate through the cover body.
[0007] Preferably, the heat conduction device includes a heat dissipation part. The heat dissipation part includes two plate parts installed on the cover body. The U-shaped part and the memory module clamped by it are both clamped between the two plate parts, and the two plate parts are attached to both sides of the memory module in the width direction.
[0008] Preferably, the memory device comprises two U-shaped parts and two memory bars, the two U-shaped parts respectively penetrate through both sides of the cover in the length direction, and the two memory bars are respectively clamped at both ends of the two U-shaped parts in the length direction.
[0009] Preferably, the cold plate includes a connected connecting portion, a first heat conducting portion and a second heat conducting portion, the first heat conducting portion and the second heat conducting portion are respectively arranged on both sides of the connecting portion in a width direction, and the longitudinal section of the cold plate is convex-shaped, and the circuit board is clamped between the connecting portion and the cover body.
[0010] Preferably, the cover body includes a cover portion, a first L-shaped plate and a second L-shaped plate, the first L-shaped plate and the second L-shaped plate are respectively arranged on both sides of the connecting portion in the width direction, the circuit board is clamped between the connecting portion and the cover portion, the first L-shaped plate includes a first plate and a second plate that are connected and arranged in an L shape, the first plate extends along the outer side of the circuit board to the connecting portion, and the first plate is attached to the connecting portion, the second plate is connected to the end surface of the first heat-conducting portion, the second L-shaped plate includes a third plate and a fourth plate that are connected and arranged in an L shape, the third plate extends along the outer side of the circuit board to the connecting portion, and the third plate is attached to the connecting portion, and the fourth plate is connected to the end surface of the second heat-conducting portion.
[0011] Preferably, a first slot is provided on the top of the first heat conducting part along its length direction, and the second plate abuts and is connected to the bottom of the first slot; a second slot is provided on the top of the second heat conducting part along its length direction, and the fourth plate abuts and is connected to the bottom of the second slot.
[0012] Preferably, the first slot extends from a side of the first heat conducting part away from the connecting part to the first heat conducting part, the second plate covers the bottom of the first slot, the second slot extends from a side of the second heat conducting part away from the connecting part to the second heat conducting part, and the fourth plate covers the bottom of the second slot.
[0013] Preferably, the second plate is provided with a plurality of first connection holes at intervals along its length direction, countersunk screws pass through the first connection holes and are screwed to the first heat conducting part, and the fourth plate is provided with a plurality of second connection holes at intervals along its length direction, countersunk screws pass through the second connection holes and are screwed to the second heat conducting part.
[0014] Preferably, two elongated holes are respectively provided on both sides of the cover in the length direction, and the two U-shaped members are respectively inserted into the two elongated holes and connected to the circuit board.
[0015] Preferably, a connector is provided at one end of the circuit board in the width direction.
[0016] Advantages of the utility model:
[0017] The utility model provides a super-large memory cache board for aerospace, which includes a cold plate, a circuit board, a cover body, a memory device and a heat conduction device. The circuit board is clamped between the cold plate and the cover body, and both sides of the cover body in the length direction are connected to the cold plate. The memory device includes a U-shaped part and a memory strip. The U-shaped part penetrates through the cover body and is connected to the circuit board. The U-shaped part is arranged on one side of the cover body in the length direction, and the memory strips are clamped at both ends of the U-shaped part in the length direction. The heat conduction device is installed on the cover body and is attached to the memory strips to conduct the heat generated by the memory strips to the cold plate through the cover body. The super-large memory cache board for aerospace provided by the utility model greatly improves the memory capacity and space utilization rate without increasing the number of cache boards. Description of the drawings
[0018] Figure 1 is a schematic structural diagram of a super-large memory cache board for aerospace provided by an embodiment of the utility model;
[0019] Figure 2 is a schematic structural diagram of a circuit board and a connector provided by an embodiment of the utility model;
[0020] Figure 3 is a schematic structural diagram of a memory device provided by an embodiment of the utility model;
[0021] Figure 4 is a schematic structural diagram of a cover body provided by an embodiment of the utility model;
[0022] Figure 5 is a schematic structural diagram of a first L-shaped plate and a second L-shaped plate provided by an embodiment of the utility model;
[0023] Figure 6 is a schematic structural diagram of a heat dissipation part provided by an embodiment of the utility model;
[0024] Figure 7 is a schematic structural diagram of a cold plate provided by an embodiment of the utility model.
[0025] In the figure:
[0026] 1, cold plate; 11, connecting part; 12, first heat conduction part; 121, first card slot; 13, second heat conduction part; 131, second card slot; 2, circuit board; 3, cover body; 31, covering part; 311, long hole; 32, first L-shaped plate; 321, first plate; 322, second plate; 3221, first connection hole; 33, second L-shaped plate; 331, third plate; 332, fourth plate; 3321, second connection hole; 4, memory device; 41, memory strip; 42, U-shaped part; 5, heat dissipation part; 51, plate part; 6, countersunk head screw; 7, connector. Detailed implementation mode
[0027] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the sake of description, only the parts related to the present utility model are shown in the drawings, rather than all the structures.
[0028] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0029] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.
[0030] In the description of this embodiment, the orientation or positional relationship terms such as "above", "below", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.
[0031] This embodiment provides an aerospace ultra-large memory cache board, which has a large memory capacity on the one hand, is compact in structure and high in space utilization on the other hand, and can also meet the heat dissipation requirements and weight requirements.
[0032] Please refer to Figures 1-7, a super-large memory cache board for aerospace includes a cold plate 1, a circuit board 2, a cover 3, a memory device 4 and a heat conduction device. The circuit board 2 is clamped between the cold plate 1 and the cover 3. The two sides in the length direction of the cover 3 are connected to the cold plate 1. The memory device 4 and the heat conduction device are both arranged on the cover 3. The memory device 4 includes a memory module 41 with a large storage capacity, which can meet the requirements. The heat conduction device is used to conduct the heat generated by the memory module 41 to the cold plate 1 through the cover 3, and the cold plate 1 exports the heat to the electronics chassis and the satellite. On the basis of the existing 3U single board, the space is fully utilized to form a super-large memory, and the heat dissipation requirements can also be met.
[0033] Preferably, please refer to Figure 2 , a connector 7 is arranged at one end in the width direction of the circuit board 2 for connecting the power supply and other electronic devices.
[0034] Optionally, due to the advantages of low density, high stiffness and good machining accuracy of the aluminum alloy material, the cover 3 is made of the aluminum alloy material.
[0035] Specifically, please refer to Figure 3 , the memory device 4 includes a U-shaped part 42 and a memory module 41. The U-shaped part 42 is arranged on one side in the length direction of the cover 3, and the U-shaped part 42 penetrates through the cover 3 and is further connected to the circuit board 2. Slots are arranged on both opposite sides at the two ends in the length direction of the U-shaped part 42, and the two ends in the length direction of the memory module 41 are respectively clamped in the slots at the two ends of the U-shaped part 42, thereby realizing the fixation of the memory module 41.
[0036] Optionally, please continue to refer to Figure 1 and Figure 3 , the memory device 4 includes two U-shaped parts 42 and two memory modules 41. The two U-shaped parts 42 respectively penetrate through the two sides in the length direction of the cover 3. The two memory modules 41 correspond to the two U-shaped parts 42 one by one. The two ends in the length direction of the two memory modules 41 are respectively clamped in the slots at the two ends of the two U-shaped parts 42, further increasing the memory capacity and realizing a super-large memory on the basis of the existing 3U single board.
[0037] Preferably, please refer to Figure 4 , two long holes 311 are respectively arranged on the two sides in the length direction of the cover 3. The two long holes 311 are arranged along the length direction of the cover 3 to accommodate large-size memory modules 41. The two U-shaped parts 42 respectively pass through the two long holes 311 and are connected to the circuit board 2.
[0038] Furthermore, please refer to Figure 1 and Figure 6, the heat conduction device includes a heat dissipation member 5, and the heat dissipation member 5 includes two plate members 51. The two plate members 51 are spaced apart along the length direction of the cover body 3 and installed on the top of the cover body 3. One set of corresponding U-shaped members 42 and the memory modules 41 clamped by them are both clamped between the two plate members 51. The two plate members 51 are attached to both sides of the memory module 41 in the width direction to increase the contact area with the memory module 41 and improve the heat transfer efficiency.
[0039] Adaptively, the heat conduction device includes two heat dissipation members 5. Each heat dissipation member 5 includes two plate members 51. The two plate members 51 of one set of heat dissipation members 5 are spaced apart along the length direction of the cover body 3 and installed on one side of the top of the cover body 3 in the length direction. One set of corresponding U-shaped members 42 and the memory modules 41 clamped by them are both clamped between the two plate members 51. The two plate members 51 of the other set of heat dissipation members 5 are spaced apart along the length direction of the cover body 3 and installed on the other side of the top of the cover body 3 in the length direction. The other set of corresponding U-shaped members 42 and the memory modules 41 clamped by them are both clamped between the two plate members 51.
[0040] Preferably, according to the different heat dissipation requirements for different power consumptions of the memory module 41, it can be flexibly designed. Near the position where the memory module 41 generates more heat, that is, near the position where heat dissipation needs to be strengthened, a partial area of the two plate members 51 attached to this position is set as a solid structure. The position where less heat is generated has lower heat dissipation requirements, and the outer side of a partial area of the two plate members 51 attached to this position is set as a hollow structure or thinned to meet the weight requirements.
[0041] Further preferably, the plate member 51 has four ends, and connection blocks are provided at the four corners on the opposite side of the two plate members 51. The two opposite connection blocks are connected by bolts to strengthen the structure.
[0042] Furthermore, in this embodiment, both sides of the cover body 3 in the length direction are respectively attached to and connected to both sides of the cold plate 1 in the length direction to expand the contact area between the cover body 3 and the cold plate 1 and improve the heat transfer efficiency of the memory module 41 while ensuring the normal temperature of the circuit board 2.
[0043] Specifically, please refer to Figure 1 and Figure 7, the cold plate 1 includes a connecting portion 11, a first heat conducting portion 12 and a second heat conducting portion 13 which are connected. The first heat conducting portion 12 and the second heat conducting portion 13 are respectively connected to two sides of the connecting portion 11 in the width direction, and both the first heat conducting portion 12 and the second heat conducting portion 13 are connected to the lower position of the connecting portion 11, so that the longitudinal section of the cold plate 1 is convex-shaped. Through the above structural arrangement, the circuit board 2 can be clamped between the connecting portion 11 and the cover body 3, and two sides of the cover body 3 in the length direction can be respectively connected to the first heat conducting portion 12 and the second heat conducting portion 13, so as to enable the cover body 3 to directly conduct heat to the first connecting portion 11 and the second connecting portion 11, and control the heat to be conducted to the circuit board 2 through the connecting portion 11.
[0044] Further, please refer to Fig. 4 and Figure 5 , the cover body 3 includes a covering portion 31, a first L-shaped plate 32 and a second L-shaped plate 33. The first L-shaped plate 32 and the second L-shaped plate 33 are respectively arranged on two sides of the connecting portion 11 in the width direction. Through the above structural arrangement, the circuit board 2 can be clamped between the connecting portion 11 and the covering portion 31, and the first L-shaped plate 32 and the second L-shaped plate 33 can be respectively connected to the first heat conducting portion 12 and the second heat conducting portion 13.
[0045] Preferably, the first L-shaped plate 32 includes a first plate 321 and a second plate 322 which are connected and arranged in an L-shape. The first plate 321 extends along the outer side of the circuit board 2 to the junction of the connecting portion 11 and the first heat conducting portion 12, and the second plate 322 is connected to the end face of the first heat conducting portion 12. Optionally, the first plate 321 is attached to the connecting portion 11. The second L-shaped plate 33 includes a third plate 331 and a fourth plate 332 which are connected and arranged in an L-shape. The third plate 331 extends along the outer side of the circuit board 2 to the junction of the connecting portion 11 and the second heat conducting portion 13, and the fourth plate 332 is connected to the end face of the second heat conducting portion 13. Optionally, the third plate 331 is attached to the connecting portion 11.
[0046] Further, please continue to refer to Figure 7 , a first card slot 121 is provided along the length direction at the top of the first heat conducting portion 12, the second plate 322 abuts against and is connected to the bottom of the first card slot 121. A second card slot 131 is provided along the length direction at the top of the second heat conducting portion 13, and the fourth plate 332 abuts against and is connected to the bottom of the second card slot 131. By providing the first card slot 121 and the second card slot 131, the second plate 322 and the fourth plate 332 can be clamped and connected.
[0047] To further improve the heat transfer efficiency, the first slot 121 in this embodiment extends from the side of the first heat conducting portion 12 away from the connecting portion 11 to the first heat conducting portion 12, and the second plate 322 covers the bottom of the first slot 121, thereby expanding the area of the first slot 121 and thus expanding the contact area between the second plate 322 and the first slot 121. Similarly, the second slot 131 extends from the side of the second heat conducting portion 13 away from the connecting portion 11 to the second heat conducting portion 13, and the fourth plate 332 covers the bottom of the second slot 131, thereby expanding the area of the second slot 131 and thus expanding the contact area between the fourth plate 332 and the second slot 131.
[0048] For example, the second plate 322 is provided with a plurality of first connection holes 3221 at intervals along its length direction, and the fourth plate 332 is provided with a plurality of second connection holes 3321 at intervals along its length direction. Countersunk screws are passed through the first connection holes 3221 one by one and screwed to the first heat conducting part 12, and countersunk screws are passed through the second connection holes 3321 one by one and screwed to the second heat conducting part 13. The second plate 322 and the fourth plate 332 are respectively stably connected to the first card slot 121 and the second card slot 131, and are fit together.
[0049] Preferably, this embodiment uses 2-M2.5*6 cross countersunk screws.
[0050] This embodiment utilizes the existing standard 3U board structure in electronics, which greatly increases the memory capacity and space utilization without increasing the number of cache boards. It can also meet the heat dissipation and weight requirements, and saves R&D and launch costs.
[0051] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.
Claims
1. An aerospace ultra-large memory cache board, characterized in that, It includes a cold plate (1), a circuit board (2), a cover (3), a memory device (4) and a heat conduction device. The circuit board (2) is clamped between the cold plate (1) and the cover (3), and both sides in the length direction of the cover (3) are connected to the cold plate (1). The memory device (4) includes a U-shaped part (42) and a memory module (41). The U-shaped part (42) penetrates through the cover (3) and is connected to the circuit board (2). The U-shaped part (42) is arranged on one side in the length direction of the cover (3). The memory module (41) is clamped at both ends in the length direction of the U-shaped part (42). The heat conduction device is installed on the cover (3), and the heat conduction device is attached to the memory module (41) for conducting the heat generated by the memory module (41) to the cold plate (1) through the cover (3).
2. The super-large memory cache board for aerospace according to claim 1, characterized in that, The heat conduction device includes a heat dissipation part (5). The heat dissipation part (5) includes two plate parts (51) installed on the cover (3). The U-shaped part (42) and the memory module (41) clamped by it are both clamped between the two plate parts (51), and the two plate parts (51) are attached to both sides in the width direction of the memory module (41).
3. An aerospace ultra-large memory cache board according to claim 1, characterized in that, The memory device (4) includes two U-shaped parts (42) and two memory modules (41). The two U-shaped parts (42) respectively penetrate through both sides in the length direction of the cover (3), and the two memory modules (41) are respectively clamped at both ends in the length direction of the two U-shaped parts (42).
4. A space super-large memory cache board according to claim 1, characterized in that, The cold plate (1) includes a connecting part (11), a first heat conduction part (12) and a second heat conduction part (13) which are connected. The first heat conduction part (12) and the second heat conduction part (13) are respectively arranged on both sides in the width direction of the connecting part (11), and the longitudinal section of the cold plate (1) is in a convex shape. The circuit board (2) is clamped between the connecting part (11) and the cover (3).
5. The super-large memory cache board for aerospace according to claim 4, characterized in that, The cover (3) includes a covering part (31), a first L-shaped plate (32) and a second L-shaped plate (33). The first L-shaped plate (32) and the second L-shaped plate (33) are respectively arranged on both sides in the width direction of the connecting part (11). The circuit board (2) is clamped between the connecting part (11) and the covering part (31). The first L-shaped plate (32) includes a first plate (321) and a second plate (322) which are connected and arranged in an L shape. The first plate (321) extends along the outside of the circuit board (2) to the connecting part (11), and the first plate (321) is attached to the connecting part (11). The second plate (322) is connected to the end face of the first heat conduction part (12). The second L-shaped plate (33) includes a third plate (331) and a fourth plate (332) which are connected and arranged in an L shape. The third plate (331) extends along the outside of the circuit board (2) to the connecting part (11), and the third plate (331) is attached to the connecting part (11). The fourth plate (332) is connected to the end face of the second heat conduction part (13).
6. The super-large memory cache board for aerospace according to claim 5, characterized in that A first card slot (121) is provided at the top of the first heat conducting portion (12) along its length direction, and the second plate (322) abuts against and is connected to the bottom of the first card slot (121); a second card slot (131) is provided at the top of the second heat conducting portion (13) along its length direction, and the fourth plate (332) abuts against and is connected to the bottom of the second card slot (131).
7. An aerospace ultra-large memory cache board according to claim 6, characterized in that, The first card slot (121) extends from a side of the first heat conducting portion (12) away from the connecting portion (11) to the first heat conducting portion (12), the second plate (322) covers the bottom of the first card slot (121), the second card slot (131) extends from a side of the second heat conducting portion (13) away from the connecting portion (11) to the second heat conducting portion (13), and the fourth plate (332) covers the bottom of the second card slot (131).
8. The super-large memory cache board for aerospace according to claim 5, characterized in that, The second plate (322) is provided with a plurality of first connection holes (3221) at intervals along its length direction, and countersunk screws pass through the first connection holes (3221) and are screwed to the first heat conducting part (12); the fourth plate (332) is provided with a plurality of second connection holes (3321) at intervals along its length direction, and countersunk screws pass through the second connection holes (3321) and are screwed to the second heat conducting part (13).
9. A spaceflight ultra-large memory cache board according to any one of claims 1-8, characterized in that Two elongated holes (311) are respectively provided on both sides of the cover body (3) in the length direction, and the two U-shaped members (42) are respectively inserted into the two elongated holes (311) and connected to the circuit board (2).
10. A space super-large memory cache board according to any one of claims 1-8, characterized in that, A connector (7) is provided at one end of the circuit board (2) in the width direction.