Inductance module for heat dissipation, power supply module and electronic equipment

Abstract

The utility model relates to the technical field of electronic circuit heat dissipation, in particular to an inductance module for heat dissipation, a power supply module and electronic equipment, which comprise a shell, at least one magnetic coil, a heat transfer part and a heat dissipation part, the heat transfer part and the heat dissipation part are arranged at the two ends of the shell, and the magnetic coil is arranged in the shell; heat dissipation grooves are formed in the upper surface and / or the lower surface of the magnetic coil; the heat transfer part is used for absorbing heat generated by a power device in the power supply module, the heat dissipation groove is used for transmitting the heat to the heat dissipation part, the inductance module of the power supply module is improved, and the heat dissipation groove is formed in the outer surface of the magnetic coil of the inductance module, so that the heat dissipation effect is further enhanced, and different shape requirements can be met; on the basis that the space of the power supply module is not increased, the heat dissipation efficiency of the whole power supply module is improved, and the requirement of the high-power and high-density power supply module for heat dissipation is met.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuit heat dissipation, in particular to an inductor module, a power supply module and an electronic device for heat dissipation. Background Art

[0002] A high power density power supply module is a power supply device with a small volume but capable of outputting a high power. Through advanced designs and technologies, it can achieve high power output within a limited space, thereby reducing the overall size and providing a large amount of electric power to meet the needs of various devices or systems. It is commonly used in situations with strict space requirements and high power demands, such as aerospace, communication equipment, electric vehicles, and other fields. For example, in some miniaturized electronic devices, a high power density power supply module can provide sufficient power support without increasing too much volume; in electric vehicles, it helps to save space and improve the overall performance of the vehicle. The high power density power supply module is the result of the continuous development and innovation of power supply technology, providing important support for the miniaturization and high performance of devices.

[0003] Due to the requirements of specific products for high power density, the space of the power supply module is compressed very small, which leads to the following heat dissipation problems: a large amount of heat generated in the limited space is difficult to quickly dissipate, easily forming local heat accumulation and causing the temperature to rise rapidly; the distance between closely arranged devices is relatively close, the heat conduction path is blocked, and the heat is difficult to effectively transfer to the heat dissipation structure; in some high power density power supply modules, there may also be local overheating, resulting in a decline in device performance, shortened lifespan, or even damage.

[0004] In view of this, overcoming the defects of this prior art is an urgent problem to be solved in this technical field. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is how to solve the problem of poor heat dissipation effect of the high power density power supply module.

[0006] The utility model adopts the following technical solutions:

[0007] In a first aspect, there is provided an inductor module for heat dissipation, including: a housing 1, at least one magnetic coil 2, a heat transfer part 3, and a heat dissipation part 4; the heat transfer part 3 and the heat dissipation part 4 are arranged at both ends of the housing 1, and the magnetic coil 2 is arranged inside the housing 1; heat dissipation grooves 5 are formed on the upper surface and / or the lower surface of the magnetic coil 2;

[0008] The heat transfer part 3 is used to absorb the heat generated by the power devices in the power supply module, and the heat dissipation grooves 5 are used to transfer the heat to the heat dissipation part 4.

[0009] Preferably, a gap 6 is provided between the magnetic coils 2, and the gap 6 is filled with a heat-conducting material, which is one or more of a heat-conducting silica gel sheet, heat-conducting silicone grease, and heat-conducting mud.

[0010] Preferably, a heat dissipation part 4 is provided on the side of the housing 1, and the heat dissipation part 4 includes air-cooled heat dissipation, water-cooled heat dissipation, liquid-cooled heat dissipation, and / or graphite heat dissipation.

[0011] Preferably, the cross-sectional shape of the heat dissipation groove 5 is one or more of square, semi-circular, arc-shaped, or trapezoidal.

[0012] Preferably, the magnetic coil 2 includes a magnetic core and a coil wound on the surface of the magnetic core.

[0013] Preferably, the heat transfer part 3 is provided below the lowermost magnetic coil 2, and a heat-conducting material is filled between the heat transfer part 3 and the lowermost magnetic coil 2.

[0014] Preferably, the heat dissipation part 4 is provided above the uppermost magnetic coil 2, and a heat-conducting material is filled between the heat dissipation part 4 and the uppermost magnetic coil 2.

[0015] In a second aspect, a power supply module is provided, including: a circuit board 7, a power device 8, and the inductor module as described in the first aspect; the circuit board 7 is provided below the heat transfer part 3, and the power device 8 is provided below the circuit board 7;

[0016] The heat transfer part 3 of the inductor module is used to absorb the heat generated by the power device 8.

[0017] Preferably, the inductor module is electrically connected to the circuit board 7, and the power device 8 is electrically connected to the circuit board 7;

[0018] The power device 8 is located within the projected area of the inductor module on the circuit board 7.

[0019] In a third aspect, an electronic device is provided, including: a chassis, a main board, and the power supply module as described in the second aspect, the power supply module is provided on the main board, and the main board is provided within the chassis.

[0020] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0021] The present utility model improves the inductor module of the power supply module, opens heat dissipation grooves 5 on the outer surface of the magnetic coil 2 of the inductor module, further enhances the heat dissipation effect, can adapt to different shape requirements, improves the heat dissipation efficiency of the overall power supply module without increasing the space of the power supply module, and meets the heat dissipation requirements of high-power and high-density power supply modules. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0023] Figure 1 It is a schematic structural diagram of an inductance module provided by an embodiment of the present invention;

[0024] Figure 2 It is another schematic structural diagram of an inductance module provided by an embodiment of the present invention;

[0025] Figure 3 It is a schematic structural diagram of the magnetic coil 2 of an inductance module provided by an embodiment of the present invention;

[0026] Figure 4 It is another schematic structural diagram of the magnetic coil 2 of an inductance module provided by an embodiment of the present invention;

[0027] Figure 5 It is a schematic structural diagram of a power supply module provided by an embodiment of the present invention;

[0028] Figure 6 It is a schematic structural diagram of an electronic device provided by an embodiment of the present invention.

[0029] In all the accompanying drawings, the same reference numerals represent the same structure, where:

[0030] Housing 1, magnetic coil 2, heat transfer part 3, heat dissipation part 4, heat dissipation groove 5, gap 6, circuit board 7, power device 8. Detailed implementation manners

[0031] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further details the present invention in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0032] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, i.e., "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples", etc., are intended to indicate that a specific feature, structure, material, or characteristic related to the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, however, it is not limited that they can be carried by one embodiment or example in a combined manner.

[0033] In the description of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, for example, in the description, for the same type of nouns, the method of adding "A" and "B" at the end is used to describe them as two independent individuals. In this case, the features defined with "A" and "B" are only used for the purpose of distinguishing the same type of individuals and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0034] When describing some embodiments, the expressions "coupled", "coupled to", and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components have direct physical contact or electrical contact with each other. Another example is that when describing some embodiments, the term "coupled" may be used to indicate that two or more components have direct physical contact or electrical contact. However, the term "connected" or "coupled" may also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed herein are not necessarily limited to the content of the present utility model.

[0035] In addition, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0036] Embodiment 1:

[0037] A large amount of heat generated within the limited space of a high-power density power module is difficult to dissipate quickly, easily forming local heat accumulation, causing the temperature to rise rapidly, obstructing the heat conduction path, making it difficult for the heat to be effectively transferred to the heat dissipation structure, and local overheating will lead to a decline in device performance, shortened lifespan, and even damage.

[0038] To solve the aforementioned problems, without additionally increasing heat dissipation components, the embodiments of the present utility model improve the inductance module that already exists in the power module and has an electrical connection with the power device, and provide an inductance module for heat dissipation, as Figure 1 shown, including: a housing 1, at least one magnetic coil 2, a heat transfer part 3, and a heat dissipation part 4; the heat transfer part 3 and the heat dissipation part 4 are arranged at both ends of the housing 1, and the magnetic coil 2 is arranged inside the housing 1; heat dissipation grooves 5 are formed on the upper surface and / or the lower surface of the magnetic coil 2; the heat transfer part 3 is used to absorb the heat generated by the power device in the power module, and the heat dissipation grooves 5 are used to transfer the heat to the heat dissipation part 4.

[0039] Among them, the inductance module has two specific functions in the power module: on the one hand, from the perspective of the electrical function of the circuit, the inductance module stores and releases the energy converted by the power device, and slows down the current mutation caused by the energy conversion, making the power more stable during the energy conversion process. The specific filtering method is not elaborated too much in this embodiment; on the other hand, from a structural perspective, since a large amount of heat is generated by the power device when the power module is running, the heat can be dissipated through the inductance module.

[0040] The housing 1 is used to protect the internal components of the inductance module and provides an installation structure for the magnetic coil 2 and other devices. It is usually made of a material with good heat conduction performance, such as metal, to promote heat conduction. The magnetic coil 2 is the core part of the inductance module, and the magnetic coil 2 includes a magnetic core and a coil wound around the surface of the magnetic core.

[0041] In one embodiment, the magnetic coil 2 is used to generate an electromagnetic field to achieve the conversion of electrical energy and magnetic energy, and the corresponding number of magnetic coils 2 is set according to the function and effect of the inductance module. When there are multiple magnetic coils 2 in the inductance module, referring to Figure 1 , a gap 6 is provided between the magnetic coils 2, and the gap 6 is filled with a heat-conducting material. The heat-conducting material is one or more of a heat-conducting silica gel sheet, heat-conducting silicone grease, and heat-conducting clay. Providing a gap 6 between the magnetic coils 2 and filling the gap 6 with a heat-conducting material can improve the overall heat dissipation performance of the inductance module. This design allows heat to be transferred more effectively between the magnetic coils 2, thereby maintaining the temperature of the module within a reasonable range and ensuring the stable operation and lifespan of the device.

[0042] The thermal conductive silicone sheet is a soft and elastic thermal management material that can fill the gap 6 between the magnetic coils 2, or between the magnetic coil 2, the heat dissipation part 4 and the heat transfer part 3, effectively conduct heat, and at the same time can play the role of insulation and shock absorption. It is easy to install and can quickly adapt to components of different shapes, but it may not be as heat-resistant as other materials. The thermal conductive silicone grease is a highly thermally conductive insulating silicone material with low oil separation, high and low temperature resistance, water resistance, ozone resistance, and weather aging resistance. It can maintain the grease state during use for a long time within a wide temperature range and is suitable for heat dissipation and insulation between the heating body and the heat dissipation body in various instruments, meters, electronics, and electrical appliances. The thermal conductive silicone grease has good thixotropy, moderate consistency, is easy to use, and the coating or potting process is simple. The thermal conductive paste is usually a material with a relatively high thermal conductivity and is suitable for applications that require higher heat conduction performance. It has a higher consistency and can fill larger gaps 6, but it may not be as easy to construct as the thermal conductive silicone sheet and the thermal conductive silicone grease.

[0043] The thermal conductivities of different materials are different. Materials with higher thermal conductivities can be selected to improve the heat conduction efficiency. The workability of the material affects the installation efficiency and sealing effect, and at the same time the cost of the material will play an important role in the design. In actual applications, one or more thermal conductive materials may need to be selected to fill the gap 6 between the magnetic coils 2 according to specific thermal management requirements and cost considerations to achieve the best heat conduction effect. More specific details are not elaborated in this embodiment.

[0044] In one embodiment, as Figure 2 shown, in order to dissipate heat better, a heat dissipation part 4 can also be provided on the side of the housing 1. The heat dissipation part 4 includes air cooling, water cooling, liquid cooling, and / or graphite cooling. The heat dissipation grooves 5 are evenly arranged on the upper and lower surfaces of the magnetic coil 2. These heat dissipation grooves 5 help to improve the heat conduction efficiency and enable heat to be quickly dissipated from the heat source (such as the power device in the power module). The number and size of the heat dissipation grooves 5 on each magnetic coil 2 are not specifically limited in this embodiment. In one embodiment, the cross-sectional shape of the heat dissipation groove 5 is one or more of square, semi-circular, arc-shaped, or trapezoidal. Among them, Figure 3 shown is the square heat dissipation groove 5, Figure 4Shown is a semi-circular heat dissipation groove 5. Square heat dissipation grooves 5 can provide a large surface area, which helps to improve the heat dissipation efficiency. They have a simple structure and are easy to manufacture and process. However, square heat dissipation grooves 5 may have limitations in air flow because their edges may block the air flow. Semi-circular heat dissipation grooves 5 have a uniform heat dissipation area, which can promote heat dissipation in all directions, have less resistance to air flow, and help to improve the air circulation efficiency. However, the processing of semi-circular heat dissipation grooves 5 may be more complex than that of square ones and may require more precise manufacturing processes. In addition to square and circular shapes, heat dissipation grooves 5 can also be designed into other shapes, such as irregular shapes, to meet specific heat dissipation requirements or optimize the heat conduction path. In practical applications, it may be necessary to test the heat dissipation performance of heat dissipation grooves 5 with different shapes through experiments and simulations to determine the optimal shape design of heat dissipation grooves 5. In addition, the shape and size of heat dissipation grooves 5 should also be coordinated with the designs of other components (such as fans, heat sinks, etc.) to achieve the best heat dissipation effect.

[0045] In one embodiment, the heat transfer part 3 is arranged below the bottommost magnetic coil 2, and a heat-conducting material is filled between the heat transfer part 3 and the bottommost magnetic coil 2. The heat dissipation part 4 is arranged above the topmost magnetic coil 2, and a heat-conducting material is filled between the heat dissipation part 4 and the topmost magnetic coil 2. The heat transfer part 3 is located at one end of the inductor module and is used to directly absorb the heat generated by the power device 8 in the power module and transfer the heat to the heat dissipation groove 5 on the magnetic coil 2 through heat conduction. The heat dissipation part 4 is located at the other end of the inductor module, and its function is to receive the heat transferred from the heat dissipation groove 5 of the magnetic coil 2. The heat dissipation part 4 is usually designed with a more spacious heat dissipation area, such as the shape of a heat sink, fins or other structures that enhance heat dissipation, so as to effectively dissipate the heat to the external environment. More specific details are not elaborated in this embodiment.

[0046] In this embodiment, the designs of the heat transfer part 3 and the heat dissipation part 4 are for optimizing the thermal management of the magnetic coil 2 module. By arranging the heat transfer part 3 and the heat dissipation part 4 between the magnetic coils 2, the heat generated by the magnetic coil 2 can be effectively controlled, ensuring that the temperature of the magnetic coil 2 module is maintained within a reasonable range, thereby ensuring the stable operation and lifespan of the device.

[0047] The inductor module is specifically designed for efficient heat dissipation to address the thermal management challenges in high power density applications. By integrating the heat dissipation function into its own structure, the inductor module improves the heat conduction efficiency and helps to maintain the compact design of the power module. With this design, the inductor module can effectively manage the large amount of heat generated in the power module, prevent local overheating, thereby extending the lifespan of the device and maintaining its stable operation. This inductor module with an integrated heat dissipation design has broad application potential in electric vehicles, servers, renewable energy conversion systems, and other electronic devices that require efficient thermal management.

[0048] In this embodiment, heat dissipation grooves 5 are provided on the outer surface of the magnetic coil 2, further enhancing the heat dissipation effect. It can adapt to different shape requirements. Without increasing the space of the power module, the overall heat dissipation efficiency of the power module is improved, meeting the heat dissipation requirements of high-power and high-density power modules.

[0049] Embodiment 2:

[0050] An inductance module was proposed in Embodiment 1. In this embodiment, a power module will be proposed, as Figure 5 shown, the power module includes: a circuit board 7, a power device 8, and the inductance module as described in Embodiment 1; the circuit board 7 is disposed below the heat transfer portion 3, and the power device 8 is disposed below the circuit board 7; the heat transfer portion 3 of the inductance module is used to absorb the heat generated by the power device 8.

[0051] Among them, Figure 5 the heat dissipation grooves are shown taking the square as an example. In other embodiments, they can also be of other shapes. The circuit board 7 can be a printed circuit board (abbreviated as PCB). When the power device 8 is working, heat will be transferred to the heat transfer portion 3 of the inductance module through the heat conduction medium in the circuit board 7. The heat conduction medium in the circuit board 7 may be a heat conduction coating, a heat conduction pad, or other heat conduction materials, which help the heat transfer between the circuit board 7 and the inductance module. The advantage of this design is that the heat can be effectively transferred from the power device 8 to the heat transfer portion 3 of the inductance module, and then through the transfer of the heat dissipation grooves 5 on the magnetic coil 2 in the inductance module, the heat is dissipated to the external environment through the heat dissipation portion 4 of the inductance module. Such a thermal management design helps to keep the temperature of the power module within a controllable range, prevent overheating, and thus improve the efficiency and lifespan of the power module.

[0052] In one embodiment, the inductance module is electrically connected to the circuit board 7, and the power device 8 is electrically connected to the circuit board 7; the power device 8 is located within the projected area of the inductance module on the circuit board 7.

[0053] Among them, the circuit board 7 plays the role of connecting the inductor module and the power device 8, enabling them to work together in the power supply module. In addition, the power device 8 is located within the projected area of the inductor module on the circuit board 7, which can reduce the space occupied on the circuit board 7, thus achieving a more compact design of the power supply module. At the same time, it is helpful for heat management because the heat generated by the power device 8 can be directly transferred to the inductor module and dissipated through the heat transfer part 3 and the heat dissipation part 4. This layout helps to optimize the electrical performance because the close electrical connection between the power device 8 and the inductor module can reduce the line length, lower the resistance and inductance, thereby improving the efficiency of the power supply module. By transmitting heat from the heat conducting medium inside the circuit board 7 to the heat transfer part 3 at the bottom of the inductor module, reasonable conduction and dispersion of heat are achieved, avoiding local overheating, and reducing the risk of device performance degradation, shortened lifespan, or even damage.

[0054] For the specific structure of the inductor module, refer to Embodiment 1, which will not be elaborated in this embodiment.

[0055] Embodiment 3:

[0056] Based on the power supply module proposed in Embodiment 2, an electronic device is proposed in this embodiment, such as Figure 6 As shown, the electronic device includes: a chassis, a main board, and the power supply module as described in Embodiment 2.

[0057] Among them, the power supply module is arranged on the main board, and the main board is arranged inside the chassis. The power supply module is electrically connected to the main board, and the power supply module is used to supply power to the main board.

[0058] For the specific structure of the power supply module, refer to Embodiment 2, which will not be elaborated in this embodiment.

[0059] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An inductance module for heat dissipation, characterized in that, Comprising: A housing (1), at least one magnetic coil (2), a heat transfer part (3), and a heat dissipation part (4); the heat transfer part (3) and the heat dissipation part (4) are arranged at two ends of the housing (1), and the magnetic coil (2) is arranged inside the housing (1); heat dissipation grooves (5) are formed on the upper surface and / or the lower surface of the magnetic coil (2); The heat transfer part (3) is used for absorbing the heat generated by the power device in the power module, and the heat dissipation groove (5) is used for transferring the heat to the heat dissipation part (4).

2. The inductor module for heat dissipation according to claim 1, wherein A gap (6) is provided between the magnetic coils (2), and the gap (6) is filled with a heat conductive material, and the heat conductive material is one or more of a heat conductive silica gel sheet, a heat conductive silicone grease, and a heat conductive mud.

3. The inductance module for heat dissipation according to claim 1, wherein, The side part of the housing (1) is provided with the heat dissipation part (4), and the heat dissipation part (4) includes air-cooled heat dissipation, water-cooled heat dissipation, liquid-cooled heat dissipation, and / or graphite heat dissipation.

4. The inductance module for heat dissipation according to claim 1, characterized in that, The cross-sectional shape of the heat dissipation groove (5) is one or more of a square, a semicircle, an arc, and a trapezoid.

5. The inductor module for heat dissipation according to claim 1, wherein The magnetic coil (2) includes a magnetic core and a coil wound on the surface of the magnetic core.

6. The inductance module for heat dissipation according to claim 1, wherein, The heat transfer part (3) is arranged below the lowermost magnetic coil (2), and a heat conductive material is filled between the heat transfer part (3) and the lowermost magnetic coil (2).

7. The inductor module for heat dissipation according to claim 1, wherein The heat dissipation part (4) is arranged above the uppermost magnetic coil (2), and a heat conductive material is filled between the heat dissipation part (4) and the uppermost magnetic coil (2).

8. A power module, characterized in that, Comprising: A circuit board (7), a power device (8), and an inductor module as described in any one of claims 1-7; the circuit board (7) is arranged below the heat transfer part (3), and the power device (8) is arranged below the circuit board (7); The heat transfer part (3) of the inductor module is used for absorbing the heat generated by the power device (8).

9. The power supply module according to claim 8, wherein The inductor module is electrically connected to the circuit board (7), and the power device (8) is electrically connected to the circuit board (7); The power device (8) is located within the projected area of the inductor module on the circuit board (7).

10. An electronic device, characterized in that, Comprising: A chassis, a main board, and a power module as described in any one of claims 8-9, the power module is arranged on the main board, and the main board is arranged inside the chassis.

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