Combined capacitor with good heat dissipation effect

Abstract

The utility model discloses a combined capacitor with a good heat dissipation effect, and relates to the technical field of capacitors, the combined capacitor comprises a combined shell and a combined heat dissipation mechanism, and the inner side of the combined shell is provided with the combined heat dissipation mechanism; through the arrangement of the combined heat dissipation mechanism, multiple groups of combined capacitors are mutually connected through the array connecting disc, the convenience of capacitor installation is improved, meanwhile, the combined capacitors are protected through the combined shell, when the combined capacitors are used, heat dissipation is conducted on the capacitors through the heat dissipation fan, heat dissipation plates facilitate heat dissipation in the combined shell, and the heat dissipation efficiency is improved. The method comprises the following steps: step 1, in the operation process of a heat dissipation fan, a heat dissipation effect is ensured, heat in a combined shell is absorbed through a heat conduction top cover and a water cooling pipe, and meanwhile, each column of combined capacitors are separated to a certain extent through the water cooling pipe, so that mutual influence among the combined capacitors is reduced, and step 2, in the operation process of the heat dissipation fan, airflow passing through the water cooling pipe is slowed down through a flow slowing grid, so that the heat dissipation effect is improved. And the heat absorption effect of the water-cooled tube on the combined capacitor is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a combined capacitor with good heat dissipation effect. Background Technique

[0002] A capacitor is an electronic component that can store and release electric charges and plays various roles in a circuit; the basic structure of a capacitor consists of two conductive plates (electrodes) and an insulating material (dielectric). The working principle of a capacitor is based on the energy storage characteristic of an electric field, and it can be used in a circuit for smoothing current, filtering, energy conversion, coupling and decoupling, and controlling the timing of signals, etc.

[0003] After retrieval, the text with the publication number of "CN215342305U" mentions that "the utility model relates to an electronic capacitor with good heat dissipation effect, including a housing assembly. The inside of the housing assembly includes an upper housing, and a lower housing is arranged at the bottom of the upper housing. Heat sinks are fixedly installed on the opposite sides of the upper housing and the lower housing. The upper housing is connected to the lower housing through a connection assembly. The inside of the lower housing includes a pressing assembly. The connection assembly includes two insertion blocks. The tops of the two insertion blocks are fixedly installed on the bottom of the upper housing, and card slots are opened at the bottoms of the two insertion blocks.", and it dissipates heat from the capacitor through heat sinks. However, in high-power and high-density applications of multiple groups of capacitors, the heat between these capacitors will affect each other, and it is difficult to meet the heat dissipation requirements.

[0004] Therefore, we provide a combined capacitor with good heat dissipation effect to solve the above problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide a combined capacitor with good heat dissipation effect to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: a combined capacitor with good heat dissipation effect, including a combined housing and a combined heat dissipation mechanism, and the combined heat dissipation mechanism is arranged inside the combined housing;

[0007] The combined heat dissipation mechanism includes an array installation component and an exhaust air component. The array installation component is arranged inside the combined housing, and the exhaust air components are installed at the left and right ends inside the combined housing.

[0008] Preferably, the array installation component includes an array connection disk, connection pins, and a combined capacitor. The array connection disk is installed inside the combined housing, connection pins are fixedly connected to the left and right ends of the array connection disk, and the combined capacitor is installed at the top of the array connection disk.

[0009] Preferably, the exhaust component includes a heat dissipation rack, a heat dissipation fan, and a heat dissipation plate. The heat dissipation racks are welded to the left and right ends inside the combined housing, and the heat dissipation fans are installed inside the heat dissipation racks.

[0010] Preferably, heat dissipation plates are installed at the front and rear ends of the combined housing, and each heat dissipation plate corresponds to each column of combined capacitors one by one.

[0011] Preferably, a water-cooled heat conduction component is installed at the top of the combined housing. The water-cooled heat conduction component includes a heat conduction top cover, a refrigeration cycle water-cooled box, a water-cooled pipe, a flow-attenuating grid, a heat conduction bottom fin plate, and a heat conduction top fin plate. The heat conduction top cover is installed at the top of the combined housing, the refrigeration cycle water-cooled box is installed at the top of the heat conduction top cover, and the water-cooled pipes are arranged between the combined capacitors.

[0012] Preferably, the flow-attenuating grid is installed outside the water-cooled pipe, and each flow-attenuating grid corresponds to each water-cooled pipe one by one.

[0013] Preferably, the lower surface of the heat conduction top cover is provided with a heat conduction bottom fin plate, and the upper surface of the heat conduction top cover is provided with a heat conduction top fin plate.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. Through the setting of the combined heat dissipation mechanism, multiple groups of combined capacitors are interconnected through the array connection plates, improving the convenience of capacitor installation. At the same time, the combined housing protects the combined capacitors. When the combined capacitors are in use, the heat dissipation fan dissipates heat from the capacitors, and the heat dissipation plate facilitates the discharge of the heat inside the combined housing, ensuring the heat dissipation effect.

[0016] 2. Through the setting of the water-cooled heat conduction component, the heat inside the combined housing is absorbed through the heat conduction top cover and the water-cooled pipes. At the same time, each column of combined capacitors is separated to a certain extent by the water-cooled pipes, reducing the mutual influence between the combined capacitors. Fourthly, during the operation of the heat dissipation fan, the flow-attenuating grid slows down the airflow passing through the water-cooled pipes, improving the heat absorption effect of the water-cooled pipes on the combined capacitors. At the same time, the fin plates increase the air contact area, enhancing the convective heat conduction effect of the heat dissipation fan. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall external structure proposed by the present utility model;

[0018] Figure 2 is a schematic diagram of the internal structure of the combined housing proposed by the present utility model;

[0019] Figure 3 is a schematic diagram of the structure of the array installation component proposed by the present utility model;

[0020] Figure 4 Schematic diagram of the structure of the water-cooled heat conduction component proposed by the present utility model.

[0021] In the figure: 1. Combined housing; 2. Combined heat dissipation mechanism; 21. Array mounting component; 211. Array connection plate; 212. Connection pin; 213. Combined capacitor; 22. Exhaust component; 221. Heat dissipation frame; 222. Heat dissipation fan; 223. Heat dissipation plate; 3. Water-cooled heat conduction component; 31. Heat conduction top cover; 32. Refrigeration cycle water-cooled box; 33. Water-cooled pipe; 34. Flow retardation grid; 35. Heat conduction bottom fin plate; 36. Heat conduction top fin plate. Specific implementation mode

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present utility model.

[0023] Embodiment 1

[0024] Please refer to Figures 1-4 As shown, a combined capacitor with good heat dissipation effect includes a combined housing 1 and a combined heat dissipation mechanism 2. The combined heat dissipation mechanism 2 is arranged inside the combined housing 1;

[0025] The combined heat dissipation mechanism 2 includes an array mounting component 21 and an exhaust component 22. The array mounting component 21 is arranged inside the combined housing 1, and the exhaust components 22 are installed at the left and right ends inside the combined housing 1.

[0026] Furthermore, the array mounting component 21 includes an array connection plate 211, connection pins 212 and a combined capacitor 213. The array connection plate 211 is installed inside the combined housing 1. The connection pins 212 are fixedly connected to the left and right ends of the array connection plate 211. The combined capacitor 213 is installed at the top of the array connection plate 211. The array connection plate 211 is used to connect multiple groups of combined capacitors 213 to improve the convenience of capacitor installation. At the same time, the combined housing 1 protects the combined capacitor 213.

[0027] Furthermore, the exhaust component 22 includes a heat dissipation frame 221, a heat dissipation fan 222 and a heat dissipation plate 223. The heat dissipation frames 221 are welded to the left and right ends inside the combined housing 1, and the heat dissipation fans 222 are installed inside the heat dissipation frames 221. When the combined capacitor 213 is in use, the heat dissipation fans 222 dissipate heat from the capacitor.

[0028] Further, heat dissipation plates 223 are installed at the front and rear ends of the combined housing 1. The heat dissipation plates 223 correspond one-to-one with each column of combined capacitors 213. Through the heat dissipation plates 223, the heat inside the combined housing 1 is discharged, ensuring the heat dissipation effect.

[0029] Embodiment 2

[0030] Please refer to Figure 1 、 Figure 2 and Figure 4 As shown, compared with Embodiment 1, as another implementation manner of the present invention, a water-cooled heat conduction component 3 is installed at the top of the combined housing 1. The water-cooled heat conduction component 3 includes a heat conduction top cover 31, a refrigeration cycle water-cooled box 32, a water-cooled pipe 33, a flow retardation grid 34, a heat conduction bottom fin plate 35, and a heat conduction top fin plate 36. A heat conduction top cover 31 is installed at the top of the combined housing 1, and a refrigeration cycle water-cooled box 32 is installed at the top of the heat conduction top cover 31. A water-cooled pipe 33 is arranged between the combined capacitors 213. The heat inside the combined housing 1 is absorbed through the heat conduction top cover 31 and the water-cooled pipe 33. At the same time, each column of combined capacitors 213 is separated to a certain extent through the water-cooled pipe 33, reducing the mutual influence between the combined capacitors 213.

[0031] Further, a flow retardation grid 34 is installed outside the water-cooled pipe 33. The flow retardation grid 34 corresponds one-to-one with the water-cooled pipe 33. During the operation of the heat dissipation fan 222, the airflow passing through the water-cooled pipe 33 is slowed down through the flow retardation grid 34, improving the heat absorption effect of the water-cooled pipe 33 on the combined capacitors 213.

[0032] Further, a heat conduction bottom fin plate 35 is arranged on the lower surface of the heat conduction top cover 31, and a heat conduction top fin plate 36 is arranged on the upper surface of the heat conduction top cover 31. The air contact area is increased through the fin plates, increasing the convective heat conduction effect of the heat dissipation fan 222.

[0033] Working principle: When in use, in the first step, install this device at the location where it is required to be used. Connect multiple groups of combined capacitors 213 to each other through the array connection plate 211 to improve the convenience of capacitor installation. At the same time, protect the combined capacitors 213 through the combined housing 1. In the second step, when the combined capacitors 213 are in use, dissipate heat from the capacitors through the cooling fan 222, and facilitate the discharge of heat inside the combined housing 1 through the heat dissipation plate 223 to ensure the heat dissipation effect. In the third step, absorb the heat inside the combined housing 1 through the heat-conducting top cover 31 and the water-cooling pipe 33. At the same time, separate each column of combined capacitors 213 through the water-cooling pipe 33 to reduce the mutual influence between the combined capacitors 213. In the fourth step, during the operation of the cooling fan 222, slow down the airflow passing through the water-cooling pipe 33 through the flow-attenuating grid 34 to improve the heat absorption effect of the water-cooling pipe 33 on the combined capacitors 213. At the same time, increase the air contact area through the fin plates to enhance the convection heat conduction effect of the cooling fan 222. In this way, the use of a combined capacitor with good heat dissipation effect is completed.

[0034] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A combined capacitor with good heat dissipation effect, comprising a combined housing (1) and a combined heat dissipation mechanism (2), characterized in that, The inner side of the combined housing (1) is provided with a combined heat dissipation mechanism (2); The combined heat dissipation mechanism (2) includes an array mounting component (21) and an exhaust air component (22). The array mounting component (21) is arranged on the inner side of the combined housing (1), and the exhaust air component (22) is mounted at the left and right ends of the inner side of the combined housing (1).

2. The combined capacitor with good heat dissipation effect according to claim 1, wherein, The array mounting component (21) includes an array connection disk (211), connection pins (212) and a combined capacitor (213). The array connection disk (211) is mounted on the inner side of the combined housing (1). The left and right ends of the array connection disk (211) are fixedly connected with the connection pins (212), and the combined capacitor (213) is mounted on the top end of the array connection disk (211).

3. The combined capacitor with good heat dissipation effect according to claim 1, characterized in that, The exhaust air component (22) includes a heat dissipation frame (221), a heat dissipation fan (222) and a heat dissipation plate (223). The heat dissipation frame (221) is welded to the left and right ends of the inner side of the combined housing (1), and the heat dissipation fan (222) is mounted inside the heat dissipation frame (221).

4. The combined capacitor with good heat dissipation effect according to claim 1, characterized in that, The heat dissipation plates (223) are mounted at the front and rear ends of the combined housing (1), and the heat dissipation plates (223) correspond to each column of the combined capacitors (213) one by one.

5. The combined capacitor with good heat dissipation effect according to claim 2, characterized in that A water-cooled heat conduction component (3) is mounted on the top end of the combined housing (1). The water-cooled heat conduction component (3) includes a heat conduction top cover (31), a refrigeration cycle water-cooled box (32), a water-cooled pipe (33), a flow buffering grid (34), a heat conduction bottom fin plate (35) and a heat conduction top fin plate (36). The heat conduction top cover (31) is mounted on the top end of the combined housing (1), the refrigeration cycle water-cooled box (32) is mounted on the top end of the heat conduction top cover (31), and the water-cooled pipe (33) is arranged between the combined capacitors (213).

6. The combined capacitor with good heat dissipation effect according to claim 5, characterized in that, The flow buffering grid (34) is mounted on the outer side of the water-cooled pipe (33), and the flow buffering grid (34) corresponds to the water-cooled pipe (33) one by one.

7. The combined capacitor with good heat dissipation effect according to claim 5, characterized in that, The lower surface of the heat conduction top cover (31) is provided with the heat conduction bottom fin plate (35), and the upper surface of the heat conduction top cover (31) is provided with the heat conduction top fin plate (36).

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