Dehumidification device for air monitoring equipment

Abstract

The dehumidification device for the air monitoring equipment comprises an upper cover, a shell and a condenser, the condenser comprises a heat insulation base, a water cooling box, two semiconductor pieces and two heat conduction fins, the water cooling box is installed at the bottom of a concave structure of the heat insulation base, and the two semiconductor pieces and the two heat conduction fins are installed on the heat insulation base. Refrigerating surfaces of the two semiconductor chips are respectively attached to the side wall of the water cooling box, and the two heat conducting fins are respectively attached to heating surfaces of the two semiconductor chips and are respectively fixed at the side part of the heat insulation base; the water cooling box comprises a box body and a box cover, the box cover and the box body are arranged in a matched mode, a refrigeration air chamber is arranged in the box body, and a partition plate is arranged in the refrigeration air chamber. A water cooling box of the condenser comprises a refrigerating air chamber of a core refrigerating space, so that a certain amount of liquid water can be conveniently stored, and the refrigerating contact surface can be increased; and the partition plate is additionally arranged in the refrigeration air chamber to divide the refrigeration air chamber into two parts, so that the contact surface between the gas to be detected and the refrigeration air chamber is further increased, and the condensation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of gas monitoring, and specifically, to a dehumidifying device for air monitoring equipment. Background Art

[0002] In the field of environmental monitoring, air monitoring equipment mostly adopts sensor monitoring technology, and sensors need a suitable humidity environment to work. However, in many places in China, especially in the southern regions, due to the humid climate and high water content in the air, sensors working in a high-humidity environment for a long time are likely to cause inaccurate detection results, false alarms or damage to the sensors. To address these problems, most current air monitoring equipment on the market has taken relevant dehumidification measures, and the most common one is to achieve dehumidification by heating the sampling device in the sampling link.

[0003] The existing Chinese patent with the publication number CN218358375U discloses a dehumidifying device and a storage cabinet. The semiconductor component of the dehumidifying device is arranged at the dehumidifying opening of the cabinet to be dehumidified. The semiconductor component includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first cold end and a first hot end. The first cold end is close to the dehumidifying opening and the first hot end is far from the dehumidifying opening. The second semiconductor chip has a second cold end and a second hot end. The second cold end is far from the dehumidifying opening and the second hot end is close to the dehumidifying opening. The control component is used to be arranged on the cabinet to be dehumidified, and is electrically connected to both the first semiconductor chip and the second semiconductor chip, and is used to control one of the first semiconductor chip and the second semiconductor chip to work while the other is turned off.

[0004] The dehumidifying device in the prior art has achieved a certain dehumidification effect to a certain extent, but the designed refrigeration space has a low condensation efficiency for gases and cannot make good use of the limited refrigeration space. Summary of the Utility Model

[0005] Aiming at the defects in the prior art, the purpose of the utility model is to provide a dehumidifying device for air monitoring equipment.

[0006] According to a dehumidifying device for air monitoring equipment provided by the utility model, it includes an upper cover, a housing and a condenser. The upper cover and the housing form an accommodating space, and the condenser is installed in the accommodating space.

[0007] The condenser includes a heat insulation base, a water cooling box, semiconductor chips and heat conducting fins. The heat insulation base includes a hollow concave structure. The water cooling box is installed at the bottom of the concave structure of the heat insulation base. There are two semiconductor chips and two heat conducting fins. The refrigerating surfaces of the two semiconductor chips are respectively attached to the side walls of the water cooling box, and the two heat conducting fins are respectively attached to the heating surfaces of the two semiconductor chips, and the two heat conducting fins are respectively fixed to the sides of the heat insulation base.

[0008] The water-cooled box includes a box body and a box cover, the box cover is arranged in cooperation with the box body, the interior of the box body includes a refrigerating gas chamber, and a partition is arranged inside the refrigerating gas chamber.

[0009] Preferably, the condenser further includes a base frame which is installed at the bottom of the housing;

[0010] A square hole is formed in the upper cover, and the base frame extends from the bottom of the housing to the square hole and protrudes outside the upper cover.

[0011] Preferably, the condenser further includes a temperature transmitter and a digital display controller. The temperature transmitter is mounted on the outer end face of the box cover, and the digital display controller is installed on the base frame and protrudes outside the upper cover;

[0012] Both the temperature transmitter and the two semiconductor chips are electrically connected to the digital display controller.

[0013] Preferably, the condenser further includes fans. There are two fans, and the two fans are respectively installed on two side walls of the base frame, and one fan corresponds to one heat-conducting fin.

[0014] Preferably, a first air inlet joint is fixed on the upper side wall of the housing, and a first air outlet joint and a first drain joint are fixed on the lower side wall of the housing.

[0015] Preferably, a second air inlet joint and a second air outlet joint are arranged on the box cover. The second air inlet joint and the second air outlet joint respectively correspond to two parts of the refrigerating gas chamber separated by the partition; a second drain joint is arranged at the bottom of the box body; the second air inlet joint, the second air outlet joint and the second drain joint are respectively connected to the refrigerating gas chamber; the second air inlet joint is connected in series with the first air inlet joint through a pipeline, and the second air outlet joint is connected in series with the first air outlet joint through a pipeline.

[0016] Preferably, both the second air inlet joint and the second air outlet joint are arranged upward along the gravity direction, and the second drain joint is arranged downward along the gravity direction.

[0017] Preferably, a drain valve is further included. The drain valve is installed at the bottom of the housing. One end of the drain valve is connected to the first drain joint, and the other end of the drain valve is connected to the second drain joint.

[0018] Preferably, the water-cooled box further includes an O-ring. A sealing groove is arranged on the end face of the opening of the box body. The O-ring is placed in the sealing groove, and the box cover is fixed to the box body and presses the O-ring.

[0019] Preferably, heat-conducting silica gel is coated between the semiconductor chip and the water-cooled box, and between the heat-conducting fin and the semiconductor chip.

[0020] Compared with the prior art, the utility model has the following beneficial effects:

[0021] 1. The utility model adopts a condenser for refrigeration. The water-cooled box of the condenser contains a refrigeration gas chamber in the core refrigeration space, which is convenient for storing a certain amount of liquid water and can also increase the refrigeration contact surface. A partition is added inside the refrigeration gas chamber to divide the refrigeration gas chamber into two parts, further increasing the contact surface between the gas to be measured and the refrigeration gas chamber and increasing the condensation efficiency;

[0022] 2. The utility model sets the condenser as an electronic condenser. The electronic condenser includes a digital display controller and a temperature transmitter, which can not only effectively filter out the water vapor in the gas to be measured, avoid the influence of high-humidity gas on the detection data and possible damage to the sensor, but also improve the accuracy and reliability of the detection results;

[0023] 3. The utility model sets the semiconductor chip as the core refrigeration component. After the semiconductor chip is powered on, its refrigerating side reduces the temperature of the water-cooled box and its interior, indirectly reducing the temperature of the gas to be measured, and further reducing the water vapor saturation degree of the gas to be measured, so as to achieve the purpose of condensing water vapor;

[0024] 4. The utility model condenses the water vapor in the gas to be measured into liquid water by using the condenser, and then regularly discharges the liquid water by controlling the opening and closing of the drain valve, so as to achieve the purpose of drying and dehumidifying. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, purposes and advantages of the utility model will become more obvious:

[0026] Figure 1 It is a schematic internal structure diagram of the dehumidification device mainly embodied in the utility model;

[0027] Figure 2 It is an exploded view of the condenser mainly embodied in the utility model;

[0028] Figure 3 It is a schematic structure diagram of the water-cooled box mainly embodied in the utility model;

[0029] Figure 4 It is an isometric view of the condenser mainly embodied in the utility model;

[0030] Figure 5 It is an isometric view of the dehumidification device mainly embodied in the utility model.

[0031] In the figure:

[0032] Housing 1, Base frame 300, Sealing groove 3515

[0033] Slot-shaped hole 101, Digital display controller 310, Box cover 352

[0034] Open hole 102, Fan 320, O-ring 353

[0035] Keyhole 103, Heat insulation base 330, Second air outlet joint 354

[0036] First air inlet joint 110, Temperature transmitter 340, Second air inlet joint 355

[0037] First air outlet joint 120, Water cooling box 350, Second drain joint 356

[0038] First drain joint 130, Box body 351, Semiconductor chip 360

[0039] Wall-through terminal 140, Partition board 3513, Heat conduction fin 370

[0040] Upper cover 2, Refrigerating gas chamber 3514, Drain valve 4

[0041] Condenser 3, Support frame 410, Fan protection net 6 Specific implementation mode

[0042] The present utility model will be described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present utility model, but do not limit the present utility model in any form. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several changes and improvements can still be made. These all belong to the protection scope of the present utility model.

[0043] As Figures 1 to 3 shown, a dehumidifying device for an air monitoring device provided by the present utility model includes an upper cover 2, a housing 1 and a condenser 3. The upper cover 2 and the housing 1 form an accommodating space, and the condenser 3 is installed in the accommodating space. The condenser 3 includes a heat insulation base 330, a water cooling box 350, a semiconductor chip 360 and a heat conduction fin 370. The heat insulation base 330 includes a hollow concave structure. The water cooling box 350 is installed at the bottom of the concave structure of the heat insulation base 330. There are two semiconductor chips 360 and two heat conduction fins 370. The refrigerating surfaces of the two semiconductor chips 360 are respectively attached to the side walls of the water cooling box 350, the two heat conduction fins 370 are respectively attached to the heating surfaces of the two semiconductor chips 360, and the two heat conduction fins 370 are respectively fixed on the sides of the heat insulation base 330. The water cooling box 350 includes a box body 351 and a box cover 352. The box cover 352 and the box body 351 are cooperatively arranged. The interior of the box body 351 includes a refrigerating gas chamber 3514, and a partition board 3513 is arranged inside the refrigerating gas chamber 3514.

[0044] This utility model adopts the semiconductor condensation principle. The condenser 3 is used to condense the water vapor in the gas to be measured into liquid water, and then the liquid water is removed to achieve the purpose of drying and dehumidifying. The condenser 3 is the core working unit of this utility model. The water-cooled box 350 therein is placed in the concave space of the heat-insulating base 330 and includes a box body 351 and a box cover 352. The refrigerating gas chamber 3514 inside the box body 351 is the core refrigerating space. The gas to be measured enters the refrigerating gas chamber 3514, and the temperature of the gas to be measured is reduced in this refrigerating space, and the water vapor is condensed into liquid water. It can be understood that the refrigerating gas chamber 3514 should be designed to be of an appropriate larger size, so that it is convenient to store a certain amount of liquid water, and at the same time, it can increase the refrigerating contact surface and increase the condensation efficiency. The refrigerating gas chamber 3514 is preferably a cylindrical barrel-shaped cavity. To further increase the contact surface between the gas to be measured and the refrigerating gas chamber 3514, appropriate partitions 3513 are added inside the refrigerating gas chamber 3514. The partitions 3513 can be arranged in the middle of the cavity of the refrigerating gas chamber to divide the refrigerating gas chamber 3514 into two parts.

[0045] In a specific embodiment, such as Figure 2 and Figure 3 shown, the water-cooled box 350 is designed as a rectangular parallelepiped with a hollow interior component, including a box body 351, a box cover 352 and an O-ring 353. The refrigerating gas chamber 3514 with a cylindrical barrel-shaped structure is included inside the box body 351. A sealing groove 3515 is provided at the opening of the box body. A semi-circular sealing groove can be machined on the upper end surface of the box body 351. The O-ring 353 is placed in the sealing groove 3515, and the box cover 352 is fixed to the box body 351 through threaded holes and presses the O-ring 353. The O-ring 353 is preferably made of fluororubber material.

[0046] In a specific embodiment, the heat-insulating base 330 is processed into a concave structure. The heat-insulating base 330 has two functions. One is to serve as an installation base for carrying the water-cooled box 350, the semiconductor chip 360 and the heat-conducting fin 370, and the other is to insulate and keep warm to reduce the heat exchange rate between the water-cooled box 350 and the ambient air. The heat-insulating effect of the heat-insulating base 330 directly affects the working efficiency of the condenser 3, that is, if the heat-insulating effect of the heat-insulating base 330 is good, the working efficiency of the condenser 3 is high, otherwise the working efficiency is low. The heat-insulating base 330 is preferably made of ABS material with stable structure, wide working temperature range and excellent heat-insulating performance.

[0047] Further, to ensure the heat insulation effect, the water-cooling box 350 is tightly attached to the bottom of the concave structure of the heat insulation base 330. A feasible implementation method is to tightly attach the box body 351 to three sides of the concave structure and make the box cover 352 face outward. The designed height of the water-cooling box 350 is lower than the concave structures of the heat insulation bases 330 on both sides, so as to form a groove. After the semiconductor chip 360 is powered on, one end face is cooled and the other end face is heated. The cooling end face is attached to the side wall of the water-cooling box 350, and the heat-conducting fin 370 is attached to the heating end face of the semiconductor chip 360. Thermal conductive silicone is applied between the semiconductor chip 360 and the water-cooling box 350, and between the heat-conducting fin 370 and the semiconductor chip 370. There are two groups of semiconductor chips 360 and heat-conducting fins 370 respectively, which are placed on both side walls of the water-cooling box 350. During specific assembly, the two heat-conducting fins 370 are fixed to both sides of the heat insulation base 330 through threaded holes, and clamp the water-cooling box 350 and the two semiconductor chips 360. Since the size of the heat-conducting fin 370 is slightly larger, the four side faces of the water-cooling box 350 are lower than the heat insulation base 330 and the heat-conducting fin 370. The two heat-conducting fins 370 and the heat insulation base 330 form a groove space. The water-cooling box 350 contacts the heat insulation base 330 on three sides to form a heat insulation surface, and contacts the semiconductor chip 360 on two sides to form a cooling surface. The heat-conducting fin 370 is preferably made of aluminum alloy, copper or other heat-conducting metal materials. At the same time, the outer side of the box cover 352 becomes the bottom surface of this groove space and is not heat-insulated. The heat insulation treatment for this surface uses a glue-sealing method. Specifically, AB glue or other methods can be selected. There is no limitation here, as long as the heat insulation effect is achieved.

[0048] Further, the condenser further includes a base frame 300, and the base frame 300 is installed at the bottom of the housing 1; a square hole is opened on the upper cover 2, and the base frame 300 extends from the bottom of the housing 1 to the square hole and protrudes outside the upper cover 2. The base frame 300 is fixed to the bottom of the housing 1 through threaded holes, and the condenser 3 is fixed to the bottom of the housing through the base frame 300. A square hole can be opened in the middle part of the upper cover 2 so that the base frame 300 is higher than the housing 1 and can protrude outside the upper cover 2. The heat insulation base 330 is processed into a hollow concave structure and is fixed to the inner bottom of the base frame 300 through threaded holes. The condenser 3 includes a heat insulation base 330, a temperature transmitter 340, a water-cooling box 350, a semiconductor chip 360 and a heat-conducting fin 370, which are integrated in the base frame 300 and assembled into an integral structure, making the component structure compact, small in volume and easy to install.

[0049] Furthermore, the condenser 3 further includes a temperature transmitter 340 and a digital display controller 310. The temperature transmitter 340 is mounted on the outer end face of the box cover 352, and the digital display controller 310 is installed on the base frame 300 and protrudes outside the upper cover 2; both the temperature transmitter 340 and the two semiconductor chips 360 are electrically connected to the digital display controller 310. At this time, the condenser 3 is an electronic condenser. At the top of the base frame 300, a digital display controller 310 is installed at the part protruding outside the upper cover 2. The digital display controller 310 is a display and control component, which has a display screen capable of reading the temperature value in real time and setting buttons for setting relevant parameters. The digital display controller 310 protrudes outside the upper cover 2 along with the electronic condenser, which is convenient for reading the real-time temperature value and setting relevant parameter values at any time. The power of the external power supply of the condenser 3 is not less than 1.5 times its rated power, and the control temperature range of the digital display controller 310 needs to be set correctly and reasonably. At the same time, in order to facilitate obtaining the real-time temperature, a temperature transmitter 340 is also mounted on the outer end face of the box cover 352. The temperature transmitter 340 is in full contact with the box cover 352 and fixed on the outer end face of the box cover 352. The temperature transmitter 340 preferably uses a metal aluminum plate structure to achieve full contact with the box cover 352 and transfer heat in time, ensuring that the temperature transmitter 340 can reflect the temperature of the water-cooled box 350 in time and truly. Further, both the temperature transmitter 340 and the two semiconductor chips 360 are electrically connected to the digital display controller 310. The temperature transmitter 340 timely transmits the obtained temperature value to the digital display controller 310. The digital display controller 310 sets the preset temperature range value, including setting the refrigeration start temperature and stop temperature values. When the temperature detected by the temperature transmitter 340 is higher than the start temperature, the refrigeration starts. When the temperature detected by the temperature transmitter 340 is lower than the stop temperature, the refrigeration shuts down. The start and stop of power supply to the semiconductor chip 360 are controlled by the temperature detected by the temperature transmitter 340, and then the start and stop of the refrigeration and dehumidification work are indirectly controlled.

[0050] Furthermore, the condenser 3 further includes two fans 320. The two fans 320 are respectively installed on two side walls of the base frame 300, and one fan 320 is arranged corresponding to one heat-conducting fin 370. In a specific embodiment, one fan 320 is installed on each side of the base frame 300 to exhaust heat and cool down the heat-conducting fin 370. The fan 320 is fixed on the base frame 300 through screws 3201 and is on the same axis as the heat-conducting fin 370, the semiconductor chip 360, and the water-cooled box 350. The base frame 300 is provided with corresponding ventilation holes at this axis position. A wall-through terminal 140 for connecting to an external power supply is installed on the lower side wall of the housing 1. The wall-through terminal 140 is electrically connected to the fan 320 and the digital display controller 310, and the digital display controller 310 is electrically connected to the temperature transmitter 340 and the two semiconductor chips 360.

[0051] A preferred embodiment is as follows: The base frame 300 is set as a rectangular frame, including a top plate, a bottom plate and two side plates. Among them, the top plate of the base frame 300 protrudes out of the upper cover 2 through the square hole of the upper cover 2, and a digital display controller 310 is installed on the outer end face of the top plate. Ventilation holes for accommodating two fans are respectively arranged in the middle and lower parts of the two side plates of the base frame 300. The bottom plate of the base frame 300 is set as a bottom plate with a disconnected middle part, including a first bottom plate and a second bottom plate. The first bottom plate and the second bottom plate are respectively connected to the two side plates, and the first bottom plate and the second bottom plate are not connected. Such a setting is more convenient for the installation of other components included in the condenser 3. For example, when the width of the heat insulation base 330 is not much different from the width of the base frame 300, when installing the heat insulation base 330 onto the base frame 300, since the first bottom plate and the second bottom plate are not connected, the heat insulation base 330 can push the first bottom plate and the second bottom plate to the side and expand them within a reasonable range, and the heat insulation base 330 is easily installed on the base frame 330.

[0052] As Figure 4 and Figure 5 As shown, a first air inlet joint 110 is fixed on the upper side wall of the housing 1, a first air outlet joint 120 and a first drain joint 130 are fixed on the lower side wall of the housing 1, and a drain valve 4 is installed at the bottom of the housing 1 for discharging condensed water. A keyhole 103 for installation is also opened at the bottom of the housing 1. A number of slot-shaped holes 101 and open holes 102 are opened on the peripheral side walls of the housing 1, and a fan protection net 6 is installed outside the open holes 102. The housing 1 is connected to the upper cover 2 by countersunk head screws, the condenser 3 is fixed inside the housing 1, and the drain valve 4 is connected to the pipeline of the condenser 3. The present utility model adopts the semiconductor condensation principle, uses the condenser 3 to condense the water vapor in the gas to be measured into liquid water, and then regularly discharges the liquid water by controlling the opening and closing of the drain valve 4, so as to achieve the purpose of drying and dehumidifying.

[0053] In addition, as Figure 2As shown in the figure, the water-cooled box 350 further includes a second air inlet joint 355, a second air outlet joint 354, and a second drain joint 356. Among them, the second air inlet joint 355 and the second air outlet joint 354 are provided on the box cover 352, and the second drain joint 356 is provided at the bottom of the box body 351. After the box body 351, the box cover 352, and the O-ring 353 are hermetically connected, the second air inlet joint 355, the second air outlet joint 354, and the second drain joint 356 are all communicated with the refrigeration gas chamber 3514. The first air inlet joint 110 and the second air inlet joint 355, and the first air outlet joint 120 and the second air outlet joint 354 are connected in series through PTFE tubes. The box cover 352 is preferably a square thin piece and can be fixed to the box body 351 by round head screws. The second air inlet joint 355 and the second air outlet joint 354 installed on the box cover 352 respectively correspond to the two parts of the refrigeration gas chamber 3514 separated by the partition plate 3513. One end of the drain valve 4 is connected to the first drain joint 130, and the other end of the drain valve 4 is connected to the second drain joint 356. The box body 351, the box cover 352, the second air inlet joint 355, the second air outlet joint 354, and the second drain joint 356 are preferably made of stainless steel material. The specific implementation method is as follows: The drain valve 4 is fixed to the bottom of the housing 1 through the support frame 410 and is close to the condenser 3. It is connected to the second drain joint 356 on the lower side of the condenser 3 through a pipeline. One end interface of the drain valve 4 is connected in series with the second drain joint 356 through a PTFE tube, and the other end interface of the drain valve 4 is connected in series with the first drain joint 130 through a PTFE tube. The drain valve 4 is preferably an electric two-way valve, which is opened when powered on and closed when powered off, and is electrically connected to an external controller. The switching time and frequency can be preset. The specific switching frequency depends on the refrigeration efficiency and the amount of condensed liquid water measured in the experiment.

[0054] It should be emphasized that when assembling the present invention, the following principle should be followed: the second air inlet joint 355 and the second air outlet joint 354 should face upward along the gravity direction, and the second drain joint 356 should face downward along the gravity direction. This ensures that when a certain amount of liquid water condenses in the refrigeration gas chamber 3514, the upper part of the refrigeration gas chamber 3514 is a gas space, and the lower part is a liquid water space, avoiding liquid water from entering the working gas path.

[0055] The working principle of refrigeration and dehumidification:

[0056] Preset the parameters of the digital display controller 310, including setting the refrigeration start and stop conditions. For example, set the start temperature to 15°C and the stop temperature to 12°C. That is, when the temperature detected by the temperature transmitter 340 is higher than 15°C, the refrigeration starts; when it is lower than 12°C, the refrigeration shuts down. At the same time, preset the switch cycle of the drain valve 4, which is set according to the specific situation of the condensate volume. In this embodiment, according to the experimental results, the cycle is preset to open once every 24 hours, and the opening time is 1 minute. The semiconductor refrigeration sheet 360 is the core refrigeration component. After it is powered on, the refrigerating side reduces the temperature of the water-cooled box 350 and its internal temperature, indirectly reduces the temperature of the gas to be measured, and further reduces the water vapor saturation of the gas to be measured, so as to achieve the purpose of condensing water vapor. When the drain valve 4 is closed, the condensate is temporarily stored in the water-cooled box 350, and when the drain valve 4 is opened, the condensate is discharged. Through the above periodic operation of condensation and drainage, this embodiment realizes the purpose of intelligent dehumidification.

[0057] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0058] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. Without conflict, the embodiments of the present application and the features in the embodiments can be arbitrarily combined with each other.

Claims

1. A dehumidifying device for an air monitoring device, characterized in that, Including: An upper cover (2), a housing (1), and a condenser (3). The upper cover (2) and the housing (1) form an accommodation space, and the condenser (3) is installed in the accommodation space; The condenser (3) includes a heat insulation base (330), a water cooling box (350), a semiconductor chip (360), and heat conduction fins (370). The heat insulation base (330) includes a hollow concave structure. The water cooling box (350) is installed at the bottom of the concave structure of the heat insulation base (330). There are two semiconductor chips (360) and two heat conduction fins (370). The cooling surfaces of the two semiconductor chips (360) are respectively attached to the side walls of the water cooling box (350). The two heat conduction fins (370) are respectively attached to the heating surfaces of the two semiconductor chips (360), and the two heat conduction fins (370) are respectively fixed to the sides of the heat insulation base (330); The water cooling box (350) includes a box body (351) and a box cover (352). The box cover (352) is cooperatively arranged with the box body (351). The interior of the box body (351) includes a refrigerating gas chamber (3514), and a partition (3513) is arranged inside the refrigerating gas chamber (3514).

2. The dehumidification device for an air monitoring device according to claim 1, wherein The condenser (3) further includes a base frame (300), and the base frame (300) is installed at the bottom of the housing (1); A square hole is opened on the upper cover (2), and the base frame (300) extends from the bottom of the housing (1) to the square hole and protrudes outside the upper cover (2).

3. The dehumidifying device for an air monitoring device according to claim 2, wherein, The condenser (3) further includes a temperature transmitter (340) and a digital display controller (310). The temperature transmitter (340) is mounted on the outer end face of the box cover (352), and the digital display controller (310) is installed on the base frame (300) and protrudes outside the upper cover (2); The temperature transmitter (340) and the two semiconductor chips (360) are both electrically connected to the digital display controller (310).

4. The dehumidifying device for an air monitoring device according to claim 1, characterized in that, The condenser (3) further includes fans (320). There are two fans (320), and the two fans (320) are respectively installed on the two side walls of the base frame (300). One fan (320) is arranged corresponding to one heat conduction fin (370).

5. The dehumidifying device for an air monitoring device according to claim 1, characterized in that, A first air inlet joint (110) is fixed on the upper side wall of the housing (1), and a first air outlet joint (120) and a first drain joint (130) are fixed on the lower side wall of the housing (1).

6. The dehumidifying device for an air monitoring device according to claim 5, characterized in that, A second air inlet joint (355) and a second air outlet joint (354) are arranged on the box cover (352). The second air inlet joint (355) and the second air outlet joint (354) are respectively arranged corresponding to the two parts of the refrigerating gas chamber (3514) separated by the partition (3513); A second drain joint (356) is arranged at the bottom of the box body (351); The second air inlet joint (355), the second air outlet joint (354), and the second drain joint (356) are respectively connected to the refrigerating gas chamber (3514); The second intake joint (355) is connected in series with the first intake joint (110) through a pipeline, and the second outlet joint (354) is connected in series with the first outlet joint (120) through a pipeline.

7. The dehumidifying device for an air monitoring device according to claim 6, characterized in that, Both the second intake joint (355) and the second outlet joint (354) are arranged upward along the gravity direction, and the second drain joint (356) is arranged downward along the gravity direction.

8. The dehumidifying device for an air monitoring device according to claim 6, characterized in that, It further includes a drain valve (4). The drain valve (4) is installed at the bottom of the housing (1). One end of the drain valve (4) is connected to the first drain joint (130), and the other end of the drain valve (4) is connected to the second drain joint (356).

9. The dehumidifying device for an air monitoring device according to claim 1, characterized in that, The water-cooling box (350) further includes an O-ring (353). A sealing groove (3515) is provided at the end face of the opening of the box body (351). The O-ring (353) is placed in the sealing groove (3515), and the box cover (352) is fixed to the box body (351) and presses the O-ring (353).

10. The dehumidifying device for an air monitoring device according to claim 1, characterized in that, Thermal conductive silicone is coated between the semiconductor chip (360) and the water-cooling box (350), and between the heat dissipation fins (370) and the semiconductor chip (360).

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