Chip frame discharging support capable of effectively preventing blocking strip from being not closed

Abstract

The utility model provides a chip frame discharging support capable of effectively preventing a blocking strip from being not closed. The chip frame discharging support comprises a support body and a material blocking mechanism. A bottom plate is arranged at the bottom of the frame body and is used for bearing a material box loaded with a lead frame; one end of the frame body is a feeding end, and the other end of the frame body is a discharging end; a gap is reserved between the bottom of the frame on one side of the frame body and the bottom plate to form a discharge port; the material blocking mechanism is arranged on the frame, located at the discharging end, of the frame body. The material blocking mechanism comprises a baffle and a hinge piece. The baffle is rotationally arranged on the frame body through the hinge piece, a torsional spring is arranged on the hinge piece, one end of the torsional spring is connected with a frame of the discharging end of the frame body, and the other end of the torsional spring is connected with the baffle. According to the utility model, wire collapse or frame deformation caused by the fact that the frame vibrates out of the material box when the baffle is not closed manually can be effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, and specifically relates to a chip frame discharging bracket that can effectively prevent the baffle from not being closed. Background Art

[0002] Chip ball bonding is a very important technology in the semiconductor packaging process. It involves using fine metal wires (such as gold wires, copper wires or aluminum wires) to connect the electrode leads on the surface of the semiconductor device chip with the external leads of the substrate or lead frame through heat, pressure and ultrasonic energy, so as to realize the electrical interconnection between the chip and the substrate and the information intercommunication between chips.

[0003] After the chip ball bonding on the lead frame, the lead frame needs to be inserted into the cassette orderly from the feeding end. At present, during the operation of the equipment, the discharging bracket is likely to shake the frame out of the cassette, resulting in wire collapse and frame deformation.

[0004] Aiming at the above-mentioned existing technology, it is expected to provide a chip frame discharging bracket that can effectively prevent the baffle from not being closed. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a chip frame discharging bracket that can effectively prevent the baffle from not being closed, which can effectively avoid the frame being shaken out of the cassette due to the baffle not being closed manually, resulting in wire collapse or frame deformation.

[0006] A chip frame discharging bracket that can effectively prevent the baffle from not being closed, comprising a frame body and a material blocking mechanism;

[0007] The bottom of the frame body has a bottom plate for receiving the cassette loaded with the lead frame;

[0008] One end of the frame body is the feeding end, and the other end is the discharging end;

[0009] There is a gap between the bottom of one side frame of the frame body and the bottom plate to form a discharging opening;

[0010] The material blocking mechanism is arranged on the frame of the discharging end;

[0011] The material blocking mechanism includes a baffle and a hinge;

[0012] The baffle is rotatably arranged on the frame body through the hinge, and a torsion spring is arranged on the hinge. One end of the torsion spring is connected to the frame of the discharging end of the frame body, and the other end is connected to the baffle.

[0013] Specifically, the hinge includes a rotating shaft, a first support plate, a second support plate and the torsion spring;

[0014] The first support plate and the second support plate are both rotatably arranged on the rotating shaft;

[0015] The first support plate is fixed on the frame at the border of the discharging end, and the second support plate is fixed on the baffle plate;

[0016] The torsion spring is sleeved on the middle part of the rotating shaft, and one end of the torsion spring is connected to the first support plate, and the other end is connected to the second support plate;

[0017] Two sleeves are symmetrically arranged on the first support plate. Both sleeves are parallel to the rotating shaft. One end of the two sleeves facing each other has an opening, and there is a gap between the two openings;

[0018] First springs are arranged in both sleeves, and the outer ends of the first springs are connected with steel balls;

[0019] An insertion plate is fixed at the position on the second support plate opposite to the gap.

[0020] Preferably, placing grooves are arranged on both sides of the insertion plate corresponding to the positions of the steel balls. When the insertion plate is inserted into the gap between the two openings, both steel balls are located in the placing grooves.

[0021] Preferably, a sensor is arranged on the border of the frame, and the sensor is directly above the hinge.

[0022] Preferably, a plurality of rollers are arranged on the inner side of the border of the frame.

[0023] Furthermore, a plurality of mounting holes are arranged at equal intervals along the vertical direction on the inner side of the border of the frame. Second springs are arranged in the mounting holes, and the rollers are arranged at the outer ends of the second springs.

[0024] Preferably, a profiling groove is arranged on the bottom plate.

[0025] A conveying device for a semiconductor chip mounting machine of the present utility model has the following advantages compared with the prior art:

[0026] (1) It can effectively avoid the frame shaking out of the material box due to the baffle not being closed manually, resulting in wire collapse or frame deformation;

[0027] (2) When the situation of stacked materials occurs in the equipment, the lead frame pushes out the material box to trigger the inductor, and the equipment alarms, effectively reducing the situation of stacked discharging materials. Brief Description of the Drawings

[0028] Figure 1 is a structural schematic diagram of a chip frame discharging support for effectively preventing the non-closure of the retaining bar in this embodiment Figure 1 ;

[0029] Figure 2 is a structural schematic diagram of the hinge in this embodiment;

[0030] Figure 3 It is a schematic structural diagram of the frame body in this embodiment;

[0031] Figure 4 It is a schematic structural diagram of a chip frame discharging bracket that can effectively prevent the baffle from not being closed in this embodiment Figure 2 。 Specific implementation manner

[0032] The following further describes the present invention in conjunction with the accompanying drawings and specific embodiments.

[0033] Such as Figure 1 shown, a chip frame discharging bracket that can effectively prevent the baffle from not being closed includes a frame body 1 and a material blocking mechanism.

[0034] The bottom of the frame body 1 has a bottom plate 2 for receiving the cassette loaded with the lead frame. One end of the frame body 1 is a feeding end 3, and the other end is a discharging end 4. There is a gap between the bottom of one side frame of the frame body 1 and the bottom plate 2 to form a discharging port 5.

[0035] The material blocking mechanism is arranged on the frame of the frame body 1 at the discharging end 4; the material blocking mechanism includes a baffle 6 and a hinge 7; the baffle 6 is rotatably arranged on the frame body 1 through the hinge 7, and a torsion spring 8 is arranged on the hinge 7. One end of the torsion spring 8 is connected to the frame of the discharging end 4 on the frame body 1, and the other end is connected to the baffle 6; thus arranged, when the staff needs to inspect the lead frame in the cassette, open the baffle 6, and after taking out the lead frame, the baffle 6 will automatically reset under the elastic action of the torsion spring 8.

[0036] In this embodiment, such as Figure 2As shown in the figure, the hinge 7 includes a rotating shaft 9, a first support plate 10, a second support plate 11, and the torsion spring 8. The first support plate 10 and the second support plate 11 are both rotatably arranged on the rotating shaft 9. The first support plate 10 is fixed on the frame 1 at the border of the discharging end 4, and the second support plate 11 is fixed on the baffle 6. The torsion spring 8 is sleeved on the middle part of the rotating shaft 9, and one end of the torsion spring 8 is connected to the first support plate 10, and the other end is connected to the second support plate 11. Two sleeves 12 are symmetrically arranged on the first support plate 10. Both sleeves 12 are parallel to the rotating shaft 9. One end of the two sleeves 12 facing each other has an opening, and there is a gap 13 between the two openings. First springs (not shown in the figure) are arranged in both sleeves 12, and the outer ends of the first springs are connected with steel balls 14. A plug plate 15 is fixed at the position on the second support plate 11 corresponding to the gap. With such a setting, when the baffle 6 is in the closed state, the plug plate 15 is inserted into the gap 13 between the two openings, and the steel balls 14 on both sides of the plug plate 15 are both pressed against the plug plate 15 under the elastic force of the connected first springs, so that the baffle 6 firmly blocks the discharging end 4 of the frame 1. When it is necessary to open the baffle 6, the staff rotates the baffle 6, takes out the lead frame to be sampled in the material box, then releases the baffle 6. Under the elastic force of the torsion spring 8, the baffle 6 resets, and the plug plate 15 on the second support plate 11 is inserted into the gap 13 between the two openings.

[0037] Further, as Figure 2 shown, placing grooves 16 are arranged on both sides of the plug plate 15 corresponding to the positions of the steel balls 14. When the plug plate 15 is inserted into the gap 13 between the two openings, both steel balls 14 are located in the placing grooves 16, which further prevents the baffle 6 from being opened due to vibration.

[0038] In this embodiment, a sensor 17 is arranged on the border of the frame 1, and the sensor 17 is located directly above the hinge 7. When the baffle 6 is opened, the sensor 17 will send a signal to an external controller, which is convenient for the staff to observe whether the baffle 6 is opened during sampling inspection or is opened by vibration.

[0039] In this embodiment, a plurality of rollers 18 are arranged on the inner side of the border of the frame 1 to reduce the friction between the material box and the inner wall of the frame 1.

[0040] Further, as Figure 3 shown, a plurality of mounting holes 19 are arranged at equal intervals along the vertical direction on the inner side of the border of the frame 1. Second springs (not shown in the figure) are arranged in the mounting holes 19. As Figure 4 shown, the rollers 18 are arranged at the outer end parts of the second springs. With such a setting, it not only plays a guiding role for the material box, but also facilitates the up and down movement of the material box.

[0041] When the above-mentioned discharging support is in use, an empty material box is placed on the manipulator of the vertical lifting mechanism. One end of the material box faces the feeding end 3 of the frame body 1, and the other end faces the discharging end 4 of the frame body 1. The lead frame after ball bonding is orderly conveyed into the material box, and the baffle 6 plays a role in blocking the material at the other end of the material box. When the material box is loaded, the external vertical lifting mechanism descends, places the material box on the bottom plate 2, and the staff can take out the material box from the discharging port.

[0042] In this embodiment, as Figure 3 shown, the bottom plate 2 is provided with a profiling groove 20 to facilitate the manipulator to stably place the material box on the bottom plate.

[0043] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A chip frame discharging bracket that effectively prevents the baffle from not being closed, characterized in that, It includes a frame body and a material blocking mechanism; The bottom of the frame body has a bottom plate for receiving the cartridge loaded with the lead frame; One end of the frame body is the feeding end, and the other end is the discharging end; There is a spacing between the bottom of one side frame of the frame body and the bottom plate to form a discharging port; The material blocking mechanism is arranged on the frame body on the frame at the discharging end; The material blocking mechanism includes a baffle and a hinge; The baffle is rotatably arranged on the frame body through the hinge, a torsion spring is arranged on the hinge, one end of the torsion spring is connected to the frame at the discharging end, and the other end is connected to the baffle.

2. The chip frame discharging support for effectively preventing the baffle from not being closed as claimed in claim 1, wherein, The hinge includes a rotating shaft, a first support plate, a second support plate and the torsion spring; Both the first support plate and the second support plate are rotatably arranged on the rotating shaft; The first support plate is fixed on the frame at the discharging end of the frame body, and the second support plate is fixed on the baffle; The torsion spring is sleeved on the middle part of the rotating shaft, and one end of the torsion spring is connected to the first support plate, and the other end is connected to the second support plate; Two sleeves are symmetrically arranged on the first support plate, both sleeves are parallel to the rotating shaft, one end of the two sleeves facing each other has an opening, and there is a gap between the two openings; A first spring is arranged in each of the two sleeves, and a steel ball is connected to the outer end of the first spring; An insertion plate is fixed at a position on the second support plate corresponding to the gap; 3. The chip frame discharging support for effectively preventing the baffle from not being closed as claimed in claim 2, wherein Placing grooves are arranged on both sides of the insertion plate corresponding to the positions of the steel balls. When the insertion plate is inserted into the gap between the two openings, both steel balls are located in the placing grooves.

4. The chip frame discharging bracket for effectively preventing the baffle from not being closed as claimed in claim 1, wherein, A sensor is arranged on the frame of the frame body, and the sensor is located directly above the hinge; 5. An output support for a chip frame that effectively prevents the baffle from not being closed, characterized in that, A number of rollers are arranged inside the frame of the frame body; 6. The chip frame discharging support for effectively preventing the baffle from not being closed as claimed in claim 5, wherein A number of mounting holes are arranged at equal intervals along the vertical direction inside the frame of the frame body, a second spring is arranged in the mounting holes, and the rollers are arranged at the outer end of the second spring; 7. An output support for a chip frame that effectively prevents the baffle from not being closed, as described in any one of claims 1 to 6, characterized in that, A profiling groove is arranged on the bottom plate.

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