Wafer reversing device for taking test silicon wafer

Abstract

The utility model provides a wafer reversing device for taking test silicon wafers, which relates to the technical field of auxiliary devices for semiconductor silicon wafer production, and comprises a platform for accommodating silicon wafer baskets, the silicon wafer baskets comprise a wafer basket to be reversed and a wafer leading-in basket; a first groove structure extends from one end of the platform to the inner side of the platform; the wafer reversing mechanism comprises a movable main body and a pushing piece connected to one side of the movable main body, the movable main body can move along the platform, a pushing plate is arranged at the end of the pushing piece, and the pushing plate can extend into the wafer basket to be subjected to wafer reversing along the first groove structure to push part of the silicon wafers in the wafer basket to be subjected to wafer reversing into the wafer leading-in basket. The utility model has the beneficial effects that the test silicon wafer can be quickly and efficiently taken, and the problems that the silicon wafer is easily damaged, errors are easily made, slot positions are not corresponding and the like caused by manual operation by using a suction pen are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of auxiliary devices for semiconductor silicon wafer production, in particular to an inverting device for taking test silicon wafers. Background Art

[0002] Before the acid etching operation of semiconductor silicon wafers, 5 silicon wafers need to be taken out from a full wafer basket and put into a new wafer basket, and then enter the equipment for test operation. Only when the test is problem-free can the normal acid etching operation start.

[0003] The existing inverting basket equipment can only achieve full basket inverting, and cannot select only a few of them for inverting basket operation, thus unable to meet the requirement of only inverting a few wafers in the test use scenario.

[0004] Currently, the method for taking test silicon wafers is as follows: manually use a suction pen to suck 5 times from a full wafer basket, a total of 5 wafers are sucked out and put into a new wafer basket.

[0005] There are problems of high requirements for employees' operations, easy damage to silicon wafers, and easy occurrence of problems such as non-corresponding quantity and slot positions during the inverting basket operation, which affect the corresponding management of silicon wafers, increase the work content of employees, and result in low efficiency. Summary of the Utility Model

[0006] The purpose of the utility model is to provide an inverting device for taking test silicon wafers, so as to solve the technical problems existing in the prior art that manually using a suction pen to suck silicon wafers has high requirements for employees' operations, is easy to damage silicon wafers, and is prone to problems such as non-corresponding quantity and slot positions during the inverting basket operation, which affect the corresponding management of silicon wafers, increase the work content of employees, and result in low efficiency. The many technical effects that can be produced by the preferred technical solution among the many technical solutions provided by the utility model are elaborated below.

[0007] To achieve the above purpose, the utility model provides the following technical solutions:

[0008] An inverting device for taking test silicon wafers provided by the utility model includes:

[0009] A platform for accommodating a silicon wafer basket, the silicon wafer basket including a to-be-inverted wafer basket and an imported wafer basket; a first groove structure is provided extending from one end of the platform towards the inside of the platform.

[0010] An inverting mechanism, including a movable main body and a pushing member connected to one side of the movable main body. The movable main body can move along the platform, and a push plate is provided at the end of the pushing member. The push plate can extend into the to-be-inverted wafer basket along the first groove structure to push some silicon wafers inside it into the imported wafer basket.

[0011] Preferably, it further includes a comb-tooth type wafer mapping sensor, wherein:

[0012] A second groove structure is provided extending inward from the other end of the platform along the platform.

[0013] The comb-shaped wafer mapping sensor is connected to the other side of the movable body, and the comb-shaped wafer mapping sensor can move within the second groove structure for monitoring the information of the silicon wafers in the loading cassette.

[0014] Preferably, the push plate and the pushing member are detachably connected.

[0015] Preferably, the push plate includes a fixed part and an adjusting part movably connected to the fixed part. The fixed part is connected to the end of the pushing member. The adjusting part includes at least one group, and the adjusting part can expand and contract along the end of the fixed part.

[0016] Preferably, the wafer inverting mechanism further includes an inverting rod connected to the movable body.

[0017] Preferably, the pushing member includes a "U"-shaped structure. One end of the "U"-shaped structure is connected to one side of the movable body, and the push plate is provided at the other end of the "U"-shaped structure.

[0018] Preferably, a first cassette accommodating position and a second cassette accommodating position are symmetrically provided on the surface of the platform, where:

[0019] The first cassette accommodating position is for accommodating the cassette to be inverted; the second cassette accommodating position is for accommodating the loading cassette.

[0020] RFID is provided in both the first cassette accommodating position and the second cassette accommodating position.

[0021] Preferably, a chute / slider is provided at the top of the movable body, and a slider / chute for mating connection with the chute / slider is provided at the bottom of the platform.

[0022] Preferably, the length of the second groove structure is not greater than the length of the first groove structure.

[0023] The wafer - inverting device for taking test wafers provided by the present utility model includes a platform and a wafer - inverting mechanism. The platform is used to accommodate the wafer basket to be inverted and the import wafer basket. A first groove structure is provided extending from one end of the platform towards the inner side of the platform, and the wafer basket to be inverted is arranged close to the first groove structure. The wafer - inverting mechanism includes a movable body and a pushing member connected to one side of the movable body. The movable body can move along the platform. A push plate is arranged at the end of the pushing member. When the movable body moves along the platform, the pushing member connected thereto moves along with the movable body, and thus the push plate arranged at the end of the pushing member moves along the first groove structure, pushing the wafers required for testing from the wafer basket to be inverted into the import wafer basket. It can quickly and efficiently take test wafers, avoiding problems such as easy damage to wafers, easy errors, and slot misalignment caused by manual operation with a suction pen. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following - described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0025] Figure 1 is a schematic structural diagram of an embodiment of the wafer - inverting device for taking test wafers of the present utility model;

[0026] Figure 2 is a schematic structural diagram of the wafer - inverting device for taking test wafers of the present utility model during use;

[0027] Figure 3 is a schematic structural diagram of the wafer - inverting mechanism in the wafer - inverting device for taking test wafers of the present utility model;

[0028] Figure 4 is Figure 1 a top - view structural diagram of;

[0029] Figure 5 is a schematic structural diagram of the bottom of the platform in the wafer - inverting device for taking test wafers of the present utility model;

[0030] Figure 6 is a schematic structural diagram of the push plate in the third embodiment of the wafer - inverting device for taking test wafers of the present utility model.

[0031] In the figure: 1. Platform; 10. Slide block; 11. First groove structure; 12. Second groove structure; 101. First wafer - basket accommodation position; 102. Second wafer - basket accommodation position; 103. RFID;

[0032] 2. Film Rewinding Mechanism; 21. Movable Body; 211. Slide Groove; 22. Pushing Member; 23. Pushing Plate; 231. Fixed Portion; 232. Adjusting Portion; 24. Film Rewinding Rod

[0033] 3. Silicon Wafer Basket; 31. Basket for Wafers to be Rewound; 32. Import Basket

[0034] 4. Comb Tooth Type Wafer Mapping Sensor Detailed Implementation Manner

[0035] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other implementation manners obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the scope protected by the present utility model.

[0036] Embodiment 1

[0037] Figure 1 is a structural schematic diagram of this embodiment, Figure 2 is a structural schematic diagram when this embodiment is in use, as Figure 1 and Figure 2 shown, this embodiment provides a film rewinding device for taking test silicon wafers, including a platform 1 and a film rewinding mechanism 2.

[0038] Among them, the platform 1 is used to accommodate the silicon wafer basket 3, and the silicon wafer basket 3 includes a basket 31 for wafers to be rewound and an import basket 32; a first groove structure 11 is provided extending from one end of the platform 1 towards the inner side of the platform. In this embodiment, the basket 31 for wafers to be rewound is arranged close to the first groove structure 11.

[0039] The film rewinding mechanism 2 includes a movable body 21 and a pushing member 22 connected to one side of the movable body 21. The movable body 21 can move along the platform 1, and a pushing plate 23 is provided at the end of the pushing member 22. The pushing plate 23 can extend into the interior of the basket 31 for wafers to be rewound along the first groove structure 11 to push some of the silicon wafers inside it into the import basket 32.

[0040] Specifically, by moving the movable body 21 along the platform 1, the pushing member 22 connected thereto is driven to move along with the movable body 21, so that the pushing plate 23 provided at the end of the pushing member 22 moves along the first groove structure 11, and the silicon wafers required for testing are pushed from the basket 31 for wafers to be rewound into the import basket 32. During use, the width of the pushing plate 23 can be set to be the same as the size occupied by the number of silicon wafers required for testing to be taken in the basket 31 for wafers to be rewound. With such a setting, the test silicon wafers can be taken quickly and efficiently by operating the film rewinding mechanism 2, avoiding problems such as easy damage to the silicon wafers, easy errors, and slot misalignment caused by manual operation with a suction pen.

[0041] As an alternative embodiment, the wafer flipping device for picking up the test wafer further includes a comb-type wafer mapping sensor 4.

[0042] Specifically, a second groove structure 12 is formed extending from the other end of the platform 1 towards the inside of the platform 1; the comb-type wafer mapping sensor 4 is connected to the other side of the movable body 21, and the comb-type wafer mapping sensor 4 can move within the second groove structure 12 for monitoring the information of the wafers in the loading cassette 32.

[0043] In this embodiment, a comb-type wafer mapping sensor of model ASW-SG is adopted to facilitate better monitoring of the wafer information in the loading cassette 32. During actual production and use, the comb-type wafer mapping sensor 4 can be connected to the control system to conveniently report operation data in a timely and efficient manner when in use.

[0044] In this embodiment, the length of the second groove structure 12 is not greater than the length of the first groove structure 11, so as to facilitate smooth wafer flipping while enabling better monitoring.

[0045] As an alternative embodiment, Figure 3 is a schematic structural diagram of the wafer flipping mechanism in this embodiment, as Figure 3 shown, the wafer flipping mechanism 2 further includes a wafer flipping rod 24, and the wafer flipping rod 24 is connected to the movable body 21. By providing the wafer flipping rod 24, it is convenient to operate by holding the wafer flipping rod 24, making it more convenient to use.

[0046] Specifically, the pushing member 22 includes a "U" - shaped structure, one end of the "U" - shaped structure is connected to one side of the movable body 21, and a push plate 23 is provided at the other end of the "U" - shaped structure.

[0047] As an alternative embodiment, Figure 4 is Figure 1 a top - view structural schematic diagram of Figure 4 as shown, first cassette accommodating positions 101 and second cassette accommodating positions 102 are symmetrically arranged on the surface of the platform 1.

[0048] Among them, the first cassette accommodating position 101 is used to accommodate the wafer cassette 31 to be flipped; the second cassette accommodating position 102 is used to accommodate the loading cassette 32; RFID 103 is provided in both the first cassette accommodating position 101 and the second cassette accommodating position 102. By providing the RFID, the control system can read the information of the wafer cassette 31 to be flipped and the loading cassette 32, so as to facilitate information management and processing.

[0049] As an alternative embodiment, a chute / slider is provided at the top of the movable body 21, and a slider / chute for mating connection with the chute / slider is provided at the bottom of the platform 1. The chute and the slider can adopt an "I"-shaped structure or other structures with a limiting effect to prevent slippage during use.

[0050] Figure 5 is a schematic diagram of the structure at the bottom of the platform in this embodiment. As shown in Figure 4 and Figure 5 In this embodiment, a chute 211 is provided at the top of the movable body 21, and a slider 10 for mating connection with the chute 211 is provided at the bottom of the platform 1. Through the cooperation of the chute 211 and the slider 10, the sliding of the movable body 21 relative to the platform 1 can be made smoother. At the same time, the slider 10 plays a limiting role to prevent the movable body 21 from deviating or slipping off.

[0051] Embodiment Two

[0052] Different from Embodiment One, in this embodiment, to improve the applicable range of this wafer-inverting device for taking test wafers, the push plate 23 and the pushing member 22 are detachably connected. With this setting, the push plate 23 can be replaced according to different test requirements to facilitate taking wafers in different numbers.

[0053] Embodiment Three

[0054] Different from Embodiment One and Embodiment Two, Figure 6 is a schematic diagram of the structure of the push plate in this embodiment. As shown in Figure 6 the push plate 23 includes a fixed part 231 and an adjusting part 232 movably connected to the fixed part 231. The fixed part 231 is connected to the end of the pushing member 22. The adjusting part 232 includes at least one group, and the adjusting part 232 can extend and retract along the end of the fixed part 231. With this setting, the push plate 23 can be adjusted through the adjusting part 232 according to different test requirements to facilitate taking wafers in different numbers.

[0055] In this embodiment, two groups of adjusting parts 232 are symmetrically arranged on both sides of the fixed part 231 to evenly increase the same distance on both sides of the fixed part and make the overall force more balanced.

[0056] Of course, in some embodiments, the adjusting part 232 can also be arranged on one side of the fixed part 231.

[0057] As described above, the above are only the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claimed rights.

Claims

1. An inverting device for picking up a test silicon wafer, characterized in that, Comprising: A platform for accommodating a silicon wafer carrier basket, the silicon wafer carrier basket including a wafer to be inverted carrier basket and an introduced wafer carrier basket; a first groove structure is provided extending from one end of the platform towards the inner side of the platform. An inverting mechanism, including a movable body and a pushing member connected to one side of the movable body, the movable body being capable of moving along the platform, a push plate being provided at the end of the pushing member, and the push plate being capable of extending into the interior of the wafer to be inverted carrier basket along the first groove structure to push some of the silicon wafers inside it into the introduced wafer carrier basket.

2. The wafer inversion device for taking test wafers according to claim 1, characterized in that: It further includes a comb-shaped wafer mapping sensor, wherein: A second groove structure is provided extending from the other end of the platform towards the inner side of the platform. The comb-shaped wafer mapping sensor is connected to the other side of the movable body, and the comb-shaped wafer mapping sensor is capable of moving within the second groove structure for monitoring the silicon wafer information in the introduced wafer carrier basket.

3. The wafer inversion device for picking up test wafers according to claim 1 or 2, characterized in that: The push plate and the pushing member are provided as detachably connected.

4. A wafer inversion device for picking up test wafers according to claim 1 or 2, characterized in that: The push plate includes a fixed part and an adjusting part movably connected to the fixed part, the fixed part being connected to the end of the pushing member, the adjusting part including at least one group, and the adjusting part being capable of telescoping along the end of the fixed part.

5. A wafer inversion device for taking a test wafer according to claim 1 or 2, characterized in that: The inverting mechanism further includes an inverting rod connected to the movable body.

6. The wafer inversion device for picking up test wafers according to claim 1 or 2, characterized in that: The pushing member includes a "U"-shaped structure, one end of the "U"-shaped structure being connected to one side of the movable body, and the push plate being provided at the other end of the "U"-shaped structure.

7. A wafer inversion device for picking up a test wafer according to claim 1 or 2, characterized in that: First and second carrier basket accommodating positions are symmetrically provided on the surface of the platform, wherein: The first carrier basket accommodating position is for accommodating the wafer to be inverted carrier basket; the second carrier basket accommodating position is for accommodating the introduced wafer carrier basket. RFID is provided in both the first carrier basket accommodating position and the second carrier basket accommodating position.

8. A wafer inversion device for taking a test wafer according to claim 1 or 2, characterized in that: A chute / slider is provided at the top of the movable body, and a slider / chute for mating connection with the chute / slider is provided at the bottom of the platform.

9. A wafer inversion device for picking up test wafers according to claim 2, characterized in that: The length of the second groove structure is not greater than the length of the first groove structure.

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