Chip bearing device, chip assembly and gene sequencer

Abstract

The utility model discloses a chip bearing device, a chip assembly and a gene sequencer, and the chip bearing device comprises a heat conduction seat which is provided with a pedestal and a boss, and the back surface of a sequencing chip is adsorbed on the surface of the boss; a second protruding part is arranged on the surface of the liquid path port, and the second protruding part penetrates through the base; under the condition that the chip assembly is mounted on the surface of the heat conducting seat, the first protruding part is matched with the second protruding part, so that the sealing piece is propped against the second protruding part; and the temperature control assembly is arranged below the heat conducting seat and is used for controlling the temperature of the heat conducting seat. In the application, the base extends outwards around the periphery of the boss, the second protruding part can penetrate through the base of the heat conducting seat, and the sealing element in the first protruding part can be aligned with the second protruding part under the condition that the first protruding part extrudes downwards, so that the problem that the positioning precision between the sequencing chip and the liquid path port is not reliable in the prior art is solved.

Description

Technical Field

[0001] This application belongs to the technical field of in vitro diagnostic instruments, and particularly relates to a chip carrier device, a chip assembly, and a gene sequencer. Background Art

[0002] When a gene sequencer is in use, reagents and samples need to be transported to a sequencing chip through pipelines and pump valves, and the sequencing chip provides a "reaction site" for sequencing. To avoid direct contact between the operator and the sequencing chip during the chip loading process, the chip is usually carried in a chip clamping outer frame to form a chip assembly, and the chip assembly is assembled and fixed on a stage as a disposable consumable.

[0003] Figure 1 FIG. is a schematic structural diagram of a stage provided by the prior art. Liquid path ports 02 are provided on both sides of the heat conduction base 01 along the length direction. As Figure 2 shown, elastic limiters 03 are provided on the side surfaces of the liquid path ports 02. After the chip assembly is assembled and fixed on the stage surface, vacuum adsorption is started. Under the action of the vacuum adsorption, the sequencing chip and the heat conduction base are in a pressed state. At the same time, both ends of the sequencing chip are pressed down. Under the action of the elastic limiters 03, the openings of the chip flow channels are pressed against the liquid path ports 02, so as to connect the sequencing chip and the liquid path ports 02.

[0004] In order to keep the liquid path ports 02 finely adjusted in height under the action of the elastic limiters 03, a certain gap needs to be provided between them and the heat conduction base 01. However, when the elastic limiters 03 are in a compressed state, the surfaces of the liquid path ports 02 may be slightly inclined. In this case, it is easy to have a problem that the positioning accuracy between the liquid path ports and the flow channel openings of the sequencing chip is unreliable, resulting in gas entering the pipeline, and further affecting the photographing process after the sequencing reaction. Utility Model Content

[0005] This application discloses a chip carrier device, a chip assembly, and a gene sequencer to solve the problem of poor sealing between the sequencing chip and the liquid path ports existing in the prior art.

[0006] In a first aspect of this application, a chip carrier device is provided. The device is used to carry a chip assembly. The chip assembly includes a sequencing chip, a chip clamping outer frame, and a seal. The chip clamping outer frame has a body and a sinking part that sinks relative to the body. The sinking part is used to carry the sequencing chip, and a first protrusion for installing the seal is provided on the bottom surface of the sinking part;

[0007] The chip carrier device includes:

[0008] A heat conduction base having a base and a convex platform protruding from the surface of the base. The base and the convex platform are integrally formed, and the back surface of the sequencing chip is adsorbed on the surface of the convex platform;

[0009] A liquid path port, on the surface of which a second protrusion is provided. The liquid path port is arranged below the heat conducting base, and the second protrusion penetrates through the base; when the chip assembly is installed on the surface of the heat conducting base, the first protrusion cooperates with the second protrusion so that the seal is abutted against the second protrusion;

[0010] A temperature control component, arranged below the heat conducting base, for controlling the temperature of the heat conducting base.

[0011] Optionally, the inner diameter of the first protrusion is larger than the outer diameter of the second protrusion so that the first protrusion is sleeved outside the second protrusion.

[0012] Optionally, a plurality of positioning pins are arranged on the base, and at least one of the plurality of positioning pins is not on the same straight line as other positioning pins. The positioning pins cooperate with through holes opened on the chip clamping outer frame.

[0013] Optionally, the internal fluid channel of the liquid path port is a two-in-one L-shaped channel. The L-shaped channel includes two first channels that are in contact with the seal and a second channel that is communicated after the two first channels converge. The second channel is perpendicular to the plane formed by the central axes of the two first channels, and the second channel is used to connect with a liquid path joint.

[0014] Optionally, the temperature control component includes:

[0015] A Peltier;

[0016] A liquid cooling end cover, arranged below the Peltier, for performing heat exchange with the Peltier;

[0017] An elastic mechanism, including a guide shaft, a heat insulation pad sleeved outside the guide shaft, and an elastic member. The heat insulation pad is used to limit the liquid cooling end cover from detaching from the Peltier. One end of the elastic member abuts against the heat insulation pad, and the other end contacts the lower end surface of the guide shaft. When the Peltier heats and expands, the liquid cooling end cover slides downward along the guide shaft.

[0018] In the second aspect of the present application, a chip assembly is provided, including: a sequencing chip, a chip clamping outer frame, and a seal. The chip clamping outer frame has a body and a sunken portion that sinks relative to the surface of the body. The sunken portion is used to carry the sequencing chip, and a first protrusion for installing the seal is arranged on the bottom surface of the sunken portion.

[0019] Optionally, a step is arranged between the sunken portion and the body, and a third protrusion is arranged on the side surface of the step. The third protrusion is used to abut against the side surface of the sequencing chip.

[0020] Optionally, the sequencing chip is provided with a plurality of flow channels, and openings are provided at the ports of each flow channel, and the position of the first protrusion corresponds to the opening.

[0021] Optionally, bumps are provided on the inner wall of the first protrusion, and protrusions are provided on the outside of the seal, and the bumps are used to support the protrusions.

[0022] In a third aspect of the present application, a gene sequencer is provided, including the chip carrier device provided in any implementation manner of the first aspect, and the chip carrier device is used to carry the chip assembly provided in any implementation manner of the second aspect.

[0023] It can be seen from the above technical solutions that in the chip carrier device provided in the present application, the base extends outward around the boss, and the second protrusion can penetrate the base of the heat conduction seat. When the first protrusion is pressed downward, the seal inside the first protrusion can be aligned with the second protrusion, solving the problem of unreliable positioning accuracy between the sequencing chip and the liquid path port in the prior art. Description of the Drawings

[0024] Figure 1 Schematic diagram of the stage structure provided by the prior art;

[0025] Figure 2 Schematic diagram of the structure of the liquid path port provided by the prior art;

[0026] Figure 3 Schematic diagram of the structure of the chip carrier device provided by the embodiment of the present application;

[0027] Figure 4 Exploded structure diagram of the chip assembly provided by the embodiment of the present application;

[0028] Figure 5 Cross-sectional view of the chip assembly provided by the embodiment of the present application;

[0029] Figure 6 Cross-sectional view of the chip carrier device provided by the embodiment of the present application along the width direction;

[0030] Figure 7 For Figure 6 Enlarged structure diagram of part a in

[0031] Figure 8 Cross-sectional view of the chip carrier device provided by the embodiment of the present application along the length direction;

[0032] Figure 9 Exploded structure diagram of the temperature control component provided by the embodiment of the present application;

[0033] Figure 10A cross-sectional view of the chip carrier device provided by the embodiment of the present application along another width direction.

[0034] Reference numerals: 01 - heat conduction base; 02 - liquid path port; 03 - elastic limiting member; 1 - chip assembly; 11 - sequencing chip; 12 - chip clamping outer frame; 13 - seal; 121 - body; 122 - sunken part; 123 - first protrusion; 124 - step; 125 - third protrusion; 111 - flow channel; 112 - opening; 1231 - bump; 131 - protrusion; 14 - upper left shell; 15 - upper right shell; 2 - heat conduction base; 21 - base; 22 - boss; 211 - positioning pin; 3 - liquid path port; 31 - second protrusion; 32 - first channel; 33 - second channel; 4 - temperature control assembly; 41 - Peltier; 42 - liquid cooling end cover; 43 - elastic mechanism; 421 - upper liquid cooling end cover; 422 - lower liquid cooling end cover; 431 - guide shaft; 432 - heat insulation pad; 433 - elastic member. Detailed implementation manners

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely below. Apparently, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0036] The present application provides a chip carrier device for carrying a chip assembly. In the prior art, a sequencing chip and a plastic clamping outer frame are assembled and fixed as a disposable consumable to form a chip assembly, and a seal is fixed on the liquid path port. When the chip assembly is installed on the carrier, an external force is used to squeeze and align the opening of the flow channel on the sequencing chip with the seal on the liquid path port to form a liquid path. However, since the liquid path port is arranged on one side of the heat conduction base and is a separated design, when there is a slight inclination on the surface of the liquid path port, it is easy to have a problem that the positioning accuracy between the sequencing chip and the liquid path port is unreliable.

[0037] Based on this, referring to Figure 3 the structural schematic diagram shown, this embodiment provides a new chip carrier device (i.e., a carrier) and a chip assembly cooperating with the chip carrier device. Referring to Figure 4 and Figure 5 the structural schematic diagrams shown, the chip assembly 1 includes a sequencing chip 11, a chip clamping outer frame 12, and a seal 13. The chip clamping outer frame 12 has a body 121 and a sunken part 122 sunken relative to the body 121. The sunken part 122 is used to carry the sequencing chip 11, and a first protrusion 123 for installing the seal 13 is provided on the bottom surface of the sunken part 122.

[0038] AsFigure 3 As shown, the chip carrier device includes: a heat-conducting base 2 having a base 21 and a boss 22 protruding from the surface of the base 21, the base 21 and the boss 22 being integrally formed, and the back surface of the sequencing chip 11 being adsorbed on the surface of the boss 22; a liquid path port 3 having a second protrusion 31 on its surface, the liquid path port 3 being disposed below the heat-conducting base 2, and the second protrusion 31 penetrating through the base 21; when the chip assembly 1 is mounted on the surface of the heat-conducting base 2, the first protrusion 123 cooperates with the second protrusion 31 so that the seal 13 abuts against the second protrusion 31; a temperature control component 4 disposed below the heat-conducting base 2 for controlling the temperature of the heat-conducting base 2.

[0039] The sequencing chip is usually provided with at least two flow channels. In order to transport reagents and samples to each flow channel for reaction, liquid path ports 3 are respectively disposed at both ends of the sequencing chip. The liquid path port 3 is usually a one-to-N joint, and the number of N is the same as the number of flow channels on the sequencing chip. One end of the liquid path port is communicated with a pipeline for transporting fluid, and the other end is communicated with the flow channel opening of the sequencing chip. In the chip carrier device provided in this embodiment, the base 21 extends outward around the boss 22, the second protrusion 31 can penetrate through the base 21 of the heat-conducting base 2, and a small clearance fit is provided between the second protrusion 31 and the through hole in the base 21. The second protrusion 31 abuts against the bottom of the base 21 under the action of a spring; when the first protrusion 123 is pressed downward, the seal 13 inside the first protrusion 123 can be aligned with the second protrusion 31, solving the problem of unreliable positioning accuracy between the sequencing chip and the liquid path port in the prior art.

[0040] Furthermore, since the temperature of the heat-conducting base 2 is relatively high during operation, in the case where the seal is fixed to the liquid path port in the prior art, the seal is prone to aging. In this embodiment, the seal is provided as a disposable consumable on the chip assembly, which can avoid this problem and is relatively convenient to maintain.

[0041] In this embodiment, the bottom surface of the sinking portion 122 is parallel to the bottom surface of the body 121, and the first protrusion 123 protrudes downward relative to its bottom surface. Regarding the heat-conducting base 2, the boss 22 is located in the middle of the base 21 and protrudes upward relative to the base 21. The first protrusion 123 is annular, and the second protrusion 31 is cylindrical. The cooperation between the first protrusion 123 and the second protrusion 31 can have the following two forms:

[0042] In the first form, the end of the seal 13 is flush with the end of the first protrusion 123 or the seal 13 slightly protrudes a small part. The outer diameter of the first protrusion 123 is equal to the outer diameter of the second protrusion 31. When the chip clamping outer frame is pressed down, the first protrusion 123 and the second protrusion 31 are aligned, and the seal 13 located inside the first protrusion 123 can be aligned with the second protrusion 31. It can be understood that here "alignment" mainly means the alignment of the opening of the seal 13 and the opening of the second protrusion 31, which will not be elaborated below.

[0043] The second form is as Figure 6 and Figure 7 shown. The inner diameter of the first protrusion 123 is larger than the outer diameter of the second protrusion 31 so that the first protrusion 123 is sleeved outside the second protrusion 31, and then the seal 13 located inside the first protrusion 123 can be aligned with the second protrusion 31.

[0044] In this embodiment, after the chip component is placed on the stage and positioned, the vacuum adsorption control switch is turned on. The sequencing chip is adsorbed on the plane of the heat conduction seat under the action of the vacuum adsorption force. The lower end of the seal 13 is completely attached to the second protrusion 31 at the upper end of the liquid path port 3, and the seal 13 on the chip component is in interference fit with the second protrusion 31 by the vacuum adsorption force, causing the seal 13 to deform, so that the seal 13 and the liquid path port 3 maintain a sealed contact surface without liquid leakage under the action of the vacuum adsorption force. Further, when the chip component is placed on the table, the first protrusion 123 contacts the table. In this embodiment, the bottom surface of the seal 13 is concave inside the first protrusion 123 to avoid contamination caused by the seal 13 directly contacting the table.

[0045] In the above two forms, in the first form, if there is no strict positioning, deviation may occur, resulting in deviation in "alignment". Therefore, in this embodiment, the alignment method of the second form is selected. In this form, the process of the first protrusion 123 being sleeved outside the second protrusion 31 is the positioning process, which further increases the positioning accuracy between the sequencing chip and the liquid path port.

[0046] Before the above precise positioning, this embodiment first performs a rough positioning, as Figure 3 shown. The implementation method is as follows: A plurality of positioning pins 211 are provided on the base 21. At least one of the plurality of positioning pins 211 is not on the same straight line as other positioning pins. The positioning pins 211 cooperate with the through holes opened on the chip clamping outer frame 12.

[0047] In a feasible way, three positioning pins are provided on the base 21. Two of the positioning pins are arranged along the length direction of the base, and the other positioning pin is arranged in the width direction of the base 21. The three positioning pins form "three-point positioning".

[0048] It should be noted here that in the case of the assembly of the chip component and the chip carrier device, the direction along the chip flow channel is the length direction, and on the surface of the carrier stage, the direction perpendicular to the length direction is the width direction.

[0049] In this embodiment, in addition to having the second protrusion 31, the liquid path port 3 also has a passage for fluid transportation inside. The lower passage of the liquid path port 3 has a thread feature. The liquid path joint is connected to the lower passage of the liquid path port through a thread pair. The liquid path joint is connected to the liquid path pipe. The other end of the liquid path pipe has the same liquid path joint for connecting to other external pump valves. The liquid path pipes inside the carrier stage are orderly connected to the external pump valves.

[0050] Figure 8 It is a cross-sectional view of the chip carrier device along the length direction. The internal fluid channel of the liquid path port 3 is an L-shaped channel with two inlets converging into one. The L-shaped channel includes two first channels 32 that abut against the seal and a second channel 33 that is connected after the two first channels converge. The second channel 33 is perpendicular to the plane formed by the central axes of the two first channels 32. The second channel is used to connect to the liquid path joint, so that the connection between the liquid path port 3 and the liquid path joint is in a horizontal state. Compared with the vertical state in the traditional technology, the horizontal state is more reliable and is not likely to loosen or even fall off during the movement of the carrier device.

[0051] Refer to Figure 9 and Figure 10 According to the structural schematic diagram shown, the temperature control component 4 includes: a Peltier 41; a liquid cooling end cover 42 disposed below the Peltier 41 for heat exchange with the Peltier 41; an elastic mechanism 43 including a guide shaft 431, a heat insulation pad 432 sleeved outside the guide shaft 431, and an elastic member 433. The heat insulation pad 432 is used to isolate temperature conduction to prevent direct contact between the hot and cold ends. One end of the elastic member 433 abuts against the heat insulation pad 432, and the other end contacts the lower end surface of the guide shaft 431. When the Peltier 41 heats up and expands, the liquid cooling end cover 42 slides downward along the guide shaft.

[0052] During the sequencing process, reaction substances such as reagents and enzymes in the chip need to react within a specific temperature range, and different reaction substances and enzymes have different temperature conditions for the reaction. Further, during the sequencing and photographing process, the internal temperature of the chip needs to be reduced to within the range of 20°C to 25°C at room temperature. Moreover, the heat conduction base needs to have a function of cyclic temperature rise and fall, and the Peltier (TEC) can well meet this functional requirement. When an electric current is passed, one end of the TEC generates a "heating" phenomenon, and the other end generates a "cooling" phenomenon. When the direction of the electric current is switched, the phenomena at both ends of the TEC change with the change of the current direction. Therefore, the left and right positions on the lower end surface of the heat conduction base have grooves with the same surface area as the TEC to fit with the TEC, and a certain amount of thermal conductive silicone grease needs to be applied between the surface of the TEC and the heat conduction base during the fitting process, which is more conducive to temperature conduction; during the heating process, a temperature sensor is installed on the side end of the heat conduction base to feedback and control the temperature signal.

[0053] The liquid cooling end cover 42 includes a liquid cooling upper end cover 421 and a liquid cooling lower end cover 422, and the liquid cooling upper end cover 421 and the liquid cooling lower end cover 422 are fixedly connected. One end of the TEC is in contact with the lower end surface of the heat conduction base, and the other end is in contact with the lower end surface of the guiding shaft 431. The contact surface is covered with thermal conductive silicone grease to isolate air. The upper surface of the liquid cooling upper end cover has a groove with the same surface size as the TEC, and this groove is the same as the groove at the left lower position of the heat conduction base, both having high flatness and roughness.

[0054] Inside the liquid cooling upper end cover, there are rows of grooves that together form an S-shaped flow channel for the condensed water to flow through. There is a circle of grooves around the outside of the S-shaped flow channel, and these grooves are used for installing O-ring seals. When the liquid cooling lower end cover is locked with the liquid cooling upper end cover by screws, the seal ring at the middle groove is sealed through compression deformation, thus ensuring no liquid leakage.

[0055] There are two threaded holes on the liquid cooling lower end cover for installing liquid path pipe joints. These liquid path pipe joints can rotate to any direction in the plane, and the liquid path pipes are connected through the joints and extend along the outlet at the rear end of the stage to be connected with external pump valves. A temperature protection switch is installed on the side of the liquid cooling upper end cover. When an abnormal situation occurs during the operation of the TEC, the temperature protection switch can quickly cut off the power supply to protect the safety of the equipment. The front liquid path port assembly and the rear liquid path port assembly are installed at both ends of the liquid cooling upper end cover, which are respectively the inlet and outlet of the chip liquid path.

[0056] In this embodiment, a stage adjustment plate and an outer frame are further provided. The stage adjustment plate is used to fix the heat conduction base, and a leveling mechanism is provided between it and the outer frame. The flatness of the stage adjustment plate is adjusted through the leveling mechanism, and then the flatness of the heat conduction base is adjusted.

[0057] The TEC in the temperature control component is installed between the heat conduction seat and the upper end cover of the liquid cooling. The elastic mechanism 43 is arranged on the upper end cover of the liquid cooling. The elastic mechanism 43 is provided with a guide shaft 431, a heat insulation pad 432 and an elastic member 433. Among them, the elastic member 433 can be a compression spring. One end of the guide shaft 431 has a thread. The lower end face of the guide shaft protrudes outward near the proximal end, similar to a screw structure. The threaded end of the guide shaft is connected to the heat conduction seat. The compression spring is arranged between the heat insulation pad 432 and the lower end face of the guide shaft. In the initial state, the compression spring is in a compressed state, and the TEC is tightly connected to the heat conduction seat and the upper end cover of the liquid cooling to ensure reliable temperature transfer. When the chip undergoes temperature rise and fall cycles, due to the influence of thermal stress, the thermal stress can be released in time through the elastic mechanism 43. The elastic mechanism 43 can ensure that the TEC is not easily crushed during installation, and at the same time ensure that the flatness of the heat conduction seat is not affected by temperature as much as possible.

[0058] In a feasible manner, four elastic mechanisms 43 are arranged, which are respectively located at the four corners of the upper end cover of the liquid cooling. The four corners of the lower end cover of the liquid cooling are recessed inward to provide space for the elastic mechanism.

[0059] Refer to Figure 4 and Figure 5 Referring to the structural schematic diagrams shown in

[0060] In this embodiment, the body 121 and the sunken part 122 are integrally formed, and no fasteners are required inside the entire chip component 1, thereby increasing reliability and sealing performance.

[0061] The sunken part 122 is flush with the bottom surface of the body 121, the top surface sinks, and the middle part of the sunken part is hollowed out. This hollowing ensures that the sequencing chip is in contact with the surface of the boss 22, so as to facilitate temperature control of the sequencing chip. A step 124 is arranged between the sunken part 122 and the body 121. A third protruding part 125 is arranged on the side surface of the step 124. The third protruding part 125 is used to abut against the side surface of the sequencing chip 11. In the traditional technology, the side of the sequencing chip is in overall contact with the chip clamping outer frame. If the thickness of the sequencing chip is ignored, the contact method is line contact. In this embodiment, the third protruding part 125 is provided, so that the contact between the sequencing chip and the chip clamping outer frame is "point contact", thereby reducing the risk of extrusion damage to the chip after thermal expansion.

[0062] Further, the sequencing chip 11 is provided with a plurality of flow channels 111, and openings 112 are provided at the ports of each flow channel. The position of the first protrusion 123 corresponds to the opening 112. The first protrusion 123 is used to mount a seal 13, and the upper port of the seal 13 here is hermetically connected to the chip by compression, and the lower port is hermetically docked with the liquid path port on the external carrier.

[0063] Further, bumps 1231 are provided on the inner wall of the first protrusion 123, and protrusions 131 are provided on the outside of the seal 13. The bumps 1231 are used to support the protrusions 131. When the chip assembly is installed on the heat conducting base, the upper end of the seal 13 abuts against the bottom surface of the sequencing chip and is opposite to the opening 112; the lower end of the seal 13 abuts against the second protrusion 31, so that the sequencing chip is communicated with the liquid path port.

[0064] In this embodiment, the chip assembly 1 further includes a left upper shell 14 and a right upper shell 15 disposed at the left and right ends of the chip. Pressing claws are provided on the sides of the left upper shell 14 and the right upper shell 15 close to the chip, and the pressing claws abut against the chip surface for fixing the sequencing chip.

[0065] After the sequencing chip is installed with the chip clamping outer frame, the chip can slightly shake within the chip clamping outer frame, and the shaking amount is 0.05 mm. Under the slight elastic force of the third protrusion 125, the chip contacts the third protrusion 12 of the chip clamping outer frame. Finally, the left upper shell and the right upper shell are installed and fastened, and thus the chip is assembled; there is sealant at both ends of the chip, and this sealant has the functions of sealing and acting as a flow channel.

[0066] The embodiment of the present application further provides a gene sequencer, including Figure 3 a chip carrying device provided by any implementation manner, and the chip carrying device is used to carry Figure 4 a chip assembly provided by any implementation manner.

[0067] The above are only the embodiments of the present application and are not used to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application are included in the scope of the claims of the present application pending approval.

Claims

1. A chip carrier device, characterized in that, The device is used to carry a chip component, which includes a sequencing chip, a chip clamping outer frame, and a seal. The chip clamping outer frame has a body and a sunken part that sinks relative to the body. The sunken part is used to carry the sequencing chip, and a first protrusion for installing the seal is provided on the bottom surface of the sunken part; The chip carrying device includes: A heat conducting seat, which has a base and a boss protruding from the surface of the base. The base and the boss are integrally formed, and the back surface of the sequencing chip is adsorbed on the surface of the boss; A liquid path port, on whose surface a second protrusion is provided. The liquid path port is arranged below the heat conducting seat, and the second protrusion penetrates the base; when the chip component is installed on the surface of the heat conducting seat, the first protrusion cooperates with the second protrusion so that the seal abuts against the second protrusion; A temperature control component, arranged below the heat conducting seat, for controlling the temperature of the heat conducting seat.

2. The chip carrier device according to claim 1, characterized in that, The inner diameter of the first protrusion is larger than the outer diameter of the second protrusion, so that the first protrusion can be sleeved outside the second protrusion.

3. The chip carrier device according to claim 1, wherein, A plurality of positioning pins are arranged on the base, and at least one of the plurality of positioning pins is not on the same straight line as the other positioning pins. The positioning pins cooperate with through holes opened on the chip clamping outer frame.

4. A chip carrier device according to claim 1, wherein, The internal fluid channel of the liquid path port is a two-in-one L-shaped channel. The L-shaped channel includes two first channels that abut against the seal and a second channel that is connected after the two first channels converge. The second channel is perpendicular to the plane formed by the central axes of the two first channels, and the second channel is used to connect with a liquid path joint.

5. A chip carrier device according to claim 1, characterized in that, The temperature control component includes: A Peltier; A liquid cooling end cover, arranged below the Peltier, for heat exchange with the Peltier; An elastic mechanism, which includes a guide shaft, a heat insulation pad sleeved outside the guide shaft, and an elastic member. The heat insulation pad is used to isolate temperature conduction. One end of the elastic member abuts against the heat insulation pad, and the other end contacts the lower end surface of the guide shaft. When the Peltier heats up and expands, the liquid cooling end cover slides down along the guide shaft.

6. A chip component, characterized in that, It includes: a sequencing chip, a chip clamping outer frame, and a seal. The chip clamping outer frame has a body and a sunken part that sinks relative to the surface of the body. The sunken part is used to carry the sequencing chip, and a first protrusion for installing the seal is provided on the bottom surface of the sunken part.

7. A chip component according to claim 6, characterized in that, A step is provided between the sunken part and the body, and a third protrusion is provided on the side surface of the step. The third protrusion is used to abut against the side surface of the sequencing chip.

8. A chip component according to claim 6, characterized in that, The sequencing chip is provided with a plurality of flow channels, and openings are provided at the ports of each flow channel. The position of the first protrusion corresponds to the openings.

9. A chip component according to claim 6, wherein, Protrusions are provided on the inner wall of the first protrusion, and protrusions are provided on the outside of the seal. The protrusions are used to support the protrusions.

10. A gene sequencer, characterized in that, It includes the chip carrying device according to any one of claims 1 to 5, and the chip carrying device is used to carry the chip component according to any one of claims 6 to 9.

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