Camera support for simultaneously detecting upper surface and lower surface of wafer
By designing a camera bracket for simultaneously detecting the upper and lower surfaces of the wafer, the problem of low detection efficiency on the back of the wafer is solved, and automated detection of upper and lower surfaces is realized, which improves production efficiency and detection integrity.
Patent Information
- Application Number
- CN202421987341.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-16
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2034-08-16
AI Technical Summary
In the prior art, wafer back inspection usually requires manual flip, resulting in low detection efficiency and cannot be carried out simultaneously with frontal detection, affecting production efficiency.
Design a camera bracket for simultaneously detecting the upper and lower surfaces of the wafer, including a three-dimensional frame formed by the camera base, the camera top and the column. It has a built-in wafer bearing platform and robotic hand, which can automatically grab the wafer and take pictures of the upper and lower surfaces on the transparent carrier table.
Simultaneous detection of the upper and lower surfaces of the wafer is achieved, which improves detection efficiency, reduces production stagnation, and ensures the integrity and accuracy of detection.
Smart Images
Figure CN223139372U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor wafer processing, in particular to a camera support for simultaneously detecting the upper and lower surfaces of a wafer. Background Art
[0002] Wafer inspection is of crucial significance in the semiconductor manufacturing process. It ensures that wafers meet strict quality standards before entering each manufacturing stage, thereby guaranteeing the performance and reliability of the final products. The inspection can identify and classify various defects on the front and back surfaces of wafers, such as microcracks, particle contamination, flatness problems, etc. If these defects are not detected in a timely manner, they may lead to more serious problems during the manufacturing process, affecting the functions of circuits and devices. Backside inspection of wafers is of great significance in the semiconductor manufacturing process, although traditionally more attention has been paid to the front side of wafers (i.e., the manufacturing side of circuits and devices). Backside inspection of wafers is of great significance in the semiconductor manufacturing process. First of all, it can ensure the structural integrity of wafers, detect mechanical damage, cracks or other defects on the back side, prevent cracking or damage during processing and operation, and thus guarantee the mechanical strength and reliability of wafers. Secondly, detecting the flatness of the back side helps the wafer to be evenly stressed during the production process, avoid stress concentration in processes such as chemical mechanical polishing, and reduce the generation of cracks and fragments. Backside inspection can also detect particles, dust or chemical contaminants, preventing them from migrating to the front side of the wafer during subsequent processing and affecting the performance of circuits and devices.
[0003] Wafer inspection usually focuses on the front side, while backside inspection generally involves manually operating the machine to flip the wafer and visually checking for problems on the back side of the wafer. This will lead to production stagnation and low efficiency. Summary of the Utility Model
[0004] To solve the above problems existing in the prior art, the utility model proposes a camera support for simultaneously detecting the upper and lower surfaces of a wafer.
[0005] The utility model can be realized by the following technical solutions:
[0006] A camera support for simultaneously detecting the upper and lower surfaces of a wafer includes a three-dimensional frame formed by a camera base, a camera top seat and a column. The frame includes a wafer carrying platform, which is installed on the column, and also includes a manipulator for grasping the wafer and placing it on the wafer carrying platform.
[0007] Further, the camera slide rail base and the top seat have the same structure, with a cross-shaped slide rail in the middle and inclined 45-degree slide rails on both the left and right sides.
[0008] Further, there are multiple screw holes on the column, and the camera slide rail base or the top seat is fixed in the screw holes by screws.
[0009] Furthermore, the wafer carrier platform is transparent, with a circle dug out in the middle. The center of the dug-out circle is coaxial with the center of the wafer, and the radius of the dug-out circle is 10 mm smaller than the radius of the wafer. Moreover, a piece of area where the manipulator can move up and down is dug out on one side of the wafer carrier platform.
[0010] Furthermore, 1 / 4 of the volume of the column is dug out from the top to the middle. The wafer carrier platform is placed on it and is stuck on it in the front, back, left, and right directions.
[0011] Beneficial Effects
[0012] During the wafer processing, wafer inspection is usually carried out on the front side. For the back side inspection, generally, the operator manually flips the wafer on the machine stage and checks whether there are any problems on the back side of the wafer by eye. This will lead to production stagnation and low efficiency. The utility model can be installed inside other machines on the production line or can be made into a separate inspection machine stage. It can simultaneously inspect the upper and lower surfaces of the wafer. The manipulator grabs and adsorbs the wafer below the wafer, places it on the tempered glass wafer carrier platform, and the upper and lower cameras take pictures. Since the carrier platform is transparent, the images of the upper and lower surfaces of the wafer can be clearly taken. Description of the Drawings
[0013] Figure 1 is a structural schematic diagram of the utility model;
[0014] Figure 2 is an overall structural schematic diagram of the utility model;
[0015] Figure 3 is a structural schematic diagram of the wafer carrier platform;
[0016] Figure 4 is a structural schematic diagram of the camera base and the camera top seat. Specific Embodiments
[0017] The following specific embodiments are used to illustrate the implementation manners of the utility model. Those skilled in the art can easily understand the other advantages and effects of the utility model from the content disclosed in this specification.
[0018] As Figure 1 , shown in FIG. 2, a camera support for simultaneously inspecting the upper and lower surfaces of a wafer of the utility model includes a three-dimensional frame formed by matching a camera base 1, a camera top seat 7, and a column 3. The frame includes a wafer carrier platform 5 installed on the column 3, and also includes a manipulator 4 for grabbing the wafer and placing it on the wafer carrier platform 5. The manipulator grabs and adsorbs the wafer below the wafer, places it on the tempered glass wafer carrier platform 5, and the upper and lower cameras take pictures. Since the carrier platform is transparent, the images of the upper and lower surfaces of the wafer can be clearly taken.
[0019] As Figure 4As shown in the figure, the camera base and the top base have the same structure. There is a cross-shaped slide rail in the middle, and the left and right sides are inclined 45-degree slide rails. The camera can be adjusted freely in this slide rail, and then the screw is tightened. The bolt head and the bottom of the camera are clamped on the slide rail to fix the position of the camera, so as to achieve a better imaging effect. The shapes of the bottom and top base slide rails can be changed, such as hole shapes, multiple small holes, and the camera can be placed at the positions of multiple small holes.
[0020] There are multiple screw holes on the four columns 3, and the height of the camera base or the top base can be adjusted according to actual needs to achieve a better position for camera imaging. The columns can also be changed to slide rails instead of small holes to adjust the height of the top and bottom bases.
[0021] As Figure 3 shown in the figure, the wafer carrier platform 5 is made of transparent tempered glass. A circle is dug out in the middle. The center of the dug-out circle is coaxial with the center of the wafer, and the radius of the dug-out circle is 10 mm smaller than the radius of the wafer. While ensuring as much hollowing as possible, there is enough surrounding area to support the wafer, which will make the imaging effect better after the manipulator leaves the wafer. A piece of area of the tempered glass is also dug out at the position of the manipulator so that the tempered glass will not affect the manipulator's picking and placing of the wafer.
[0022] The column of the wafer carrier platform is dug out 1 / 4 of its volume from the top to the middle for the wafer carrier platform to be placed on it and clamped on it from the front, back, left, and right. The column plays the role of carrying the wafer carrier platform and limiting its position.
[0023] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A camera bracket for simultaneous detection of the upper and lower surfaces of a wafer, characterized in that, It includes a three-dimensional framework formed by a camera slide rail base, a camera top base, and a column. Inside the framework, there is a wafer carrier platform, which is installed on the column. Inside the framework, there is also a manipulator for grasping the wafer and placing it on the wafer carrier platform.
2. The camera support for simultaneous detection of the upper and lower surfaces of a wafer according to claim 1, characterized in that The camera base and the top base have the same structure, with a cross-shaped slide rail in the middle and inclined 45-degree slide rails on both the left and right sides.
3. A camera bracket for simultaneously detecting the upper and lower surfaces of a wafer according to claim 1, characterized in that, There are multiple screw holes on the column, and the camera slide rail base or the top base is fixed in the screw holes by screws.
4. A camera support for simultaneously detecting the upper and lower surfaces of a wafer according to claim 1, characterized in that, The wafer carrier platform is transparent, with a circle dug out in the middle. The center of the dug-out circle is coaxial with the center of the wafer, and the radius of the dug-out circle is 10 mm smaller than the radius of the wafer. And on one side of the wafer carrier platform, an area where the manipulator can move up and down is dug out.
5. A camera support for simultaneously detecting the upper and lower surfaces of a wafer according to claim 1, characterized in that 1 / 4 of the volume of the column is dug out from the top to the middle, and the wafer carrier platform is placed on it and is stuck on it in the front, back, left, and right directions.