Photoelectric device test tool

Abstract

The utility model discloses a photoelectric device testing tool which comprises a base, a floating plate assembly and a circuit board. The base comprises a limiting groove, a groove and a probe set. The probe set is located in the groove, and probes of the probe set penetrate through the groove. The floating plate assembly comprises a limiting boss and a probe set through hole. And the limiting boss is embedded into the limiting groove and is movably connected in the limiting groove. And the limiting boss is limited by the limiting groove. And an elastic component is arranged between the base and the floating plate assembly. When the photoelectric device to be tested is not located above the floating plate assembly, the upper surfaces of the probes are lower than the upper surfaces of the probe group through holes, and the probes are not exposed and are protected. When the to-be-tested photoelectric device is located above the floating plate assembly, the upper surface of the probe is higher than the upper surface of the through hole of the probe set, and the probe is electrically connected with the to-be-tested photoelectric device. And the circuit board is positioned below the base and is electrically connected with the probes, so that the circuit board, the probes and the photoelectric device to be tested are electrically connected.

Description

Technical Field

[0001] This application relates to the field of communication technologies, and particularly to a test tool for optoelectronic devices. Background Art

[0002] In new services and application models such as cloud computing, mobile Internet, and video, optical communication technologies are used. In optical communication, an optical module is a tool for realizing the mutual conversion of optical and electrical signals and is one of the key components in optical communication devices. With the rapid development of 5G networks, the optical module at the core of optical communication has seen significant development.

[0003] The device packaging in the field of optical communication involves packaging processes such as device coupling and testing, requiring electrical connection between the pins of the device and the test tool for optoelectronic devices to achieve interaction between the test tool for optoelectronic devices and the device (such as power-on control, detection, etc.). The test tool for optoelectronic devices is provided with probes electrically connected to the pins of the device. During the testing process of multiple modules, the probes of the test tool for optoelectronic devices are reused and are prone to damage. Summary of the Utility Model

[0004] This disclosure provides a test tool for optoelectronic devices to protect the test tool for optical modules probe .

[0005] To solve the above technical problems, the embodiments of this application disclose the following technical solutions:

[0006] In some embodiments, a test tool for optoelectronic devices is provided, including: a base, including:

[0007] A limit groove;

[0008] A groove,

[0009] A probe group located at the bottom of the groove, and the probes of the probe group penetrate through the groove;

[0010] A floating plate assembly located in the groove, and an elastic member is provided between the floating plate assembly and the base; the elastic member is compressed by force to cause the floating plate assembly to move towards the base;

[0011] The floating plate assembly includes:

[0012] A limit boss embedded in the limit groove and movably connected in the limit groove;

[0013] Probe group through holes, the probes are embedded in the probe through holes, and the diameter of the probe through holes is larger than the diameter of the probes;

[0014] The upper surface of the probes is lower than the upper surface of the probe group through holes;

[0015] The circuit board is located below the base and is electrically connected to the probe.

[0016] The technical solutions in the above technical solutions have the following advantages or beneficial effects: The aperture of the through-hole of the probe group is larger than the diameter of the probe, and the probe can move within the through-hole of the probe group. An elastic member is provided between the base and the floating plate assembly. When the optoelectronic device to be tested is not located above the floating plate assembly, the upper surface of the probe is lower than the upper surface of the through-hole of the probe group, and the probe is not exposed, thus protecting the probe. When the optoelectronic device to be tested is located above the floating plate assembly, the elastic member is compressed by force, and the floating plate assembly moves towards the base, driving the probe to move within the through-hole of the probe group. The upper surface of the probe is higher than the upper surface of the through-hole of the probe group, enabling the probe to be electrically connected to the optoelectronic device to be tested. The circuit board is located below the base and is electrically connected to the probe, realizing the electrical connection among the circuit board, the probe, and the optoelectronic device to be tested. The upper surface of the probe is lower than the upper surface of the through-hole of the probe group, and at this time, the probe is not exposed, protecting the probe. When the optoelectronic device to be tested is located above the floating plate assembly, the elastic member is compressed by force, and the floating plate assembly moves along the limit groove towards the base, driving the probe to move within the through-hole of the probe group so that the upper surface of the probe is higher than the upper surface of the through-hole of the probe group, and the probe is electrically connected to the optoelectronic device to be tested.

[0017] In some embodiments, an optoelectronic device testing tooling is provided, and the width of the limit groove is greater than the width of the limit boss.

[0018] The technical solutions in the above technical solutions have the following advantages or beneficial effects: The limit groove can accommodate the limit boss, preventing the limit groove from hindering the movement of the limit boss, so that when the floating plate assembly moves downward under force, the floating plate assembly can move within the limit groove, realizing the movement of the floating plate assembly away from or towards the bottom plate.

[0019] In some embodiments, an optoelectronic device testing tooling is provided, and the optoelectronic device testing tooling further includes a pressing plate assembly located above the floating plate assembly; the pressing plate assembly and the floating plate assembly are pressed together to form a cavity, and the optoelectronic device to be tested is located in the cavity.

[0020] The technical solutions in the above technical solutions have the following advantages or beneficial effects: The pressing plate assembly is pressed on the floating plate assembly, causing the floating plate assembly to move towards the bottom plate, so that the probes of the probe group are exposed on the surface of the floating plate assembly. The pressing plate assembly exerts a downward pressure on the optoelectronic device to be tested and the floating plate assembly, making the connection between the optoelectronic device to be tested and the probes of the probe group tighter.

[0021] In some embodiments, an optoelectronic device testing tooling is provided, and the base includes a heat dissipation block located at the bottom of the groove; the floating plate assembly includes: a first avoidance hole, and the heat dissipation block is embedded in the first avoidance hole, and the optoelectronic device to be tested is located on the upper surface of the heat dissipation block.

[0022] The technical solution in the above technical solution has the following advantages or beneficial effects: The optoelectronic device to be tested is located on the upper surface of the heat dissipation block, and the heat dissipation block is in contact connection with the optoelectronic device to be tested, so that the heat dissipation block dissipates heat from the optoelectronic device and improves the heat dissipation effect.

[0023] In some embodiments, an optoelectronic device testing tooling is provided. The floating plate assembly includes: a first protruding portion located between the probe through-hole group and the first avoidance hole; the upper surface of the first protruding portion is higher than the upper surface of the probe through-hole group.

[0024] The technical solution in the above technical solution has the following advantages or beneficial effects: The first protruding portion is higher than the upper surface of the probe through-hole group, which avoids the contact between the outer components and the probe and can protect the probe.

[0025] In some embodiments, an optoelectronic device testing tooling is provided. The bottom plate includes a locking assembly. The locking assembly includes: a limit slider located in the groove; a limit locking member penetrating through the side wall of the base, one end of the limit locking member is located outside the base, and the other end abuts against the side wall of the limit slider; the limit locking member pushes the limit slider to move.

[0026] The technical solution in the above technical solution has the following advantages or beneficial effects: The limit locking member can push the limit slider so that the limit slider squeezes the optoelectronic device to be tested, and is used to fix the optoelectronic device to be tested.

[0027] In some embodiments, an optoelectronic device testing tooling is provided. The upper surface of the limit slider is higher than the upper surface of the heat dissipation block so that the limit slider contacts the optoelectronic device to be tested.

[0028] The technical solution in the above technical solution has the following advantages or beneficial effects: The limit locking member pushes the limit slider so that the limit slider abuts against the optoelectronic device to be tested and fixes the optoelectronic device to be tested.

[0029] In some embodiments, an optoelectronic device testing tooling is provided. The floating plate assembly includes a second avoidance portion, and the limit slider is embedded in the second avoidance portion.

[0030] The technical solution in the above technical solution has the following advantages or beneficial effects: The second avoidance portion provides an avoidance for the limit slider, so that the limit slider can abut against the optoelectronic device to be tested.

[0031] In some embodiments, an optoelectronic device testing tooling is provided, and the pressing plate assembly is movably connected to the floating plate assembly. The technical solution in the above technical solution has the following advantages or beneficial effects: The pressing plate assembly is movably connected to the floating plate assembly, which facilitates the connection between the pressing plate assembly and the floating plate assembly during testing and enables quick replacement during the next testing process, thereby improving the testing speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] To more clearly illustrate the technical solutions in the present disclosure, the drawings required for use in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure, and those of ordinary skill in the art can also obtain other drawings based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and do not limit the actual dimensions of the products involved in the embodiments of the present disclosure, the actual processes of the methods, the actual timings of the signals, etc.

[0033] Figure 1 FIG. [FIG. NUMBER] is a partial architecture diagram of an optical communication system provided according to some embodiments;

[0034] Figure 2 FIG. [FIG. NUMBER] is a partial structural diagram of a host computer provided according to some embodiments;

[0035] Figure 3 FIG. [FIG. NUMBER] is a structural diagram of an optical module provided according to some embodiments;

[0036] Figure 4 FIG. [FIG. NUMBER] is an exploded view of an optical module provided according to some embodiments;

[0037] Figure 5 FIG. [FIG. NUMBER] is a schematic structural diagram of an optoelectronic device provided according to some embodiments;

[0038] Figure 6 FIG. [FIG. NUMBER] is a schematic connection diagram of an optoelectronic device and an optoelectronic device testing tooling provided according to some embodiments;

[0039] Figure 7 FIG. [FIG. NUMBER] is a schematic structural diagram of an optoelectronic device testing tooling provided according to some embodiments;

[0040] Figure 8 FIG. [FIG. NUMBER] is an exploded schematic diagram of an optoelectronic device testing tooling provided according to some embodiments;

[0041] Figure 9 FIG. [FIG. NUMBER] is a schematic structural diagram of a base provided according to some embodiments;

[0042] Figure 10 FIG. [FIG. NUMBER] is a schematic structural diagram of a floating plate assembly provided according to some embodiments;

[0043] Please note that the "[[FIG. NUMBER]]" in the translation needs to be replaced with the actual figure number according to the specific content of the original text.Figure 11 Schematic diagram of a base and floating plate assembly provided according to some embodiments;

[0044] Figure 12 Schematic diagram of a probe group provided according to some embodiments;

[0045] Figure 13 Exploded view of a probe group provided according to some embodiments. Detailed implementation manners

[0046] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. The light loaded with information is an optical signal. The optical signal propagates in the information transmission device, which can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. The information that an information processing device can process exists in the form of an electrical signal. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablet computers, and televisions are common information processing devices. Optical fibers and optical waveguides are common information transmission devices.

[0047] The conversion between optical signals and electrical signals between information processing devices and information transmission devices is achieved through an optical module. For example, an optical fiber is connected to the optical signal input end and / or optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or electrical signal output end of the optical module. The first optical signal from the optical fiber is transmitted into the optical module, and the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal into the optical network terminal. The second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module converts the second electrical signal into a second optical signal and transmits the second optical signal into the optical fiber. Since information processing devices can be interconnected through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0048] Figure 1 Partial architecture diagram of an optical communication system provided according to some embodiments. As Figure 1 shown, the local part of the optical communication system presents as a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0049] One end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. Total internal reflection can occur in the optical fiber 101. The optical signal can maintain almost the original optical power during propagation in the direction of total internal reflection. Multiple total internal reflections occur in the optical fiber 101 to transmit the optical signal from the direction of the remote information processing device 1000 into the optical module 200, or transmit the optical signal from the optical module 200 towards the remote information processing device 1000, realizing information transmission over a long distance with low power loss.

[0050] The number of optical fibers 101 can be one or multiple (two or more); the optical fiber 101 and the optical module 200 can be connected in a pluggable and movable manner or in a fixed connection.

[0051] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so as to establish a unidirectional / bidirectional electrical signal connection between the host computer 100 and the optical module 200; the host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor and control the working state of the optical module 200.

[0052] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104. The external electrical interface can access an electrical signal network. Exemplarily, the network cable interface 104 is configured to access the network cable 103, so as to establish a unidirectional / bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0053] An Optical Network Unit (ONU), an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), and a data center server are common host computers.

[0054] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0055] Exemplarily, the third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101, and the second optical signal propagates in the optical fiber 101 towards the remote information processing device 1000.

[0056] Exemplarily, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal into the local information processing device 2000.

[0057] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. In the above process of converting optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0058] Figure 2 FIG. is a partial structural diagram of a host computer provided according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure related to the host computer 100 and the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a radiator 107 disposed on the cage 106, and an electrical connector (not shown in the figure) disposed inside the cage 106. The radiator 107 has a convex structure for increasing the heat dissipation area, and the fin-like structure is a common convex structure.

[0059] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0060] Figure 3 FIG. is a structural diagram of an optical module provided according to some embodiments, Figure 4 FIG. is an exploded view of an optical module provided according to some embodiments. As Figure 3 and Figure 4 shown, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, an optical transmitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical receiving component 500.

[0061] The housing includes an upper housing 201 and a lower housing 202. The upper housing 201 covers the lower housing 202 to form the above housing having two openings 204 and 205. The outer contour of the housing generally presents a rectangular body.

[0062] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower housing 202 to form the above-mentioned housing.

[0063] In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper housing 201 covering the lower housing 202.

[0064] The direction where the line connecting the two openings 204 and 205 is located may be consistent with the length direction of the optical module 200 or may not be consistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 the right end), and the opening 205 is also located at the end of the optical module 200 ( Figure 3 the left end). Or, the opening 204 is located at the end of the optical module 200, while the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends out from the electrical port 204 and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port and is configured to access an external optical fiber 101 so that the optical fiber 101 connects the optical transmitting component 400 and the optical receiving component 500 in the optical module 200.

[0065] Adopting the assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the optical transmitting component 400, the optical receiving component 500, etc. into the above-mentioned housing, and the upper housing 201 and the lower housing 202 can package and protect the above-mentioned devices. In addition, when assembling the circuit board 300, the optical transmitting component 400 and the optical receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0066] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

[0067] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer or to release the fixed connection between the optical module 200 and the host computer.

[0068] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging component of the unlocking component 600; when the unlocking component 600 is pulled, the engaging component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the engaging component and the host computer to release the fixation of the optical module 200 to the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0069] The circuit board 300 includes circuit traces, electronic components, chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components can include, for example, capacitors, resistors, triodes, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips can include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0070] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connectors in the cage 106 of the host computer 100.

[0071] The circuit board 300 also includes a gold finger 301 formed on its end surface. The gold finger 301 is composed of a plurality of independent pins. When the circuit board 300 is inserted into the cage 106, the gold finger 301 is electrically connected to the electrical connectors in the cage 106. The gold finger 301 can be provided only on the surface of one side of the circuit board 300 (for example Figure 4The upper surface shown) can also be disposed on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions with a large demand for the number of pins. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in cooperation with rigid circuit boards as a supplement to rigid circuit boards.

[0072] At least one of the optical transmitting component 400 or the optical receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301.

[0073] In some embodiments, the optical transmitting component 400 and the optical receiving component 500 are physically separated from the circuit board 300 respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors respectively.

[0074] In some embodiments, at least one of the optical transmitting component or the optical receiving component can be directly disposed on the circuit board 300. For example, at least one of the optical transmitting component or the optical receiving component can be disposed on the surface of the circuit board 300 or on the side of the circuit board 300.

[0075] In some embodiments, the optical transmitting component 400 or the optical receiving component 500 can be a tubular housing structure. The optical transmitting component 400 and / or the optical receiving component 500 is a set of optoelectronic devices. For the convenience of description, the optical transmitting component 400 and / or the optical receiving component 500 will be referred to as optoelectronic devices hereinafter.

[0076] Figure 5 FIG. is a schematic structural diagram of an optoelectronic device according to some embodiments. As shown in the figure, the optoelectronic device includes a housing 410 and pins 420 penetrating inside and outside the housing. One end of the pin 420 is located inside the housing 410, and the other end of the pin 420 is located outside the housing 410. The pin 420 can be used to transmit an electrical signal from outside the housing to inside the housing. The encapsulation of the optoelectronic device involves encapsulation processes such as device coupling and testing, and requires electrical connection between the pins of the device and the test tooling to achieve the interaction between the test tooling and the device.

[0077] Figure 6 FIG. is a schematic connection diagram of a to-be-tested optoelectronic device and an optoelectronic device test tooling according to some embodiments. Figure 7 FIG. is a schematic structural diagram of a to-be-tested optoelectronic device test tooling according to some embodiments. Figure 8 FIG. is an exploded schematic diagram of an optoelectronic device test tooling according to some embodiments. As Figure 6 、 Figure 7 and Figure 8As shown, the optoelectronic device testing tooling can include a base 510, a floating plate assembly 520, and a pressing plate assembly 530.

[0078] In some embodiments, the floating plate assembly 520 is located above the base 510, and an elastic member is provided between the floating plate assembly 520 and the base 510.

[0079] The pressing plate assembly 530 can be pressed on top of the floating plate assembly 520. After the pressing plate assembly 530 and the floating plate assembly 520 are pressed together, a cavity 550 is formed. The optoelectronic device to be tested can be located within the cavity 550.

[0080] The pressing plate assembly 530 and the floating plate assembly 520 can be movably connected. For example, one end of the pressing plate assembly 530 is fixedly connected to the floating plate assembly 520, and the other end of the pressing plate assembly 530 can move around the fixed end. When the other end of the pressing plate assembly 530 is lifted, the upper opening of the cavity 550 facilitates the installation of the optoelectronic device to be tested. When the other end of the pressing plate assembly 530 is pressed down, the pressing plate assembly 530 can be pressed on top of the tested optoelectronic device.

[0081] The pressing plate assembly 530 and the floating plate assembly 520 are detachably connected. For example, the pressing plate assembly 530 can include a first fixing member 531 and a second fixing member 532.

[0082] The second fixing member 532 is located above the first fixing member 531, and the first fixing member 531 is connected to the second fixing member 532.

[0083] In some embodiments, the width of the first fixing member 531 is greater than the width of the second fixing member 532. The first fixing member 531 is located above the floating plate assembly 520. The first fixing member 531 straddles above the floating plate assembly 520, and the first fixing member 531 is fixedly connected to the base 510.

[0084] The length of the second fixing member 532 is greater than the length of the first fixing member 531, and the second fixing member 532 can be pressed on top of the floating plate assembly 520. The second fixing member 532 can exert a downward pressure on the optoelectronic device to be tested and the floating plate assembly, so that the pins of the optoelectronic device to be tested are electrically connected to the probe group.

[0085] The floating plate assembly 520 is subjected to the gravity of the optoelectronic device to be tested, and the elastic member between the floating plate assembly 520 and the base 510 is compressed under force, and the floating plate assembly 520 moves towards the base.

[0086] The optoelectronic device testing tooling can test a circuit board 540. The circuit board 540 is located on the lower surface of the base 510 and is electrically connected to the probe group of the base 510.

[0087] Figure 9 It is a schematic structural diagram of a base provided according to some embodiments. Figure 10The structural schematic diagram of a floating plate assembly provided according to some embodiments is as follows. As Figure 9 and Figure 10 shown, the base 510 may be provided with a groove 512, and one side of the groove 512 has an opening. The floating plate assembly 520 is embedded in the groove 512, and the limiting boss 521 is embedded inside the limiting groove 511.

[0088] The floating plate assembly 520 is provided with a limiting boss 521, and the limiting boss 521 protrudes outward relatively. The base 510 is provided with a limiting groove 511, and the limiting groove 511 may be located on the inner wall of the base 510. The limiting boss 521 may be embedded inside the limiting groove 511. The width of the limiting groove 511 is greater than the width of the limiting boss 521, so that the limiting boss 521 can move up and down along the limiting groove 511. The limiting groove 511 can limit the movement of the limiting boss 521. The limiting groove can accommodate the limiting boss to prevent the limiting groove from hindering the operation of the limiting boss, so that when the floating plate assembly moves downward under force, the floating plate assembly can move in the limiting groove, realizing the movement of the floating plate assembly away from or towards the bottom plate.

[0089] The limiting groove 511 may be provided around the four sides of the base, and the limiting groove 511 may be provided on the two opposite side walls of the base.

[0090] The base 510 may be provided with a probe group 513, and the probe group 513 is located at the bottom of the groove 512. The probe group 513 can penetrate the base 510 to achieve electrical connection. One end of the probe group 513 protrudes from the upper surface of the base 510, and one end of the probe group 513 protrudes from the lower surface of the base 510.

[0091] The upper surface of the probe group 513 protrudes from the upper surface of the base 510, and the lower surface of the probe group 513 protrudes from the lower surface of the base 510.

[0092] The probe group 513 is located on one side of the cavity 550, so that the probe group 513 is located on one side of the optoelectronic device to be tested, and the probe group 513 can be connected to the pins of the optoelectronic device to be tested.

[0093] In some embodiments, the probe group 513 may be integrally formed with the base 510. The probe group 513 may be detachably connected to the base 510.

[0094] The probe group 513 may include multiple probes.

[0095] In some embodiments, the base may be provided with a heat dissipation block 514. The heat dissipation block 514 protrudes from the lower surface of the base. The optoelectronic device to be tested may be located on the heat dissipation block 514 to facilitate the heat dissipation of the optoelectronic device to be tested.

[0096] The thermal conductivity of the heat dissipation block 514 is greater than that of the floating plate assembly. The heat dissipation block 514 is in contact connection with the optoelectronic device to be tested to improve the heat dissipation effect.

[0097] Figure 11 A structural schematic diagram of a base and a floating plate assembly provided according to some embodiments. As Figure 11 shown, a limiting boss 521 is provided at the edge of the floating plate assembly 520, and the limiting boss 521 is matched with the limiting groove 511 to achieve the matching and limiting between the floating plate assembly 520 and the base 510.

[0098] The floating plate assembly 520 is provided with a probe group through hole 523, and the probe group 513 can be embedded in the probe group through hole 523. Exemplarily, the probe group through hole 523 can be a through hole that can accommodate all the probes of the probe group, or multiple through holes that can accommodate a single probe.

[0099] In some embodiments, the aperture of the probe group through hole 523 is larger than the diameter of the probe, so that the probe can move within the probe group through hole.

[0100] An elastic member is provided between the floating plate assembly 520 and the base 510. When the optoelectronic device to be tested is not placed, the upper surface of the probe group 513 is lower than the upper surface of the floating plate assembly 520, and the upper surface of the floating plate assembly 520 can protect the probe group 513. After the optoelectronic device to be tested is placed, the upper surface of the probe group 513 is higher than the upper surface of the floating plate assembly 520, so that the probe group 513 is connected to the pins of the optoelectronic device to be tested.

[0101] In some embodiments, after the optoelectronic device to be tested is placed, the pressing plate assembly is pressed above the floating plate assembly 520, and the pressing plate assembly forms a downward pressure on the floating plate assembly 520, so that the floating plate assembly 520 moves towards the base, and the upper surface of the probe group 513 is higher than the upper surface of the floating plate assembly 520, so that the probe group 513 is connected to the pins of the optoelectronic device to be tested.

[0102] In some embodiments, the floating plate assembly 520 may be provided with a package mounting portion, and the package of the optoelectronic device to be tested is mounted on the package mounting portion.

[0103] In some embodiments, the floating plate assembly 520 may be provided with a first relief hole 522. The heat sink 514 can be embedded in the first relief hole 522, so that the upper surface of the heat sink 514 is exposed above the floating plate assembly 520 through the first relief hole 5222. The optoelectronic device to be tested is in contact with the upper surface of the heat sink 514, which facilitates the heat dissipation of the optoelectronic device to be tested.

[0104] The first relief hole 522 is located in the package mounting portion, and the package mounting portion is matched with the housing of the optoelectronic device to be tested.

[0105] In some embodiments, the floating plate assembly 520 may be provided with a first protrusion 524. The upper surface of the first protrusion 524 is higher than the height of the probe group through hole 523. The first protrusion 524 can make the periphery of the probe group through hole 523 higher than the probe group through hole 523, and can protect the probes.

[0106] The upper surface of the first protrusion 524 is higher than the upper surface of the heat sink, so that when the optoelectronic device to be tested is placed on the heat sink, the first protrusion 524 supports the pins of the optoelectronic device to be tested.

[0107] The lower surface of the housing of the optoelectronic device to be tested is lower than the pins, and the lower surface of the housing of the optoelectronic device to be tested contacts the upper surface of the heat sink.

[0108] In some embodiments, the base 510 may be provided with a locking assembly. The locking assembly may include a limit slider 515 and a limit locking member 516.

[0109] The limit slider 515 is located in the groove 512, and the limit locking member 516 can penetrate through the side wall of the base 510. One end of the limit locking member 516 is located in the groove 512, and the other end is located outside the base 510. The limit locking member 516 can push the limit slider 515 to move in the groove 512, so that the limit slider 515 contacts the floating plate assembly 520. One end of the limit locking member 516 is located outside the base, and the other end abuts against the side wall of the limit slider.

[0110] In some embodiments, the limit locking member 516 may be movably connected to the side wall of the base 510. By way of example, the limit locking member 516 may be a screw rod. By rotating the screw rod, the limit slider 515 is pushed to contact the optoelectronic device to be tested, thereby fixing the base 510 and the floating plate assembly 520.

[0111] In some embodiments, the floating plate assembly 520 may include a second avoidance portion 525 to facilitate the installation and avoidance of the limit slider 515.

[0112] The upper surface of the limit slider 515 is higher than the upper surface of the heat sink 514, so that the limit slider 515 can contact the optoelectronic device to be tested, thereby fixing the optoelectronic device to be tested and the optoelectronic device test tooling.

[0113] Embodiments of the present disclosure provide an optoelectronic device test tooling for providing electrical tests to optoelectronic devices. The optoelectronic device test tooling may include a base 510, a floating plate assembly 520, and a pressing plate assembly 530. The floating plate assembly 520 is located above the base 510, and the pressing plate assembly 530 is located above the floating plate assembly 520.

[0114] The floating plate assembly 520 includes a limiting boss 521. The base 510 is provided with a limiting groove 511. The limiting boss 521 can be embedded inside the limiting groove 511. The width of the limiting groove 511 is greater than the width of the limiting boss 521, so that the limiting boss 521 can move up and down along the limiting groove 511. The pressing plate assembly 530 can be pressed on the upper side of the floating plate assembly 520. After the pressing plate assembly 530 and the floating plate assembly 520 are pressed together, a cavity 550 is formed. The optoelectronic device to be tested can be located inside the cavity 550.

[0115] The base 510 can be provided with a probe group 513. The probe group 513 is located at the bottom of the groove 512. The probe group 513 can penetrate through the base 510 to achieve electrical connection. When the floating plate assembly 520 is not affected by the gravity of the optoelectronic device to be tested, the upper surface of the probe group is lower than the upper surface of the floating plate assembly 520. The upper surface of the floating plate assembly 520 can protect the probe group 513. After the optoelectronic device to be tested is placed, the elastic member between the plate assembly 520 and the base 510 is compressed by force, and the floating plate assembly 520 moves downward, so that the upper surface of the probe group 513 is higher than the upper surface of the floating plate assembly 520, so that the probe group 513 is connected to the pins of the optoelectronic device to be tested.

[0116] For the convenience of disassembly and installation of the probe group, the probe group and the base are detachably installed.

[0117] Figure 12 It is a schematic diagram of a probe group provided according to some embodiments. Figure 13 It is an exploded schematic diagram of a probe group provided according to some embodiments. As Figure 12 and Figure 13 shown, the probe group can include: a first fixing member 5131 and a second fixing member 5132. The first fixing member 5131 and the second fixing member 5132 can be fixedly connected through a connecting member.

[0118] The first fixing member 5131 can include a probe mounting portion 51313 and first fixing plates 51311 and second fixing plates 51312 located on both sides of the probe mounting portion 51313.

[0119] The probe mounting portion 51313 can be used to fix the probe. The first fixing plates 51311 and the second fixing plates 51312 are respectively located on both sides of the probe mounting portion 51313. The first fixing plate 51311 is connected to the second fixing member 5132 through a connecting member. The second fixing plate 513121 is connected to the second fixing member 5132 through a connecting member.

[0120] In some embodiments, the upper surface of the first fixing plate 51311 is lower than the upper surface of the probe mounting portion 51313. The upper surface of the first fixing plate 51311 is lower than the upper surface of the probe mounting portion 51313. The probe mounting portion 51313 protrudes from the first fixing plate 51311 and the second fixing plate 51312 so that the probe protrudes from the base.

[0121] In some embodiments, for the convenience of positioning the first fixing member 5131 and the second fixing member 5132, the second fixing member 5132 is provided with a limiting portion 5133. The limiting portion 5133 is connected to the first fixing member 5131 in a matching manner.

[0122] Since the above embodiments are all described by reference and combination on the basis of other methods, and there are the same parts between different embodiments, the same or similar parts between the various embodiments in this specification can be referred to each other. Details are not elaborated here again.

[0123] It should be noted that in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such circuit structure, article or device. Without further limitation, an element defined by the statement "comprising a..." does not exclude the existence of additional identical elements in the circuit structure, article or device including the element.

[0124] This application aims to cover any variations, uses or adaptations of this application, which follow the general principles of this application and include common general knowledge or conventional technical means in the technical field not disclosed in this application. The description and examples are only regarded as exemplary, and the true scope and spirit of this application are pointed out by the content of the claims.

[0125] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optoelectronic device testing tooling, characterized in that, Comprising: A base, comprising: A limiting groove; A recess, A probe group located at the bottom of the recess, and the probes of the probe group penetrate through the recess; A floating plate assembly located in the recess, and an elastic member is provided between the floating plate assembly and the base, and the elastic member is compressed by force to enable the floating plate assembly to move towards the base; The floating plate assembly comprises: A limiting boss embedded in the limiting groove, and the limiting boss is movably connected in the limiting groove; A probe group through hole, the probe is embedded in the probe group through hole, and the diameter of the probe through hole is larger than the diameter of the probe; The upper surface of the probe is lower than the upper surface of the probe group through hole; A circuit board located below the base and electrically connected to the probe.

2. The optoelectronic device testing tooling according to claim 1, wherein The width of the limiting groove is larger than the width of the limiting boss, so that the floating plate assembly moves towards the recess after being stressed.

3. The optoelectronic device testing tooling according to claim 1, characterized in that, Comprising: A pressing plate assembly located above the floating plate assembly; the pressing plate assembly and the floating plate assembly are pressed together to form a cavity, and the optoelectronic device to be tested is located in the cavity.

4. The optoelectronic device testing tooling according to claim 1, characterized in that, The floating plate assembly comprises: a first avoidance hole; The base comprises a heat dissipation block located at the bottom of the recess, the heat dissipation block is embedded in the first avoidance hole, and its upper surface is used for carrying the optoelectronic device to be tested during the period.

5. The optoelectronic device testing tooling according to claim 4, characterized in that, The floating plate assembly comprises: a first protrusion located between the probe through hole group and the first avoidance hole; the upper surface of the first protrusion is higher than the upper surface of the probe group through hole.

6. The optoelectronic device testing tooling according to claim 4, wherein The base comprises a locking assembly, and the locking assembly comprises: A limiting slider located in the recess, A limiting locking member penetrating through the side wall of the base, one end of the limiting locking member is located outside the base, and the other end abuts against the side wall of the limiting slider; The limiting locking member pushes the limiting slider to move.

7. The optoelectronic device testing tooling according to claim 6, characterized in that, The upper surface of the limiting slider is higher than the upper surface of the heat dissipation block.

8. The optoelectronic device testing tooling according to claim 6, wherein The floating plate assembly comprises a second avoidance portion, and the limiting slider is embedded in the second avoidance portion.

9. The optoelectronic device testing tooling according to claim 3, wherein, The pressing plate assembly is movably connected to the floating plate assembly.

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